Huawei FusionServer RH8100 V3

Technical Presentation
www.huawei.com

HUAWEI TECHNOLOGIES CO., LTD.

Agenda

1 Click to add Title

Market Segments

2 Click to add Title

RH8100 V3 Introduction

3 Click to
RH8100 V3 Feature add Title
Highlights

4 Global References

www.huawei.com • Huawei Confidential 1

Typical Application Scenarios

Business Large Scale

Intelligence Virtualization

In-Memory In-memory
Database reliability and u ptime
+
+99.99% scalability

Computing

www.huawei.com • Huawei Confidential 2

Mission Critical Server Milestones

 Hot-plug Memory

 SPECint and SPECfp No.1

 SPECvirt_SC2013 No.1
Huawei NC Chips
 12 SPEC Records 16P/32P servers

RH8100
8P server
Updated to E7 v3 in 2015Q3

RH5885 V3 and
RH5885 V2（8S） RH5885H V3
Updated to E7 v3 in 2015Q3

RH5885 V2（4S）

www.huawei.com • Huawei Confidential 3

The Developments of E7 Processors
2011 2012 2013 2014 2015 Future

Boxboro-EX Brickland
Intel® Xeon® Intel® Xeon® processor Intel® Xeon® processor
Intel® Xeon® processor E7-
processor E7-8800/4800/2800 v2 E7-8800/4800/2800 v3 Future
8800/4800/2800 product families
7500/6500 series product families product families Xeon® E7
(NHM-EX) (WSM-EX) (HSW-EX)
(IVB-EX)

Features E7-8800/4800 (WSM-EX) E7-8800/4800 v2 (IVB-EX) E7-8800/4800 v3(HSW-EX)

Cores Up to 10 Up to 15 Up to 18
Procedure 32 nm 22 nm 22nm
L3 Cache Up to 30 MB Up to 37.5 MB Up to 45 MB
Perf Mode: 1066,1333 MT/s Perf Mode: 1333 , 1600 MT/s
Memory 800, 978, 1066, DDR3 Lockstep Mode: 1066,1333, Lockstep Mode: 1333, 1600,
1600 MT/s, DDR3 1866 MT/s, DDR4
16 DIMMs (2 24 DIMMs/(3 DIMMs/DDR 24 DIMMs/(3 DIMMs/DDR
DIMMs/CPU
DIMMS/DDR channel) channel) channel)

www.huawei.com • Huawei Confidential 4

Agenda

1 Click to add Title

Market Segments

2 Click to add Title

RH8100 V3 Introduction

3 Click to
RH8100 V3 Feature add Title
Highlights

4 Global References

www.huawei.com • Huawei Confidential 5

RH8100 V3 8P Mission Critical Server

• Designed for Mission Critical applications

• Up to 48TB SAP HANA® certification(cluster)
• Maintenance without opening the chassis
• RAS 2.0 technologies , hot-swappable parts

144 Cores 12 TB Memory 24 HDDs 18 PCIe

www.huawei.com • Huawei Confidential 6

Interop Best of Show Award 2015

RAS 2.0 technologies onsite demo, including hot-swappable memory and PCIe

www.huawei.com • Huawei Confidential 7

RH8100 V3 Specification
Form Factor 8U
Front View CPU counts 4 or 8
CPU type Intel Xeon E7-8800 v2 or v3, up to 18 cores/CPU
RH8100 V3 front & back view

DIMM Up to 192 DDR3 or DDR4(with E7 v3) DIMMs，max

6TB(32GB) or 12TB (64GB)
HDD 8, 12 or 24 x 2.5” SAS or SATA HDD or SSD
RAID
RAID0、1、10、5、50、6、60，max 2GB cache
Rear view
PCIe slots Up to18 PCIe slots ( including two for RAID)
LOM Two mezz cards: Max. 8× GE , 4× 10GE or 4x GE+2×
10GE
PSU 220V/110V AC and -48V DC， 1+1 or2+2 redundant
Fan 8 cooling fans, N+1 redundant
Temperature 5℃-40℃

• High reliability：60 RAS features, support memory module hot swappable and hardware partition
Highlights

• 2X performance：Support E7-8800 v2 or V3 processors，up to 144 cores and 12TB memory

• Large local storage：Up to 24 x 2.5-inch HDDs, good for SAP HANA applications
• Easy maintenance： Modular design，Memory, PSU, HDDs fans and (4) PCIe cards are hot-swappable

www.huawei.com • Huawei Confidential 8

RH8100 V3 Front View
CPU & Memory
 8 CPU modules (1 CPU + 2 memory
sub-modules )
 16 hot -swappable memory modules

HDD
 3 optional front modules:
8,12 or 24 HDD s
 Multiple RAID functions

Diagnostics panel

 Touchable LCD panel

 Key components status displaying
 User is able to configure through LCD

www.huawei.com • Huawei Confidential 9

RH8100 V3 Back View
PCIe slot

 Up to 18 （rear: 10, internal: 6,

8 fans 2 for RAID）
 4 slots support hot-swap

Ethernet Mezzanine card

2 management
modules
 Two Ethernet mezz cards
 3 types: 2 GE, 4 GE or 2 x 10GE

PSU

4 PSUs
 94%，platinum PSU
 Support 2 + 2， or 1 + 1
 Support power capping
4 PCIe slots, 6 PCIe slots, not
Ethernet Mezz card
hot-swappable hot-swappable

www.huawei.com • Huawei Confidential 10

E7-8800 v3 Processors

CPU Frequency(GHz) Cores Cache(MB) Power consumption

（W)
2.5 18 45 165
E7-8890 v3
2.3 18 45 150
E7-8880 v3
2.1 18 45 140
E7-8870 v3
2.2 16 40 140
E7-8860 v3

www.huawei.com • Huawei Confidential 11

E7-8800 v3 Processors

Frequency Cache Power Consumption

Processor Cores
(GHz) (MB) （W)

E7-8891 v3 2.8 10 45 165

E7-8893 v3 3.2 4 45 140

E7-8880L v3 2.0 18 45 115

E7-8867 v3 2.5 16 45 165

www.huawei.com • Huawei Confidential 12

Agenda

1 Click to add Title

Market Segment

2 Click to add Title

RH8100 V3 Introduction

3 Click to
RH8100 V3 Feature add Title
Highlights

4 Global References

www.huawei.com • Huawei Confidential 13

Highlights of RH8100 V3

1. 60 RAS features 1. Up to 144 cores 1.Modular design

2. Memory hot swappable 2. Max 12 TB DDR3/DDR4 2.PCIe hot-swappable
3. Fault management 3. Up to 18 PCIe slots 3. Touchable LCD
4. Physical partition 4. 24 x 2.5-inch HDD/SSDs 4. Remote management
5.40°C ambient temperature

 Reliable  Easy
 Performance
maintenance

Reliable & Powerful

www.huawei.com • Huawei Confidential 14

As Reliable as Unix Server

Redundancy 1 Minute
Memory hot-plug Maintenance

Predictive failure analysis

BIOS and management
Modular design

Intel E7 v3 RAS
60+
RAS features
features

RAS 2.0
Technologies 40℃
Environment

www.huawei.com • Huawei Confidential 15

Hot-swappable Memory module

16 x memory modules 8 x CPU module) RH8100 V3 memory module

• RH8100 V3 is made of 8 CPU modules.

• Each CPU modules include 1 x E7

v2/v3 CPU plus 2 memory sub-
modules

• Each memory module has 12 DIMM

slots.

• Support memory hot migration

• Support DDR3 and DDR4

Each CPU module includes

2 memory sub-modules

www.huawei.com • Huawei Confidential 16

How Memory Module is hot-swapped?

Step by Step
High performance Fusion Console

HFC
step1_b: Report to
step1_c: User take Hot-swao
user
action
IVB-EX IVB-EX IVB-EX
step 3：data in memory

MEM-15
is online relocated
MEM-1

MEM-3
New -3

step 4&5：Swap
memory module

step1_a: PFA finds the step 2:

MEM-16

warnings
MEM-2

MEM-4

Sparing memory
module star PCT patent：PCT/CN2013/087XXX
working Applicant：Huawei Technologies Co. Ltd
Subject：A memory data migration method, computer and device
Running Error Sparing
PFA: Predictive Failure
Analysis

www.huawei.com • Huawei Confidential 17

Physical Partition: FusionPar

Hardware Partition-FusionPar
Total Partition-A Partition-B
• RH8100 V3 can be configured as
8 CPU CPU CPU CPU CPU CPU CPU CPU CPU
two 4-socket servers
96 DIMM
192 DIMM 96 DIMM • The users can configure it through
LCD panel or BMC management
6 HDD 6 HDD
12 HDD module
8 PCIe 8 PCIe • A gigabit Ethernet heartbeat
16 PCIe
locates between the two 4-socket

HFC-1 HFC-2
partitions

www.huawei.com • Huawei Confidential 18

Physical Partition: FusionPar

HFC-1 HFC-2 HFC-1 GE- HFC-2

heartbeat

CPU CPU CPU CPU CPU CPU CPU CPU

CPU CPU CPU CPU CPU CPU CPU CPU

Single 8S Two 4S
mode mode

step1: Customer can partition it through BMC web UI or a button on LCD panel
step2: RH8100 V3 would automatically finish the remaining actions

www.huawei.com • Huawei Confidential 19

Hot-Swappable PCIe

Demo 4 x hot-plug PCIe slots

 Four Hot-swappable PCIe slots, No need to reboot the system

 Press the hot-plug button，pull out the riser card in 20 seconds
 Windows Server, Redhat Linux and SUSE Linux support this feature

www.huawei.com • Huawei Confidential 20

Three HDDs Configurations
Flexible Configurations

 Support 8 , 12 or 24 2.5-inch HDDs or SSDs

 Support one or two RAID controllers

FM-A（12 HDD） FM-B（24HDD） FM-C（8 HDD）

www.huawei.com • Huawei Confidential 21

Fault Management System
Feature

• Core: Huawei HI1710 BMC chip

• Predictive Failure Analysis: memory, HDD, Fan, PCIe SSD
• Firmware：BIOS and out-of-band management
• Two ways to set： Web UI and LCD panel
software

www.huawei.com • Huawei Confidential 22

Running in 40°C Ambient Temperature

• Well-designed air path helps take the heat away quickly,

the cooling system is able to dissipate 6000W heat

• Noise Control：Noise level is below 69dBA

Air path in different zones

• Smart Power: Dynamic power monitoring and control

• ASHARE A3： Allowable temperature is from 5 °C to 40 °C,

saving cooling cost
High efficiency, low noise fan

www.huawei.com • Huawei Confidential 23

Higher Performance than Unix Server(Integer)

SPECint_rate_base2006
SPECfp_rate_base2006
7000
5000
6000 5740
3960 3870
4000
5000
4170
4000 3000
2280
3000 2440 2000

2000
1000
1000
0
0 Power 780 Power E880 RH8100 V3
Power 780 Power E880 RH8100 V3

 Power 8，4.35GHz，8 cores/socket，up to 64 cores

 Intel ® Xeon ® E7－8890 v3，2.5GHz，18 cores/socket，up to 144 cores

www.huawei.com • Huawei Confidential 24

Performance of 8S Servers

SPECfp2006 Rate SPECint2006 Rate

4000 3930 5500 5470 5470 5460

3870 3850
3810
3800 5400
5340

3600 5300

3400 5200

5100
3200

5000
3000
RH8100 V3 2800E2 x3960 X6 Superdome X
RH8100 V3 2800E2 Superdome X x3960 X6

 Intel ® Xeon ® E7－8890 v3，2.5GHz，up to 144 cores

www.huawei.com • Huawei Confidential 25

 Agenda

1 Click to add Title

Market Segment

2 Click to add Title

RH8100 V3 Introduction

3 Click to
RH8100 V3 Feature add Title
Highlights

4 Global References

www.huawei.com • Huawei Confidential 26

Global References
Telecom Manufacture Integrator Finance Utility Trade

Saudi STC Finland SAP China ICBC Italy San Matteo Italy
Hospital

Vodafone, Spain Spain Poland S4E People's Bank

China State Grid CTS Hong Kong
of China

China Telecom Singapore Bilot, Oy, Finland Russia Central Bank Kazakhstan Copaco Netherland

www.huawei.com • Huawei Confidential 27

State Grid Scheduling System
 x86 servers are to be used as the core computing
devices to substitute for the existing midrange
computers in the scheduling system.
Needs  The deployment density and computing efficiency
need to be increased, and the investment and
maintenance costs need to be reduced.

 Deploy Huawei blade servers in the intelligent

simulation system to increase the deployment density.
Solution
 Deploy Huawei 4S and 8S x86 servers for the power
scheduling system to provide a high-performance,
high-reliability platform.

 Reduce the TCO by 30%.

 Improve system performance by 15% by using
Benefits customized testing and optimization.
 Provide quick service rollout by using the open,
universal architecture.

www.huawei.com • Huawei Confidential 28

e-Commerce Platform for CTS Hong Kong

Requirements
 An open and universal architecture is required to
reduce the costs.
 The platform must be flexibly scalable to meet E-Business
development requirements for new services.
Application
servers
Solution

 x86 8-socket servers are used to construct a cluster. x86 cluster DB Server
 Based on universal, commercial software, the service substitute for
rollout is fast. midrange
 Rich RAS features ensure high reliability.
computers

Benefits
 The platform TCO is reduced by 50%.
 The system running is stable, and mission-critical "The Huawei x86 servers used for constructing the travel e-commerce
applications run properly. platform greatly reduce the cost, shorten the service rollout time."

www.huawei.com • Huawei Confidential 29

Migrate China Mobile’s Billing System
Challenges
 Low performance: Massive data mining challenges the traditional architecture of RISC
servers and disk arrays.
 Unfeasible IT service transformation: The scale-up centralized architecture is difficult to
expand
 High TCO: High TCO comes with high performance of hardware and software.

Solution
 Huawei high-end 8-socket servers are used to run altered x86 server systems.

 The scale-out architecture is introduced and services are migrated to Linux from AIX.

 Huawei provides x86 servers, which feature low cost and high scale-out, and uses the
cluster, load balancing, etc..

Customer Benefits
 Low TCO: The hardware procurement cost is reduced, expenditure is under control,
and the maintenance cost is reduced by 60%.
 Optimized architecture: Simplified IT system facilitates scalability and a loose-couple
architecture meets service development requirements.
 High performance: Performance of real-time accounting-related services is improved
by more than 50%

www.huawei.com • Huawei Confidential 30

Build an Efficient Chip Simulation Platform

Challenges- Global Foundries

 The existing chip simulation platform provides poor performance that cannot meet
simulation service requirements, impacting chip design verification and test tasks.
 The chip simulation software provides poor concurrent capability and cannot be improved
through distributed deployment. To prevent the simulation process from being interrupted,
each single server must deliver high performance without breakdown.

Solutions- Huawei 8P Mission Critical Server

 The RH8100 V3 provides 6 TB memory capacity and 1.2 TB high-performance ES3000 V2

PCIe SSD cards. It increases the simulation system performance by over 10x by
eliminating data exchange between CPUs and hard disks in the calculation process and
reducing read and write operations on hard disks.

Customer Benefits
 The new chip simulation platform enables the calculation tasks, formerly require one day to
handle, to be completed within 1 hour.

www.huawei.com • Huawei Confidential 31

 Thank you
www.huawei.com

Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved.

The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product
portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive
statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time
without notice.