Chapter 10 Digital CMOS Logic Circuits

10.1 Digital circuit design : An overview 10.2 Design and performance analysis of the CMOS inverter 10.3 CMOS logic gate circuits 10.4 Pseudo- NMOS logic circuits

10.1 Digital circuit Design : An Overview

10.1.1 Digital IC technologies and logic circuit families
Fig. 10.1 Digital IC technologies and logic circuit families

CMOS
Replaced NMOS (much lower power dissipation) Small size, ease of fabrication Channel length has decreased significantly (as short as 0.06 m or shorter) Low power dissipation than bipolar logic circuits ( can pack more) . High input impedance of MOS transistors can be used to storage charge temporarily (not in bipolar) High levels of integration for both logic (chapter 10) and memory circuits (chapter 11) . Dynamic logic to further reduce power dissipation and to increase speed performance .

Bipolar
TTL (Transistor-transistor logic) had been used for many years . ECL (Emitter Coupled Logic) : basic element is the differential BJT pair in chapter 7 . BiCMOS : combines the high speed of BJTs with low power dissipation of CMOS . GaAs : for very high speed due to the high carrier mobility . Has not demonstrated its potential commercially .

Features to be Considered
Interface circuits for different families Logic flexibility Speed Complex functions Noise immunity Temperature Power dissipation Co$t

10.1.2 Logic circuit characterization

Fig. 10.2 Typical voltage transfer (VTC) of a logic inverter .

Fig. 10.3 Definitions of propagation delays and switching times of the logic inverter

Fan-In and Fan -Out

Fan-in of a gate : number of inputs . Fan-out : maximum number of similar gates that a gate can drive while remaining within guaranteed specifications (to keep NMH above certain minimum) .

10.2 Design and performance analysis of the CMOS inverter . 10.2.1 Circuit structure
Fig. 10.4 (a) The CMOS inverter and (b) its representation as a pair of switches operated in a complementary fashion .

10.2.2 Static operation

10.2.2 Static operation

Fig. 10.5 The voltage transfer characteristic (VTC) of the CMOS inverter when QN and QP are matched

10.2.3 Dynamic Operation

Fig. 10.6 Circuit for analyzing the propagation delay of the inverter

Fig. 10.7 Equivalent circuits for determining the propagation delays

10.3 CMOS Logic Gate Circuits

10.3.1 Basic structure Fig. 10.8 Representation of a three- input CMOS logic gate

Fig. 10.10 Examples of pull down networks (PDN)

Fig. 10.10 Examples of pull- up networks (PUN)

Fig. 10.11 Usual and alternative symbols for MOSFETs

10.3.2 The Two Input NOR Gate

Fig. 10.12 A two input CMOS NOR gate

10.3.3 The Two- Input NAND Gate

Fig. 10.13 A two-input CMOS NAND gate

10.3.4 A Complex Gate

10.3.5 Obtaining the PUN and the PDN and Vice Versa
Fig. 10.14 CMOS realization of a complex gate

10.3.6 The Exclusive- OR Function

Fig. 10.15 Realization of the exclusive OR (XOR) function .

10.3.8 Transistor Sizing

Fig. 10.16 Proper transistor sizing for a four- input NOR gate

Fig. 10. 17 Proper transistor sizing for a four- input NAND gate

Fig. 10.18 Circuit for Example 10.2

10.4 Pseudo- NMOS Logic Circuits

10.4.1 The pseudo NMOS inverter
Fig. 10.19 (a) The pseudo- NMOS logic inverter . (b) The enhancement load NMOS inverter (c) The depletion- load NMOS inverter

Fig. 4-2 . The enhancement-type NMOS transistor with applied voltage

The I-V characteristic of MOSFET

The n- channel depletion type MOSFET

The depletion type n-channel MOSFET

10.4.2 Static Characteristics

Fig. 10.20 Graphical construction to determine the VTC of the inverter

Fig. 10.21 VTC for the pseudo- NMOS inverter .

10.4.4 Dynamic Operation