Zaven Kalfayan

Lindsay Hunting
Phyllis Xu
Joy Perkinson

Presentation Outline

Motivation of project

Project goals

Processing and materials

Results

Cost analysis

TechWatch and future work

What is a Metamaterial?
A periodic material that derives its
properties from its structure rather
than its components.

*Taken From 3.042 handout & Physics Worlds 2005 Sound Ideas

Project Motivation

Developing field of research

Applications in wide range of sectors,

such as communications, optics,
energy

Currently used for wave manipulation

Project Goals
Design a process using lithography to
fabricate a 3D structure
Create macroscale models of 2D
structure, phase mask, and 3D
structure
Create a 3D metamaterial and image
using SEM

Process Design
Interference
lithography

Phase mask
2-D
photoresist
pattern

Titania structure
Sol-gel infiltration

3-D pattern

2D Structure Fabrication
Coat
plain Si
wafer

coat with HMDS to

promote adhesion

coat with SU-8 20xx

photoresist using
spin coater

Exposure
UV exposure for
xx seconds

Develop

flip 90 and
expose again

submerge in PM
acetate to dissolve
unexposed
photoresist (20
min

soft bake @95

to evaporate
solvent and cut
into pieces

post bake at first

65 then 95 to
promote crosslink
formation

submerge in
isopropanol to
wash away all
remnantsfinal
structure

Phase Mask Fabrication

Step 1

Vacuum sample with open bottle of

fluorosilane so that it evaporates onto
sample.

Step 2

Layer with PDMS and heat at 65to 75for

at least three hours.

Step 3

Gently peel off PDMS layer as phase

mask.

3D Structure Fabrication
Coat
plain glass
slide

coat with HMDS to

promote adhesion

coat with SU-8 2005

photoresist using
spin coater

Exposure
Place phase
mask on top of
slide

Develop

Expose for xx
seconds and
remove phase mask

submerge in PM
acetate to dissolve
unexposed
photoresist (5-10 min)

soft bake @95

to evaporate
solvent and cut
into pieces

post bake at first

65 then 95 to
promote crosslink
formation

submerge in
isopropanol to
wash away all
remnantsfinal
structure

Process Tuning

Exposure times (contact lithography):

SU8-2002: 0.5-25 seconds
SU8-2005: 5-40 seconds
SU8-2015: 1-45 seconds

Exposure times (interference lithography):

3-20 seconds for all samples

Prototype Functionality
Problems for 2D & 3D patterns

15s SU-8 2015 Top

1. Overexposure
2. Unwashed monomer
3. Adhesion problems
4. Inconsistent results

15s SU-8 2015 Cross

Design Functionality
2-D Patterns

5s

exposure of SU-8 2015

Coated with HMDS

Broadband laser filtered at 365nm
Top down
Hole spacing - 3.38 um
Hole length ~1.5um
5s SU-8 2015 Cross

5s SU-8 2015 Top

Design Functionality
Phase mask

PDMS on SU-8 2015 2D pattern

Coated with flourosilane
Baked overnight 65C
Column
Spacing ~ 4 um
Height ~15 um

PM of 10s SU-8 2015

PDMS on 10s SU-8 2015

Design Functionality
3-D Patterns
3s SU-8 2005Top

3s exposure of SU-8 2005

355 YAG pulse laser

Coated with HMDS

Used in continues mode

Thickness ~ 5um

2-D Pattern

CAD Model

3-D Printing Model

Actual Sample

Phase Mask

3-D Pattern

Cost Analysis

Fixed cost:
Spin coater, lasers, SEM
General lab equipment, facilities
Variable cost:
SU-8 20xx and HMDS ($300/1L $30/500mL )
Trifluoroacetic acid and TiO2 ($60/100mL, $117/50mL)
Si wafers ($15/piece)
Glass wafers ($240/2500 slides)
Total costs/sample: $6/sample

Future Work

Optimize process

Explore new thicknesses and exposure

times

Adhesion promoters

Create more complicated 3D structures

Characterize 3D structure properties

TechWatch
2004:
Miniaturized antennas based on negative
permittivity materialsLucent Technologies
Metamaterial scanning lens antenna systems
and methodsThe Boeing Company
2003:
Metamaterials employing photonic crystalMIT
Methods of fabricating electromagnetic
metamaterialsThe Boeing Company
2002:
Resonant antennasLucent Technologies

Questions?

Design Functionality
Thick Film Photoresist
Calculation:
Sin (70) = 58 / t
Thickness (t) ~ 61 microns
Success!

45s SU-8 2050

Design Functionality
Problems in 2-D patterns
1. Un-washed monomer
2. Over exposure
15s SU-8 2015 Top

3. Non-uniform columns
Width of top ~ 1.81 um
Width of bottom ~ 1.00 um

15s SU-8 2015 Cross

TiO2 Sol Gel Infiltration

Step 1

Dip sample in TiO2 solution (trifluoroacetic

acid, titanium oxide, and deionized water) for
about 30 seconds.

Step 2

Dry the sample for at least 2 hours.

Step 3

Heat sample up to 600C in 8 hours and

cool down to room temperature in 6 hours
to evaporate photoresist.