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Presentation
NAME
: CHIA YI MENG
STUDENT ID
: KEM130013
COURSE CODE : KMEM3194 INDUSTRIAL TRAINING
COMPANY NAME : TEXAS INSTRUMENTS MALAYSIA
(TIM)
SUPERVISOR (TIM)
: MR. AMIR HAMZAH JAMAL ABDUL NASIR (FOL SECTION
MANAER)
COORDINATOR (UM) : DR. KHOO SHIN YEE
1960-80s Invention of
microcontroller, DSP, DLP
Electronic
handheld
calculator,
single-chip
Pioneer in
Industry
Malaysian
electronic
Manufacturi
ng
Production
line of IC
Assembly
Engineering
(Mr See Chee
Sun)
Equipment
efficiency
Test
Engineering
Quality
Planning/
WPL
HR, Finance,
IT,
Communica
tion, etc
Test the
functionality
Quality
control
Planning,
purchase,
logistic
Site
function
Die prep
Preparation
of die from
wafer
Front of line
End of line
Wire bond
Die bond
Moulding
(Mr Amir
Hamzah)
QFN
NQFN
(Mr Mujibur)
(Mr Fariz)
Singulation,
inspection,
pick and
place
ENGINEERS ROLE
Review and working closely in maintaining FOL performance
delivery of reporting and metric (Downtime, MTBA)
Side task
Objective:
1) Recipe optimization
Inspection results not as expected (over rejects, escaped rejects, consistency)
More inspection test runs performed with more variations of units to
determine its capability
2) Wipeout mechanism
Wipeout process does not perform perfectly
Wire is not broken or cut, but creating depressed or slung wire
Imbalance on levelness of supporting structure
Readjustment on levelness required to ensure perfectly
flat and balance (extremely small discrepancy)
2) Censoring system
Detecting leadframe loading condition
3) Computer software
Microsoft Excel processing and compiling data in a systematic format,
variety functions help speeding up analysis process
Microsoft PowerPoint Slides presentations of projects
SolidWORKS Simulation in proving assumptions made and theory
applied
SELF-REVIEW/REFLECTION
Technical knowledge improvement in Texas Instruments
(semiconductors IC, DSP, DLP)
ACKNOWLEDGEMENT
Mr See Chee Sun (Assembly Engineering Department
Director)
~THANK
YOU~
FACULTY OF ENGINEERING