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ABOUT

Intel Corporation is an American multinational semiconductor chip maker corporation headquartered in Santa Clara, California. Intel is the world's largest and highest valued semiconductor chip maker, based on revenue. It is the inventor of the x86 series of microprocessors, the processors found in most personal computers. Intel Corporation, founded on July 18, 1968, is a portmanteau of Integrated Electronics (the fact that "intel" is the term for intelligence information was also quite suitable). Intel also makes motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphic chips, embedded processors and other devices related to communications and computing. Founded by semiconductor pioneers Robert Noyce and Gordon Moore and widely associated with the executive leadership and vision of Andrew Grove, Intel combines advanced chip design capability with a leading-edge manufacturing capability. Though Intel was originally known primarily to engineers and technologists, its "Intel Inside" advertising campaign of the 1990s made it and its Pentium processor household names.

INTEL CO-ORPORATION CALIFORNIA

CORE OF INTEL I7

X58 BLOCK DIAGRAM

INTEL TURBO BOOST TECHNOLOGY 2.06: EXTRA GHZ ON DEMAND Intel Turbo Boost Technology 2.0 automatically speeds up the processor when the users workload requires extra performance.

Intelligent Efficiency
Because Intel Turbo Boost Technology 2.0 can match processor speeds to current requirements and reduce processor speed when less performance is needed, it can lower energy costs on all PCs and extend battery life on laptops

 Intel Smart Cache

Intel Smart Cache is a multicore, optimized cache that improves performance and efficiency by increasing the probability that each execution core of a multi-core processor can access data from a more efficient, higher-performance cache subsystem. By sharing L2 and L3 caches among each core based on the workload, Intel Smart Cache allows each core to dynamically use up to 100% of available cache. When one core has minimal cache requirements, other cores can increase their percentage of cache, reducing cache misses and increasing performance.

INTEL VPRO TECHNOLOGY

Intel Core vPro processors are specifically designed for business, delivering cost savings and control while improving security and remote manageability. Not only will businesses reduce power con- sumption costs thanks to energy- saving features, but IT can also reduce maintenance costs by enabling remote configuration, diagnosis, isolation, and repair of infected PCs.3, 1

NEHALEM
With the release of the Nehalem microarchitecture in November 2008,[14] Intel introduced a new naming scheme for its Core processors. There are three variants, Core i3, Core i5 and Core i7, but the names no longer correspond to specific technical features like the number of cores. Instead, the brand is now divided from lowlevel (i3), through mid-range (i5) to high-end performance (i7),[15] which correspond to three, four and five stars in Intel's Intel Processor Rating[16] following on from the entry-level Celeron (one star) and Pentium (two stars) processors.[17] Common features of all Nehalem based processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI Express and Direct Media Interface on the processor replacing the aging quadpumped Front Side Bus used in all earlier Core processors. All these processors have 256 KB L2 cache per core, plus up to 12 MB shared level 3 cache. Because of the new I/O interconnect, chipsets and mainboards from previous generations can no longer be used with L1 cache 64KB per core Nehalem based processors.
L2 cache L3 cache 256KB per core 4MB to 12MB shared

Two Nehalem Chips (Sockets), each containing four processors (cores) running at up to 2.93GHz Each chip has three DRAM channels attached, each 8 bytes wide at 1.066Gb/s (3*8.5GB/s). Can have up to two DIMMs on each channel (up to 4GB/DIMM) PCI Express connections for Graphics cards and other extension boards. Up to 8 GB/s per slot. QuickPath point-point system interconnect between CPUs and I/O. Up to 25.6 GB/s per link.

Disk drives attached with 3Gb/s serial ATA link

Slower peripherals (Ethernet, USB, Firewire, WiFi, Bluetooth, Audio)

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 IVY BRIDGE
Ivy Bridge is a codename line of Intel processors based on the 22nm manufacturing process. The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on tri-gate ("3D") transistors , which is also used in the future Xeon and Core i7 Ivy BridgeEX,Ivy Bridge-EP and Ivy Bridge-E microprocessors due for release in 2013. Ivy Bridge processors are backwardscompatible with the Sandy Bridge platform, but might require a firmware update (vendor specific).[1] Intel has released new 7-series Panther Point chipsets with integrated USB 3.0 to complement Ivy Bridge.[2]
L1 cache L2 cache L3 cache 64 kB per core 256 kB per core 2 MB to 8 MB shared

 SANDY BRIDGE
Sandy Bridge-E[1] is the codename of an eight-core Intel processor based on the Sandy Bridge microarchitecture. It follows the sixcoreGulftown/Westmere-EP processor that used the older LGA 1366 package, which is replaced with LGA 2011 starting with Sandy Bridge-EP. TheCPUID extended model number is 45 (2Dh) and four product codes are used, 80619 for the UP Core i7 models and the higher numbers for the various Xeon E5 DP server models. Two versions of the die exist, with four or eight cores, respectively. Out of those, some cores may be disabled, which is used for products that are sold with two or six cores visible o the user.
Cores 8 (physical), 16 (logical) L2 cache 8 256 kB L3 cache 20 MB