Sot Sc70 Ocap

1. Stop machine. Do 100% inspection on all wafers processed until the last visual monitoring.
2. Quantify/ categorize defect seen and log on the results on applicable log sheet.
1. Check setting on wafer chuck table
flatness and height.
2. Check for lost vacuum pressure
setting.
3. Check tape cutter blade if worn out.
4. Check chuck plate if defective.
5. Check abnormality on transfer arm.
6. Check for defective vacuum cap
(Tech).
7. Check for wrong wafer thickness
setting.
8. Check wafer diameter setting.
9. Check for presence of FM on wafer
backside.
10. Check for presence of FM on chuck
plate.
11. Check for defective wafer ring.
12. Check misalignment of sensor joint.
(Tech)
1. Check for occurrence of wrinkled
tape.
2. Check for low vacuum pressure
setting.
3. Check for wrong tape used.
4. Check tape if expired.
1. Correct wafer rotation, adjust wafer thickness
setting.
2. Adjust vacuum pressure setting, replace
worn-out vacuum detect sensor. (Tech)
3. Replace tape cutter blade. (Tech)
4. Replace defective chuck plate, replace worn
out vacuum detect sensor. (Tech)
5. Clean transfer arm for Takatori only.
Replace defective transfer arm. (Tech).
6. Replace defective vacuum cap (Tech).
7. If wrong, correct wafer thickness setting.
8. If wrong, correct wafer diameter setting.
9. Perform air ionize cleaning.
10. Perform air blow cleaning.
11. Scrap warped or defective wafer ring, select
and used good wafer ring.
12. Perform manual alignment of sensor joint
(Tech).
1. Correct tensioner setting and replace tape
cutter if needed. (Tech)
2. Correct vacuum pressure setting and activate
auto-vacuum sensor. (Tech)
3.Replace with required tape type.
4. Scrap expired tape and replace with un-
expired tape.
ANY REJECT
SEEN?
BROKEN WAFER/
WAFER CRACK?
BACKSIDE
BUBBLES?
CONTINUE
PROCESSING
LOG RESULTS, FINDINGS
AND C/A TO LOG SHEET
OR EQUIVALENT
PASS?
1. Call Tech/MEE to do
further analysis and C/A
2. Call PE if problem is still
not solved for analysis and
C/A.
Visual check using
dummy wafers
NO
NO
YES
YES
YES
NO
NO
YES
OCC CATEGORY INPUT VARIABLES CORRECTIVE ACTION C/A VERIFICATION DISPOSITION / RECORDING
OUT OF CONTROL ACTIVITY PLAN (OCAP)
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : TAKATORI
PROCESS : WAFER MOUNT REVISION LEVEL : C
CONTROL ITEM : VISUAL DEFECTS I
A
1. Correct machines malfunctions on wafer
handling. (Tech)
2. Clean chuck plate using air blow gun
3. Replace defective chuck plate. (Tech)
3.1 Include in PM Activity. (PM Group)
SCRATCH?
NO
YES
1. Check machines handling
procedure.
2. Check presence of FM on chuck
plate.
3. Check chuck plate if already
defective.
CALL SUP OR PE TO GENERATE
MRB REPORT FOR ANY LOT
BELOW MAVERICK
YIELD TRIP POINT
1. Check air ionizer application if
functional.
2. Check contamination/FM at wafer
backside.
1. Check actual BD# vs. LTC BD#.
2. Compare Actual Die ID and Bond
layout vs. Actual wafer vs. BD Die
ID.
1. Repair / replace air ionizer (Tech)
2. Hold and inform PE for disposition
1. Hold lot and call PC to replace either LTC or
BD.
2. Check compilation for corresponding blanket
disposition. If blanket disposition exists, follow
its instruction. If none, call PE for disposition.
FM UNDER
THE WAFER?
MIXED DEVICE?
CONTINUE
PROCESSING
PASS?
1. Call Tech/MEE to do
further analysis and C/A
C/A.
1. Visual check using
dummy wafers.
2. For out-of-range
wafer thickness and
if lot undergo back
grind, check new
wafer thickness.
NO
NO
YES
YES
NO
YES
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : TAKATORI
PROCESS : WAFER MOUNT REVISION LEVEL : C
CONTROL ITEM : VISUAL DEFECTS II
OUT-OF-RANGE
WAFER THICKNESS?
A
1. Check and compare actual
thickness vs. BD requirement/
attached customer documents vs.
Control Plan.
1. If non-correlated, hold lot and inform
Supervisor /PE.
1.1 Check compilation for corresponding
blanket disposition. If blanket disposition
exists, follow its instruction. If none, call
PE for disposition.
1.2 If actual thickness is greater than
maximum requirement, recommend to
customer to do back grinding down to
nominal thickness.
1.3 If actual thickness is less than minimum
requirement, inform customer on the risk
and ask waiver if lot should proceed.
NO
YES
DIE ID / WAFER RUN
NON CORRELATION?
NO
YES 1. Check and compare actual die ID
/ wafer run vs. BD requirement/
attached customer documents
1. If non-correlated, hold lot and inform
Supervisor /PE.
1.1 Check compilation for corresponding
blanket disposition. If blanket disposition
exists, follow its instruction. If none, call
PE for disposition.
NO
OR EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : TSK / DISCO
PROCESS : WAFER SAW REVISION LEVEL : D
CONTINUE
PROCESSING
PASS?
NO
YES
A
ANY
REJECT
SEEN?
DIE
CHIPOUT /
DIE
CRACK?
1. Stop machine. Do 100% inspection on all wafers processed until the last monitoring.
2. Quantify / Categorize defect seen and log on the results on applicable log sheet.
Visual Check using
dummy wafers
AND C/A TO LOG SHEET OR
EQUIVALENT
1. Call MEE / Tech to do further
analysis and C/A.
2. Call PE if problem is still not
solved for analysis and C/A.
YES
NO
NO
YES
1. Check feed rate parameter
2. Check actual blade used.
2.1 Check blade condition for
wear or damage.
3. Check wafer for occurrence of fly-offs.
4. Check chuck table for foreign material.
(Silicon debris, etc.)
5. Check spindle vibration. (Tech)
6. For devices requiring blade dressing,
check sufficiency of blade dressing.
7. Check for manifold and directional control
valve condition. (Tech)
8. Check correctness of blade type used.
9. Check for chuck table non-planarity due
to improper machine set up/conversion.
(Tech)
10. Check correctness of wafer release from
the chuck table.
11. Check linear arm vacuum line for
clogging. (Tech)
12. Check functionality of Blade Breakage
Detector (BBD). (Tech)
13. Check correctness of machine
parameters recall from Program Library
System. (PLS)
Note: Applicable only on machines
capable of PLS
14. Check if blade exceeds blade life
15. Check water flow rate for low water
pressure
16. Check for any foreign material in wheel
mount (Tech)
17. Measure wobbling of wheel mount if
within the maximum requirement (Tech)
18. Check for dents in water nozzle (Tech)
19. Check for clogged water nozzles (Tech)
20. Check for misaligned water nozzle with
respect to blade exposure (Tech)
21. Check for defective spindle shaft axial
and spindle tip axial (Tech)
22. Measure wobbling of spindle shaft axial if
within the max tolerance (Tech)
23. Measure wobbling of spindle tip axial if
1. Adjust / reduce feed rate
1.1 Activate auto kerf check
2. Replace if wrong blade was used
2.1 Replace with new and same blade type
for damaged blade (Tech).
2.2 Activate auto broken blade detector
(Tech).
3. Perform wafer reheat.
4. Clean chuck table using blowgun.
5. Include checking of flange run out in PM activity
(PM)
5.1 Activate automatic kerfwidth monitor.
6. Activate precut mode of redressed blade.
7. Activate auto-machine stop mode after
cleaning.
7.1 Activate sense proximity control sensor or
spinner cylinder. (Tech)
8. Check LTC/Blade Selection Matrix on ATPDocs
for proper blade requirement.
9. Adjust/replace chuck table. (Tech)
10 Set vacuum blow pressure to 45-85 psi. (Tech)
11. Clean blow airline for clogging. (Tech)
11.1 Repair/Replace chuck table. (Tech)
11.2 Clean linear arm vacuum line. (Tech)
12. Repair/Replace BBD sensor. (Tech)
13. Recall the proper program on PLS.
14. Replace blade (Tech)
15. Adjust water pressure as per specs requirement
16. Clean/dress wheel mount to remove the foreign
material (Tech)
17. Calibrate wheel mount wobbling if exceeds the
</=2 microns tolerance (Tech)
18. Repair/replace water nozzle with dents (Tech)
19. De-clogged nozzles or repair dent parts (Tech)
20. Use nozzle height calibration jig to align the water
nozzle with blade exposure (Tech)
21. Calibrate/replace defective spindle shaft axial tip
(Tech)
22. Calibrate spindle shaft axial wobbling if exceeds
the </=2 microns tolerance (Tech)
23. Calibrate spindle shaft tip axial wobbling if
exceeds the maximum tolerance (Tech)
BELOW MAVERICK
YIELD TRIP POINT
CONTINUE
PROCESSING
PASS?
NO
YES
DEEP
CUT/
SHALLO
W CUT?
1. Check blade height.
2. Check spindle condition/ spindle
carbon brush.
2.1 Check resistance between
spindle shaft and main
machine body (PM)
3. Check for tape thickness data
setting.
4. Check for tape cut depth
impression through focusing on
CCTV.
5. Check non contact sensor if
clean.
6. Check Cutter set voltage (Tech)
7. Check for table planarity due to
improper set-up conversion
(Tech)
8. Check/Asses if applicable for
rework (Optr/Tech/PE)
parameters recall from Program
Library System. (PLS)
Note: Applicable only on
machines capable of PLS
10. Check cutter set value
11. Check vacuum supply
12. Check chuck table contact point
during cutter set (Tech)
1. Adjust Z-height.
2. Replace carbon brush if length is <8 mm
(PM)
2.1 if > 33Kohms, check carbon brush
connection, replace as needed (PM).
3. Adjust tape thickness data settings.
4. Adjust Z-height.
5. Clean Non Contact Sensor using Cotton
swab soaked in DI H2O.
6. Adjust voltage to 4.9 to 5.1 V (Tech)
7. Adjust / Replace chuck table. Run test cut
using film tape only. (Tech)
8. For deep cut, rework affected wafer.
8.1 Patch whole film tape on wafer
backside.
8.2 Use optimized ejector needle height and
bond pick delay parameters during Detach
/Load (Tech)
8.3 Pick and place and transfer of dice into
appropriate waffle pack.
8.4 Transfer units onto film frame.
10 Adjust value and perform calibration.
11. Adjust vacuum supply as per requirement.
12 Adjust contact point during cutter set (Tech)
1. Visual check
using dummy
wafers
2. For deep cut/
shallow cut,
subject sawn
film tape to Die
Attach for
standard tape
expansion.
OR EQUIVALENT
analysis and C/A.
NO
YES
A
DIE WASH OUT?
1. Recall the correct program from PLS.
2. Remount succeeding wafers using correct
mounting tape.
3. Perform post mount cure on succeeding
wafers.
4. Reduce DI H2O flow rate to 1.0 L/min.
5. Correct position and direction of water
nozzles. (Tech)
6. Replace worn out / damaged blade. (Tech)
parameter recalled from the
Program Library System (PLS).
capable of PLS
2. Check correctness of mounting
tape used.
3. For devices requiring post mount
cure, check wafers if undergone
post mount cure prior saw.
4. Check DI H2O pressure.
5. Check position and direction of
water nozzle. (Tech)
6. Check blade condition for wear or
damage.
NO
YES
B
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : VISUAL DEFECTS III
CONTINUE
PROCESSING
PASS?
NO
YES
Visual check using
dummy wafers
OR EQUIVALENT
analysis and C/A.
B
C
MISALIGN CUT?
WAFE
R
FLY-
OFF?
1. Check for wrong programming of
eye point during set-up.
2. Check for mis-processed single
wafer with different die size.
capable of PLS
4. Mislead auto-correction by
machine after kerf width check.
5. Wrong manual alignment point
6. Check cut index cut accuracy
6.1 For multi die, check Y-index
accuracy vs. required sawing plan.
7. Check correctness of device
number on machine program vs.
actual device number.
8. Check straightness of saw street
within the wafer.
9. Check correctness of die size
measurement input on device
program.
10. Check machine spindle vibration
due to load spreader on machine
platform (Tech)
11. Check for blade to cross hair offset
12. Check for X and Y axis error
(Tech)
1. Check lock gripper spring if
worn-out. (Tech)
2. Check for loose rotary arm on
transfer section causing
inconsistent positioning at
cleaning. (Tech)
1. Replace defective lock gripper spring (Tech)
1.1 Include checking of wafer gripper lock
spring during PM activity. (PM Group)
1.1 Activate vacuum gage auto-stop for
wafer presence. (Tech)
2. Perform error recovery procedure for arm
error (Tech).
YES
YES
NO
NO
1. Correct eye-point programming.
1.1 Activate wafer saw alarm system on
PRS.
1.2 Activate guard band window on Y-
correction auto-detector. (Tech)
1.3 Activate 0-level check during device
set-up.
2. Retrieve / generate program for new die
size.
4. Edit auto kerf check program
4.1 Perform 1
st
good cut line check.
4.2 Activate auto kerf target parameter.
5. Edit and save program with correct
alignment.
5.1 Activate machine auto kerf check.
6. Correct cut index on machine program.
6.1 Correct cut index on device program
based on required sawing plan.
8. Adjust blade cut position so as to cut
available space on the two misaligned
streets.
8.1 Stop processing and call LM/PE if
street misalignment is imbalance.
9. Measure and save accurate die size.
10. Repair/ eliminate machine spindle
vibration (Tech).
11. Apply F1 correction / hairline adjust vs.
actual cut.
12. Re-initialize machine and repair as needed
(Tech)
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : VISUAL DEFECTS IV
CONTINUE
PROCESSING
PASS?
NO
YES
Visual check using
dummy wafers
LOG RESULTS,
FINDINGS
OR EQUIVALENT
analysis and C/A.
D
YES
NO
NO
KERF
WIDTH
/ DIE
SIZE
FAILU
RE?
Program Library System (PLS)
damage.
3. For devices requiring blade
dressing, check sufficiency of
blade dressing.
4. Check correctness of blade type
used.
5. Check if there is sufficient cooling
water delivered to the blades.
1. Recall the program from PLS.
2. Replace worn out / damaged blade.
(Tech)
3. Activate pre-cut mode or redress blade.
4. Check LTC / Blade Selection Matrix on
ATPDOCS for proper blade requirement.
4.1 Replace with correct type of blade.
(Tech)
5. Adjust DI H2O flow rate to 1.0 L/min
minimum.
C
UNSAWN
WAFER /
UNCUT
LINE
1. Correct cutter set parameter setting.
(Tech)
2. Adjust BBD setting to within
specification. (Tech)
3. Replace broken / worn out blade.
(Tech)
4. Correct loading of wafers on cassette.
YES
NO
1. Check cutter set parameter
setting.
2. Check blade breakage detector.
(Tech)
3. Check for broken blade
occurrence.
4. Check proper loading of wafers on
cassette.
SCRATC
H /
PASSIVA
-TION
DAMAGE
?
damage.
2. Check wafer for occurrence of fly-
offs.
3. Check remaining blade exposure
if it could cause the blade hub to
hit die surface.
4. Check for undetected broken
blade (Tech).
5. Check for incorrect wafer
thickness entry.
6. Check for water nozzle distance
to wafer surface (Tech).
7. Check for incorrect tape thickness
entry.
8. Check for incorrect blade height
settings.
(Tech)
2. Perform wafer reheating.
2.1 Replace damaged blade (Tech).
3. Replace with new blade. (Tech)
4. Stop machine operation, replace the
blade.
4.1 Repair the machine and fix BBD.
(Tech)
5. Input actual wafer thickness based on
LTC.
6. Calibrate or adjust nozzle distance to
chuck or wafer surface (Tech).
7. Input correct tape thickness.
8. Adjust blade height settings so that
blade hub will not hit die surface.
YES
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : VISUAL DEFECTS V
CONTINUE
PROCESSING
PASS?
NO
YES
Visual check using
dummy wafers
EQUIVALENT
analysis and C/A.
D
YES
NO
SAW DUST
/
GALVANIC
CORROSIO
N?
1. Manually swab affected wafers/units with
surfactant and subject it to another wash /
dry cycle in the machine.
2. Adjust DI H2O flow rate to 1.0 Li/min
minimum.
3. Replace surfactant type. (Tech)
4. Refill surfactant tank. (Tech)
5. Edit/correct washing/drying parameters.
6. Correct pump stroke rate / length setting.
6.1 Adjust stoke rate / length to maximum
setting.
7. Replace / Repair pump solenoid valve
(Tech).
8. Adjust DI wash water pressure (Tech)
8.1 If necessary, repair / replace wash
water pump (Tech).
9. Perform handling procedure on wafers
staged during process.
10. For stand-alone surfactant, mix the solution
using stirring rod minimum of 1 minute.
(Tech)
10.1 For surfactant tank with agitator, adjust
rpm settings (Tech).
11. Remove residues found on valve guide and
valve seat. (Tech)
12. Perform bleeding procedure; turn on the
air vent valve to release trapped air. (Tech)
13. If out of range, shutdown machine and
inform LM/PE/facilities.
14. Repair if misaligned or clogged (Tech).
15. Adjust spinner water pressure (Tech).
1. Check sawn wafers from the
same lot for saw dusts.
2. Check proper DI H2O flow rate
requirement.
3. Check correctness of
surfactant type used. (Tech)
4. Check surfactant level on tank
if above minimum requirement
5. Check correctness of washing
/ drying parameters being
used.
6. Check pump stroke rate /
length setting.
7. Check functionality of pump
solenoid valve. (Tech)
8. Check DI wash water
pressure. (Tech)
9. Check staging of wafer during
process.
10. Check surfactant solution for
any gel type material present.
(Tech)
11. Check valve ball condition of
pump if pulsating / moving.
(Tech)
12. Check presence of surfactant
foams on cutting chamber.
13. Check DI H2O resistivity if out-
of range.
14. Check nozzle for misalignment
or clogging (Tech).
15. Check spinner water pressure
if too low (Tech).
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : KERFWIDTH FAILURE
CONTINUE
PROCESSING
PASS?
POC
above
UCL Run
above CL
Increasin
g Trend
NO
YES
POC
above
UCL Run
above CL
Increasin
g Trend
POC
below
LCL Run
below CL
Decreasi
ng
Trend?
These are opportunity points. No
issuance of tag
1. Adjust/ reduce feed rate.
2. Replace blade with new one.
3. Adjust water pressure as per specs
requirement.
4. Reinstall blade and ensure proper fitting of
blade to hub.
5. If not planar, level / replace table. (Tech)
6. Adjust spindle speed as per specs
requirement.
Re-qualify machine
using dummy
wafers.
Sample Size: 1
Dummy wafer
minimum
EQUIVALENT
analysis and C/A.
IS KERF
WIDTH OUT
OF
CONTROL
CONDITION
?
At least
1
reading
out of
specs?
1. Stop machine.
2. On affected wafer, perform
100% visual inspection using
75x-150x magnification of high
power microscope.
3. Perform machine analysis.
(Tech).
Issue Tag for machine shutdown
and record readings, parameters at
SPC Database.

1. Check feed rate setting used.
2. Check blade if worn out,
broken or blade exceeds
specified blade life.
3. Check if water flow rate of
spindle cooling/cutting is out of
range.
4. Check blade for any vibration.
5. Check planarity of chuck table.
(Tech).
6. Check if spindle speed is out of
range.
POC
below
LCL Run
below CL
Decreasin
g Trend?
X-Bar Chart
R-Chart
YES
NO
NO
YES
X-Bar Chart
R-Chart
1. Log parameters and reading on SPC
Database (PCM)
2. Allow continuation of process.
YES
YES
YES
YES
NO
NO
NO
NO
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : LOW DI H2O RESISTIVITY (PURE)
CONTINUE
PROCESSING
PASS?
NO
YES
Pure DI
H2O
Resistivity
dropped to
Alarm
limit?
1. Rewash affected wafer with replenished DI H2O
and dry.
1.1 Segregate and place an alert tag on affected
wafer.
1.2 Take sample units from affected wafer on four
quadrants for SEM EDX analysis on possible
contaminants present on bond pads. (PE)
1.3 Inform customer on the problem encountered.
(PE)
2. Perform trouble shooting/ correction until DI H2O
resistivity normalized. (Facilities)
2.1 Inform production once DI H2O resistivity
from main supply stabilized. (Facilities)
3. Perform DI H2O purging on all machines for 15
minutes. (Tech)
4. Obtain DI H2O sample after replenishment for
analysis as required (Ex. Bacteria Count, Fluorine,
Chlorine, etc.). (Facilities)
Perform sampling
inspection on next
wafer
SS: 45 units
EQUIVALENT
1. Call MEE / Tech / Facilities to
do further analysis and C/A.
NO
1. Stop machine operation except for machines currently running when DI H2O
resistivity in trouble.
2. Finish dicing and washing of wafers in-process when DI H2O resistivity dropped.
3. Record on log sheet all affected wafers including the problem encountered.
Stop lot processing until DI H2O resistivity stabilized.
1. Check wafer/ bond pad quality.
2. Check root cause of DI H2O
Resistivity from main supply.
(Facilities)
3. Check machine condition. (Tech)
4. Check DI H2O sample quality
(Facilities)
YES
BELOW MAVERICK
YIELD TRIP POINT

CONTINUE
PROCESSING

Re-qualify the
machine and
visual check
using 5 dummy
units minimum.
(Tech)

NO
YES
YES
1. Call MEE/Tech to do
further analysis and CA.
not solved for analysis
and C/A.
1. If there is dripping, stop machine operation call technician for machine
repair.
2. If above USL, stop machine operation call Tech. for machine
qualification.
3. If inconsistent, stop machine call Tech. for machine repair.
4. if misplaced die, call Tech. for die placement correction.
5. If offset, call Tech. for epoxy dispensed correction.
6. If contaminated, replace rubber tip with new one. (Tech.)
7. If expired epoxy, replace. Hold the affected lot for engineering
and MRB generation.
8. If incorrect, replace rubber tip/ showerhead with the correct one.
(Tech.)
9. If misaligned, re-align missed-die sensor. If defective, replace. (Tech.)
10. If out of range, set the vacuum and dispense pressure setting as
per requirement. If leaky, repair the defective part. (Tech.)
ANY REJECT
SEEN?
1. Stop machine operation. Do 100% inspection on units processed
until the last visual monitoring.
2. Quantify/categorize defect seen and log on the results on
logsheet.
Epoxy on Die/
Epoxy on Lead
1. Check for epoxy dripping.
2. Check epoxy fillet height and coverage if above
specs requirement.
3. Check for epoxy dispense consistency.
4. Check for misplaced die.
5. Check for offset epoxy dispensed.
6. Check for rubber tip contamination.
7. Check if epoxy exceeds pot life on epoxy
syringe.
8. Check for incorrect rubber tip/ showerhead
type used. (Tech.)
9. Check for missed-die sensor alignment and
functionality. (Tech.)
10. Check for vacuum and dispense pressure
setting or leak. (Tech.)
1. Check for epoxy dispense inconsistency.
2. Check for bubbles in epoxy syringe.
3. Check if epoxy in syringe is <1cc.
4. Check if showerhead is incorrect.
5. Check for inc. epoxy dispensed pattern.
6. Check for dirty or clogged showerhead. (Tech.)
7. Check for rubber tip planarity. (Tech.)
8. Check for anvil block planarity. (Tech.)
9. Check for vacuum and dispense pressure
setting or leak. (Tech.)
Incomplete fillet/
Coverage/ Epoxy
Void
1. If inconsistent, stop machine operation call Tech. for machine repair.
2. If there are bubbles, purge epoxy to lint free paper or perform cycle
dispensing until uniform epoxy dispense is attain.
3. If less than 1 cc, replace epoxy.
4. If incorrect, replace showerhead with the correct one. (Tech.)
5. If inconsistent, stop machine operation call Tech. for machine repair.
6. If clogged or dirty, clean or replace affected showerhead. (Tech.)
7-8. If non-planar, perform bondhead planarity check and teach pick and
bond Z-height. (Tech)
9. If out of range, set the vacuum and dispense pressure setting as per
requirement. If leaky, repair the defective part. (Tech.)
Mis-aligned/
Slanted Angular Die/
Chip-out/ Die backside
tool mark/ None pick
or skip good die
1. Check for uneven needle impression on Nitto
tape.
2. Check for needle type or diameter used. (Tech.)
3. Check for worn-out ejector needle. (Tech.)
4. Check for needle ejection height setting. (Tech.)
5. Check if rubber tip used is incorrect. (Tech.)
6. Check for bond Z-height or level setting. (Tech.)
7. Check bond delay setting. (Tech.)
8. Check for ejector needle velocity setting. (Tech.)
9. Check for over stretch of wafer tape. (Tech.)
10. Check for wafer placement angle setting. (Tech.)
11. Check for PRS setting. (Tech.)
12. Check for incorrect vacuum setting. (Tech.)
1. If there is uneven needle impression, call Tech. for needle calibration.
2. If incorrect needle type or diameter used, replace with new one.
(Tech.)
3. If ejector needle is already worn-out, replace with new one. (Tech.)
4. Adjust or set ejector needle height as per specs requirement. (Tech.)
5. If incorrect, place rubber tip with the correct one. (Tech.)
6. Re-define bond Z-height bond level. Add offset value of bond
height to leadframe. (Tech).
7. Adjust bond level setting as per requirement. (Tech.)
8. Adjust ejector needle velocity setting as per requirement. (Tech.)
9. Adjust wafer stretch setting as per minimum requirement. (Tech.)
10. Adjust wafer placement angle setting. (Tech.)
11. Adjust PRS/ fixed setting and lighting. (Tech.)
12. Adjust vacuum pressure setting as per recommended set-up. (Tech.)
PASS?
NO
A
NO
YES
YES
NO
YES
NO
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : ESEC / TOSOK / ASM
PROCESS : DIE ATTACH REVISION LEVEL : D
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT

CONTINUE
PROCESSING

Re-qualify the
machine and
visual check
using 5 dummy
units minimum.
(Tech)
NO
YES
further analysis and CA..
and C/A..
1. If wash-out ink, stop operation, call KOL/PE for wafer
disposition. If faded ink, call Tech for lighting or PRS
adjustment.
2. If inconsistent ink location, stop operation, call Tech. for ink
dot window setting adjustment.
3. If inconsistent ink dot size, stop operation, call Tech. for
mach. adjustment.
3.1 Manually create a smaller size of ink dot on the same
inked die. (Tech.)
3.2 Perform ink dot and PRS / fixed programming on the
manually created ink dot. (Tech.)
4. Optimize auto lighting set-up for PRS setting. (Tech)
Ink Die/ Edge Die
1. Check for washout or faded ink of
the wafer.
2. Check for inconsistent ink location.
3. Check for inconsistent ink dot size.
4. Check for machine PRS setting. (Tech)
1. Check for inconsistent epoxy dispense or not
uniform epoxy fillet distribution.
2. Check for misalignment or non-planar of rubber
tip. (Tech.)
3. Check for center to center misalignment of
ejector with respect to die. (Tech.)
4. Check for un-teach bond Z-height setting. (Tech.)
Die Tilt
1. If inconsistent, stop machine operation call Tech. for
machine repair.
2. If misaligned rubber tip, re-align rubber tip. If non-planar,
perform bond head planarity check and re-teach bond
Z-height. (Tech.)
3. If misaligned, perform centering or re-set-up of ejector
needle with respect to die. (Tech)
4. Re-calibrate bond Z-height setting of the machine. (Tech.)
Misoriented die
1. Check for incorrect wafer, LF and plates
orientation.
2. Check for improper loading of LF at bond input
stack loader.
1. If incorrect, correct orientation or follow as stated on BD,
SWR or special instruction if any.
2. Activate LF hole sensor. (Tech)
PASS?
A
Leadframe Physical
Defect
1. Check for too deep strip mark code.
2. Check if physical defect is material inherent.
3. Check if LF magnetic sensor level is too high.
(Tech.)
4. Check for incorrect calibration or mechanical
alignment. (Tech.)
5. Check for worn-out magazine stocking base or
deformed parts. (Tech.)
1. Adjust strip mark code air pressure setting. (Tech.)
2. If material inherent call Prod. Sup. Or PE for dispo. On
affected batch.
2.1. Replace affected batch with new one but do sampling
inspection (5 strips/pack). If no reject, proceed
processing.
2.2. If there is reject on new batch, repeat 2.1 and 2
3. Adjust magnetic sensor height to make it level to track
planarity. (Tech.)
4. If misaligned, perform mach. re-calibration and mechanical
alignment. (Tech.)
5. If worn-out magazine, scrap affected magazine. If deformed
stocking base call Tech for machine repair. (Optr.)
NO
YES
NO
YES
NO
YES
YES
NO
Wrong Leadframe
Pad size
1. Check for wrong MH allocation.
2. Check for wrong LF issuance at kitting. (MH)
1. Inform MH to replace it with the correct pad size.
2. Inform kitter and return wrong LF to replace it with correct
one.
2.1. Call Prod. Sup. Or PE to dispo the affected lot.
B
NO
YES
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT

CONTINUE
PROCESSING

Re-qualify the
machine and
visual check
using 5 dummy
units minimum.
(Tech)
NO
YES
and C/A..
1. Perform FAI and visual monitoring 1X/magazine and every
set-up.
1.1 Process one lot at a time.
1.2 Do magazine tracking thru LTC fill-up.
1.3 Call Prod. Sup. or PE for dispo the affected lot.
2. If worn-out screw replace it with new. (Tech)
3. Adjust air supply setting. (Tech.)
4. If worn-out, segregate and dispose defective strip marks.
(Optr/Tool Keeper)
5. If worn-out, replace base block. (Tech.)
Wrong/Incomplete
Stripmark Character
1. Check for wrong used of strip mark character.
2. Check for worn-out screw. (Tech)
3. Check for insufficient air supply. (Tech)
4. Check for worn-out stripmark character.
5. Check for worn-out base block. (Tech)
Tarnished Leadframe
1. Check if LF tarnishing is material inherent.
2. Check LF history if prolong stored at ambient
temperature. (MH/LP)
3. Check expiration date of affected LF.
affected batch.
1.1. On affected lot, call Prod. Sup. Or PE for disposition.
processing.
2. If LF prolong stored at ambient temp., withdraw new batch
of LF and dispose affected one.
3. If expired, replace with new batch and call Prod. Sup. to
dispo the expired LF.
PASS?
B
Mixed Device
NO
YES
NO
YES
YES
NO
1. Check if 2 different devices/ lots placed in one
wafer carrier.
2. Check for mis-lead PRS function on green ink with
dark background on die surface (multi-device
wafer).
3. Check for multi die ID reflected on BD (multi-
device wafer).
1. Utilize one carrier per ILN and call Prod. Sup. or PE for
dispo the affected lot.
2. Call tech for PRS adjustment/calibration.
3. Call Prod. Sup. or PE for verification and to heads-up BD
enhancement.
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : WAFER MAP DIE PICKED LOCATION
YES
NO
CONTINUE
PROCESSING
1. Check for wrong map alignment
vs. programmed. (Tech)
2. Check for incorrect die alignment
during test mode. (Tech)
3. Check for wrong die size setup or
index step. (Tech)
1. Check for manual encoding of
map id. (Tech)
2. Check if barcode reader is non-
functional. (Tech)
3. Check for incorrect barcode label
and map file used. (Optr/Tech)
1. Re-setup ALPS orientation
setup. (Tech)
2. Adjust actual wafer mounting.
3. Check original map file w/ ICS.
(Tech)
Correlate picked die
location, actual vs. map
display using unique dice.
SS: 25 units max per
wafer.
1. Check for incorrect ALPS
orientation setup. (Tech)
2. Check for offset mounting of
actual wafer.
3. Check if original map file has
different format. (Tech)
1. Use barcode reader. (Tech)
2. Replace non-functional
barcode reader. (Tech)
3. Replace incorrect barcode
sticker. (Tech)
1. Re-setup map alignment.
(Tech)
2. Use unique die alignment.
(Tech)
3. Re-setup die size. (Tech)
analysis and C/A.
ANY WRONG
DIE PICKED
SEEN?
Offset
map/die?
Wrong map
file used?
Wrong map
orientation?
Incorrect bin
used?
1. Check for incorrect bin or die type
requirement per lot. (Tech)
2. Check for un-marked set-up bin
codes. (Tech)
1. Key in the correct bin codes or
die to be processed. (Tech)
2. Un-mark set-up bin codes.
(Tech)
NO
YES
NO
YES
NO
YES
NO
YES
NO
YES
PASS?
1. Stop machine operation.
2. Quantify/categorize wrong picked units and log on the results on logsheet.
3. Call supervisor
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : BOND LINE THICKNESS FAILURE (BLT)
Any BLT
failure seen?
CONTINUE
PROCESSING
NO
YES
1. Issue PCM Tag to stop machine operation for analysis, corrective action and requal until pass.
2. On lots processed since last good monitoring :
2.1 Do 100% x-ray inspection for void and mark reject unit for any failure seen.
2.2 Do 5 units BLT re-sampling per affected magazine, if at least 1/5 failed, hold affected lot inform PE for lot disposition
(MRB if applicable).
1.Call MEE / Tech to do
further analysis and C/A.
2.Call PE if problem is still
and C/A
PASS?
NO
YES
Any reading below
Guard band?
YES
MACHINE SET-UP
1.Check for proper installation of pick-up tool.
(Tech).
2.Check bond Z-height level. (Tech).
3.Check tool shank and pivot spring. (Tech.)
4.Check bond force. (Tech).
5.Check for bond time. (Tech).
6.Check for bond blow time. (Tech).
7.Check for clogged shower head. (Tech).
8. Check for anvil block planarity. (Tech).

MATERIAL
1.Check epoxy sticker for epoxy pot life.
2.Check for bubbles in epoxy syringe.
3.Check for epoxy dispense consistency.
4.Check leadframe paddle planarity. (Tech).

NO

1. Submit 2 dummy
units for BLT
buy off.
2. Perform visual
inspection on first
strip processed.

Any reading above
Guard band?
NO
YES
1. Continue Process
MACHINE SET-UP
1. Replace or re-install pick up tool (Tech).
2. Adjust or redefine bond Z-height level.
(Tech).
3. Adjust/ replace tool shank and pivot spring
if necessary. (Tech).
4. Adjust bond force if necessary. (Tech).
5. Adjust bond time if necessary. (Tech).
6. Adjust bond blow time if necessary. (Tech).
7. If clogged, clean or replace affected
showerhead. (Tech).
8. If non-planar, perform BH Planarity check
and teach pick and bond Z-height. (Tech).

MATERIAL
1. If expired, replace epoxy and re-qualify,
Hold affected lot if any, inform PE/SUP for
lot disposition.
2. If there are bubbles, purge epoxy to metal
sheet epoxy dispense or perform cycle
dispensing until uniform epoxy dispense
is attain.
3. If inconsistent, stop machine operation, call
Tech. for machine repair.
4. If non planar, perform dispense height
setting per die paddle of the leadframe.
(Tech).
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : BOND LINE THICKNESS FAILURE (For Customer with SPC requirement in BLT)
1. Submit 2 dummy
units for BLT buy
off.

2. Perform visual
inspection on
first strip
processed
Is BLT out
of control
condition?
CONTINUE
PROCESSING
PASS?
1. Call MEE / Tech to
do further analysis
and C/A.
2. Call PE if problem is
still not solved.
NO
YES
YES
NO
YES
At least 1 reading
out of specs?
1. Issue PCM Tag for stop machine operation,
analysis, corrective action and requal.
2. On lots processed since last good
monitoring:
2.1 Do 100% visual inspection for defects.
2.2 Do 100% X-ray inspection for void and
mark reject for any failure seen.
2.3 Do 5 units BLT re-sampling per affected
mag., if at least 1/5 failed, hold lot inform PE.
MACHINE SET-UP :
1. Check for proper installation of pick-up
tool. (Tech.)
2. Check or redefine bond-z height. (Tech.)
3. Check tool shank and pivot spring. (Tech.)
4. Adjust bond time/force if necessary. (Tech.)
5. Adjust bond blow time if necessary. (Tech.)
6. Check for clogged shower head. If clogged,
clean or replace affected shower head.
(Tech.)
7. Check for anvil block planarity. If non-
planar, perform BH planarity check and
teach pick and bond z-height. (Tech.)

MATERIAL :
1. Check epoxy sticker for pot life. If expired,
replace epoxy. If with affected lot, call
supervisor to check if MRB disposition
is required.
2. Check for bubbles in epoxy syringe. If there
are bubbles, purge epoxy to lint free paper
or perform cycle dispensing until uniform
epoxy dispense is attain.
3. Check for epoxy dispensed consistency.
If inconsistent, stop machine operation call
Tech. for machine repair.
4. Check leadframe paddle planarity. If non-
planar, perform dispense height setting per
die paddle of the leadframe. (Tech.)
POC on/above UCL,
POC on/below LCL,
Run below CL,
Decreasing Trend
LOG RESULTS,
FINDINGS and
C/A on SPC Database
NO
YES
Decreasing Trend
Run below CL
POC on/above UCL,
Increasing Trend,
Run above CL
Issue PCM Tag. Stop machine operation.
Require for corrective action and re-qualification.
NO
YES
NO
Issue PCM Tag. Stop machine operation. Require
corrective action and re-qualification.
Note : There is an increased unit to unit BLT
variability.
YES
X-bar Chart
R Chart
NO
Run above CL,
Increasing Trend
This is an opportunity point. Go to next
monitoring.
NO
YES
monitoring.
BELOW MAVERICK
YIELD TRIP POINT
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : BLUE M
PROCESS : DIE ATTACH CURE REVISION LEVEL : C
CONTROL ITEM : DIE SHEAR FAILURE
Die Shear test
failure seen?
CONTINUE
PROCESSING
NO
YES
1. Stop machine operation. Do 100 % inspection on units processed until the last visual monitoring.
2.Quantify / categorize defect seen and log on the results on logsheet.
1.Call MME / Tech to do
and C/A

PASS?
NO
YES
Cure Temp Beyond
+/- 5C
Cure Time Beyond
+30 / - 0 mins
YES
1.Check temperature / time on
display read out.
2.Check cure temperature / time
setting.
3.Check machine profile.
1.If beyond requirement, stop machine
operation and inform technician for
actual temperature measurement
using thermocouple.
2.If incorrect program setting, stop
machine operation and inform
technician to change program
setting.
3.If machine profile not performed, stop
machine operation and inform PM to
perform profiling.
1. Re-qualify
machine using
dummy units.
SS: 4 units

2. Apply correct
oven curing
profile. (Tech)
NO
Cure Rise Temp > 1HR
YES
1.Check machine timer.
2.Check cure time setting.
4.Check load capacity.
NO
1.If the above requirement, stop machine
operation and inform technician to
adjust / calibrate timer.
2.If incorrect program setting, stop machine
operation and inform technician to change
program setting.
perform profiling.
4.Determine maximum load capacity and
follow maximum requirement.
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
PROCESS : DIE ATTACH CURE REVISION LEVEL : C
CONTROL ITEM : DIE SHEAR FAILURE (For Customer with SPC requirement)
1. Re-qualify
machine using
dummy units.
SS: 4 units

2. Apply correct
oven curing
profile. (Tech)
At least 1 DST
reading failed?
CONTINUE
PROCESSING
PASS?
do further analysis
and C/A.
still not solved.
YES
NO
YES
1. Stop machine operation. Do 100% X-ray inspection for void on affected lot. (PCM/Optr.)
2. Quantify / categorize defect seen and log on the results on applicable logsheet.
1-2. If incorrect, apply correct oven
program setting per epoxy type.
3. If expired epoxy, replace. Hold the
affected lot for Engineering
disposition and MRB generation.
4. If low dry BLT and insufficient epoxy
coverage, hold affected lot for
Engineering disposition.
POC on/below LCL,
Run below CL,
Decreasing Trend
NO
YES
Decreasing Trend
Run below CL
POC on/above UCL,
Increasing Trend,
Run above CL
1. Check for incorrect or wrong setting of
oven curing time.
oven curing temperature.
3. Check for expired epoxy.
4. Check for dry BLT and epoxy coverage.
NO
YES
NO
Require corrective action and re-qualification.
YES
X-bar Chart
R Chart
NO
POC on/above UCL,
Run above CL,
Increasing Trend
NO
YES
This is an opportunity point. For POC, note
down parameters used in SPC data. Go to
next monitoring.
down parameters used in SPC. Go to next
monitoring.
BELOW MAVERICK
YIELD TRIP POINT
LOG RESULTS,
FINDINGS and
C/A on SPC Database
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : NOT APPLICABLE
PROCESS : WAFER MOUNT (DAF) REVISION LEVEL : C
CONTROL ITEM : ALL
Refer to System - OCAP Control Procedure for ATP3 Central Die Preparation Spec# 02-3791
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : TSK/ DISCO
PROCESS : WAFER SAW (DAF) REVISION LEVEL : D
CONTINUE
PROCESSING
PASS?
NO
YES
A
ANY
REJECT
SEEN?
DIE
CHIPOUT /
DIE
CRACK?
1. Stop machine. Do 100% inspection on all wafers processed until the last monitoring.
2. Quantify / Categorize defect seen and log on the results on applicable log sheet.
Visual Check using
dummy wafers
EQUIVALENT
analysis and C/A.
YES
NO
NO
YES
1. Check feed rate parameter
2. Check actual blade used.
2.1 Check blade condition for
wear or damage.
3. Check wafer for occurrence of fly-offs.
4. Check chuck table for foreign material.
(Silicon debris, etc.)
5. Check spindle vibration. (Tech)
6. For devices requiring blade dressing,
check sufficiency of blade dressing.
7. Check for manifold and directional control
valve condition. (Tech)
8. Check correctness of blade type used.
9. Check for chuck table non-planarity due
to improper machine set up/conversion.
(Tech)
10. Check correctness of wafer release from
the chuck table.
11. Check linear arm vacuum line for
clogging. (Tech)
12. Check functionality of Blade Breakage
Detector (BBD). (Tech)
parameters recall from Program Library
System. (PLS)
capable of PLS
14. Check if blade exceeds blade life
15. Check water flow rate for low water
pressure
16. Check for any foreign material in wheel
mount (Tech)
17. Measure wobbling of wheel mount if
within the maximum requirement (Tech)
18. Check for dents in water nozzle (Tech)
19. Check for clogged water nozzles (Tech)
20. Check for misaligned water nozzle with
respect to blade exposure (Tech)
21. Check for defective spindle shaft axial
and spindle tip axial (Tech)
22. Measure wobbling of spindle shaft axial if
23. Measure wobbling of spindle tip axial if
1. Adjust / reduce feed rate
1.1 Activate auto kerf check
2. Replace if wrong blade was used
2.1 Replace with new and same blade type
for damaged blade (Tech).
2.2 Activate auto broken blade detector
(Tech).
3. Adjust water pressure. No wafer pre-heat.
4. Clean chuck table using blowgun.
5. Include checking of flange run out in PM
activity (PM)
5.1 Activate automatic kerfwidth monitor.
6. Activate precut mode of redressed blade.
7. Activate auto-machine stop mode after
cleaning.
7.1 Activate sense proximity control sensor or
spinner cylinder. (Tech)
8. Check LTC/Blade Selection Matrix on for
proper blade requirement.
9. Adjust/replace chuck table. (Tech)
10 Set vacuum blow pressure to 45-85 Psi.
(Tech)
11. Clean blow airline for clogging. (Tech)
11.1 Repair/Replace chuck table. (Tech)
11.2 Clean linear arm vacuum line. (Tech)
12. Repair/Replace BBD sensor. (Tech)
14. Replace blade (Tech)
requirement
16. Clean/dress wheel mount to remove the foreign
material (Tech)
17. Calibrate wheel mount wobbling if exceeds the
</=2 microns tolerance (Tech)
18. Repair/replace water nozzle with dents (Tech)
19. De-clogged nozzles or repair dent parts (Tech)
20. Use nozzle height calibration jig to align the
water nozzle with blade exposure (Tech)
21. Calibrate/replace defective spindle shaft axial
tip (Tech)
22. Calibrate spindle shaft axial wobbling if
exceeds the </=2 microns tolerance (Tech)
23. Calibrate spindle shaft tip axial wobbling if
exceeds the maximum tolerance (Tech)
BELOW MAVERICK
YIELD TRIP POINT
PROCESS : WAFER SAW (DAF) REVISION LEVEL : C
CONTINUE
PROCESSING
PASS?
NO
YES
DEEP
CUT/
SHALLO
W CUT?
1. Check blade height.
2. Check spindle condition/ spindle
carbon brush.
2.1 Check resistance between
spindle shaft and main
machine body (PM)
3. Check for tape , die and DAF
thickness data setting.
4. Check for tape cut depth
impression through focusing on
CCTV.
5. Check non contact sensor if
clean.
6. Check Cutter set voltage (Tech)
7. Check for table planarity due to
improper set-up conversion
(Tech)
8. Check/Asses if applicable for
rework (Optr/Tech/PE)
10. Check cutter set value
11. Check vacuum supply
12. Check chuck table contact point
during cutter set (Tech)
1. Adjust Z-height.
2. Replace carbon brush if length is <8 mm
(PM)
2.1 if > 33Kohms, check carbon brush
connection, replace as needed (PM).
3. Adjust tape , die and DAF thickness data
settings.
4. Adjust Z-height.
5. Clean Non Contact Sensor using Cotton
swab soaked in DI H2O.
6. Adjust voltage to 4.9 to 5.1 V (Tech)
7. Adjust / Replace chuck table. Run test cut
using film tape only. (Tech)
8. For deep cut, rework affected wafer.
8.1 Patch whole film tape on wafer
backside.
8.2 Use optimized ejector needle height and
bond pick delay parameters during Detach
/Load (Tech)
8.3 Pick and place and transfer of dice into
appropriate waffle pack.
8.4 Transfer units onto film frame.
10 Adjust value and perform calibration.
11. Adjust vacuum supply as per requirement.
12 Adjust contact point during cutter set (Tech)
1. Visual check
using dummy
wafers
2. For deep cut/
shallow cut,
subject sawn
film tape to Die
Attach for
standard tape
expansion.
OR EQUIVALENT
analysis and C/A.
NO
YES
A
DICE OFF?
1. Recall the correct program from PLS.
2. Remount succeeding wafers using correct
mounting tape.
3. Reduce DI H2O flow rate to 1.0 L/min.
4. Correct position and direction of water
nozzles. (Tech)
5. Replace worn out / damaged blade. (Tech)
Program Library System (PLS).
capable of PLS
2. Check correctness of mounting
tape used.
3. Check DI H2O pressure.
4. Check position and direction of
water nozzle. (Tech)
damage.
NO
YES
B
BELOW MAVERICK
YIELD TRIP POINT
CONTINUE
PROCESSING
PASS?
NO
YES
Visual check using
dummy wafers
OR EQUIVALENT
analysis and C/A.
B
C
MISALIGN CUT?
WAFER
FLY-
OFF?
1. Check for wrong programming of
eye point during set-up.
2. Check for mis-processed single
wafer with different die size.
capable of PLS
4. Mislead auto-correction by
machine after kerf width check.
5. Wrong manual alignment point
6. Check cut index cut accuracy
6.1 For multi die, check Y-index
accuracy vs. required sawing plan.
7. Check correctness of device
number on machine program vs.
actual device number.
8. Check straightness of saw street
within the wafer.
9. Check correctness of die size
measurement input on device
program.
10. Check machine spindle vibration
due to load spreader on machine
platform (Tech)
11. Check for blade to cross hair offset
12. Check for X and Y axis error
(Tech)
1. Check lock gripper spring if
worn-out. (Tech)
2. Check for loose rotary arm on
transfer section causing
inconsistent positioning at
cleaning. (Tech)
1. Replace defective lock gripper spring (Tech)
1.1 Include checking of wafer gripper lock
spring during PM activity. (PM Group)
1.1 Activate vacuum gage auto-stop for
wafer presence. (Tech)
2. Perform error recovery procedure for arm
error (Tech).
YES
YES
NO
NO
1. Correct eye-point programming.
1.1 Activate wafer saw alarm system on
PRS.
1.2 Activate guard band window on Y-
correction auto-detector. (Tech)
1.3 Activate 0-level check during device
set-up.
2. Retrieve / generate program for new die
size.
4. Edit auto kerf check program
4.1 Perform 1
st
good cut line check.
4.2 Activate auto kerf target parameter.
5. Edit and save program with correct
alignment.
5.1 Activate machine auto kerf check.
6. Correct cut index on machine program.
6.1 Correct cut index on device program
based on required sawing plan.
8. Adjust blade cut position so as to cut
available space on the two misaligned
streets.
8.1 Stop processing and call LM/PE if
street misalignment is imbalance.
9. Measure and save accurate die size.
10. Repair/ eliminate machine spindle
vibration (Tech).
11. Apply F1 correction / hairline adjust vs.
actual cut.
12. Re-initialize machine and repair as needed
(Tech)
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : VISUAL DEFECTS IV
CONTINUE
PROCESSING
PASS?
NO
YES
Visual check using
dummy wafers
LOG RESULTS,
FINDINGS
OR EQUIVALENT
analysis and C/A.
D
YES
NO
NO
KERF
WIDTH
/ DIE
SIZE
FAILU
RE?
Program Library System (PLS)
damage.
3. For devices requiring blade
dressing, check sufficiency of
blade dressing.
4. Check correctness of blade type
used.
5. Check if there is sufficient cooling
water delivered to the blades.
1. Recall the program from PLS.
(Tech)
3. Activate pre-cut mode or redress blade.
4. Check LTC / Blade Selection Matrix on
ATPDOCS for proper blade requirement.
4.1 Replace with correct type of blade.
(Tech)
5. Adjust DI H2O flow rate to 1.0 L/min
minimum.
C
UNSAWN
WAFER /
UNCUT
LINE
1. Correct cutter set parameter setting.
(Tech)
2. Adjust BBD setting to within
specification. (Tech)
3. Replace broken / worn out blade.
(Tech)
4. Correct loading of wafers on cassette.
YES
NO
1. Check cutter set parameter
setting.
2. Check blade breakage detector.
(Tech)
3. Check for broken blade
occurrence.
4. Check proper loading of wafers on
cassette.
SCRATC
H /
PASSIVA
-TION
DAMAGE
?
damage.
2. Check wafer for occurrence of fly-
offs.
3. Check remaining blade exposure
if it could cause the blade hub to
hit die surface.
4. Check for undetected broken
blade (Tech).
5. Check for incorrect wafer
including DAF thickness entry.
6. Check for water nozzle distance
to wafer surface (Tech).
7. Check for incorrect tape thickness
entry.
8. Check for incorrect blade height
settings.
(Tech)
2. Perform wafer reheating.
2.1 Replace damaged blade (Tech).
3. Replace with new blade. (Tech)
4. Stop machine operation, replace the
blade.
4.1 Repair the machine and fix BBD.
(Tech)
5. Input actual wafer plus DAF thickness
based on LTC.
6. Calibrate or adjust nozzle distance to
chuck or wafer surface (Tech).
7. Input correct tape thickness.
8. Adjust blade height settings so that
blade hub will not hit die surface.
YES
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : VISUAL DEFECTS V
CONTINUE
PROCESSING
PASS?
NO
YES
Visual check using
dummy wafers
EQUIVALENT
analysis and C/A.
D
YES
NO
SAW DUST
/
GALVANIC
CORROSIO
N?
1. Manually swab affected wafers/units with
surfactant and subject it to another wash /
dry cycle in the machine.
2. Adjust DI H2O flow rate to 1.0 Li/min
minimum.
3. Replace surfactant type. (Tech)
4. Refill surfactant tank. (Tech)
5. Edit/correct washing/drying parameters.
6. Correct pump stroke rate / length setting.
6.1 Adjust stoke rate / length to maximum
setting.
7. Replace / Repair pump solenoid valve
(Tech).
8. Adjust DI wash water pressure (Tech)
8.1 If necessary, repair / replace wash
water pump (Tech).
9. Perform handling procedure on wafers
staged during process.
10. For stand-alone surfactant, mix the solution
using stirring rod minimum of 1 minute.
(Tech)
10.1 For surfactant tank with agitator, adjust
rpm settings (Tech).
11. Remove residues found on valve guide and
valve seat. (Tech)
12. Perform bleeding procedure; turn on the
air vent valve to release trapped air. (Tech)
13. If out of range, shutdown machine and
inform LM/PE/facilities.
14. Repair if misaligned or clogged (Tech).
15. Adjust spinner water pressure (Tech).
1. Check sawn wafers from the
same lot for saw dusts.
2. Check proper DI H2O flow rate
requirement.
3. Check correctness of
surfactant type used. (Tech)
4. Check surfactant level on tank
if above minimum requirement
5. Check correctness of washing
/ drying parameters being
used.
6. Check pump stroke rate /
length setting.
7. Check functionality of pump
solenoid valve. (Tech)
8. Check DI wash water
pressure. (Tech)
9. Check staging of wafer during
process.
10. Check surfactant solution for
any gel type material present.
(Tech)
11. Check valve ball condition of
pump if pulsating / moving.
(Tech)
12. Check presence of surfactant
foams on cutting chamber.
13. Check DI H2O resistivity if out-
of range.
14. Check nozzle for misalignment
or clogging (Tech).
15. Check spinner water pressure
if too low (Tech).
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : KERFWIDTH FAILURE
CONTINUE
PROCESSING
PASS?
POC
above
UCL Run
above CL
Increasin
g Trend
NO
YES
POC
above
UCL Run
above CL
Increasin
g Trend
POC
below
LCL Run
below CL
Decreasi
ng
Trend?
These are opportunity points. No
issuance of tag
1. Adjust/ reduce feed rate.
2. Replace blade with new one.
requirement.
4. Reinstall blade and ensure proper fitting of
blade to hub.
5. If not planar, level / replace table. (Tech)
6. Adjust spindle speed as per specs
requirement.
Re-qualify machine
using dummy
wafers.
Sample Size: 1
Dummy wafer
minimum
EQUIVALENT
analysis and C/A.
IS KERF
WIDTH OUT
OF
CONTROL
CONDITION
?
At least
1
reading
out of
specs?
1. Stop machine.
2. On affected wafer, perform
100% visual inspection using
75x-150x magnification of high
power microscope.
3. Perform machine analysis.
(Tech).
Issue Tag for machine shutdown
and record readings, parameters at
SPC Database.

1. Check feed rate setting used.
2. Check blade if worn out,
broken or blade exceeds
specified blade life.
3. Check if water flow rate of
spindle cooling/cutting is out of
range.
4. Check blade for any vibration.
5. Check planarity of chuck table.
(Tech).
6. Check if spindle speed is out of
range.
POC
below
LCL Run
below CL
Decreasin
g Trend?
X-Bar Chart
R-Chart
YES
NO
NO
YES
X-Bar Chart
R-Chart
1. Log parameters and reading on SPC
Database (PCM)
YES
YES
YES
YES
NO
NO
NO
NO
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : LOW DI H2O RESISTIVITY (PURE)
CONTINUE
PROCESSING
PASS?
NO
YES
Pure DI
H2O
Resistivity
dropped to
Alarm
limit?
1. Rewash affected wafer with replenished DI H2O
and dry.
1.1 Segregate and place an alert tag on affected
wafer.
1.2 Take sample units from affected wafer on four
quadrants for SEM EDX analysis on possible
contaminants present on bond pads. (PE)
1.3 Inform customer on the problem encountered.
(PE)
2. Perform trouble shooting/ correction until DI H2O
resistivity normalized. (Facilities)
2.1 Inform production once DI H2O resistivity
from main supply stabilized. (Facilities)
3. Perform DI H2O purging on all machines for 15
minutes. (Tech)
4. Obtain DI H2O sample after replenishment for
analysis as required (Ex. Bacteria Count, Fluorine,
Chlorine, etc.). (Facilities)
Perform sampling
inspection on next
wafer
SS: 45 units
EQUIVALENT
1. Call MEE / Tech / Facilities to
do further analysis and C/A.
NO
1. Stop machine operation except for machines currently running when DI H2O
resistivity in trouble.
2. Finish dicing and washing of wafers in-process when DI H2O resistivity dropped.
3. Record on log sheet all affected wafers including the problem encountered.
Stop lot processing until DI H2O resistivity stabilized.
1. Check wafer/ bond pad quality.
2. Check root cause of DI H2O
Resistivity from main supply.
(Facilities)
3. Check machine condition. (Tech)
4. Check DI H2O sample quality
(Facilities)
YES
BELOW MAVERICK
YIELD TRIP POINT

CONTINUE
PROCESSING

Re-qualify the
machine and
visual check
using 5 dummy
units minimum.
(Tech)

NO
YES
YES
further analysis and CA.
and C/A.
1. If misplaced die, call Tech. for die placement correction.
2. If contaminated, replace rubber tip with new one. (Tech.)
3. If expired DAF, hold the affected lot for engineering
and MRB generation.
ANY REJECT
SEEN?
1. Stop machine operation. Do 100% inspection on units processed
until the last visual monitoring.
2. Quantify/categorize defect seen and log on the results on
logsheet.
Adhesive on die / lead
1. Check for misplaced die.
2. Check for rubber tip contamination.
3. Check if DAF exceeds pot life on die
Wrong die / film
placement /
Scratch or crack on die/
None pick
or skip good die
1. Check for uneven needle impression on Nitto
tape.
2. Check for needle type or diameter used. (Tech.)
3. Check for worn-out ejector needle. (Tech.)
4. Check for needle ejection height setting. (Tech.)
5. Check if rubber tip used is incorrect. (Tech.)
6. Check for bond Z-height or level setting. (Tech.)
7. Check bond delay setting. (Tech.)
8. Check for ejector needle velocity setting. (Tech.)
9. Check for over stretch of wafer tape. (Tech.)
10. Check for wafer placement angle setting. (Tech.)
11. Check for PRS setting. (Tech.)
12. Check for incorrect vacuum setting. (Tech.)
1. If there is uneven needle impression, call Tech. for needle calibration.
2. If incorrect needle type or diameter used, replace with new one.
(Tech.)
3. If ejector needle is already worn-out, replace with new one. (Tech.)
4. Adjust or set ejector needle height as per specs requirement. (Tech.)
5. If incorrect, place rubber tip with the correct one. (Tech.)
6. Re-define bond Z-height bond level. Add offset value of bond
height to leadframe. (Tech).
7. Adjust bond level setting as per requirement. (Tech.)
8. Adjust ejector needle velocity setting as per requirement. (Tech.)
9. Adjust wafer stretch setting as per minimum requirement. (Tech.)
10. Adjust wafer placement angle setting. (Tech.)
11. Adjust PRS/ fixed setting and lighting. (Tech.)
12. Adjust vacuum pressure setting as per recommended set-up. (Tech.)
PASS?
NO
A
NO
YES
YES
NO
PKG/OPERATION : SOT/SC70/TO MACHINE TYPE : ESEC / ASM
PROCESS : DIE ATTACH (DAF) REVISION LEVEL : C
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT

CONTINUE
PROCESSING

Re-qualify the
machine and
visual check
using 5 dummy
units minimum.
(Tech)
NO
YES
and C/A..
1. If wash-out ink, stop operation, call KOL/PE for wafer
disposition. If faded ink, call Tech for lighting or PRS
adjustment.
2. If inconsistent ink location, stop operation, call Tech. for ink
dot window setting adjustment.
3. If inconsistent ink dot size, stop operation, call Tech. for
mach. adjustment.
3.1 Manually create a smaller size of ink dot on the same
inked die. (Tech.)
3.2 Perform ink dot and PRS / fixed programming on the
manually created ink dot. (Tech.)
4. Optimize auto lighting set-up for PRS setting. (Tech)
Ink Die/ Edge Die
1. Check for washout or faded ink of
the wafer.
2. Check for inconsistent ink location.
3. Check for inconsistent ink dot size.
4. Check for machine PRS setting. (Tech)
1. Check for misalignment or non-planar of rubber
tip. (Tech.)
2. Check for center to center misalignment of
ejector with respect to die. (Tech.)
3. Check for un-teach bond Z-height setting. (Tech.)
Die Tilt
1. If misaligned rubber tip, re-align rubber tip. If non-planar,
perform bond head planarity check and re-teach bond
Z-height. (Tech.)
2. If misaligned, perform centering or re-set-up of ejector
needle with respect to die. (Tech)
3. Re-calibrate bond Z-height setting of the machine. (Tech.)
Wrong die orientation
1. Check for incorrect wafer, LF and plates
orientation.
2. Check for improper loading of LF at bond input
stack loader.
1. If incorrect, correct orientation or follow as stated on BD,
SWR or special instruction if any.
2. Activate LF hole sensor. (Tech)
PASS?
A
Lead frame Physical
Defect
1. Check for too deep strip mark code.
2. Check if physical defect is material inherent.
3. Check if LF magnetic sensor level is too high.
(Tech.)
4. Check for incorrect calibration or mechanical
alignment. (Tech.)
5. Check for worn-out magazine stocking base or
deformed parts. (Tech.)
1. Adjust strip mark code air pressure setting. (Tech.)
affected batch.
processing.
3. Adjust magnetic sensor height to make it level to track
planarity. (Tech.)
4. If misaligned, perform mach. re-calibration and mechanical
alignment. (Tech.)
5. If worn-out magazine, scrap affected magazine. If deformed
stocking base call Tech for machine repair. (Optr.)
NO
YES
NO
YES
NO
YES
YES
NO
Wrong Lead frame
Pad Size Material
1. Check for wrong MH allocation.
2. Check for wrong LF issuance at kitting. (MH)
1. Inform MH to replace it with the correct pad size.
2. Inform kitter and return wrong LF to replace it with correct
one.
2.1. Call Prod. Sup. Or PE to dispo the affected lot.
B
NO
YES
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT

CONTINUE
PROCESSING

Re-qualify the
machine and
visual check
using 5 dummy
units minimum.
(Tech)
NO
YES
and C/A..
1. Perform FAI and visual monitoring 1X/magazine and every
set-up.
1.1 Process one lot at a time.
1.2 Do magazine tracking thru LTC fill-up.
1.3 Call Prod. Sup. or PE for dispo the affected lot.
2. If worn-out screw replace it with new. (Tech)
3. Adjust air supply setting. (Tech.)
4. If worn-out, segregate and dispose defective strip marks.
(Optr/Tool Keeper)
5. If worn-out, replace base block. (Tech.)
Wrong/Incomplete
Stripmark Character
1. Check for wrong used of strip mark character.
2. Check for worn-out screw. (Tech)
3. Check for insufficient air supply. (Tech)
4. Check for worn-out stripmark character.
5. Check for worn-out base block. (Tech)
Tarnished Leadframe
1. Check if LF tarnishing is material inherent.
2. Check LF history if prolong stored at ambient
temperature. (MH/LP)
3. Check expiration date of affected LF.
affected batch.
1.1. On affected lot, call Prod. Sup. Or PE for disposition.
processing.
2. If LF prolong stored at ambient temp., withdraw new batch
of LF and dispose affected one.
3. If expired, replace with new batch and call Prod. Sup. to
dispo the expired LF.
PASS?
B
Wrong/Mixed Device
NO
YES
NO
YES
YES
NO
1. Check if 2 different devices/ lots placed in one
wafer carrier.
2. Check for mis-lead PRS function on green ink with
dark background on die surface (multi-device
wafer).
3. Check for multi die ID reflected on BD (multi-
device wafer).
1. Utilize one carrier per ILN and call Prod. Sup. or PE for
dispo the affected lot.
2. Call tech for PRS adjustment/calibration.
3. Call Prod. Sup. or PE for verification and to heads-up BD
enhancement.
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : WAFER MAP DIE PICKED LOCATION
YES
NO
CONTINUE
PROCESSING
1. Check for wrong map alignment
vs. programmed. (Tech)
2. Check for incorrect die alignment
during test mode. (Tech)
3. Check for wrong die size setup or
index step. (Tech)
1. Check for manual encoding of
map id. (Tech)
2. Check if barcode reader is non-
functional. (Tech)
3. Check for incorrect barcode label
and map file used. (Optr/Tech)
1. Re-setup ALPS or equivalent
orientation setup. (Tech)
2. Adjust actual wafer mounting.
3. Check original map file w/ ICS.
(Tech)
Correct picked die
location, actual vs. map
file using unique dice or
reference die
SS: 25 dice (max) using
reference die
1. Check for incorrect ALPS or
equivalent orientation setup.
(Tech)
2. Check for offset mounting of
actual wafer.
3. Check if original map file has
different format. (Tech)
1. Use barcode reader. (Tech)
2. Replace non-functional
barcode reader. (Tech)
3. Replace incorrect barcode
sticker. (Tech)
1. Re-setup map alignment.
(Tech)
2. Use unique die alignment.
(Tech)
3. Re-setup die size. (Tech)
analysis and C/A.
ANY WRONG
DIE PICKED
SEEN?
Offset
map/die?
Wrong map
file used?
Wrong map
orientation?
Incorrect bin
used?
1. Check for incorrect bin or die type
requirement per lot. (Tech)
2. Check for un-marked set-up bin
codes. (Tech)
1. Key in the correct bin codes or
die to be processed. (Tech)
2. Un-mark set-up bin codes.
(Tech)
NO
YES
NO
YES
NO
YES
NO
YES
NO
YES
PASS?
1. Stop machine operation.
2. Quantify/categorize wrong picked units and log on the results on logsheet.
3. Call supervisor
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : DIE ADHESIVE THICKNESS (BLT) FAILURE
Any BLT
failure seen?
CONTINUE
PROCESSING
NO
YES
1. Issue PCM Tag to stop machine operation for analysis, corrective action and requal until pass.
2. On lots processed since last good monitoring :
2.1 Do 100% x-ray inspection for void and mark reject unit for any failure seen.
2.2 Do 5 units BLT re-sampling per affected magazine, if at least 1/5 failed, hold affected lot inform PE for lot disposition
(MRB if applicable).
1.Call MEE / Tech to do
and C/A
PASS?
NO
YES
Any reading below
Guard band?
YES
MACHINE SET-UP
1.Check for proper installation of pick-up tool.
(Tech).
2.Check bond Z-height level. (Tech).
3.Check tool shank and pivot spring. (Tech.)
4.Check bond force. (Tech).
5.Check for bond time. (Tech).
6.Check for bond blow time. (Tech).
7. Check for anvil block planarity. (Tech).

MATERIAL
1.Check DAF pot life.
2.Check for bubbles in DAF.
3.Check lead frame paddle planarity. (Tech).

NO

1. Submit 2 dummy
units for BLT
buy off.
2. Perform visual
inspection on first
strip processed.

Any reading above
Guard band?
NO
YES
1. Continue Process
MACHINE SET-UP
1. Replace or re-install pick up tool (Tech).
2. Adjust or redefine bond Z-height level.
(Tech).
3. Adjust/ replace tool shank and pivot spring
if necessary. (Tech).
4. Adjust bond force if necessary. (Tech).
5. Adjust bond time if necessary. (Tech).
6. Adjust bond blow time if necessary. (Tech).
7. If non-planar, perform BH Planarity check
and teach pick and bond Z-height. (Tech).

MATERIAL
1. If expired (>30 days after DAF lamination),
hold affected lot if any, inform PE/SUP for
lot disposition.
2. If there are bubbles, hold affected lot if any,
inform PE/SUP for lot disposition.
3. If non planar, perform bond z-height
setting per die paddle of the lead frame.
(Tech).
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
1. Submit 2 dummy
units for BLT buy
off.

2. Perform visual
inspection on
first strip
processed
Is BLT out
of control
condition?
CONTINUE
PROCESSING
PASS?
do further analysis
and C/A.
still not solved.
NO
YES
YES
NO
YES
At least 1 reading
out of specs?
1. Issue PCM Tag for stop machine operation,
analysis, corrective action and requal.
2. On lots processed since last good
monitoring:
2.1 Do 100% visual inspection for defects.
2.2 Do 100% X-ray inspection for void and
mark reject for any failure seen.
2.3 Do 5 units BLT re-sampling per affected
mag., if at least 1/5 failed, hold lot inform PE.
MACHINE SET-UP :
1. Check for proper installation of pick-up
tool. (Tech.)
2. Check or redefine bond-z height. (Tech.)
3. Check tool shank and pivot spring. (Tech.)
4. Adjust bond time/force if necessary.
(Tech.)
5. Adjust bond blow time if necessary. (Tech.)
6. Check for anvil block planarity. If non-
planar, perform BH planarity check and
teach pick and bond z-height. (Tech.)

MATERIAL :
1. Check DAF pot life. If expired (>30 days
after DAF lamination), hold affected lot
any, inform PE/SUP for lot disposition.
2. Check for bubbles in DAF. If there are
bubbles, hold affected lot if any,
inform PE/SUP for lot disposition.
3. Check lead frame paddle planarity. If non
planar, perform bond z-height setting per
die paddle of the lead frame. (Tech).

POC on/above UCL,
POC on/below LCL,
Run below CL,
Decreasing Trend
LOG RESULTS,
FINDINGS and
C/A on SPC Database
NO
YES
Decreasing Trend
Run below CL
POC on/above UCL,
Increasing Trend,
Run above CL
Require for corrective action and re-qualification.
NO
YES
NO
Issue PCM Tag. Stop machine operation. Require
corrective action and re-qualification.
Note : There is an increased unit to unit BLT
variability.
YES
X-bar Chart
R Chart
NO
Run above CL,
Increasing Trend
monitoring.
NO
YES
monitoring.
BELOW MAVERICK
YIELD TRIP POINT
CONTROL ITEM : DIE ADHESIVE THICKNESS (BLT) FAILURE (For Customer with SPC requirement in BLT)

PROCESS : DIE ATTACH CURE (DAF) REVISION LEVEL : C
CONTROL ITEM : DIE SHEAR FAILURE
Die Shear test
failure seen?
CONTINUE
PROCESSING
NO
YES
1. Stop machine operation. Do 100 % inspection on units processed until the last visual monitoring.
2.Quantify / categorize defect seen and log on the results on logsheet.
1.Call MME / Tech to do
and C/A

PASS?
NO
YES
Cure Temp Beyond
+/- 5C
Cure Time Beyond
+30 / - 0 mins
YES
1.Check temperature / time on
display read out.
2.Check cure temperature / time
setting.
1.If beyond requirement, stop machine
operation and inform technician for
actual temperature measurement
using thermocouple.
2.If incorrect program setting, stop
machine operation and inform
technician to change program
setting.
perform profiling.
1. Re-qualify
machine using
dummy units.
SS: 4 units

2. Apply correct
oven curing
profile. (Tech)
NO
Cure Rise Temp > 1HR
YES
1.Check machine timer.
2.Check cure time setting.
4.Check load capacity.
NO
1.If the above requirement, stop machine
operation and inform technician to
adjust / calibrate timer.
2.If incorrect program setting, stop machine
operation and inform technician to change
program setting.
perform profiling.
4.Determine maximum load capacity and
follow maximum requirement.
EQUIVALENT
BELOW MAVERICK
YIELD TRIP POINT
PROCESS : DIE ATTACH CURE (DAF) REVISION LEVEL : C
CONTROL ITEM : DIE SHEAR FAILURE (For Customer with SPC requirement)
1. Re-qualify
machine using
dummy units.
SS: 4 units

2. Apply correct
oven curing
profile. (Tech)
At least 1 DST
reading failed?
CONTINUE
PROCESSING
PASS?
do further analysis
and C/A.
still not solved.
YES
NO
YES
1. Stop machine operation. Do 100% X-ray inspection for void on affected lot.
2. Quantify / categorize defect seen and log on the results on applicable logsheet.
1-2. If incorrect, apply correct oven
program setting per DAF type.
3. If expired DAF, hold the
affected lot for Engineering
disposition and MRB generation.
4. If low dry BLT , hold affected lot for
Engineering disposition.
POC on/below LCL,
Run below CL,
Decreasing Trend
NO
YES
Decreasing Trend
Run below CL
POC on/above UCL,
Increasing Trend,
Run above CL
oven curing time.
oven curing temperature.
3. Check for expired DAF.
4. Check for dry BLT
NO
YES
NO
Require corrective action and re-qualification.
YES
X-bar Chart
R Chart
NO
POC on/above UCL,
Run above CL,
Increasing Trend
NO
YES
down parameters used in SPC data. Go to
next monitoring.
down parameters used in SPC. Go to next
monitoring.
BELOW MAVERICK
YIELD TRIP POINT
LOG RESULTS,
FINDINGS and
C/A on SPC Database
Any reject seen?
PACKAGE/OPERATION : SOT/SC70/TO
PROCESS : WIREBOND
CONTROL ITEM : WIREBOND VISUAL DEFECTS
MACHINE TYPE : KNS8028
REVISION LEVEL
Continue Process
Matl-Related?
(Die, Leadframe)
Ball Related
Defect?
YES
NO
1. If Yes, go to material related box.
2. Correct if needed. Perform lay-out
check after C/A done
3. If yes, replace. Hold affected units,
inform Sup/PE for disposition (Optr/Tech)
4. Conduct parameter adjustment .(Tech)
5. Adjust heater block temp and conduct
heater block calibration (Tech)
6. Clean and adjust EFO wand . (Tech)
7. Adjust and align leadframe with respect
to Clamp & Insert .(Tech)
8-9 Adjust machine indexing & mechanical
problem. (Tech )
1. If problem encountered, call PE.
inform Sup/PE for disposition.(Optr/Tech)
3. Clean wire feed / path assembly .
(Optr /Tech)
4. Adjust looping parameters (Tech)
5. Adjust indexing & mechanical problem
(Tech)
: D
INPUT VARIABLES CORRECTIVE ACTION C/A VERIFICATION OCC CATEGORY DISPOSITION/
RECORDING
1.If reject = 1, Put mark on the reject unit,
log result on visual monitoring sticker.
Continue process.
2. If reject > 1, stop processing, hold lot for
PE disposition. 1. Submit units to PCM for
Requal (SS : 2 units).- Tech
2. Do visual monitoring.
( SS: 1 strip )
3. For critical single defect
occurrence perform:
- BST & 100% 3rd optical
inspection ( For Ball related )
- WPT/SPT & 100%
3rd opt inspection ( For Wire /
Stitch Related )
4.Critical defect- maverick lot :
- Subject to 100% X-ray
inspection @ Mold
further analysis and
corrective action.
still not solved for
analysis and C/A
NO
YES
YES
NO
YES
NO
YES
NO
1. Check pad quality. Material related?
2. Check ball centering.
3. Check capillary (Wrong cap, dirty, worn out
within tool life?).
4. Check bond parameters if within range.
5. Check heater block temperature if within
range.
6. Check EFO wand if clean and aligned.
7. Check leadframe alignment with respect to
Clamp and Insert (C&I non-centering).
8 .Check if there is die paddle bouncing.
9. Check for mechanical problem (gripper,
clamp gap, indexing problem, etc.).
1. Check for wire nicks, scratches, tight loop.
2. Check capillary (dirty, worn-out?)
3. Check wire feed/path assembly.
4. Check looping parameter if within range.
5. Check for any indexing problem (output
gripper problem, output elevator)

Note: Low Yield/MRB
generation is required on lots
yield reaching trip point due to
gross rejection.
1. Stop machine operation. Do 100% inspection till last good monitor done.
2. Quantify and check defect seen ( what side / ball / wire# affected ).
3. Conduct assessment on good units (3 units minimum adjacent of affected units)
3.1 For ball related defect conduct ball shear test, etch test or
intermetallic test on affected and unaffected unit/s (depending on the
defect call out ) then compare reading if no significant difference
3.2 For stitch related defect conduct wirepull or stitch pull test on affected
and unaffected unit/s then compare reading if no significant difference
3.3 Other non critical defects refer to internal visual criteria (01-2005)
4. Perform product OCAP reference Specs # 02-0157
5. Hold lot and call Sup/ME/PE for MRB generation on the following conditions:
5.1 Lot yield < yield trip point.
Log result, findings and
C/A action done at RMS
A
Looping / Wire
related defect?
C
PASS?
B
1. If Yes, go material related box
inform Sup/PE for disposition.
(Optr/Tech)
4. Conduct parameter adjustment.( Tech)
5. Adjust and calibration heater block temp
( Tech)
6. Clean and adjust EFO wand . (Tech)
7. Adjust and align leadframe with respect
to Clamp & Insert .(Tech)
8. Adjust indexing & mechanical problem
(Tech)
PROCESS : WIREBOND
CONTROL ITEM : WIREBOND VISUAL DEFECTS
REVISION LEVEL
Stitch-related
Defect?
:D
RECORDING
YES
NO
1. Check pad quality. Material related?
2. Check lead bouncing.
3. Check capillary (Wrong cap, dirty, worn out
within tool life?).
range.
7. Check leadframe alignment with respect to
Clamp and Insert (C&I non-centering).
8. Check for mechanical problem (gripper,
clamp gap, indexing problem).
Note: Low Yield/MRB
gross rejection.
C B A
RECORDING
For Affected Units ( 1 reading out of specs)
1. Segregate affected units.
2. Conduct tests on 3 units/strip affected.
3. If readings failed spec, store affected
strips and highlight issue to PE for
disposition
4. If readings passed spec, include affected
strips on good bonded units.
C/A action done at RMS/
SPC database.
POC on/below LCL.
Run below CL.
Decreasing Trend?
Any Out of Control
Condition?
YES
NO
PASS?
NO
YES
At least 1
reading is out
of spec?
NO
YES
POC on/above UCL.
Run above CL.
Increasing Trend?
X-bar / Z-bar
chart
R-bar / W -bar
chart
POC on/above UCL.
Run above CL.
Increasing Trend?
X-bar / Z-bar
chart
POC below LCL.
Run below CL.
Decreasing Trend?
R-bar / W-bar
chart
NO
YES
NO
YES
NO
YES
YES
Continue Process
These are Opportunity Points. No issuance
of Tag.
NO
Stop machine operation.
1. Check bonding pad quality.
3. Check capillary. Wrong cap, dirty, worn
within tool life?
range.
7. Check leadframe alignment with respect
to Clamp and Insert.

Points Out of Control .
1. Segregate affected units and highlight
issue to PE
4. Conduct parameter adjustment. (Tech)
5. Adjust heater block and calibrate (Tech)
6. Clean and adjust EFO wand (Tech)
7. Adjust LF alignment with respect to Clamp
& Insert (Tech)
1. Submit units to PCM
for Requal (SS : 2 units)
- Tech
2. Do visual monitoring
( SS : 1 strip )
1. Call MEE/Tech to do further
analysis and corrective action.
solved for analysis and C/A
1. For POC on/above UCL, note down
parameters used on SPC Database
Note: Low Yield/MRB
gross rejection.
PROCESS : WIREBOND
CONTROL ITEM : BALL SHEAR OCC
REVISION LEVEL
: C
RECORDING
For Affected Units (1 readings out of specs)
1. Segregate affected units.
2. Conduct tests on 3 units/strip affected.
3. If readings failed spec, store affected
strips and highlight issue to PE for disposition
4. If readings passed spec, include affected
strips on good bonded units.
C/A action done at RMS/
SPC database.
POC on/below LCL.
Run below CL.
Decreasing Trend?
Any Out of Control
Condition?
YES
NO
PASS?
NO
YES
At least 1
reading is out
of spec?
NO
YES
POC on/above UCL.
Run above CL.
Increasing Trend?
X-bar / Z-bar
chart
R-bar / W-bar
chart
POC on/above UCL.
Run above CL.
Increasing Trend?
X-bar / Z-bar
chart
POC below LCL.
Run below CL.
Decreasing Trend?
R-bar / W-bar
chart
NO
YES
NO
YES
NO
YES
YES
Continue Process
These are Opportunity Points. No issuance
of Tag.
NO
Stop machine operation.
1. Check lead finger quality.
3. Check capillary. Wrong cap, dirty, worn
within tool life?
range.
7. Check leadframe alignment with respect
to Clamp and Insert.
1. Submit units to PCM
for Requal (SS : 2 units)
2. Do visual monitoring
( SS : 1 strip )
corrective action.
still not solved for analysis
and C/A
1. For POC on/above UCL, note down
parameters used on SPC Database

Point Out of Control .
1. Segregate affected units and highlight
issue to PE
4. Conduct parameter adjustment. (Tech)
5. Adjust heater block and calibrate (Tech)
6. Clean and adjust EFO wand (Tech)
7. Adjust LF alignment with respect to Clamp
& Insert (Tech)
Note: Low Yield/MRB
gross rejection.
PROCESS : WIREBOND
CONTROL ITEM : WIRE PULL OCC
REVISION LEVEL
: C
OUT OF CONTROL ACTIVITY PLAN (OCAP)0
PACKAGE/OPERATION : SOT / SC70/TO
PROCESS : MOLD
CONTROL ITEM : DELAMINATION
YES
NO
Any Delamination
Pass
Segregate units. Log
results / corrective
action
NO
YES
do further analysis and
corrective action
corrective action.
Continue
Processing
1. Production to do 100%
visual inspection on
dummy mold shot after
correction (under 10-
30X
mag low power scope).
2. Perform 100% visual
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
3. Conduct 100% SAT
and
X-ray inspection on 1
st

good mold shot
1. Immediately shutdown affected machine (Optr/PCM)
2. Notify Maintenance and Engineer for Reject verification and provide Team disposition. (Prodn sup, PE, ME)
3. Do 100% inspection on affected lot (Visual / SAT inspection). (Optr/PCM)
4. Quantify / Categorized defect seen and log result . Attach PTR on LTC of affected lot (Optr)
5. Perform Product OCAP (Prodn, PE, ME)
Check EMC Material Handling:
1. Minimum of 24 hrs thawing time
2. Maximum 24 hrs floor life (upon opening
of
EMC bag)
3. No restorage allowed
4. Mold compound physical condition
Check Mold Tool Condition/Cleanliness:
1. Cavity bar airvent (clogged airvent)
2. Mold tool ejector pins condition /
completeness
3. Cavity bar units cleanliness (dirty
package)
4. Package sticking occurrence /
leadframe
deformation due to package sticking
Check Mold Parameters:
1. Actual transfer pressure display vs
setting
2. Actual Mold tool temperatures / hotplate
temperatures reading vs setting
3. Actual cure time vs setting
Check Pellet Room/Environment
Condition:
1. Actual RH and Temperature reading vs
required specs
Check Plasma Prior Mold Process:
1. Cleaning Effect Duration requirement
2. Plasma parameter setting
1. Replace / Scrap mold compound if
found
non-conforming with the handling
requirement
2. Scrap EMC if found abnormality on
physical condition
1. Conduct mold tool cleaning / airvent
scraping
2. Correct unbalance ejection. Replace
deform / broken ejector pins
3. Conduct mold tool cleaning /
conditioning
4. Correct mold tool temperature / cure
time. Conduct mold tool cleaning /
conditioning
1. Correct / adjust mold parameters
(transfer
pressure / mold tool temperatures /
hotplate temperatures / cure time
1. Correct pellet room / environment RH
and
Temperature setting
1. Conduct replasma if found non-
conforming with the cleaning effect
duration requirement
2. Correct / adjust plasma parameter
setting
Mold
Compound
Handling
Yes
No
Mold Tool
Condition
Yes
No
Mold
Parameters
Yes
No
EOL
environment
Condition
Yes
No
Plasma Process
Condition
Yes
No
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
CONTROL ITEM : POWER FLUCTUATION/FAILURE
YES
NO
POWER
FLUCTUATIO
N /
FAILURE
Pass
NO
YES
corrective action
corrective action.
Continue
Processing
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
3. Conduct 100% SAT
or
st

good mold shot
Yes
No
1. Wait for Facilities advice on
power
restoration (Facilities)
2. Correct/replace any defective
parts
and correct machine
functionality
(Tech)

NOTE;
Check Mold Tool Temperature
display and check/stabilize
actual
temperature prior running
mold
machine
EXTERNAL
DEFECT
No
1. Immediately shutdown affected machine (Optr/Tech)
3. Do 100% inspection on affected strips (Visual / SAT and X-ray inspection). (Optr/PCM)
1. Check power line supply consistency
(Facilities)
2. Check for any abnormality on
machine (electrical / power supply)
Tech
action
MACHINE TYPE : FICO
REVISION LEVEL : D
Pass
NO
YES
YES

1. Call technician to correct the source
of crumpled strip.
2. Perform mold tool cleaning (Optr).
If the strip still stick , check for any
chrome plate peel off (Tech)
3. Replace/correct defective ejector pins.
(Tech)
4. Conduct full mold tool cleaning
and conditioning (Optr).
5. Optimize/Lock the clamp opening speed
setting (Tech)
6. Lock the mold cure time setting (Tech)
7. Correct /adjust actual mold tool temp.
8. Pull out / replace cavity bar
9. Replace defective punches and die
of the deculler/degater. Align upper and
lower gatebreak. Align unloader to lower
gatebreak (Tech)

PROCESS : MOLD
CONTROL ITEM : VISUAL DEFECTS (IN-PROCESS MONITORS)
MACHINE TYPE : FICO
REVISION LEVEL : D
1. Immediately shutdown affected machine (Optr)
3. Do 100% inspection on affected lot (Visual / SAT or X-ray inspection). (Optr/PCM)
Cracked
Package /
Gaps
dummy mold shot
after correction (under
10-30X mag low power
scope).
inspection on 1
st
good
mold shot after
correction under 10-
30X
.
3. Conduct 100% SAT or
st

good mold shot
Chip-out
YES

1. Fine tune degator transfer unit gripper
strip loading position. Check misalign
sensor
functionality (Tech).
2. Clean/remove foreign material/debris on
deculler/degator tool (Tech)
3. Correct/replace missing/broken guide
pins (Tech)
4. Replace affected cavity bar (Tech)
NO
1. Check if cause of crack was due
to crumpled strip.
2. Check if strip/package stick at the
top/bottom mold cavity
3. Check for completeness /
functionality/condition of ejector
pins.
4. Check for current mold shot
count and conditioning
frequency.
5. Check for mold clamp opening
speed setting.
6. Check for cure time setting.
7. Check actual mold tool temp
8. Check cavity bar condition (dirty
package / peel of chrome plate)
9. Check deculler / degate condition
for any defective parts . Check
alignment of upper & lower
gatebreak
A
NO
Any reject
seen
1. Check leadframe misloading on
degator tool.
2. Check for any foreign material /
stuck-up debri s on upper and
lower deculler / degator bed.
3. Check for completeness / condition
of deculler/degator guide pins.
4. Check package gate depth /
thickness.
action
NO
YES
corrective action
corrective action.
Continue
Processing
PROCESS : MOLD
Incomplete
Fill / Window
Flash
YES
NO
A
Package Void/
Blister/ Pitted
Surface/
Bubble
1. Check for any clogged airvent.
Stuck-up debris on gate and runner
2. Check stuck-up debris on affected
bottom or top cavity bar.
3. Check mold parameters (transfer
time / Transfer pressure / Clamp
Pressure and mold tool temperature.
4. Check for any hard clamp
impression on affected units .
5. Check for any stuck-up plungers
6. Check for any abnormality on cull
thickness
7. Check for any abnormality of
machine condition (transfer profile /
transfer pressure drop/low).
8. Check pellet condition (Date/Time
ready to use / Expiration / Physical /
Pellet size) .
9. Check airvent condition (worn-out
condition)
1. Conduct tool cleaning/remove stuck-
up vent flash on airvent. Replace cavity
bar with matte finish airvent if needed.
2. Remove stuck-up debris on affected
3. Adjust/correct mold parameters.
4. Correct hard clamping on affected
cavity bar.
5. Correct stuck-up plungers. Remove
stuck-up debris/flashes on plungers
periphery.
6. Correct abnormality on transfer
assembly. Check pellet condition.
profile / transfer pressure.
8. Change / use correct mold compound.
9. Replace worn-out cavity bar if needed.
B
30X
inspection on 1
st
good
mold shot after
correction
(under 10-30X mag low
power scope). .
st

good mold shot.
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
1. Check for any clogged airvent.
Stuck-up debris on gate and runner
2. Check stuck-up debris on affected
bottom or top cavity bar / cull block.
3. Check mold parameters (transfer
time / Transfer pressure / Clamp
Pressure and mold tool temperature.
4. Check for any stuck-up plungers
5. Check for any abnormality on cull
thickness
6. Check for any abnormality of
machine condition (transfer profile /
transfer pressure drop/low).
7. Check pellet vortex temperature
condition
ready to use / Expiration / Physical /
Pellet size)
9. Check airvent / cavity bar unit
condition (worn-out condition)
10. Check pellet jig condition
11. Check for any broken pellets.
12. Check onloader vacuum condition
(unremoved loose flashes)
1. Conduct tool cleaning/remove stuck-
up vent flash on airvent. Replace cavity
bar with matte finish airvent if needed.
2. Remove stuck-up debris on affected
3. Adjust/correct mold parameters.
4. Correct stuck-up plungers. Remove
stuck-up debris/flashes on plungers
periphery.
assembly. Check pellet condition.
profile / transfer pressure.
7. Correct / adjust pellet vortex actual
temperature
9. Replace worn-out cavity bar
10. Correct abnormality on pellet jig
11. Correct abnormality on pellet bowl
feeder / pellet loader jig / pellet brake
brush
12. Correct abnormality on onloader
vacuum condition. Replace worn-out
plungers if needed.
YES
NO
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
Epoxy
Molding
Compound
(EMC) Leak
YES

1. Correct abnormality on IT arm
interlock / Pellet catch hook / Pellet
pusher / Pellet rods (Tech)
2. Correct abnormality on IT arm
interlock / Mold chase guide pins / IT arm
locator pins / LF gripper / alignment of IT
arm with mold chase
3. Correct abnormality on alignment of LF
pusher to strip / Onloader elevator
position (alignment on onloader track).
4. Correct/Adjust staging of IT arm in front
of mold chase. Correct abnormality on
pellet pusher tip / Pellet Vortex / Bowl
Feeder assembly.
5. Hold lot and inform SQE/IQA for
disposition.
6. Hold lot and check leadframe orientation
in magazine or magazine orientation on
Onloader station.
1. Check for pellet misloading
2. Check for leadframe misloading.
3. Check for double strip loading
4. Check for pellet sticking on IT arm
pellet chute.
5. Check leadframe condition
(dented LF / material related
problem )
6. Check leadframe orientation
NO
B
C
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
Blown Leads
1. Check mold tool planarity thru
paper impression.
2. Check for any stuck-up debris on
cavity runner / gate / cull.
3. Check clamp pressure and transfer
pressure parameters.
4. Check for any broken plunger tip.
5. Check for any stuck-up plunger.
6. Check transfer profile last step
position.

1. Correct unbalance mold tool planarity.
(Tech)
2. Clean/remove stuck-up debris on affected
area of mold chase / cavity bar.
3. Correct/adjust clamp or transfer
pressure setting.
4. Correct/replace broken plunger tip.
5. Correct/replace stuck-up plunger.
6. Correct/adjust transfer profile last step
position.
Crumpled
Strip
1. Check onloader elevator position.
2. Check alignment of onloader
magazine elevator to onload track.
3. Check magazine alignment on
onload elevator
4. Check for any loose strip during
travel of IT arm from preheater to
mold tool chase..
5. Check leadframe misloading on
deculler tool.

1. Correct/adjust onloader elevator position.
(Tech)
2. Correct/align onloader elevator to onload
track position (Tech).
3. Correct/align magazine position on
onload elevator (Tech/Optr).
4. Correct/align IT arm to preheater pick-up
position/Replace worn-out catch hook.
5. Correct/align OT arm to deculler strip
loading position.
YES
YES
NO
NO
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
Resin Bleed
YES

1. Correct unbalance mold tool planarity
2. Remove stuck-up debris on interlock /
cavity bar / locator pins
3. Correct/adjust clamp or transfer
pressure setting.
4. Hold lot and inform SQE / IQA for
disposition
5. Correct/adjust last step transfer position.
6. Correct/adjust mold tool temperature
7. Replace cavity bar with new one.

paper impression
interlock / cavity bar / locator pins
3. Check clamp pressure and transfer
pressure parameter
lead frame (dented LF / material
related problem)
5. Check transfer profile last step
position
6. Check mold tool temperature
7. Check cavity bar condition (dented
/ damaged cavity bar)
NO
C
D
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot .
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
Ejector
pin/Pin 1
indentation
1. Check for any stuck-up/unbalance
ejector pin position
2. Check for any deform/damage
pin 1
Damage
Leads
deculler / degator tool bed.
2. Check for any loose / defective
OT arm parts which hit leads
during unloading on deculler /
degator.

1. Correct/replace deform ejector pins.
Clean ejector pins. / drive plate
2. Correct/replace deform or damage
ejector pin 1

1. Clean/remove stuck-up debris on
deculler/degator tool bed.
2. Correct/align/replace defective OT arm
parts

YES
YES
NO
NO
Foreign material
contamination
YES
NO
1. Check upper / lower mold tool
chase / cavity bar for any stuck-up
foreign material
2. Check for any unremoved loose
flashes on mold tool
3. Check for any foreign material /
contamination embed on
leadframe (prior mold).
4. Check for any foreign material on
magazine (FOL magazine)
flashes every after tool brush /
vacuum.

1. Clean/remove stuck-up foreign material
on mold tool chase/cavity bar.
2. Correct unloader vacuum and brush
condition. Replace plungers / pot if
needed. Clean/replace vacuum filter.
3. Hold lot and inform FOL for 100%
segregation of affected strips. Clean
mold tool if needed
4. Segregate affected magazine & endorse
to FOL for magazine cleaning.
5. Correct/replace worn-out brush / curtain.
Check vacuum condition and correct if
found insufficient. Clean vacuum filter
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
YES

1. Correct / adjust mold parameters.
2. Conduct tool cleaning and conditioning.
Follow define tool cleaning and
conditioning frequency.
3. Conduct tool cleaning and conditioning.
Pull out cavity bar for chemical cleaning if
needed.
4. Correct / Replace deform/broken top or
bottom ejector pins. Correct unbalance
and stuck-up top or bottom ejector pins.
5. Replace cavity bar with new one.
7. Correct / Replace defective heater /
thermocouple.
8. Change / use correct mold cleaning
material.
1. Check mold parameters (mold tool
temperature / transfer time /
transfer pressure / cure time
2. Check mold shot count (tool
cleaning / conditioning frequency)
3. Check cavity bar surface condition
for any sign of dirty surface.
4. Check top and bottom leadf rame
ejectors, cull runner ejectors and
cull ejectors condition /
completeness / for any sign of
stuck-up ejectors / unbalance
ejection.
5. Check cavity surface chrome plate
condition (worn-out condition)
ready to use / Expiration / Physical
condition
7. Check machine condition (tool
heater condition) .
8. Check Cleaning material condition
(Date/Time ready to use /
Expiration / Physical condition.
NO
D
E
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot

Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
Mold Flash
on exposed
pad
1. Check strip condition / pad tilt
during transfer of strip from
magazine to pre heater / hotplate /
onload rail track.
2. Check hotplate / pre heater
down set condition (must have
enough clearance between paddle
to hotplate down set).
3. Check top or bottom cavity bar for
any sign of accumulated stuck-up
debris/bleed out.
vacuum.
5. Conduct xray inspection on
affected unit and check for any
sign of broken tie bar (Material or
FOL related issue.
6. Check mold tool cleaning and
conditioning frequency.

1. Clorrect / Align magazine position on
onload elevator. Check/align onload
elevator position.
2. Correct/replace hotplate bed with
modified downset.
3. Conduct manual scraping on top or
bottom cavity bar unit to remove
stuck-up debris and tool conditioning.
4. Correct/replace worn-out brush / curtain.
Check vacuum condition and correct if
found insufficient. Clean vacuum filter
5. Hold affected lot and inform FOL Team or
SQE Team for the disposition.
6. Conduct mold tool cleaning and
conditioning
YES
NO
Package
Sticking
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
YES

1. Pull out affected chase and correct hard
clamp. Correct / adjust clamp pressure.
2. Correct abnormality on Onload section /
Preheater / IT arm / AFL onload /
AFL robot gripper.
disposition
3. Inform FOL WB Team if found out FOL
related issue for disposition.

1. Check for any hard clamp
impression on affected unit.
2. Check thru xray inspection on
affected unit to check for potential
lead or wire disturbance.
3. Check thru xray inspection of
potential high wire loop height
NO
E
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot
4. For Package Mismatch
/
Misalignment:
4.1. Production to do
100%
dimensional
inspection
on dummy mold shot
after correction.
4.2 Perform 100% visual
inspection on 1
st
good
mold shot after
30X magnification low
power scope).
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
Exposed Heat
Spreader
1. Material :
Check for bent legs / wings on
heatspreader
2. Machine :
Misalign loading of
heatspreader
to loading jig in AFL Machine.
3. Method:
Heatspreader movement during
release at mold cavity area
from
loading jig prior molding

Material : (OPERATOR)
1. Handle carefully and check condition
of
heatspreader prior loading to
magazine.
Replace deformed heatspreader
(e.g. bent leads/ wings)
Machine: (OPERATOR)
1. If deviation is noted, inform MEE/Tech
for corrective action.
Method : (OPERATOR)
1. Manually align protruding/improperly
positioned heatspreader at mold
cavity using heatspreader brass plate
aligner.
YES
NO
Exposed Wire
YES

1. Correct/optimized IT arm strip loading
position and check aligner/locator pins
condition (Tech)
2. Align onloader elevator position (Tech)
or If FOL related, check FOL lot history.
3. Correct/replace broken aligner (Tech)
4. Correct/replace broken locator pins
(Tech)
5. Correct/replace stuck-up bottom ejector
pins (Tech)
6. Inform FOL for disposition (Mold Sup)
7. Correct/Replace deform / dilapidated
loading frame finger.
8. Clean/remove stuck-up debris
1. Check for any leadframe hole
deformation
2. Check for any crumpled / warp
strip prior molding.
3. Check mold tool X-Y aligner
condition.
4. Check mold tool locator pins
condition / completeness.
5. Check bottom ejector pins
condition (stuck-up ejector pins)
6. Check strip mark condition (deep
strip mark)
7. Check loading frame finger
condition
8. Check cleanliness of chase / cavity
bar (slots / interlock / locator pins)
Package
Mismatch/
Misalignment
NO
MACHINE TYPE : FICO
REVISION LEVEL : D
Pass
NO
YES
YES
PROCESS : MOLD
CONTROL ITEM : XRAY DEFECTS (IN-PROCESS MONITORS)
1. Immediately shutdown affected machine (Optr/PCM)
3. Issue PCM TAG. Do 100% xray inspection on affected lot.
(PCM)
NO
A
Any reject
seen
1. Check high impact of onload
magazine pusher during transport
to onload elevator.
2. Check dangling wire on LF entry
3. Check condition of onload roller
(loose roller shaft/fast speed roller
down movement / missing roller
o-ring (roller to leadframe contact)
4. Check strip jamming during strip
transfer from rail inlet to preheater
turntable (rotary) /preheater.
5. Check strip jamming during strip
transfer from preheater turntable
to hotplate or preheater.
6. Check alignment of preheater
rotary to IT arm pick-up position.
7. Check alignment of pellet carrier to
IT arm pellet rod/chute.
8. High impact of pellet carrier rod to
IT arm pellet rod
9. Check alignment of IT arm to
preheater during strip pick-up
position (strip flexing).
10. Check for strip over gripping by
gripper head / LF gripper.
11. Check for any handling related
issue (magazine mishandling)
action
NO
YES
corrective action
corrective action.
Continue
Processing
Depressed
Wire, Sagged
Wire,
Damaged
Wire
1. Correct / adjust magazine pusher
speed.
2. Correct and conduct proper wire
harnessing.
3. Correct/replace defective roller shaft.
Adjust roller down speed. Install roller
o-ring
4. Correct alignment between magazine
pitching to inlet rail / preheater.
5. Correct alignment between preheater
turntable to preheater.
6. Correct alignment of preheater
rotary. Check/tighten preheater rotary
stopper screw.
x-axis or y-axis IT arm belt.
7. Correct alignment between pellet
carrier to IT arm pellet rod/chute .
8. Adjust pellet carrier elevator speed.
Tighten / fix pellet elevator stopper to
have clearance between rod of pellet
carrier and IT arm pellet rod.
9. Tighten / align preheater or IT arm
interlock. Correct/replace deform or
missing LF catch hook. Correct/re-align
x-axis or y-axis coordinates (replace
belt if needed)
10. Correct/align LF gripper. Tighten
gripper head LF holder stopper. Correct
strip overshoot or undershoot position
on preheater or rail track
11. Hold lot and return to 3
rd
Opt for
100% visual inspection and 100% xray
inspection
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
3. Conduct 100% X-ray
inspection on 1
st
good
mold shot
MACHINE TYPE : FICO
REVISION LEVEL : D
Pass
NO
YES
PROCESS : MOLD
CONTROL ITEM : XRAY DEFECTS (IN-PROCESS MONITORS)
YES
NO
action
NO
YES
corrective action
corrective action.
Continue
Processing
Lifted Ball , Lifted
Stitch, Stray Wire, No
Bond, No die, Foreign
Material, Missing
Wire, Double Bond
Wire sweep,
Broken
Wire/Shorting Wire
A
1. Check mold parameters (Transfer
speed, transfer pressure and mold
tool temperature) .
2. Check alignment of IT arm to
preheater during strip pick-up
position (strip flexing).
3. Check for strip over gripping by
gripper head / LF gripper.
4. Check condition of onload roller
(loose roller shaft/fast speed roller
down movement / missing roller
o-ring (roller to leadframe contact)
5. Check for any handling related
issue.
vacuum.
paper impression..
3. Check previous lot process
(change of lead type/count)
4. Check for any loose debris every
after tool cleaning.
Lead to lead /
Lead shorting
1. Correct / adjust mold parameters
(transfer speed, transfer pressure and
mold tool temperature)
2. Tighten / align preheater or IT arm
interlock. Correct/replace deform or
missing LF catch hook. Correct/re-align
x-axis or y-axis coordinates (replace
belt if needed)
3. 10. Correct/align LF gripper. Tighten
gripper head LF holder stopper. Correct
strip overshoot or undershoot position
on preheater or rail track
4. Correct/replace defective roller shaft.
Adjust roller down speed. Install roller
o-ring
5. . Hold lot and return to 3
rd
Opt for
100% visual inspection and 100% xray
inspection
1. Correct/replace worn-out brush /
curtain. Check vacuum condition and
correct if found insufficient. Clean
vacuum filter.
2. Correct unbalance mold tool planarity.
3. Conduct mold tool cleaning.
4. Conduct mold tool / machine cleaning
Internal Voids
1. Check mold parameters
ready to use / Expiration / Physical
condition
3. Check cavity bar airvents and
plunger condition
1. Correct/adjust mold parameters
(transfer time/transfer pressure/mold
tool temperature/clamp pressure.
2. Change / use correct mold compound
3. Conduct mold tool cleaning/airvent
scrapping. Replace/Clean plunger tip
YES
NO
YES
NO
1. Issue PCM Tag on affected lot.
2. Conduct 100% xray inspection and
scribe (X mark) the affected units.
(PCM)
3. Inform FOL Team for disposition
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
CONTROL ITEM : MACHINE DOWNTIME OCAP
YES
1. Immediately shutdown affected machine (Optr/ME Tech)
2. Notify Maintenance Engineers/MEE Line Tech for machine alarm verification. (Optr)
NO
Machine
Problem
Yes
L/F Onloader
Section/AFL
Yes
Hotplate
Section
IT arm
Section
Yes
No
No
No
Misalign leadframe / LF transport jamming:
1. Check for defective sensors
2. Check for Position / Teaching
misalignment
3. Check for Defective camera / vision
misalign
(offset)
Low / High Hot plate temperature
1. Check for defective heaters /
thermocouple
2 Check hotplate temperature setting
1. Check for any worn out IT arm linear
bearing
2. Check for any dirt accumulation on IT
arm
linear bearing
3. Check for any overshot X-Y IT arm
position on
heater bed
4. Check IT arm base plate if slotted
5. Check IT arm gripper finger if angular
pointed tip.

1. Correct/replace defective sensors
(MEE)
2. Correct/re-teach & store calibrated
leadframe positioning (MEE)
3. Correct/replace defective camera /
calibrate-align offset (MEE)
1. Correct/replace defective heaters/
thermocouples - MEE/Tech
2. Correct/adjust and stabilize hotplate
temperature - MEE
1. Replace defective/worn out linear
bearing.
2. Conduct cleaning on IT arm linear
bearing.
3. Conduct adjustment on X-Y IT arm
position pitching settings.
4. Replace with slotted IT arm base
plate
5. Replace with angular pointed tip IT
arm
gripper finger.
A
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
CONTROL ITEM : MACHINE DOWNTIME OCAP
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
A 1. Low / high mold tool temperature
1.1 Check for defective mold heater /
thermocouple/SSR /Triac / Temp
controllers
1.2 Check mold tool temperature setting
2. Low / high transfer (plunger) pressure
2.1 Check for loose transfer ball screw
2.2 Check for defective / uncalibrated
proportional valves/gauges
3. Low / high clamping force
3.1 Check for dirty / worn-out plunger
4. Transfer servo trouble /erratic transfer
speed
/transfer pressure Error
4.1 Check for loose transfer ball screw
4.2 Check for Plunger position
misalignment
5. Clamp Transfer Servo Error
5.1 Check for any wrong mold parameters
set .
5.2 Check if servo motor driver is
malfunction.
6.0 Clamp Moving Error
6.1 Check for any wrong mold parameters
set .
6.2 Check for any defective/worn-out link
arm.
6.3 Check for any defective/worn-out ball
screw.
6.4 Check for any worn-out or broken link
pin.

1.1 Adjust/calibrate OTP, replace
defective parts MEE
1.2 Correct/adjust mold tool temp
setting
2.1 Tighten ball screw & calibrate
verify pressure actual vs. gauge;
replace defective parts if necessary
2.2 Calibrate actual vs. gauge and
valves ,replace if necessary MEE
3.1 Adjust/optimize clamping
force, clean/align tool if needed -
MEE
4.1 Tighten/replace loose transfer
ball screw if needed - MEE
4.2 Adjust plunger position align with
pot
bushing MEE
5.1 Adjust parameter to correct setting
(MEE).
5.2 Replaced defective servo motor
driver.
(MEE)
6.1 Adjust parameter to correct setting .
6.2 Replaced defective or worn out link
arm
6.3 Replaced defective or worn-out ball
screw.
6.4 Replaced defective or worn-out link
pin

Mold Press
Section
Yes
No
Deculler Section
Yes
No
Misalign / Misload leadframe
2. Check for Position / Teaching
misalignment
3. Check Manual misplacement on Stnd /
MGPs

1. Replace defective sensors-MEE
2. Re-teach & store calibrated
leadframe
positioning - MEE
3. Proper nesting of molded units into
deculler area
Magazine Full
2. Check Strip quantity full / overload
1. Replace defective sensors -MEE
2. If yes, replace full magazine with strips
with empty magazine
LF Offloader
Section
Yes
No
30X
inspection on 1
st
good
mold shot after
30X
mag low power
scope). .
st

good mold shot
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : MOLD
CONTROL ITEM : QUANTITY DISCREPANCY (IN PROCESS MONITOR)

YES
NO Quantity
Discrepancy
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
1. Hold affected lot (Optr)
2. Check affected leadframe stripmark for any discrepancy and account lot strip quantity (Optr)
3. Notify Mold Supervisor for verification and provide disposition. (Prodn sup, PE, ME)
Qty Discrepancy
during
accounting of X
reject)
Yes
No
1. Check FOL rejects declare on LTC
2.Check FOL rejects and Mold rejects
as
per LTC/MESA system transaction.
3. Check actual Black/Green mark for
any
faded mark.
4. Check actual Black/Green Mark on
rail of
lead frame versus FOL reject declare
on
LTC.
1. Recount/recheck FOL rejects declare
on
LTC versus actual mold X reject
2. Verify/Tally FOL reject ( LTC versus
MESA
transaction)
3. If found discrepancy, segregate
affected
strips with faded Black/Green mark
for 100% X-ray inspection.
4.1 Hold the affected lot if found
discrepancy
on FOL rejects versus actual unit
with
Black/Green mark.
4.2 Endorse affected lot to PCM for
100%
x-ray inspection.
4.3 Inform FOL Team of the qty
discrepancy
issue for disposition &
acknowledgement.
1. For Qty Discrepancy
during accounting of
Reject
1.1 Production to do
100%
x-ray inspection
2. For lacking Strip
2.1 Conduct 100% visual
inspection on affected
strip (under 10-30X
mag
low power scope)
2.2 Conduct 100% X-ray
inspection on affected
strip.
Lacking Strip
(unmolded)
Yes
No
1. Check Strip Qty declare on LTC .
2. Check mold machine assembly for
any
missing strips
1.1 Recount/recheck strip qty declare on
LTC versus actual strip quantity
1.2 Hold the affected lot and inform FOL
Team of the qty discrepancy issue for
disposition & acknowledgement.
2.1 Shutdown mold machine and look for
any missing strips.
2.2 If found, check strip mark of affected
strip versus LTC.
2.3 Check/Correct Preheater/IT arm for
any
abnormality to prevent lacking strip
3. Inform FOL Team If found FOL related
issue
NOTE: For Qty Discrepancy and
Lacking Strip
> Attach PTR on affected lot.
> Mold Operator to provide 5
Whys
and submit to Mold Supervisor
MACHINE TYPE : FICO
REVISION LEVEL : D
PROCESS : POST MOLD CURE
CONTROL ITEM : Power fluctuation/ Power Outage/ Machine Downtime
MACHINE TYPE : BLUE-M / HANSEO
REVISION LEVEL : D
YES
NO
Experienced Power
Fluctuation/
Machine Downtime
2. Hold the lots inside the oven until power is restored
(Optr/Tech)
Oven temperature
went below the
required curing
time
Yes
No
Extended Baking Time Guidelines:
*1min 59mins temp out of specs = 1 hour
additional
*1h 1min 1h 59mins = 2 hours
*4h 1min 4h 59mins = Repeat whole 5 hours cycle
1. Check power line supply consistency
(Facilities)
machine (electrical / power supply)
Tech
1. Wait for Facilities advice on
power
restoration (Facilities)
2. Correct/replace any defective
parts
and correct machine
functionality
(Tech)

NOTE: Follow Extended
Baking
time Guidelines. See
below
Pass
NO
YES
corrective action
corrective action.
1. Production to do 8
strips
affected lots
power scope).
2. Conduct SAT
inspection
on the 8 strips/lot
undergone visual
inspection
3. Quantify / Categorize
defect seen and log result
Attach PTR on LTC of
affected lots
action
Continue
Processing
PACKAGE/OPERATION : SOT / SC70 / TO
CONTROL ITEM : OUT OF RANGE PARAMETER (OVEN CURE TIME AND OVEN TEMP)
YES
NO Out Of Range
parameter
detected
1. Check for possible open circuit
connection (tech)
2. Check the input voltage supply. (tech)
3. Check the output voltage supply
(tech)
4. Check functionality of internal relay
contacts (tech)
1. Check the line connection continuity
(tech)
2. Check visual condition (tech)
1. Check the controller internal contacts
condition (tech)
2. Check PCB board condition
1. Check functionality of chart/recorder
(tech)
1. Perform line to line checking of
affected
wires. Replace wires detected with
open
circuit connection (tech)
2. Perform voltage checking covering all
input voltage line (tech)
3. Perform voltage checking of output
voltage (tech)
4. Perform voltage checking. Check
triggering voltage requirement (tech)
1. If detected with open or short line,
replace the defective thermocouple
with
new spare (tech)
2. If found have torn wire covering,
replace
the thermocouple with new spare
(tech)
1. Wipe to clean or apply any contact
cleaner
to remove possible presence of dirt
(tech)
2. Perform visual checking of board to
detect
any occurrence of open circuit (tech)
1.1 If found to be out of calibration,
endorse
to calibration group to do necessary
calibration (tech)
1.2 If found to be defective, replace the
unit
with new spare (tech)
Yes
No
Defective/Shorte
d Solid State
Relay (SRR)
Yes
Defective/Shorte
d Thermocouple
No
Defective Temp
Controller
Yes
No
Defective
Honeywell
Chart
Yes
No
Pass
NO
YES
corrective action
corrective action.
action
Continue
Processing
strips
affected lots
power scope).
2. Conduct SAT
inspection
on the 8 strips/lot
undergone visual
inspection
affected lots
REVISION LEVEL : C
PACKAGE/OPERATION : SOT / SC70 /TO
CONTROL ITEM : Misprocessing (Time/Temperature Requirement)
YES
NO
Misprocessing
Parameter setting (Resp: Operator)
1.0 Oven temperature high / low
2.0 Cure time too long / short

Machine condition (Resp: Tech/PM)
1.0 Defective thermocouple
2.0 Temperature controller out of
calibration
3.0 Defective chart recorder

Methodology: (Resp; Operator)
1.0 Misloading of units
Parameter setting (Resp: Operator)
1.0 Reset required temperature
2.0 Reset to required cure time

Machine condition (Resp: Tech/PM)
1.0 Repair / replace thermocouple
2.0 Calibrate controller
3.0 Repair / replace recorder

Methodology: (Resp; Operator)
1.0 Follow / observe proper material
loading procedure
Over Cure /
Under Cure
Yes
No
Pass
NO
YES
corrective action
corrective action.
action
Continue
Processing
strips
affected lots
power scope).
2. Conduct SAT
inspection
on the 8 strips/lot
undergone visual
inspection
affected lots
REVISION LEVEL : C
CONTROL ITEM : VISUAL MONITOR

YES
NO
Any Problem
seen?
Pass
action
NO
YES
corrective action
corrective action.
Continue
Processing
1. Immediately shutdown affected machine (Optr)
3. Do 100% visual inspection on affected lots. Conduct SAT inspection (8 strips) (Optr/PCM)
Burnt Package
Yes
No
1. Check thermocouple, gauge and
controller.(Tech),
2. Check temperature and time on
honey
well and display (refer to LTC PMC
Process requirement)
3. Check program setting. (refer to LTC
PMC
Process requirement)
1. Correct the problem on thermocouple,
gauge andcontroller. (Tech/PM)
2. Correct the discrepancy on
temperature
and time on honey well and display
(tech)
3. Inform supervisor to correct
discrepancy.
strips
visual inspection
power scope).
2. Conduct SAT
inspection
on the 8 strips/lot
undergone visual
inspection
REVISION LEVEL : C
MACHINE TYPE : EO TECHNIC/RS/DY/DYSEC
REVISION LEVEL : D
PACKAGE/OPERATION :
PROCESS : LASER MARK
CONTROL ITEM : VISUAL DEFECTS
ANY REJECT
SEEN?
CUT CHARACTER
/ILLEGIBLE
MARK?
VISUAL CHECK
USING DUMMY
STRIP
SS: 1 Strip (MIN)
Pass?
LOG RESULTS,
FINDINGS AND C/A
ON APPLICABLE
LOGSHEET
CONTINUE
PROCESSING
1. Call MEE/technician to
C/A.
2. Call PE if problem still
CA
YES
NO
YES
1. Check for package contamination
2. Check AMDS program
3. Check Laser power if sufficient
4. Check Laser firing if abnormal
5. Check Laser Galvo lens if dirty (Tech)
6. Check laser beam parameters
7. Check for laser low power msg.
8. Check for any foreign material on the pkg.
9. Check Galvo head motor if defective
10. Check Master and Slave Galvo if the
units on strip are balance or equal.
11. Weak Diode pump / Yag rod Laser beam
12. Check Q-switch controller board
1. Remove mold flashes using soft materials
1.1 Adjust/repair pre-cleaning brush. (Tech)
2. Remove virus or inform PE (PE/CIM)
3. Adjust and compensate laser power (Tech)
4. Repair laser chamber assembly (Tech)
5. Remove dirt and dust at Galvo head lens (Tech)
6. Adjust laser beam parameters (Tech)
7. If wrong, Adjust laser power (Tech)
8. Clean pkg. for any foreign material.
9. Adjust Galvo head motor speed (Tech)
9.1 Replace Galvo head motor (Tech)
10. Adjust laser mark alignment parameters (Tech)
11. Replace Diode Pump / Yag rod (Tech)
12. Replace Q-switch Controller Board (Tech)
FALLING/POSITION/
MISALIGN MARK?
1. Check strip if warped/crumpled
2. Check strip movement at printing clamp
if loosen
3. Check encoder set-up if over index
4. Check printing index timing
5. Check printing stopper if defective
1. Straighten lead frame prior loading
1.1 Segregate unreworkable strip and inform PE.
2. Adjust clamping pressure and grip (Tech)
3. Adjust encoder value to meet the required
position of strips (Tech)
4. Adjust speed and sequence (Tech)
5. Replace stopper cylinder (Tech)
B
YES
NO
NO
YES
DOUBLE MARK?
1. Check stopper sensor if functional
2. Check laser font stroke if unbalance
distribution during laser firing
YES
1. Adjust Galvo head motor speed (Tech)
1.1 Replace Galvo head motor (Tech)
2. Adjust laser mark alignment parameters (Tech)
NOTE: All lots failing the required assembly yield trip point per station will require low yield analysis/report.
1. Stop machine operation and conduct 100% visual inspection on affected lot/s.
2. Do 100% visual inspection on lots processed up to last good monitor.
3. Segregate affected units and scribe the top and bottom package of reject units (per equivalent marking legend).
Record results in the applicable log sheets
4. Hold lot and call Sup/ME/PE for MRB generation on the following
conditions:

Note: Call MRB for Gross
Rejection>/= Maverick Lot
Trigger Point (call
Sup/MEE/PE)
NO
SOT/SC70/TO
NO
REVISION LEVEL : D
OCC Category Input Variables Corrective Actions C/A Verification Disposition/Recording
Trigger Point (call
Sup/MEE/PE)
SMEARED/
SWAYING MARK?

VISUAL CHECK
USING DUMMY
STRIP
SS: 1 Strip (MIN)
Pass?
LOG RESULTS,
FINDINGS AND C/A
ON APPLICABLE
LOGSHEET
CONTINUE
PROCESSING
1. Call MEE/technician to
C/A.
2. Call PE if problem still
CA
NO
YES
1. Check marking alignment
2. Check strip condition
3. Check for pkg. offset to LF
4. Check for position encoder (Tech)
5. Check printing clamp if loose
6. Check laser power if too much high
7. Check laser font if abnormal
8. Check strip condition if deform
1. Adjust X/Y coordinates & MGC alignment (Tech)
2. For any strip deformation prior lasermarking, correct
repair the deformation. For any strip deformation which are
induced by the machine call the technician (PE/CIM)
3. If defective, call Tech for vacuum cap replacement
4. If misaligned, Call tech for manual alignment of sensor
(Tech)
5. Adjust laser power parameter (Tech)
6. Adjust/repair laser font stroke (CIM/PE)
7. Adjust printing clamp grip (Tech)
8. Straighten/repair the strip with deformation or
if not rework able call the attention of PE or the
Supervisor
WRONG
MARK?
1. Check for LF orientation setting
2. Check for Correct MID
3. Check for marking character
4. Check barcode reader if ILN to transact is correct
5. Check MID print out if correct
1. If wrong, correct LF orientation (Tech)
2. If wrong, correct MID set-up
3. If wrong, call MID to correct problem
4. Replace barcode reader and inform CIM for the
wrong ILN used during transaction (PE/CIM)
5. Re-print the corrected MID
NO MARK?
1. Check for lead frame rail hole teaching
2. Check orientation sensor if defective
3. Check quantity in and out machine counter if
defective
4. Check for any foreign material on the pkg
5. Check for Laser low power error msg
6. Check machine sequence on error, no mark
strip must be ejected to inspection bin
1. Adjust teaching of oval hole orientation (Tech)
2. Adjust amplifier sensor sensitivity (Tech)
2.1 Replace orientation sensor (Tech)
3. Replace/repair machine counter (Tech)
4. Clean pkg. for any foreign material.
5. If wrong, Adjust laser power (Tech)
6. Adjust machine program to eject strip/s at inspection
bin after machine error
YES
YES
YES
NO
NO
NO
B
INVERTED MARK
/MISORIENTED MARK?
1. Check for LF orientation setting
2. Check for Correct MID
3. Check for marking character
4. Check orientation sensor if defective
1. If wrong, correct LF orientation (Tech)
2. If wrong, correct MID set-up
3. If wrong, call MID to correct problem
4. Adjust transmitter/receiver sensitivity (Tech
4.1 Remove dirt and dust (Tech)
4.2 Re-Teach oblong hole of lead frame (Tech)
4.3 Replace orientation sensor (Tech)
YES
NO
Reference Spec no. 02-3816
REVISION LEVEL : D
CONTROL ITEM : MARKING CONTRAST PROBLEM (Laser beam power)
OCC Category Input Variables Corrective Actions C/A Verification Disposition/Recording
VISUAL CHECK
USING DUMMY
STRIP
SS: 1 Strip
Pass?
LOG RESULTS,
FINDINGS AND C/A
ON APPLICABLE
LOGSHEET
CONTINUE
PROCESSING
1. Call MEE/technician
to do further analysis
and C/A.
2. Call PE if problem
analysis and CA
NO
YES
ANY CONTRAST
PROBLEM?
1. Check Pulse Duty and Draw step for laser
dust.
2. Check oil contamination on handling of
units with dirty finger cots and gloves.
3. Weak Diode pump / Yag rod Laser beam
1. Adjust Laser Parameters (Tech)
2. Remove dirty finger cots and gloves and wipe
the marking to became clearly visible
3. Replace Diode Pump / Yag rod (Tech)
NO
YES
1. Stop machine operation and conduct 100% visual inspection on affected lots.
2. Check lots processed for same defect occurrence using 100%/sublot inspection, Put Engineering Tag to undergone
100% visual inspection under 3x luxo lamp mag. minimum of 3 preceding sublots if
trapped during lasermarking on the affected lot, if not , identify also the minimum 3 succeeding sublots.
Failed lots to undergone 100% inspection. (Continue OCAP until zero defect found/monitor)
Note : PE or Supervisor to generate Engineering Tag to be attached on the LTC of the affected lot.
3. Scribe with an LM-mark the top and bottom package of reject units. Record results in the applicable log sheets
4. Affected lot is under Laser Mark PE supervision from Laser to Pack station for final disposition.
YES
NOTE: Call MRB for gross rejection.
> Maverick Lot Trigger Point
LASERMARK
WATER TEMP/ WATER FLOW ERROR
PROCESS :
CONTROL ITEM :
REVISION LEVEL : C
ANY REJECT
SEEN?
CONTINUE
PROCESSING
Pass?
analysis and C/A.
solved for analysis and CA.
.
NO
YES
YES
YES
NO
Water Temp. Error
1. Check temp. display.

2. Check actual temp with
respect to display.
3. Check compressor.
4. Check pump motor.
5. Check chilled water supply
( for ND Yag Laser type).
6. Check water temp sensor.
7. Check Q-Switch temp.
8. Check cooling station ventilation

1. Temp. reqd. is 18 to 23 deg. C.
Replaced D.I. water if necessary.
2. If found discrepancy, calibrate
temperature.
3. If found defective, Replaced it..
4. If found defective, Replaced it..
5. If chilled temp is high, inform
Facilities Group.
6. If found defective , Replaced it.
7. Replaced if needed.
8. Replaced defective fan or
installed additional exhaust fan.
Water Flow Error
1. Check flow of water from
cooling system to laser
head..
2. Check pump motor.
3. Check chilled water supply
( for ND Yag Laser type).
4. Check water flow sensor.
5. Check Q-Switch flow of water.

1. If clogged is presence,
Replaced affected hose.

2. If found defective, Replaced it.
3. If found chilled water is
clogged, inform facilities.
4. If found defective, Replaced it.
5. If found clogged, cleaned hose
or replaced clogged hose.
Visual check using
dummy strip.

SS: 1 strip (MIN)
YES
NO
1. Stop machine operation and conduct 100% visual inspection on affected lot/s.
2. Do 100% visual inspection on lots processed up to last good monitor.
3. Segregate affected units and scribe the top and bottom package of reject units (per equivalent marking legend).
Record results in the applicable log sheets
4. Hold lot and call Sup/ME/PE for MRB generation on the following
conditions:
LOG RESULTS,
FINDINGS AND C/A
ON APPLICABLE
LOGSHEET
Trigger Point (call
Sup/MEE/PE)
NO
PROCESS : DEBAR/DEJUNK (MECHL DEFLASH)

MACHINE TYPE : FICO MACHINE
REVISION LEVEL : D

Incomplete Dambar
Cut
ANY REJECT
SEEN?
CONTINUE
PROCESSING

Microgap/ Crack /
Chipout
Intrusion /
Protrusion
Shoulder /
Vertical Burr
Pass?
1. Call MEE / Tech to do
NO
NO
NO
NO
YES
YES
YES
YES
YES
NO
NO
1.0 Check for any offset/mismatch..

2.0 Check if with worn-out punch
and die. (ME)

3.0 Check if with broken punch. (ME)

4.0 Check if there is a non-optimized
punch penetration. (ME)

5.0 Check if theres a non-
synchronized indexer vs. tool
up/down. (ME)
1.1 Mark/Scribe the affected unit(s)

1.2 Inform source/previous station
about the problem.

2.1 Replace worn-out punch and die.
(ME)

3.1 Replace broken punch. (ME)

4.1 Adjust carving block tool height. (ME)

4.2 Replace worn-out carving block tool
punch and die. (ME)

5.1 Adjust non-synchronized indexer vs.
tool up/down. (ME)

5.2 Adjust tool set-up up and down. (ME)

Package Scratch /
Side/Endflash
YES
NO
Note:

For Critical defects, microgap & package
Crack call MRB for lots ID, risk assessment
and customer disposition. (Supv/ME/PE)
YES
1.0 Stop affected machine processing, do 100% visual inspection on lot(s) processed since last good monitor
2.0 Quantify all affected units and segregate from the good units
Process dummy units
and perform 100%
visual inspection under
sufficient magnification
(10X-50X)
1.0 Segregate and yield off
affected unit.
2.0 Record all actions done
on applicable logsheet.
OCC CATEGORY INPUT VARIABLES CORRECTIVE ACTIONS C/A VERIFICATION DISPOSITION/RECORDING
Generate MRB report
if =/> Maverick lot yield
(Supv/PE/ME)
PROCESS : TRIM FORM SINGULATION

REVISION LEVEL : D
Microgap /
Crack Failure
1.0 Check for any foreign material
on the tool.

2.0 Check for warped leadframe.

3.0 Check punch and die if worn-out.
(ME)

4.0 Check if tool is not properly set-up.
(ME)
ANY REJECT
SEEN?
CONTINUE
PROCESSING
Shoulder Crack
Damaged Leads
Package Scratch
Pass?

analysis and C/A.
.
NO
NO
NO
NO
YES
YES
YES
YES
YES
NO
A
1.1 Blow gun tools to remove foreign
material.

1.2 Clean tool by polishing for any dirt
that maybe embedded on the
tooling. (ME)

2.1 Straighten warp leadframe, careful
not to damage the leads and
package.

2.2 Adjust carving block tool height.
(ME)

(ME)

4.0 Adjust to proper tool set-up.
inspect the following onloading
unit, transport assembly, offloading
unit and tooling. (ME)

NO
YES
Process dummy units
and perform 100%
visual inspection under
sufficient magnification
(10X-50X)
1.0 Stop affected machine processing, do 100% visual inspection on lot(s) processed since last good monitor
2.0 Quantify all affected units and segregate from the good units
affected unit.
Note:
For Critical defects, microgap & package
crack call MRB for lots ID, risk assessment
and customer disposition. (Supv/ME/PE)
Generate MRB report
(Supv/PE/ME)

REVISION LEVEL : D
Lead Spread /
Profile Height
CONTINUE
PROCESSING
Lead Length /
Foot Length
End/Side Flash
Pass?

analysis and C/A.
.
NO
NO
NO
YES
YES
YES
YES
NO
A
1.0 Check for any foreign material
on the tool.

2.0 Check for warped leadframe.

(ME)

4.0 Check if tool is not properly set-up.
(ME)
material.

tooling. (ME)

2.1 Straighten warp leadframe, careful
not to damage the leads and
package.

2.2 Adjust index pusher and guide rails
for any misalignment. (ME)

2.3 Adjust carving block tool height.
(ME)

(ME)

4.0 Adjust to proper tool set-up.
inspect the following onloading
unit, transport assembly, offloading
unit and tooling. (ME)
1.0 Perform visual
inspections on 5
dummy and good
units
2.0 Perform
dimensional
check on units
affected unit.
Generate MRB report
(Supv/PE/ME)
CONTROL ITEM : COPLANARITY

REVISION LEVEL : D
POC on
/above UCL/Run
above CL/Increasing
Trend?
CONTINUE
PROCESSING
Pass?
Call PE if problem is still not
NO
NO
NO
NO
YES
YES
YES
YES
YES
NO
Log corrective actions to
FAI/EFAI Logsheet/SPC
Database. (Optr/ME)
NO
X bar chart
R bar chart
X bar chart
R bar chart
These are Opportunity Points.
1.0 Log readings on SPC Database for
POC below LCL
2.0 Continue process.
Stop affected machine processing
Needs Analysis & C/A (and retest for
POPC occurrence)
---------------------------------------------------
1.0 Check for any foreign material on
the tool.

2.0 Check for warped/crumpled
leadframe.

/with broken toolings - (ME)

4.0 Check if tool is not properly
aligned/set- up. - (ME)

5.0 Tool out of dimensional
requirements - (ME)
YES
At least
1 reading is out
of spec?

Out of
control condition
observed?
1. Segregate/Quantify affected units
2. Conduct sampling on at least 5 units per strip affected
3. If readings fail the specification, hold the affected lot and highlight the problem to PE
for disposition
4. If readings pass the specification, include it in good units
POC on
/above UCL/Run
above CL/Increasing
Trend?
POC on
/below LCL/Run
below CL/Decreasing
Trend?
POC on
/below LCL/Run
below CL/Decreasing
Trend?
material
tooling -- (ME)
2.1 Straighten warp leadframe, be
careful not to damage the leads and
package
2.2 Adjust index pusher and guide rails
for any misalignment -- (ME)
2.3 Adjust carving block tool height (ME)
3.1 Replace wornout punch and die (ME)
3.2 Replace broken toolings/parts --(ME)
4.0 Adjust to proper tool setup. Inspect
the following onloading unit,
transport assy, offloading unit and
toolings -- (ME)
5.0 If out of dimensions, replace and
issue SCAR -- (ME)
1.0 Perform visual
inspections on 5
dummy and good
units
2.0 Perform
dimensional
check on units
Generate MRB report
(Supv/PE/ME)
MACHINE TYPE : N/A
REVISION LEVEL : C
PROCESS : BACK END / EOL (END OF LINE)
CONTROL ITEM : VARIANCE / QUANTITY DISCREPANCY (IN PROCESS MONITOR)
YES
ANY VARIANCE
/ QUANTITY
DISCREPANCY?
YES
At Pass-Thru Box:
1. Check the magazine #s & actual
quantity of magazine vs. LTC
2. Verify the previous FOL station
LTC entry if complete filled-up

At Mold:
2. Tally the FOL rejects and Mold
rejects as per LTC/MESA system
transaction

At DB/DJ, Lasermark, DTFS-LLC:
2. Recount the lot quantity of the lot
if variance/quantity discrepancy is
valid.
a. Check for any PTR attachment
on the LTC to tally the number of
actual quantity discrepancy
b. If problem can be resolved with
the previous station, move the lot to
the next.

At FVI:
3. Check for any PTR attachment to
Pre-alert for quantity discrepancy &
proper tallying

1.1 Do not take the magazine/s to Mold Station and
inform FOL & KOL/Mold sup if theres discrepancy
1.2 If applicable, check for the 3
rd
Opt Gate stamp &
fill-up. Inform FOL/KOL/SUP if theres discrepancy

2.1 Perform X-ray if actual FOL reject is less than
actual rejects found at Mold
2.2 Reject excess FOL defects undeclared on the LTC
2.3 Verify with the previous process/station owner the
quantity discrepancy seen
2.4 Issue PTR for traceability/ acknowledgment

2.1 Verify with the previous process/station owner the
quantity discrepancy seen
2.2 Issue PTR for traceability/acknowledgment

3.1 Check LTC declaration of both FOL/EOL defects.
3.2 Verify for any process/station declared rejection
i.e. at Mold (inc fill) to focus the inspection on the
said defect & if there are undeclared rejects
resulting to quantity discrepancy, verify and settle
with the concerned process/station
Verify C/A Done:
1. If variance/ quantity
discrepancy is
resolved, tally the lots
quantity based on Lot
Traveller Card (LTC) &
MESA System
transaction

2. If variance/ quantity
discrepancy is not
resolved, generate
MRB and provide
necessary
improvement action
CONTINUE LOT
PROCESSING

Variance/
Quantity
Discrepancy
A
Note: Call MRB for Gross Rejection>/= Maverick Lot Trigger Point
1. Recount and verify the quantity of the lot if variance/quantity discrepancy is valid
2. Notify immediate supervisor/KOL (King Of The Line) once there is valid variance/quantity discrepancy
3. Recheck the previous process/stations Lot Traveller Card (LTC) transaction to identify to whom (optr, Prodn sup)
to address query for the quantity discrepancy incident
4. Issue PTR (Production Trouble Request) for traceability and to enable acknowledgment of previous (optr, Prodn sup)
process/station owner
5. Perform Product OCAP as necessary and hold the concerned lot on current station if the variance/ (optr, Prodn sup)
quantity discrepancy is not resolved
6. Find the missing strip/s-unit/s inside Assembly and Escalate to middle management if not resolved (optr, Prodn sup)
A
OCC CATEGORY INPUT VARIABLES CORRECTIVE ACTION C/A VERIFICATION DISPOSITION/RECORDING
NO
YES
Pass ?
NO
NO

Sot Sc70 Ocap

Caricato da

Informazioni sul documento

Descrizione originale:

Copyright

Formati disponibili

Condividi questo documento

Condividi o incorpora il documento

Opzioni di condivisione

Hai trovato utile questo documento?

Questo contenuto è inappropriato?

Copyright:

Formati disponibili

Sot Sc70 Ocap

Caricato da

Copyright:

Formati disponibili

1. Stop machine. Do 100% inspection on all wafers processed until the last visual monitoring.

Potrebbero piacerti anche