PAI

SPECIALTY PLASTICS
Polyamideimide (PAI)

CORPORATE TRAINING AND PLANNING

 PAI
Structure

O O
O O
C C R N C C
N
R N N R
C C
H H
O O

Polyamideimide

CORPORATE TRAINING AND PLANNING

 PAI

Polyamideimides were introduced in

1964 and the range includes molding
compounds, electrical insulating and
stoving lacquers, films and fibers.

The original manufacturer of molding

compounds of interest to designers was
Amoco (US).

CORPORATE TRAINING AND PLANNING

 PAI
Manufacture

This product group consists of polyimides

formed by polycondensation of imide chains with
aromatic diamines.

Torlon is manufactured by phosgenation of

trimellitic anhydride and reaction of the acid
chloride with 4,4'-diaminophenyl methane in N-
methyl pyrrolidone at room temperature.

The resultant polyamide acid is cyclized to

polyamideimide.

CORPORATE TRAINING AND PLANNING

 PAI
General Description
• Normal molecular weight PAI cannot be melt
processed by injection molding/extrusion because of
very high viscosity

• To enable these processes to be used, the material is

supplied with reduced molecular weight.

• The melt viscosity of PAI as supplied is so low that

thin walled injection moldings are possible.

• Because the moldings are still thermoplastic after

injection molding, i.e. prior to post treatment, scrap
such as sprues, rejects, etc. can be recycled.

CORPORATE TRAINING AND PLANNING

 PAI
General Description
• PAI melts polymerize further above 246 °C.

• Since these molding compounds are processed

at about 350 °C, post-polymerization occurs.

• Although process ability is not generally

affected adversely, the already starting
polymerization limits the residence time of
the melt in the plasticizing cylinder and
recycling of scrap.
• Even post heat-treated PAI is still somewhat
thermoplastic but the melt viscosity is so
high that it cannot be plasticized again.
CORPORATE TRAINING AND PLANNING
 PAI

Structure and General Properties-1

The imide content imparts high stiffness,

hardness and flame retardance while the
amide groups effect flexibility and
ductility and melt process ability of this
polyamide imide.

CORPORATE TRAINING AND PLANNING

 PAI

Structure and General Properties-2

Polyamideimides are characterized by the

following properties:
- high strength between - 190 & + 260 °C,
- high impact strength,
- high dimensional stability (amorphous
thermoplastic),
- high fatigue limit (JBW = 56 N/mm2),
CORPORATE TRAINING AND PLANNING
 PAI

Structure and General Properties-3

- high heat distortion temperature (265 to 280°C),

- low coefficient of linear expansion (6x10-6 to
20x10-6 K -1),
- very good dielectric properties,
- high chemical resistance (except to strong
- alkaline solutions, oxidizing acids, nitrogen
- containing solvents, superheated steam above
160 °C).
- resistant to stress cracking media,
CORPORATE TRAINING AND PLANNING
 PAI
Structure and Properties -4

- flame retardant (V-0), low emission of smoke

and toxic gases,
- resistant to oxidation,
- resistant to high energy radiation,
- high UV stability,
- low outgassing losses in high vacuum,
- can be bonded,
- can be metallized by conventional methods.

CORPORATE TRAINING AND PLANNING

 PAI

Designers and processors must note the

following:
- the relatively high melt viscosity limits the
size of injection moldings,
- high pressures and injection speeds are
required for injection molding,
- pellets must be predried,
- injection molds must be preheated to
between 200 and 260 °C,
- moldings must be post heat treated.
CORPORATE TRAINING AND PLANNING
 PAI
Availability

The range includes the unmodified grades

and other injection molding and extrusion
compounds with fillers and/or
reinforcements. PTFE and graphite filled
grades are available.

PAI is supplied as pellets for injection

molding.
CORPORATE TRAINING AND PLANNING
 PAI
Mechanical Properties-1
Short-term Behavior at Low Rate of Deformation:
At room temperature, PAI do not exhibit a yield
point.

Even at 204°C, the flexural strength of the PAI

grades selected is superior to that of well known
high temperature resistant thermoplastics and
even polyimides.

The high level of mechanical properties of PAI is

retained even after extended annealing at 250 °C.
CORPORATE TRAINING AND PLANNING
 PAI
Mechanical Properties-2

Creep Behavior Under Uniaxial Stress:

PAI is very creep resistant. It reacts to high
mechanical stresses more like metals than plastics.
Glass fiber reinforced PAI are suitable for high
mechanical and thermal stresses.
Behavior at High Rate of Deformation:
The impact strength of PAI is superior to that of
other high-performance plastics.

Behavior Under Vibration:

PAI exhibits a high fatigue limit which is
maintained up to about 170 °C.
CORPORATE TRAINING AND PLANNING
 PAI
Mechanical Properties-3

Friction and Wear Characteristics:

The frequent use of PAI, especially the
graphite and PTFE-filled grades for
manufacturing bearings is based on the low
wear of this material even in dry running.

All PAI moldings must be subsequently heat

treated. The wear factor K is significantly
affected by this post-treatment. Maximum
wear resistance is achieved after more
than eight days at 260 °C.

CORPORATE TRAINING AND PLANNING

 PAI
Electrical Properties
• PAl exhibits excellent electrical &
dielectric properties.

• The conductivity of PAI can be

increased by the addition of graphite.

• Material reinforced with 30% w/w

carbon fiber is used to shield
components from electromagnetic
interference (EMI).
CORPORATE TRAINING AND PLANNING
 PAI
Water Absorption

In humid atmospheres or when immersed in water,

PAI absorbs small amounts of moisture.

The maximum amount of water absorbed (5% w/w)

is reached after about three months immersion at
90°C. The absorbed water is rapidly given off
again by warming the molding to temperatures
between 120 and 175°C.
The dimensions of the molding alter on absorption
of water and the dimensional stability at high
temperatures falls.
CORPORATE TRAINING AND PLANNING
 PAI
Weathering Resistance
PAI exhibits excellent UV and thus weathering
resistance.

Resistance to High Energy Radiation

PAI is very resistant to radiation.

Flammability
PAI is distinguished by low smoke emission in
fires. The flame temperature is 570 °C, The
oxygen index varies between 44 and 52%
depending on grade.

CORPORATE TRAINING AND PLANNING

 PAI
Processing -1
• PAI has a high melt viscosity and is reactive in the
melt state. This prevents the use of increasing
temperature to decrease viscosity.

• PAI is best fabricated with heavy duty, high rate

injection-molding equipment. The high rate is
preferentially obtained by use of hydraulic
accumulators.

• PAI is shear sensitive and low compression screws

are recommended.

• Prior to injection, compression or transfer molding,

PAI must be dried for about 16 hours at 150 °C or, in
the case of injection molding granules, for about 8
hours at 180 °C. CORPORATE TRAINING AND PLANNING
 PAI
Processing-2

At low shear rates, the viscosity of the PAI

melt is very high.
At higher shear rates it approaches those of
polycarbonate and ABS. Thus complicated
injection mold cavities can be filled at high
injection speed with relatively low injection
pressure.

The viscosity is not particularly temperature

dependent in the processing range of 315 to
360°C.
CORPORATE TRAINING AND PLANNING
 PAI
Processing-3

Processing conditions are:

• Injection molding:
Melt temperature:336 to 360 °C
Mold temperature:230 °C

• Compression molding:
Molding pressure:35 N mm-2
Mold temperature:345°C
Preheating is required.
CORPORATE TRAINING AND PLANNING
 PAI
Processing-4
Finally, post cure is an important step in
processing PAI.

• PAI moldings must be heat treated. The

temperature is maintained at 245 °C for
24 hours and then raised to 260°C over 24
hours.

• Components subject to wear should be

kept at this temperature for 5 days to
increase wear resistance.
CORPORATE TRAINING AND PLANNING
 PAI
Surface Finishing

Of all the current metallizing processes such as

electroplating, plasma spraying, ion plating and
vacuum metallizing, only the last is unsuitable.

The moldings are first pickled, then washed,

catalytically treated, activated, chemically
nickel plated, then electroplated and dried.
Electroplating is performed only prior to heat
treatment

CORPORATE TRAINING AND PLANNING

 PAI
Joining
Bonding PAI moldings can be bonded using adhesives
based on amide-imide. Such joins can be mechanically
stressed and are resistant to heat and chemicals.
Suitable adhesives can be prepared by, for example,
dissolving PAI in n-methyl pyrrolidone (35% solution).

The surfaces to be joined must be free of grease and

clean and fit closely together. Roughening increases
the bond strength. After applying the adhesive and
pressing the parts together, they are kept at 175 to
190 °C for 30 minutes. Temperatures of 230 to 245 °C
are used for wall thicknesses greater than 10 mm.
epoxide resins and cyanoacrylate adhesives are also
suitable although their physical and chemical
limitations should be taken into account.
CORPORATE TRAINING AND PLANNING
 PAI
Typical Applications-1

• PAI glass reinforced resin grade is

characterized by high strength and high
modulus.

• It has a very high strength to weight ratio

allowing it to replace metal in compressors
and in aerospace applications, including
housings, structures, and equipment boxes.

• PAI is used successfully for load bearing

components exposed to temperatures up to
260°C. Stresses are mainly mechanical
and/or electrical.
CORPORATE TRAINING AND PLANNING
 PAI
Typical Applications-2
• Components subject to electrical/dielectric
stresses include connector insulating
components of special grades of PAI for
the aerospace industry and coil formers
and for seismographs.

• Moldings subjected mainly to mechanical

stresses include cam switches, vanes for
hydraulic & pneumatic motors, bearings and
housings for petrol consumption gauges for
the automotive industry, cover frames for
office machinery, slide rings.
CORPORATE TRAINING AND PLANNING
 PAI
Typical Applications-3

Parts for military aircraft, automotive

transmissions and off-highway equipment – including
hydraulic parts, seal rings, washers and bushings –
can last longer when made from PAI because these
resins combine incredible wear resistance with
other long-life benefits like toughness, thermal
performance and chemical resistance. Plus they’re
injection moldable, so fabrication can be easier and
less costly than machining metal parts.

CORPORATE TRAINING AND PLANNING

 PAI

Seals
Chip net

Bearing cage

Electrical connector Can mandrel

CORPORATE TRAINING AND PLANNING

 PAI

Typical Applications-4
• Precision components made from PAI are
virtually indestructible, making them a
strong performer for demanding
electronic handling operations.

• Test sockets molded from PAI are used

to protect delicate devices during robotic
handling and high-speed, high-force
compression into electrical test sockets.
CORPORATE TRAINING AND PLANNING
 PAI

CORPORATE TRAINING AND PLANNING

 PAI
Typical Applications-5
• Testing units for printed IC boards must be
sealed to maintain test temperatures from -50°C
to 150°C. Seal adapters machined from PAI can
provide better dimensional stability for a tighter
seal fit and offer longer part life than
traditional materials.

• PAI resin is also a major player in coating

applications, due to its outstanding surface
adhesion to a multitude of materials including
metals and polytetrafluoroethylene. PAI
dissolved in polar solvents is used to make high
temperature resistant wire lacquers and
adhesives.

CORPORATE TRAINING AND PLANNING

 PAI

Trade Name

Torlon (Solvay, US)

CORPORATE TRAINING AND PLANNING

 PAI
Further Reading

1. BRYDSON, J.A, Plastics Material, Butterworth

Heinemann, oxford, New Delhi (2005)

2. DOMININGHAUS.H, Plastics for Engineering,

Hanser publishers, Munich, New York (1998)

3. CHARLESS A . HARPER, Modern Plastics Hand

Book McGraw –Hill, New York (1999)

CORPORATE TRAINING AND PLANNING

 Table -1 Guide values of properties of PAI
PAI
Properties Units PAI
(Glass Filled)
Density g/cm3 1.38 1.56
Water absorption (23°C, 24h) % 0.33 0.24
Mechanical
Tensile strength N/mm2 190 205
Elongation at break % 15 7
Notched impact strength J/m 142 79
Service temperature in air short-term °C 300 300
without mechanical loading long-term °C 260 260
Heat deflection temperature °C 278 282

CORPORATE TRAINING AND PLANNING

 Table -1 Guide values of properties of PAI

PAI
Properties Units PAI
(Glass Filled)
Coefficient of linear expansion between 0 &
mm/mm/°C 31 16
50 °C
Thermal conductivity W/mK 0.26 0.37
Electrical
Volume resistivity Wcm 2 x1015 2 x1015
Surface resistance W 5 x1018 1x1018
Dielectric constant 4.2-3.9 4.4-6.5
Dissipation factor, tan d 50 Hz 0.026-0.03 0.022-0.023
Dielectric strength kV/mm 23 33
Fire performance to UL 94 class V-0 V-0

CORPORATE TRAINING AND PLANNING