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Presented By: Mike Violette Washington Laboratories, Ltd. September 15, 2006 7560 Lindbergh Dr. Gaithersburg, MD 20879
Introduction Elements of an EMI Situation Source "Culprit" Coupling method "Path" Sensitive device "Victim"
VICTIM SOURCE PATH
Lets see how this all got started Dead Smart Guys
Maxwell
Hertz
Marconi
Radiated Susceptibility
Radiated Emissions
Conducted Susceptibility
Conducted Emissions
Interference to TV Reception
No Interference
VICTIM
Loop Area
Induced Current
V
D M
VC
M
INoise
VC
M
Loop Area
Induced Current
Instrumentation Interference
EKG Signal
Interference Current, If
NOISE
Effect of Modulation
Interference Current, If
Electrostatic Discharge & Transient Pulses ESD can induce glitches in circuits, leading to false triggering, errors in address & data lines and latch-up of devices
Upset Damage Degradation leading to future failure(s)
Gee, the humidity is low in here. Whats this for?
Filtering
Please, Im very ticklish C
EKG Signal
Interference Current
Surge Coupling
Lightning and pulse sources cause high-energy transients into power and data cables
Direct
Indirect
F(t)
f= 1/T 2f 3f Log F
F(t)
f= 1/ Log F
dBuV/m
3 3
CISPR B
3 3
3 3
3 3
3 3 3 3 3 3 Frequency (MHz) 3 3 3 3 3 3 3 3 3
The dB is used in Regulatory Limits (FCC, CISPR, etc.) The dB is a convenient way to express very big and very small numbers The Bel was named after Alexander Graham Bell Bel = LOG10(P2/P1) deciBel provides a more realistic scale: dB = 10LOG10(P2/P1) Voltage & Current are expressed as follows: dB (V or I) = 20LOG10(V2/V1)
20LOG derives from the conversion from Power to Voltage (ohms Law: P = E2/R)
dB
Radio Receiver Sensitivity ~ 10 dBuV E-Field Limit for FCC: ~40-60 dBuV/m Distance to moon: 107dBmile (20LOG2.5E+5miles)
Broadband Sources
Digital Switching
Inductive kick Switch bounce
Digital Signaling
Broad spectrum based on pulse width & transition time HDTV CDMA UWB Technologies
Pulsed Sources
Fourier Analysis
Do you like my new shirt?
F o u r i e r >
A
f =1/ r
F(t)
r
f= 1/ Log F
Spectrum of a Pulse
Cell phone
Switching noise
FM Radio
Cables - Overview
Major coupling factor in radiating emissions from an equipment and coupling of emissions from other sources into an equipment Acts as radiating antenna, receiving antenna, and cable-tocable coupling mechanism External cables are not typically part of the equipment design but the installation requirements must be considered during the design Problem is a function of cable length, impedance, geometry, frequency of the signal and harmonics, current in the line, distance from cable to observation point Frequency Effects: Tied into Cable Wavelength
Cables - Length/Impedance
Efficiency as an antenna - function of length compared to wavelength At typical data transfer rates - length is short At harmonics or spurs the length may become long Impedance mismatch creates a high SWR
Frequencies of testing from 26 MHz to 1 GHz Corresponding cable lengths: L ~ 11 meters @ 26 MHz to 30 cm @ 1 GHz Short cables can be large contributors to Interference Problems
Power cables Grounding wires Patient cables Data cables Control harnesses Structures!
Cables - Loops
Emissions are a function of 1) Current; 2) Loop Geometry; 3) Return Path of the Current Current flow creates a magnetic field H=I/2R for a single wire model Single wire case is not realistic Loop geometry formed by the current carrying conductor and the return line contribute to the field strength Electric field strength:
E(V /m) = 3 .3 f
3 ( MHz )
* A( cm3) *
I
I ( amps ) R( meters )
E (& H)
V ~
Area
Filters - Overview
Passband High pass Low pass Single component, L, Pi, T Common mode; differential mode Placement Components Lead length Leakage Limitations
Rejection
Noise
EKG Signal
Attenuation of Noise
Frequency (Hz)
Filters - Types
Filters - Components
Filters
Typical Schematic
Filter - Placement
Filter OUT
Filter IN
Filter
Filter Placement
Shield Concepts
Electric Field Coupling
V+
E-Field
V=0
Ground 0V Potential
Shield Concepts
Magnetic Field Coupling
>>1
I
V
Effects of Openings
Cable Leakage
+ +
V=? V=0
VRF
RF Source
RF Leakage
Metal Box
VRF
RF Source
Perfect Transmission
L ~ /2
Shielding
The Business Card Test
Good to about 1 GHz
Shielding - Overview
Materials
Electric field - conductivity Magnetic field - permeability
Discontinuities
Windows Vents Seams Panel components Cable connections
Shielding Effectiveness
Incident Field E1 Resultant Field E2
SHIELD Reflected ER
SE = E2/E1 (dB)
Shielding Reflection/Absorption
RE ( dB ) = 3 3 3 +3 3 log(
3 * R(3 meters ) * f ( Hz )
RH ( dB )
RP ( dB ) = 3 3 3 + 1 1 log(
3 3 f ( MHz ) > 3 3 R
*f ) ( Hz )
A( dB ) = k * t * f ( Hz ) * *
k = 3.4 for t in inches and k = 134 for t in meters
Shielding - Material
Metal Silver Copper Gold Aluminum Zinc Brass Nickel Iron Tin Steel Hypernick Monel Mu-Metal Stainless Steel Conductivity - 3 .3 3 3 1 .1 1 .1 1 1 .1 1 3 .3 3 3 .3 3 .3 3 3 .3 3 3 .3 3 .3 3 1 .1 1 1 .1 1 3 .3 3
All are good electric field shields
Permeability - 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
Need high u for Mag Field Shield
Shielding - Seams/Gaskets
Required openings offer no shielding in many applications Apertures associated with covers tend to be long or require many contact points (close screw spacing) Large opening treatment
Screens, ventilation covers, optic window treatments WBCO formed to effectively close opening
Shielding - Penetration
Conductors penetrating an opening negates the shielding provided by absorption and reflection Cables penetrations require continuation of the shield or Conductors require filtering at the boundary Cable shields require termination Metal control shafts serve as a conductor
Use non-metallic Terminate shaft (full circle)
Grounding - Overview
Purpose
Safety protection from power faults Lightning protection Dissipation of electrostatic charge Reference point for signals
Grounding - Impedance
Bonding
Low impedance
Avoid contamination Provide for flush junction to maximize surface contact Use gaskets or fingerstock for seam bonds Provide a connecting mechanism
Galvanic Scale
Component Selection
Spectrum of a Square Wave
T A
F(t)
f= 1/T 2f 3f Log F
F(t)
f= 1/ Log F
MAX485
MAX487
EMI V * dV dt
Circuits available in an EMI version Specify logic of necessary speed - not faster than required EMI performance varies between manufacturers
Two Sources:
&
10s kHz Broadband (radiated & conducted) dV/dT = 100sMV/s 100s Volts
100 MHz+
Design in hooks
Provide space for potential fix actions that may be required
Connect all ground pins of high frequency circuits together in the same ground structure. Do not separate, isolate, break or otherwise cut the ground plane. Do not separate, isolate, break or otherwise cut the power plane. Do not insert impedances into Vcc/power traces.
Isolated Power/Grounding
CHECKLIST
Signal Termination
RC Terminations ( 33 ohms + 33 pF) on periodic signals Group high frequency sources together; minimize trace runs of high frequency signals Dont source/sink I/O (whether internal or external) through high frequency devices Position oscillators and crystals away from I/O and openings in the chassis Snub switching power supply waveforms to minimize HF energy
Filtering
Filters are installed at enclosure wall LC filter on unshielded cables Plan for capacitor on shielded lines
Cabling
Route cables to avoid coupling Use only fully-shielded cables Fully-terminate shield grounds to metal/metalized connector shels Terminate shells to chassis
Shielding
The Business Card Test Use correctly-rated suppressor line-to-line and line-to-ground Gas Tubes Varistors SAD (Silicon Avalanche Diodes)
Bonding Checklist
Bond 3 V to chassis ground Bond 3 V to connector frames and shells Bond connector frames to chassis Bond metal frames together