Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Direction
Dr. Hazizan Md Akil School of Materials and Mineral Resources Engineering Engineering Campus, USM.
The fundamentals of thermosetting polymer processing Commercial thermosetting polymers Applications of thermosetting polymers Recent development in thermosetting polymer applications Future outlook
References Handbook of Thermoset Plastics Second Edition, by Sidney H. Goodman Organic polymer chemistry, Saunders
Preparation, properties, application Epoxy resin (Epon, DER etc) Phenolic resin Melamine formaldehyde Urea formaldehyde Polyester resin Unsaturated polyester
Applications
Applications of Thermosetting polymers Engineering components Adhesives Sealants Foams Building and construction Aerospace
Recent Developments
General characteristics
Once shaped into a permanent form, usually with heat and pressure, a thermosetting plastic cannot be remelted or reshaped because the basic polymeric component has undergone an irreversible chemical change The operation by which the raw material is converted to a hard, insoluble and infusible product is referred to as cure (or curing) and corresponds to the final step of the polymerization reaction.
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Hand lay-up (Liquid resin) Vacuum Bagging (Liquid resin) Autoclave (Laminated/prepreg) Vacuum oven (Liquid resin) Vacuum Infiltration (Liquid) Spray forming (Foam/coating) Transfer/compression moulding Vacuum forming (Prepreg)
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Processing parameters
***Since these parameters vary broadly with types of resin and hardener used, each parameter will be discussed separately for each system***
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Crosslinking
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Crosslinking (contd)
Most of the crosslinking reactions are initiated by freeradicals Free redicals are generated through thermal or photo decomposition of peroxides, hydroperoxides, azo and diazo compounds. The use of initiator (hardener) is strongly dependent on the types, fabrications and applications of the particular resin
***Since crosslinking agents and reactions are vary broadly with types of resin and hardener used, typical reaction and their mechanism will again be discussed separately for each type of resin***
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Epoxy resin
History/Introduction
Developed independently by Ciba AG (1943) 50% used for surface coating Other applications include circuit boards, carbon fibre composites, electronic component encapsulations and adhesives At present, 80-90% of commercial epoxy resins are prepared by the reaction of Bisphenol A and Epichlorohydrin.
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Phenol
Bisphenol A
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Tertiary Amines: Benzyldimethylamine (BDMA) 2-(dimethylaminomethyl)phenol (DMAMP) 2,4,6-tris(dimethylaminomethyl)phenol (TDMAMP) Triethanolamine N-n-butylimidazole
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Their structuress:
DMAMP BDMA
TDMAMP
Triethanolamine
N-n-butylimidazole
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Polyfunctional amines Diethylenetriamine (DTA) Triethylenetetramine (TET) m-Phenylenediamine (MPD) 4,4-diaminodiphenylmethane (DDM) 4,4-diaminodiphenylsulphone (DDS)
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Their structures:
DTA TET
DDM MPD
DDS
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