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Piezo-Resistivity
The resistance value of a resistor with the length l and crosssectional area A is given by
R= l/A where, is bulk resistivity.
Two Possibilities
Length & cross section:
Strain Gauges (Metals)
Resistivity as a function of strain: True Piezoresistor
Applications:
Pressure, Accelerometer
Tactile ,Gyrorotation &
Flow sensors.
ZnO
Strain Gauges
Change in Resistance is linearly related to
applied strain.
R
S g
R
is strain= l/l
Backing Film
Translates strain to
electrical resistance.
Resistance increases with
length.
Grid
(electrical resistor)
Copper-plated
Solder tabs
Strain Gauge
Wheatstone Bridge
Four resistors connected in
a loop
//
( 10-11m2/N)
7.0
Direction
(1011
m2/N)
-1
In <100>
Direction
72.0
- 66
In <110>
Direction
-102
53
-31
-18
In <100 >
Direction
In <110>
.
Doping Conc.
Doping Conc
Magnitude of max.
stress/strain at the
fixed end
Bulk Micromachined
Piezoresistive
Pressure Sensor
Sensitivity: 4mv/mm Hg
Nitride deposition+
patterning
Silicon Etching
+Oxidation
PSG deposition
+ Patterning
Nitride Deposition
Selective Nitride
Etching
PSG+Oxide
Etching+Drying
Nitride Deposition to
seal+Poly Si+Metal
Accelerometers based on
Piezoresistive sensing
Single-Crystal Si Piezoresistive
Accelerometer
Moment experienced at
the fixed end of the beam
M=F(l+L/2)
Maximum magnitude of
strain at the top of the base
of cantilever
Smax=Mt/2EI=6F(l+L/2)t/Ewt3
Relative change in
resistance
R/R=G.smax
=6Gm(l+L/2)a/Ewt2
Strain generated by
acceleration
=4 r3sin(/2)a/Ew2
Fabrication Process
Flow
SOI Wafer
Oxide:1.2um
P doped Si:30um
Angled
Implant
P+ Doping for
contact
LTO + Patterning
Selective Etching
LTO
deposition
+
Backside
Etching
Fabrication
Steps
Al Sacrificial Layer
Photo-definable
polyimide as a base
layer.
Nicr used as metal
strain gauge
Au/Cr as seed layer
for Permalloy
Electroplating
Efficient 3D
assembly
1.4um
oxide