Printed Circuit Board Design

By ANJALI ANAND

What is a PCB?
A printed circuit board or PCB interconnects electronic components without discrete wires. The Printed Circuit Board (PCB) is the laminate to which all the electronic components are soldered, with one or more layers of etched metal tracks making the connections. The components and connections in the PCB Layout are derived from the circuit diagram, and physically placed and routed by the designer to get the best result.

What is a PCB layout?

The PCB Layout defines the final physical form of the circuit A PCB should be admired for its beauty and elegance.

Manual artwork methods

1. INK METHOD SIZE : 2:1 OR 4:1 MATERIALS USED IVORY CARD AND INDIAN INK

MANUAL METHODS
2. TAPED ARTWORK METHOD SIZE 2:1 OR 4:1 3. MATERIALS USED Transparent polyester Sheet Black, Blue & Red color Tapes This method of preparing PCB artwork or PCB Design has become obsolete

DISADVANTAGESMANUAL METHOD
1. 2. 3. 4. Time consuming Less accurate (specially in MLB designs) Storage life is less Cannot meet the present day component package densities

CAD- Computer Aided Design

Softwares available on PCB Design 1. CADSTAR 2. PADS 3. P-CAD 4. ORCAD 5. CADENCE 6. MENTOR GRAPHICS 7. PROTEL etc.

SOFTWARE USED IN ECIL

CADSTAR VER 8.0 on WINDOWS 2000 VISULA VER 5.0 for both PCB and HMC design Both the softwares are from M/s. ZUKEN-REDAC , U.K

Category of PCB Designs

SINGLE SIDE (SSB) DOUBLE SIDE (DSB) MULTILAYER (MLB)

Design Technologies
Digital Analog Mixed signals (analog & digital) R.F Using SMT with single side and two side mounting Micro vias/ fine line Buried/ Blind via

Multi layer Board (MLB)

MLB is designed when 1. Reduction in PCB size is required 2. Component density is high 3. Coupling or shielding of a large number of connections is required 4. Low impedance of supply lines and good distribution of the supply currents are necessary

Basic steps in PCB Design

1.Schematic/logic/circuit diagram capture&net list generation 2. Bill of material preparation/component selection/creation 3.Mechanical dimensions/fixed component location of the pcb 4.Component placement 5.Routing 6.Post processing 7.Photo plotting (generation of films) 8.Computer aided manufacturing (CAM)

Schematic diagram
The schematic diagram is the logical connections between the electronic components Netlist: Looks like .pcb .con .cod2 U1 1 r2 1 U3 5 c1 1

Bill of material / Component selection

The component list shall include the following details: 1.The nomenclature used for various components like Resistors R Capacitors C Transistors Q Diode D ICs U Resistor networks RN or RP

2.The component pitch and no of pins etc 3.Lead diameter 4.Body dimension 5.Any heat sink requirement etc.. 6.Data sheet for any nonstandard components

Mechanical dimensions/fixed component locations

Shall contain the following 1.Board outline drawing 2.Mounting hole location 3.Connector location 4.Details of any cutout/slot etc.. 5.Location of fixed component like switches,LEDs,transformers etc..

Component placement
1.Auto placement 2.Manual placement The following points shall be considered for component placement 1.Component with nearest connections 2.Preferably mount all ICs in same orientation 3.Provide sufficient free space on the board edge for card-guides/handles

Component Placement
4.Distribute the components for uniform package density over the entire board 5.Keep the components accessible for easy replacement 6.Keep heat sensitive components away from heat producing components

Routing
1.Auto routing 2.Manual routing The following design rules/assignments are to be defined before routing 1.Minimum conductor width for signals,power ground etc.. 2.Minimum conductor spacing

Routing
3.Pad size for all components 4.Minimum drill size 5.Minimum via/PTH size with drill size 6.No. of layers 7.Routing of critical signals 8.Board edge clearance

Post processing
The following activities are done in post processing after routing 1.Smoothing 2.Mitering 3.DRC checking 4.Addition of polarity marking 5.Addition of copper marks for board circuiting

Post Processing
6.Layer no indication 7.Addition of skirting on power plane layers 8.Addition of registration marks 9.Add board dimension & layer identification for each layer 10.Generate spool/plot file called as Gerber file in RS-274X format for each layer 11.Generate N.C drill file in Excellon format for drilling.

Photo plotting
The process of converting/imaging a gerber file on to a film is photo plotting the following types of plotters are available for photo plotting 1.Vector photo plotters 2.Laser photo plotters 3.Direct write plotters 4.Laser direct imaging (LDI)

Laser photo plotter

Modern laser photo plotter can image a sheet of film (24X30) in a few minute . They can produce either a +ve image , -ve image or a composite image with any line width, pad size / pad shape . The film used for photo-plotting is silver halide with polyester base high contrast film of 7 mil thickness of KODAK, AGFA, DUPONT make etc.

In a drum type laser photo plotter, the drum will rotate at a low speed of about 60 rpm, the film is loaded on to the drum automatically and is held securely by vacuum. A laser light source moves along the drum rotation and the image created by CAD / CAM software called as GERBER file is reproduced on the film

Developing
After exposure of the film , the developing is performed in a four chambered conveyorised developer that includes developer, fixer , water rinse and drier

CAM
The image files often called as gerber files along with NC drill file received from CAD are manipulated and edited to create the Gerber , NC drill and route file

CAM
CAM also perform the following DRC check Copper area calculation Netlist for BBT Gerber , drill and route file generation Create Autocad DXF file for fabrication drawing Removal of unconnected pads in inner layer etc

Popular CAM softwares

CAM 350 GC- CAM GERB tool LAVENIR VALOR etc.

PCB Layout design Standards

There are industry standard for every aspect of PCB Design. Standards are controlled by Institute of Interconnecting and Packaging Electronic Circuits, Simply known as IPC These standards cover PCB design, manufacture and testing IPC 2221 Generic Standard on Printed Circuit Board Design.

Analysis tools available for PCB design

1.Pre layout tools for analog and digital simulation- SI (Signal Integrity) 2.Post layout tools for thermal analysis EMI/EMC adviser etc

High density inter connect technology(HDI) technology(HDI

This is the latest technology in PCB which uses components like BGA,CFP,PQFP, etc. with buried and blind via holes

Fabrication of PCBs
Dr. T.S. Krishna Ram

Blanking Scrub cleaning Printing 1. Screen 2. Photo Etching Drilling Solder coating 1. Roller Tinning, 2. HAL Cutting Inspection Despatch

Single Side PCBs

Double sided PCB (DSB)

Blanking Drilling Through hole plating 1. Electroless copper 2. Direct Metallization (Graphite/Carbon) Photo Printing Pattern Copper & TIN plating Dry film stripping

DSB

contd..

Etching TIN stripping Inspection Solder Masking Hot Air Levelling Cutting final BBT (Bare Board Testing Flying Probe) Inspection Despatch

Multi Layer PCBs - MLB

Master & Material Punching Preparation of inner layers Lamination Drilling Epoxy De-smearing Through Hole Plating Photo Printing Pattern copper & TIN plating Dry film Stripping Etching, TIN stripping Solder masking Hot Air Levelling Cutting (Final) BBT Legend Printing Inspection & Despatch

Component Division
Welcome to the presentation on Central PCB facility

Our mission

To ensure our customers success Success means understanding customer requirements

Our Commitment

On time delivery of quality PCBs

Brief profile
Production started : 1972 Quality approval : ISO 9001:2000 Membership : IPC (US) IPCA (India) Capacity / Annum : 1000 sqmtr Plant Area : 2000 sqmtr

 Specifications Min. conductor width : 8mils / 0.2mm Min. Conductor spacing : 8mils / 0.2mm Min. plated hole size : 12mils / 0.4mm Max. board size : 400mm x 500mm Max. no. of layers : 8 Max. outer layer Cu. Thickness : 2oz. Max. inner layer Cu. Thickness :2oz. Board thickness tolerance : +/- 10%

Technical Capability

Technical capability
Available finish :
HAL, Electroless Nickel & Gold (ENIG) plating for SMT/SMD, BGA, TSOP etc Liquid Photo imageable soldermask (PILSM), Soldermask on Bare copper (SMOBC) White

Soldermask finish : Legend:

Laminates:

Glass Epoxy NEMA grade, Type FR-4

CAD Design center

Hardware : 8 PCs Internet facility to have library updates EDA tools : CADSTAR ver. 8.0 Plotter : HP Design Jet 450c Printer : Laser printer

CAD Design center

Front end Engineering

CAM 350 Generation of all manufacturing outputs like 1. Panelization 2. Reverse engineering 3. CAD netlist verification 4. Flying Probe Testing 5. Bed-of-Nails Testing 6. Composite layers 7. NC editor

Equipments
We are in the process of continuous investment in plant and machinery to meet the ever increasing demands of quality and volume The following slides shows our equipments to ensure quality

Laser Raster Photoplotter RP308

Max. exposable area : 36x 26 Selectable Resolution 2000, 4000, & 8000 DPI Min. Line width 2mil at 2000 DPI 1mil at 4000 DPI 0.7mil at 8000 DPI Input Formats : Gerber RS274D, RS274X

CNC Drilling Machine

POSALUX, SWITZERLAND Rpm: 120000 Positioning Accuracy : 5microns Min. drill size : 0.3mm Drill breakage indication Both drilling and routing Depth control facility

Direct Metalization
Pre cleaning Swill Conductive graphite coating Fixing Drying chamber Inspection Microetch Anti tornish drying

Imaging or Photo printing

Hot roll laminators U.V. Exposure Developer

Imaging or Photo printing

Developer

Multi Layer press

Lamination of inner layers of Multi layer PCBs

AOI- Automatic Optical Inspection

Make: CAMTEK, Israel Optical Inspection of inner layer laminates Photo masters against gerber data

Plating

Pattern plating of copper and tin on the printed pattern and inside the holes

Etching

Dry film Stripper Ammonical Etcher Tin Stripper

Solder Masking
Scrubber Screen printer UV Exposer Tunnel Oven

Hot Air leveling- HAL

Flying probe tester

Electrical Testing of bare PCBs for shorts and opens by using gerber Data

END OF PRESENTATION

THANK YOU.