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Multilayer PCB Image Transfer Technology II

Charles Kao, Ph.D Tel: 02-2601-0700 Mobile: 0939-268-725 cckao@csun.com.tw

V2.1 2007/4/10

2004/4/5

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Annular Ring

1 2

Through Hole

Dielectric

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/ V-Cut

AOI H

Multi-Layer Process
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AOI
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Artwork
( ( ) (Glass Photo-mask) )

CAD/CAM (Gerber File) PCB Layout Tooling Holes Date Code


X: 1.000225, Y: 1.000625

H Ex. L/S: 4.5/3.5 (


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7 mil

p
< 1500 < 800

Kodak ARX7 20rC, 50%RH : 0.0018% / rC : 0.0009% / %RH

Film Liquid - 3M,

Artwork Punch
pin

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Barco/SilverWriter

2004/4/5

: 4000~25400 dpi : 18"x24", 28"x 32" : < 0.16 mil, 4 Qm : < 0.08 mil, 2 Qm : < 0.5 mil, 12.7 Qm : < 0.58 mil, 12.7 Qm Throughput: PCB 18"x24", 4000 dpi, 2 min/pcs : 7 mil : 18"x24"~28"x 32"( ) : 20"x24", 20"x26", 22"x26", 22"x28", 24"x28", 24"x30" 9/58

Kodak ARX7

Toolings

Artwork
Pin

/Pad

SMT x3

Coupon

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Inner Layer Image Transfer & Lamination


H

+
AOI

+ +
PP

X-Ray

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Print and Etch

H
Dry Film Lamination Roller Coating

1.0,1.3 mil liquid film 10~15Qm Mylar


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H 45~60 mj/cm2 H 80~120 mj/cm2


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PCB -Cu CCL

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- Resolution
Resolution
L/S = 3/3 mil s 0.45 mil L/S Tolerance
Conventional s20% Impedance control s15%, s10%, s7.5%

Resist
Thickness Thick uniformity

Exposure
Energy uniformity s10%, s 5% Light angle: CHA + DA

H Developing Ex. 1 oz Cu: 4/4 5/3 Break point position Ex. 0.5 oz Cu: 3/3 3.5/2.5 Uniformity Error Budget Example Etching Uniformity Artwork
DPI resolution Positioning error Compensation factor error 15/58 Etching time Etching factor

2004/4/5

- Registration
Registration
Requirement: Align Top and Bottom side patterns Specification:
4 Layer PCB: < 1mil 6 Layer PCB: < 0.5 mil

Error Budget
Artwork target position error
Plotting error Distance shrinkage error

Alignment mark Position:


On far left and right along center line of artwork

Manual alignment
Solid cross and edge

Automatic alignment
Solid circle and Ring
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CCD capture error (back light angle) Image processing software error Mechanical adjustment error Exposure error


H : : 1.0, 1.3 mil 8 ~ 12 Qm

Exposure
: 45 ~ 60 mj/cm2 : 80 ~ 120 mj/cm2 UVE-M500, M550, UVE-A220, A280


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Holding
15 min

Mylar

Developing
1 ~ 2% Na2CO3 / 30 ~ 32 rC (Break Point) 50 ~ 75% (Scum)

DES

H
CuCl2 FeCl3

Etching
H H ( )

Stripping
3 ~ 5% NaOH 45 ~ 55 rC

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Etch Progression
Etch 3/3 on 1 oz Cu
Undercut = (R-T)/2 Etch factor=2t/(B-T) Extent of etch = R/B

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H
Etch 3/3 on 1 oz Cu Spec: 3/3 s 0.45 mil (15%)
Etch time Top Bottom Mid mil 90 s 2.9 110 s 2.4 125 s 2.1 140 s 1.95 165 s 1.5 mil 6.0 4.0 3.3 3.0 2.4 mil 4.45 3.2 2.7 2.48 1.95 Bottom Under Etch Space cut factor mil 0.0 2.0 2.7 3.0 3.6 0.05 0.30 0.45 0.525 0.75 0.90 1.75 2.33 2.67 3.11
Unit: mil
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Extent of etch 0.50 0.75 1.1 1.0 1.25

H
1995~1996 / 175 m 7 mil 50 m 2 mil 3 (Y/X) 50 m 2 mil 125 m 5 mil 35 m 1.4 mil 4 50 m 2 mil 1997~2000 / 125 m 5 mil 25 m 1 mil 3 50 m 2 mil 75 m 3 mil 10 m 0.4 mil 4 50 m 2 mil 2001~2010 / 100 m 4 mil 25 m 1 mil 4 50 m 2 mil 50 m 2 mil 15 m 0.6 mil 5 25 m 1 mil

Attribute

H Core

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Pre-Treatment
Scrubbing
p Now ,

Pumice Pumice

H
, , H2SO4+H2O2 H Micro Etch

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CSL-A25T Dry Film Laminator


Automatic cut sheet laminator PCB:
Max. width: 24t Thickness: 0.05~3.2 mm

Capacity:
3 m/min for outer layer 2.5 m/min for inner layer

Induction heater
Up to 120 s 3 rC

Outfeed temperature sensor Option: 1000 ft dry film


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Pre Heat
40 ~ 50 rC

Dry Film Lamination


Tacking 45~50 rC 100 ~ 120 rC 3 ~ 5 Kg/cm2 2 ~ 3.5 m/min CSL-A25, CSL-M25

Cooling
10 ~ 15 min

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Horizontal Roller Coater Line


For inner layer liquid photo resist coating Capacity: 6 ~ 8 pnl/min Speed: Max. 4 m/min Drying zone: IR with HotAir, Class1000 Coating thickness:
8~12 Qm s 1 Qm

PCB:

Max. width: 24 Thickness: 0.1 ~ 1.6 mm Temperature: 100 s 3 rC


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Roller Coating
Roller Coating 8~12 Qm

Oven
Roller Oven IR PCB

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UVE-M500

5KW Mylar
2004/4/5

: 740 x 610,
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:85%

UVE-A220

CCDx2 n

CCD CCD PCB


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pin

x2

2004/4/5

UVE-A220/A280

PCB Layout

PCB

: 23.5 x 26.5t : J 1 mm : J 1.4~2 mm

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Open/Short AOI Automatic Optical Inspection
Inline Off-Line

L/S, , Registration

Co-circle and target hole

Nik , Open Pin hole


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Outer Layer Image Transfer


Tenting

H 0.7 mil

10~12 Qm H 0.3 mil 1 mil AOI

2004/4/5

: : :

(PTH: Plate Through Hole) (Panel Plating) (Pattern Plating) 34/58

Drilling

, PCB 3 or 4 , : , ,

2~3

Pin p Pin p p p Pin p , , J3.175 mm=125 mil 4000 /ft2 Spindle , 8~16 rpm 2 / , 7~8K /hr, 2000 Ex. , 6 spindles, 24 panel/cycle

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Make Holes Conductive

Debur Desmear

KMnO4 NaMnO4

Copper Plating
Panel Plating 0.3 ~ 0.5 mil

Plasma

PTH, Plate Through Hole

Throwing Power
/

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Pd p Electroless Copper ~0.03 mil 36/58

Pattern Plate

)
H

Dry Film Lamination

H
1.3, 1.5 mil

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- Resolution
Resolution Error Budget Example
L/S = 3/3 mil L/S Tolerance
Conventional s20% Impedance control s15%, s10%, s7.5%

Exposure
Uniformity Light angle

Developing Cu Plating
Uniformity

Artwork
DPI Compensation

Cu Etching
Uniformity Etching factor

Resist
Thickness

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- Registration
Registration
Requirement:
Align circuit pattern to via holes

Automatic alignment
Solid circle and Hole

Error Budget
Artwork/PCB pitch error
Dimensional stability

Specification: Ring
+5 mil ring: < 2 mil +3 mil ring: < 1 mil

PCB via drill error


Small via vs Big via 2 ply, 3 ply or 4 ply drill

Alignment mark Position:


2 marks at center line of artwork 2 marks at diagonal of PCB 4 marks at 4 corners of PCB

Exposure alignment error


CCD back light error CCD software error XY table positioning error

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Attribute

1995~1996 / 175 m 7 mil 40 m 1.6 mil 125 m 5 mil 20 m 0.8 mil

1997~2000 / 125 m 5 mil 30 m 1.2 mil 75 m 3 mil 15 m 0.6 mil

2001~2010 / 100 m 4 mil 25 m 1 mil 50 m 2 mil 5 m 0.2 mil

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Dry Film Lamination


1.3, 1.5 mil

Exposure
45 ~ 70 mj/cm2 CCD 20 Qm UVE-A250, A800

Developing
1 ~ 2% Na2CO3 /

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Copper Plating
Pattern Plating 0.5 ~ 0.7 mil 1 mil ~ 1010 Amin Ex. 20A, ~50 min

Tin/Lead Plating
,

I Cu + II Cu: 1.0 s 0.2 mil 1 mil

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Stripping
3 ~ 5% NaOH 45 ~ 50 rC

SES

Etching
H ( ( ) )


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Tin/Lead Stripping

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Attribute

1995~1996 / 200 m 8 mil 40 m 1.6 mil 0.3 (X/Y) 150 m 6 mil 20 m 0.8 mil 0.25

1997~2000 / 150 m 6 mil 30 m 1.2 mil 0.3 100 m 4 mil 15 m 0.6 mil 0.25

2001~2010 / 100 m 4 mil 20 m 0.8 mil 0.3 75 m 3 mil 15 m 0.6 mil 0.2

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UVE-M565
HEPA

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UVE-M565

s10 Qm
2004/4/5

s 25 Qm
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UVE-M565

PCB Layout

: 669x592 mm : J 1 mm : J 1.4~2 mm PCB : J 3.175 mm PCB Pin :J 3.175 mm


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UVE-A800

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UVE-A800

CCD

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UVE-A800

PCB Layout

: 570 x 650 mm : : J 1 mm PCB : J 3.175 mm

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L/S

Annular Ring
Ex. +5mil ring

Via

Accept min. 1 mil ring = 5 2 (drill error) 2 (exp error)

, Ring

Short

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Surface Finish & Final Fabrication


H V 2nd 2nd UV 3M

1st 1st UV

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Pad min. D

pad
a b

Accuracy = (a-b)/2
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<0, >0, =0,


Post cure Ex. 0.8 mil + 4 mil Solder Mask Over Bare Copper

SMOBC

Liquid Photoimageable Solder Mask

UV


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Screen Printing Curtain Coating Spray Coating Roller Coating


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Pre Cure (Tack Dry)
75rCs1rC, 25 min 75rC, 35 min 75rC, 45 min 2H, SMO-7A/8A CCO-7-6, 8

Post Cure
150rC s3rC, 60 min 6~8H SMO-7A/8A CCO-7-12

Exposure
400~600 mj/cm2

UVE-M720

UV
/ ( UVC-754MD )

Developing
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Na2CO3 1%, 30 rC 4H 2004/4/5

UVE-M720

7KW Mylar
2004/4/5

: 810 x 610,

:85%

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