Integrated Circuits

Introduction
Integration allows complex circuits consisting of thousands of transistors, diodes, resistors and capacitors to be included in a chip of semiconductor. Advantages of integration includes: Low cost (many identical circuits can be built simultaneously on a single silicon wafer. this process is called batch fabrication. Although processing steps for wafer are complex and expensive, the large number of resulting IC makes the ultimate cost fairly low). Reliability (all devices and interconnection are made on the same substrate minimizing failures due to soldered interconnections of discrete components). Reduces the overall size of the unit. Feasible to replace. Better response time and the speed of signal transfer between the circuits. Reduction of parasitic between circuits. High yield.

Types of integrated circuits

ICs can be classified in two ways: may be on the basis of their fabrication(monolithic and hybrid) or the basis of their applications (linear and digital). Linear IC performs amplification or other linear operations on the signals. e.g op-amps and simple amplifiers. Digital IC require only on-off operation of transistors. They involve logic and memory. They find application in calculators, computers etc. IC that are included entirely on a single chip is called monolithic IC. A hybrid IC may contain one or more monolithic IC bonded to an insulating substrate with appropriate interconnections.

nMOS process Integration

TESTING, BONDING AND PACKAGING

The handling and packaging of individual circuits can be most critical steps from the viewpoints of cost and reliability. The individual IC chip must be connected properly to outside leads and packaged in a way convenient for use in larger circuits.

Testing
After the wafer of monolithic circuits has been processed and final metallization pattern defined, it is placed in a holder under microscope and aligned for testing by multiple point probe. A series of tests are made to check electrical properties of device. The information is fed into the computer which compares the result with information stored in its memory, and a decision is made regarding the acceptability of the IC. Then each die that passed the test is picked up and placed in a package.

Bonding
The method used for making contacts from monolithic chip to the package was bonding of fine Au or Al wires. If a chip is to be wire bonded, it is first mounted solidly on metalized region of the package . Once the chip is mounted, the interconnecting wires are attached from various contact pads to posts on the package.

 Packaging
The final step in IC fabrication is packaging the device in a suitable medium that can protect it from the environment. The choice of package types must be made within the requirements of the application and cost considerations. The chip is mounted on a stamped metal lead frame and wire bonding is done between chip and the leads. The package is formed by applying a ceramic or plastic case.

IC packages