PCB Manufa

cturer

THE
MANUFACTU
R
ING PROCESS

Double-sided PCBs
Photoworks
First of all the plots are made and
Photoplots are developed according to the
data supplied by the customer.

Cam-Bearbeitung

The data records from the various software solutions

supported in the PCB-POOL are standardized in the Ext. Gerber Format
(RS 274X).

Material Preparation

The copper-clad panels along with the drill entry material and
a back-up-board are then cut to the size.

Drilling and pinning

At this stage the reference and tooling holes are drilled.The

PCB-POOL panel is then pinned onto the CNC machine.

CNC drilling

With the help of CNC drill machines the through-hole plated

and component drills are produced.

Through-hole platingNow an electrographic film (e.g

Palladium)is electroplated to the wall of the
drill cavity,this allows for galvanization with
copper to occur at a later stage.

Brushing-

Because PCBs must be completely

free of grease and dust,they are subjected to
rigourous cleaning(eg:by brushing) before
proceeding to the next stage.

Resist laminating-

Under extreme temperatures and

pressures the entire PCB-POOL panel is
laminated with a photosensitive dry resist
(Laminar 5038).

Resist exposure-

Using the previously generated photoplots

the resist is exposed to UV light.

Resist development-

Through cyclic construction the exposed

panel is developed in a 1% sodium carbonate
solution.The PCBs are now ready for plating.

Electroplated Conductor
Configuration-

The tracks and pads which are

developed,free of photo resist are copper plated.

Resist stripping-

The photoresist is stripped away with a 2.5%

caustic potash solution.This lends itself to the immersion and spray
coat processes.

Etching-

The next step is the spraying on of a coat of ammonia

solution onto the copper film,getting rid of any excess copper,while
the galvanised tin protects the tracks and pads.

Tin stripping-

Only then will the tin be removed using a nitic acid based
tin-stripper.This lends itself to the dipping or spraying processes.

Soldermask application-

The soldermask can be applied as a dry film or a liquid

lacquer in a hanging casting implement.After this comes the
screen-printing and spraying processes.

Soldermask exposure-

Finally using the previously generated photoplots the soldermask is exposed to light.

Soldermask development

The development of the exposed PCB is in turn achieved through a cyclic

construction in a 1% sodium solution.Hence all soldering points and pads,which are to
be tin plated later,are cleared of soldermask.

Silkscreen

Using a Direct legend Printer,the silkscreen is immediately printed onto the

soldermask.In this process the printhead sprays the screen-print,defined by Gerber
data,directly onto the PCB.

Burning-in

At a temperature of 150 degree C the soldermask is tempered over a period of

approx,60 minutes.

Surface finish
Chemical Nickel-Gold (ENIG)

The pads freely developed by the solder paste are coated with
Chemical Nickel-Gold together with the surface by means of vertical baths.
The advantages as opposed to HAL are stress-free coating and the flat surface.

Hot Air Levelling (HAL)

On the surface coating the pads are tin plated in a hot-air tinplating system at a temperature of around 270 degree C.

PinningTo prevent the panel from moving

during routing,it is pinned down onto the
routing machine bed.

Routing
In the final stages,the individual PCBs are routed from the PCB-POOL
panel with the aid of a CNC Routing machine.

THANK
YOU