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Thermoelectric (TE)
With an Emphasis in
Cooling
Thermal Control of
Electronics
-- Widah Saied
http://www.tetech.com/modules/
Outline
Basic Principles
Semiconductor P and N Type Doping
TE Design
Disadvantages
Electronic
Medical
Aerospace
Telecommunications
Basic Principles
hole flow
or with electron flow).
dT / dx
Heat transfer occurs in the direction of charge carrier movement.
(Tellurex, www.tellurex.com)
Basic Principles
Basic Principles
Basic Principles
(Tellurex, www.tellurex.com)
Basic Principles
(Tellurex, www.tellurex.com)
Electrons can travel freely in the copper conductors but not so freely in the
semiconductor.
As the electrons leave the copper and enter the hot-side of the p-type, they
must fill a "hole" in order to move through the p-type. When the electrons
fill a hole, they drop down to a lower energy level and release heat in the
process.
Then, as the electrons move from the p-type into the copper conductor on
the cold side, the electrons are bumped back to a higher energy level and
absorb heat in the process.
Next, the electrons move freely through the copper until they reach the
cold side of the n-type semiconductor. When the electrons move into the
n-type, they must bump up an energy level in order to move through the
semiconductor. Heat is absorbed when this occurs.
Finally, when the electrons leave the hot-side of the n-type, they can move
freely in the copper. They drop down to a lower energy level and release
heat in the process.
http://www.tetech.com/techinfo/#1
Basic Principles
(Tellurex, www.tellurex.com)
Basic Principles
(Tellurex, www.tellurex.com)
Basic Principles
Basic Principles
Basic Principles
(Tellurex, www.tellurex.com)
Basic Principles
An entire assembly:
(Tellurex., http://www.tellurex.com/12most.html)
(Tellurex, www.tellurex.com)
For P type semiconductors, the dopants are Group III (In, B) which have
3 valence electrons, these materials need an extra electron for bonding
which creates holes. P doped semiconductors are positive charge
carriers. Theres an appearance that a hole is moving when there is a
current applied because an electron moves to fill a hole, creating a new
hole where the electron was originally. Holes and electrons move in
opposite directions. (Wikipedia, http://en.wikipedia.org/wiki/Semiconductor).
(Tellurex, www.tellurex.com)
Figure of Merit
Z
k
Thermoelectric Materials
(Tellurex, www.tellurex.com)
Thermoelectric Materials
(Sales, 2002)
Thermoelectric Materials
Thermoelectric Materials
(Snyder, J. http://www.its.caltech.edu/~jsnyder/thermoelectrics/science_page.htm)
Bi2Te3 Properties
(Yazawa, 2005)
Bi2Te3 Properties
Thermoelectric Materials
Condensation
Condensation
Condensation
Four sealants were used to seal a TE cooling device and the weight gain
due to water entering the device measured. The best sealants should have
the lowest weight gain. The epoxy has virtually no weight gain.
(Nagy, 1997)
Condensation
(Nagy, 1997)
Thermoelectric Performance
Thermoelectric Performance
( p n )(Th Tc )
R[(1 ZT m)1/ 2 1]
Qc
T1[(1 ZTm )1/ 2 T2 / T1 ]
Thermoelectric Performance
1 / 2ZTc (TH Tc )
q
ZTH Tc
(Goldsmid,1986)
( p n )Tc
R
Coefficient of Performance
Coefficient of Performance
Below are COP values plotted versus the ratio of input current to
the modules Imax specification. Each line corresponds with a
constant DT/DTmax (the ratio of the required temperature
difference to the module's max temperature difference
specification).
Thermoelectric Performance
(Nolas et al.,2001)
Thermoelectric Performance
IRL
V 2 N (Th Tc )
A
Design Methodology
Design Methodology
http://www.marlow.com/TechnicalInfo/themoelectric_cooler_selection_p.htm
Note: maximum Q refers to the maximum heat the thermoelectric device can pump which will occur when DT=0.
TE Technology, Inc.
Improving TE performance
Multistage Modules
Multistage Modules
(Goldsmid,1964)
Multistage Modules
Improving Performance
Temperature stability
TE Cooling of Electronics
TE Cooling of Electronics
(Tellurex, www.tellurex.com)
TE Cooling of Electronics
TE Cooling of Electronics
TE Cooling of Electronics
TE Cooling of Electronics
TE Cooling of Electronics
In this application, a
memory array is being
cooled using a heat
exchanger with six
thermoelectric modules
sandwiched between two
parallel plate fin heat sink
assemblies. The
requirements for this
system was a cooling air
temperature of 30 3C.
(Simons and chu, 2000)
TE Cooling of Electronics
References
Bar-Cohen, A., Solbrekken G. L., and Yazawa, K. (2005). Thermoelectric Powered Convective Cooling of Microprocessors. IEEE Transactions of
Advanced Packaging, 28(2).
Chein, R. and Huang, G. (2004). Thermoelectric cooler application in electronic cooling. Applied Thermal Engineering, 24 (14-15), pp. 2207-2217.
Goldsmid H. (1986). Electronic Refrigeration.London:Pion.
Goldsmid H.(1964). Thermoelectric Refrigeration. New York:Plenum.
Lasance, C.J.M., and Simmons, R.E. (2005) Advances In High-Performance Cooling For Electronics. Electronics Cooling. Retrieved May2006.
http://www.electronics-cooling.com/html/2005_nov_article2.html
Mollar(2003). Themoelectric Cooler Selection Procedure. Retieved June 2006.
http://www.marlow.com/TechnicalInfo/themoelectric_cooler_selection_p.htm
Nagy, J. (1997). The Effectiveness of Water Vapor Sealing Agents When Used in Application With Thermoelectric Cooling Modules. 16th
International Conference on Thermoelectrics.
Nolas, G.S. Goldsmid H., and Sharp J. (2001). Thermoelectrics : basic principles and new materials developments. New York: Springer.
Rowe, D.M. (1995). CRC Handbook of Thermoelectrics. Boca Raton, FL: CRC Press.
Sales, Brian. (February 2002). Thermoelectric Materials: Smaller is Cooler.. Science (Vol. 295. no. 5558, pp. 1248 1249). Retrieved April 2006.
http://www.sciencemag.org/cgi/content/full/295/5558/1248 .
Simons, R. E. and Chu, R. C. (2000) Application of thermoelectric cooling to electronic equipment: A review and analysis. Annual IEEE
Semiconductor Thermal Measurement and Management Symposium, pp1-9.
Snyder, J. The Science and Materials behind Thermoelectrics. Caltech-JPL Thermoelectrics Website. Retrieved April 2006.
Tellurex. (2002). Retrieved May 2006. http://www.tellurex.com
Tellurex. (2002). The 12 Most Frequently Asked Questions About Themoelectric Cooling. Retrieved May 2006.
http://www.tellurex.com/12most.html
TE Technology, Inc. (2005) Cold Plate/Solid. Free Design Service. Retrieved June 2006. http://www.tetech.com/design/3081.shtml
TE Technology, Inc. Retrieved May 2006. http://www.tetech.com/techinfo/
TE Technology, Inc. (2005). Thermoelectric Modules. Retrieved April 2006. http://www.tetech.com/modules/
Wikipedia the Free Encyclopedia(May 2006). Semiconductor.. Retrieved May 2006. http://en.wikipedia.org/wiki/Semiconductor.
Wikipedia the Free Encyclopedia (May 2006). Condensation. Retrieved May 2006. http://en.wikipedia.org/wiki/Condensation