PHASE CHANGE MATERIALS

(PCM)
Technology overview
General functionality
Common PCMs
Types of use
Design consideration for PCM heat sink module
Common applications
Technology overview
Definition and general functionality
Phase change material (PCM) has
high heat of fusion
melts/freezes at a certain temperature
stores/ releases large amounts of energy

5 to 14 times more heat per unit volume

Temperature maintenance near

the melting point
 A phase change material (PCM) is a substance with a high heat of
fusion which, melting and solidifying at a certain temperature, is
capable of storing and releasing large amounts of energy.

Heat is absorbed or released when the material changes from

solid to liquid and vice versa; thus, PCMs are classified as
latent heat storage (LHS) units
Referring in Computer sense
Phase-change memory (PCM) is a form of computer random-
access memory(RAM) that stores data by altering the state of the
matter from which the device is fabricated.

The structure of PCM material can change rapidly back

and forth between amorphous and crystalline on a
microscopic scale.
Technology overview
Characteristics and Classification
in gas phase transformation large volumes/high pressures are involved

solid solid is very slow and has low heat of transformation

solid liquid is the most convenient type

PCMs with temperature range from 5 up to 190 C are available

Most important are those with transition temperature from 20 to 30 C

Solid-Solid PCM :
Solid/solid phase transition with the associated absorption and release of large
amounts of heat.
These materials change their crystalline structure from one lattice configuration
to another at a fixed and well-defined temperature, and the transformation can
involve latent heats comparable to the most effective solid/liquid PCMs.
Polyurethanes
Temperature
Such materials are useful because, unlike solid/liquid PCMs, range of
they do not require nucleation to prevent supercooling. solid-solid PCM
It is a solid/solid phase change, there is no visible change in solutions spans
the appearance of the PCM (other than a slight from
expansion/contraction). +25 C
to
There are no problems associated with handling liquids, i.e.
+180 C
containment, potential leakage, etc.
Selection Criteria :
Melting temperature in the desired operating temperature range
High latent heat of fusion per unit volume
High specific heat, high density and high thermal conductivity
Chemical stability
Complete reversible freeze/melt cycle
No degradation after a large number of freeze/melt cycle
Non-corrosiveness, non-toxic, non-flammable and non-explosive materials
Economic properties
Low cost
Availability
Technology overview
Common PCMs
Paraffin wax
No undercooling due to self nucleating
Low thermal conductivity in their solid state. High
Properties heat transfer rates are required during the freezing
Compatibility with conventional material of cycle
construction Volumetric latent heat storage capacity can be low
High heat of fusion
Flammable. This can be partially alleviated by
Safe and non-reactive specialist containment
High Repeatability
Cheap and easily available
Technology overview
Common PCMs
Hydrated Salts
Change of volume is very high
High latent heat storage capacity
Super cooling is major problem in solidliquid
Availability and low cost
transition
Sharp melting point
Nucleating agents are needed and they often
High thermal conductivity
become inoperative after repeated cycling
High heat of fusion

Non-flammable
Design Considerations
challenges during designing of systems
Poor thermal conductivity resulting in higher thermal gradients

Red showing hot

Blue showing cold
region

Minimize impact of voids at the critical component location

Design Considerations
continued
Reduce thermal gradient-
ts with proper fin design
Fin pitch or fin spacing
Fin thickness
Trades between thermal
gradients and PCM volume
Involves ascertaining the optimal
in thickness and pitch to arrive at
an optimal thermal storage capac-
ity with minimal thermal grad.
Pressure and void consideration
A PCM heat sink is necessarily a pressure vessel
A proper design will ensure there
is room for PCM expansion
Requires void volume wen PCM is solid
Possibility of air volume in voids
Determine pressure of compressed gas
11 22
Using ideal gas law =
1 2
(T is in kelvin)
 On-Chip PCM
High power semiconductors
for communication often
operate in pulsed mode.
Duty cycle varies between 2
to 10%.
PCM can be used near the
individual gates
It melts when operating and
freezes back when heat is
removed.
 PCM Heat Exchanger
Directed Energy Weapons require
tight temp. control, as they use
lasers and generate very high
amounts of heat in very less time.
Duty cycle is around 40%.
PCM takes heat from Deionized
water coming from laser and
rejects to VCRS sink.
Comparison of PCM and Non PCM HX

Ref.- www.1-ACT.com
HVAC Applications of PCM