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• super capacitors
THIN FILM DEPOSITION TECHNIQUE
•Deposition
•Drainage
•Evaporation
DIP COATING TECHNIQUE
CHEMICALS USED
Copper chloride( ) - 170.48g
Triethylamine(TEA)
1 5 30 3
C1
C4
2 20 30 3
Sl. No. of Tempe Dip
No dips rapture duration Thin film photo
c)
CUS1
1 5 40 3
2 20 40 3 CUS4
No. of dips Tempe Dip
Sl. rapture duration Thin film photo
No c)
1 5 50 3 CU1
2 20 50 3 CU4
VARYING DIP DURATION
Sl. No. of Tempe Dip
No dips rature duration Thin film photo
c) (min)
CU3
1 15 50 3
3 15 50 7 CUSA2
Zn DOPED CuS FILMS - BATH
Firstly 7ml of 1M copper (II) chloride solution was mixed with 2ml
of TEA and 20ml of ( ) ammonium hydroxide.
After that 15ml of 1M NaOH solution and zinc sulpahte
heptahydrate (say 0.1ml) was mixed into the solution. Ultimately
9ml of thiourea was added and distilled water was added to make
it to 100ml. Thus chemical bath for Zn doped CuS thin film
preparation is done.
Sl.no No. of Amount of Tempera Thin film
dips dopant ture
(ml) _)
1 20 0.5 50 Cuz1
2 20 1 50 Cuz2
5 20 5 50 Cuz5
RESULTS
• The thin film variation did by changing no. of dips gives us a
result that as no. of dips increases we get more dense and
homogenous films.
15 dip
320
temperature (kelvin)
315
310
305
300
66 >200 >200
resistance (Mohm)
KΩ
temperautre
325
20 dip
320
temperautre (kelvin)
315
310
305
300
35 200 >200
resistance (Mohm)
KΩ
molarity
Zn doped CuS
3.0
2.5
A
M
2.0
molarity (M)
O
U
N 1.5
T
1.0
0.5
6 8 10 12 14 16 18 20
KΩ
Resistance (Mohm)
CONCLUSION
The CuS thin film was prepared by applying
varying conditions such as changing the no. of dips, the film
temperature and dip duration, The films show less electrical
resistivity as the temperature and no. of dips increases.
THANK you