Everand Logo

Welcome to Everand!

  • Discover millions of ebooks, audiobooks, and so much more with a free trial

    Only $11.99/month after trial. Cancel anytime.

    Unavailable
    Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
    Unavailable
    Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
    Unavailable
    Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
    Ebook831 pages6 hours

    Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

    By Hengyun Zhang, Faxing Che, Tingyu Lin and Wensheng Zhao

    ()

    Currently unavailable

    Currently unavailable

    About this ebook

    Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

    • Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
    • Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
    • Provides multiphysics modeling and analysis techniques of electronic packaging
    LanguageEnglish
    PublisherElsevier Science
    Release dateNov 14, 2019
    ISBN9780081025338
    Unavailable
    Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
    Author

    Hengyun Zhang

    Dr. Hengyun Zhang is a professor in Shanghai University of Engineering Science. He has worked in industry and research institutes for 16 years, including Institute of Microelectronics (Singapore), Advanced Micro Devices and Dow Corning. He was the recipient of the Best Poster Paper award from ITHERM 2004, AMD Engineering Excellence Award 2008, and Best Paper award from Icept 2010. He has nearly 70 publications in international journals and conferences, and more than 24 patents granted/filed of thermal and packaging significance. He also served in a number of international conferences as a committee member (ITHERM, ICEPT, EPTC, MNHMT etc). He was a speaker in IME Industry Forums on thermal packaging and the project leader for more than ten research projects. His current interests include thermal management and electronics packaging.

    Related authors

    Related to Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

    Titles in the series (13)

    View More
    View More

    Related ebooks

    Materials Science For You

    View More
    View More

    Related podcast episodes

    Related articles

    • Article

      Tech At Its Best

      Jul 25, 2020

      Tech At Its Best
      2 min read

    • Article

      PEOPLE & POINTS

      Dec 15, 2022

      China’s Liu Shiwen and India’s Sharath Kamal Achanta were elected as joint chairs of the International Table Tennis Federation (ITTF) Athletes’ Commission ahead of the ITTF Summit in Amman, Jordan, on December 2. Liu, 31, was a member of China’s gold

      3 min read

    • Article

      A Highland of Vitality

      Jun 8, 2023

      Launched at the 2023 Zhongguancun Forum in Beijing in late May, China’s new-generation quantum computing cloud platform Quafu is capable of more than just performing complex computations for scientists. Its introduction makes quantum computing access

      4 min read

    • Article

      Fab Jobs

      May 26, 2023

      Fab Jobs
      8 min read

    • Article

      Scientific Peaks

      Jan 23, 2020

      For more than two decades, Zhou Qilin, a professor at Nankai University, has kept a rigid and tight work schedule. Six days of the week, he arrives at the laboratory between 7 and 8 a.m., and stays until about 8 p.m., devoting himself to chiral chemi

      4 min read

    • Article

      The Power of Joining Hands

      Jul 13, 2023

      Two years ago on July 20, a maglev train with a designed speed of 600 km per hour—the fastest land vehicle available globally—rolled off the production line and made its public debut in the coastal city of Qingdao, Shandong Province. The achievement

      4 min read

    • Article

      Japanese Paper Art Could Let Electronics Stretch Out

      Apr 4, 2018

      Kirigami, a variation of origami that involves cutting folded pieces of paper, has inspired researchers’ efforts to build malleable electronic circuits. Their innovation—creating tiny sheets of strong yet bendable electronic materials made of select

      1 min read

    • Article

      Invest In The Best Of Asia’s Innovators

      Jan 21, 2022

      Asia is home to a wealth of innovative businesses generating valuable intellectual property. This often translates to defensible economic moats and higher profitability. At Cerno Capital, we look for companies in structurally growing industries provi

      2 min read

    • Article

      The Hidden Yet Indispensable Value Of Monozukuri

      Aug 6, 2021

      In English, the Japanese word ‘monozukuri’ can be translated as ‘making things’. And it’s fair to say Japan has excelled at making things since the postwar boom that turned the country into one of the world’s industrial powerhouses. But monozukuri me

      6 min read

    • Article

      Celebrating Today’s Engineers

      Jun 10, 2018

      Celebrating Today’s Engineers
      2 min read

    • Article

      Budding Disruptors

      Dec 17, 2021

      Budding Disruptors
      6 min read

    • Article

      Learn, Think, Create

      Jul 18, 2019

      Engineering graduates are more employable than MBAs according to the India Skill Report 2019. To scale the tough competition for JEE Main (Joint Entrance Examination) demands unwavering focus and dedication from engineering aspirants, and to be emplo

      5 min read

    • Article

      The Future Of Fencing

      Dec 1, 2021

      Like many of the best ideas, the simple ones are often the most complex. A fence batten is ostensibly a straightforward bit of kit. Creating a more durable, but flexible, alternative has involved years of think tanking, research and development, but

      6 min read

    • Article

      Driving Force

      Jun 24, 2023

      Driving Force
      3 min read

    • Article

      Stretchy Liquid Metal Material Could Improve Wearable Tech

      Oct 23, 2023

      A super flexible, self-healing, and highly conductive material suitable for stretchy electronic circuitry could significantly improve the performance of wearable tech, soft robotics, smart devices, and more. Imagine a stretchable and durable sensor p

      2 min read

    • Article

      Here’s A Feasible Way For Our Devices To Send Data With Light

      Apr 25, 2018

      Researchers have developed a method to fabricate silicon chips that can communicate with light and are no more expensive than current chip technology. The new microchip technology capable of optically transferring data could solve a severe bottleneck

      3 min read

    • Article

      ‘The Silk Road’: How Do You Take Technology out of the Lab and Into the World?

      Oct 11, 2017

      How to take discoveries out of the lab and into the lives of patients was the subject of the HUBweek panel discussion in the Ragon Institute’s auditorium.

      2 min read

    • Article

      Engineering Marvel

      Aug 5, 2023

      Engineering Marvel
      3 min read

    • Article

      A Super Brain

      Mar 9, 2023

      It was the year 2005. Six researchers were in a classroom of the University of Science and Technology of China (USTC) in Anhui Province, busy working toward their dreams as pioneers of quantum computing. As there was only one computer available to th

      5 min read

    • Article

      About the Author

      Jan 25, 2021

      Yan Pang received his PhD degree in System Engineering from National University of Singapore (NUS) joint with Massachusetts Institute of Technology (MIT) in 2006, and his Master Degree and Bachelor Degree in Mechanical Engineering from Zhejiang Unive

      1 min read

    • Article

      Young Scientists Off To Beijing

      Mar 30, 2024

      Young Scientists Off To Beijing
      2 min read

    Related categories

    Reviews for Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

    0 ratings

    0 ratings0 reviews

    What did you think?

    Tap to rate

    Review must be at least 10 words