Silicon Wafer Processing

Addison Engineering has an extensive array

of processing capabilities. On our silicon or
yours, we can provide virtually any processing
service you may need, from a simple oxide
layer to completely patterned wafers.
Thermal oxide
Ion implant
Epitaxial deposition
Plasma nitride
Photoresist
Wafer bumping
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Silicon Wafer Processing

About Wafers:
In electronics, a wafer (also called a slice or substrate)
is a thin slice of semiconductor material, such as a silicon
crystal, used in the fabrication of integrated circuits and
other microdevices.
The wafer serves as the substrate for microelectronic
devices built in and over the wafer and undergoes many
microfabrication process steps such as doping or ion
implantation, etching, deposition of various materials, and
photolithographic
patterning.
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Silicon Wafer Processing

Formation:
Wafers are formed of highly pure (99.9999999%
purity) nearly defect free single crystal material.
One process for forming crystalline wafers is known as
Czochralski growth invented by the Polish chemist Jan
Czochralski.
In this process, a cylindrical ingot of high purity
monocrystalline semiconductor, such as silicon or
germanium, is formed by pulling a seed crystal from a
'melt'.
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Silicon Wafer Processing

Donor impurity atoms, such as boron or phosphorus in
the case of silicon, can be added to the molten intrinsic
material in precise amounts in order to dope the
crystal, thus changing it into n-type or p-type extrinsic
semiconductor.

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Silicon Wafer Processing

Thermal oxide:
Oxide
TEOS/PETEOS oxide
Gate oxide
Low temperature oxide
PSG glass
Silicon Nitride
LPCVD
Low Stress
Ultra-low Stress
Polysilicon (undoped)

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Silicon Wafer Processing

Metal deposition
Evaporation
Sputter
Epitaxial deposition
Ion implantation
SOI
oxidation
wafer bonding
Photolithography

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Silicon Wafer Processing

Clean
RCA clean
Mechanical
Ingot slicing
Lap & etch
Wafer thinning
Wafer downsize (diameter cut-down)
Wafer dicing

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Silicon Wafer Processing

Wafer reclaim
Laser marking
Wafer bumping
MEMS - Silicon machining

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Silicon Wafer Processing

Thin Film Processing:
LOW k
Black Diamond
Coral
Spin On
and more
OXIDE: CVD and Thermal
Thick Photoresist & Polymide
High Energy Deep Ion Implant
Nitrides (Si- and O-)

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Silicon Wafer Processing

Low Stress Silicon Nitride
BPSG, PSG, USG
Amorphous Silicon
Diamond Like Carbon
Polysilicon (Doped and Undoped)
METALS: PVD, CVD, Electroplate
Ai, Cu, Au, Cr, Ta, Ti, TiN
TiW, TaN, WN, Ni, Ru
Co, NiSi, TiO2, Pt

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Silicon Wafer Processing

Czochralski Growth:

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Silicon Wafer Processing

Grinding and Slicing:

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Silicon Wafer Processing

Lapping and Etching:

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Silicon Wafer Processing

Polishing and Cleaning:

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Silicon Wafer Processing

Sizes Available:
Silicon wafers are available in several
sizes (diameters)

1 (25mm)
2 (50mm)
3 (75 mm)
4 (100mm)
5 (125mm)
6 (150mm)
8 (200mm)
12 (300mm)
18 (450mm)

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Silicon Wafer Processing

Addison Engineering provides Silicon wafers that
are available with a wide range of characteristics
(specifications) to select from.

Thank You

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