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Adarsh Kumar
M.Tech CAD/CAM
13MCD1065
VIT University
Materials Tetrahedron
Processing
Performance
Microstructure
Properties
sa := Alternating stress
sm :=
Mean stress
Notation
R := Stress ratio
e :=
strain
Nf := number of cycles to failure
A := Amplitude ratio
epl :=
Plastic strain amplitude
eel :=
Elastic strain amplitude
K := Proportionality constant, cyclic stress-strain
n := Exponent in cyclic stress-strain
c :=
Exponent in Coffin-Manson Eq.;
also, crack length
E :=
Youngs modulus
b :=
exponent in Basquin Eq.
m :=
exponent in Paris Law
K :=
Stress intensity
K := Stress intensity amplitude
a :=
crack length
3
Fatigue
Fatigue is the name given to failure in response
growth
Dull, fibrous brittle fracture surface (rapid growth).
Life of structural components generally limited by
S-N Curves
S-N [stress-number of cycles to failure] curve defines
[Hertzberg]
smean 1
smean 2
smean 3
log Nf
[Dieter]
Endurance Limits
Some materials exhibit endurance limits, i.e. a
nucleation.
Fatigue fracture
surface
[Hertzberg]
10
Stage 2
11
[Dieter]
tip.
Stress intensity crack propagation (growth);
- stage I growth on shear planes (45),
strong influence of microstructure
- stage II growth normal to tensile load (90)
weak influence of microstructure .
Crack propagation catastrophic, or ductile
failure at crack length dependent on boundary
conditions, fracture toughness.
12
13
Dislocation Slip
Crack Nucleation
bands.
Persistent Slip Bands (PSBs) characteristic of
cyclic strains.
Slip Bands -> extrusion at free surface.
Extrusions -> intrusions and crack nucleation.
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sa
sm = (smax +smin)/2.
sm = 0, R=-1
smax/smin.
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Number of cycles := N
Crack Growth Rate := da/dN
Amplitude of Stress Intensity := K = sc.
Define three stages of crack growth, I, II and III,
in a plot of da/dN versus K.
Stage II crack growth: application of linear elastic fracture
mechanics.
Can consider the crack growth rate to be related to the applied
stress intensity.
Crack growth rate somewhat insensitive to R (if R<0) in Stage II
[fig. 12.16, 12.18b]
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da/dN
I
II
Kc
III
Kth
microstructure (defects,
surface treatment, etc.)
is almost all in the low
stress intensity regime,
i.e. Stage I. Defects, for
example, make it easier
to nucleate a crack,
which translates into a
lower threshold for
crack propagation
(Kth).
Microstructure also
affects fracture
toughness and
therefore Stage III.
18
da/dN
I
II
Kc
III
Kth
19