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Presented By:
Deepak Kumar Baghel
Introduction
Zinc oxide is an n-type semiconductor .
ZnO is an II VI group based directtransition-type compound semiconductor .
Wide energy band gap of 3.3 eV .
Hexagonal wurtzite structure.
Large exciton binding energy of 60 meV at
room temperature.
Structure of ZnO
a0
c0
Density
Melting point
Gap Energy
Value
0.32469 nm
0.52069 nm
5.606 g/cm3
2248 K
8.66
60 meV
0.24
200 cm2/V s
0.59
5-50 cm2/V s
Why ZnO?:
Cheap.
abundant .
non-toxic elements.
it can be produced for large scale coatings.
Can be tailored of the ultraviolet absorption.
high stability in a hydrogen plasma.
Crystalline growth at low temperature.
Deposition on various substrates.
More resistant to radiation damage.
Relatively high mobility.
Advantages of ZnO
Advantages of ZnO
Contd
The ZnO thin film used as an active channel
layer can achieve a relatively high mobility.So
it is possible to reduce the gate voltage for
low power goals.
The most unique property of ZnO is its large
exciton binding energy of 60 meV, which is
much larger than those of GaN (24 meV).
ZnO is also much more resistant to radiation
damage than are other common
semiconductor materials, such as Silicon, and
GaN.
Fabrication
Deposition of
ZnO on
p-Silicon <100> by thermal
evaporation of ZnO .
Ag doped ZnO on
p-Silicon <100> by thermal
evaporation of sintered (1200oC)
Ag2O doped ZnO .
p-Silicon <100> ,post deposition of ZnO to form
bilayer.
Steps of Fabrication of
Ag doped ZnO
Appropriate percentage ( 3%) by weight of Ag2O:ZnO was
chosen
Dry (0.5 Hrs) and wet (in acetone 2.5 Hrs) ball
milling was done using agate mortar and
pestle.
Removal of acetone by drying at 150oC for 15
Mins.
Pellet was formed by hydraulic pressing with a weight of 7
tons.
Sintering was done at 1200oC for 1 Hr with the rate
of rise in temperature at 5oC/Hr in air atmosphere.
Deposition was done on p- Si and annealed at 450oC
followed by top and back metallization by aluminium.
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Reasons behind
specifications
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Doping
ZnO (n-type) : 1e16 per cc
Si (p-type) : 1e14 per cc
Models used
Boltzman (Default)
Characteristics obtained
I-V Characteristics
Doping Profile
Device dimensions
Si thickness : 40 m
Channel Width: 5 m
Device Length: 20 m
Future Work
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Thank you
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