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    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
    Unavailable
    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
    Unavailable
    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
    Ebook833 pages5 hours

    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

    By E-H Wong and Y.-W. Mai

    ()

    Currently unavailable

    Currently unavailable

    About this ebook

    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

    The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

    The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

    • Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
    • Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
    • Includes program files and macros for additional study
    LanguageEnglish
    PublisherElsevier Science
    Release dateMay 23, 2015
    ISBN9780857099112
    Unavailable
    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

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