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Winstar Display Co.

, LTD

No.163 Chung Ching RD., Taichune, Taiwan, R.O.C

: 407 163

WEB: http://www.winstar.com.tw E-mail: winstar@winstar.com.tw Tel:886-4-24262208 Fax886-4-24262207

SPECIFICATION CUSTOMER : WH1602L-NGG-CT

MODULE NO.:

APPROVED BY:
( FOR CUSTOMER USE ONLY )

PCB VERSION:

DATA:

SALES BY

APPROVED BY

CHECKED BY

PREPARED BY

ISSUED DATE:

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Winstar Display Co., LTD MODLE NO

RECORDS OF REVISION
REVISED PAGE NO. DOC. FIRST ISSUE

VERSION

DATE

SUMMARY

2007-1-18

First issue

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Contents
1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Pin Function 8.Contour Drawing & Block Diagram 9.Function Description 10.Character Generator ROM Pattern 11.Instruction Table 12.Timing Characteristics 13.Initializing of LCM 14.Reliability 15. Inspection specification

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1.Module Classification Information


WH 1602 L N G G CT

BrandWINSTAR DISPLAY CORPORATION Display TypeHCharacter Type, GGraphic Type Display FontCharacter 16 words, 2Lines. Model serials no. Backlight Type NWithout backlight BEL, Blue green DEL, Green WEL, White FCCFL, White YLED, Yellow Green BTN Positive, Gray TLED, White ALED, Amber RLED, Red OLED, Orange GLED, Green TFSTN Negative

LCD Mode

NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green MSTN Negative, Blue FFSTN Positive LCD Polarizer Type/ Temperature range/ View direction AReflective, N.T, 6:00 DReflective, N.T, 12:00 GReflective, W. T, 6:00 JReflective, W. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 KTransflective, W.T,12:00 CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00

Special Code

CT : English and Cyrillic standard font

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2.Precautions in use of LCD Modules


(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Dont make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Dont disassemble the LCM. (4)Dont operate it above the absolute maximum rating. (5)Dont drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment. (8)The LCM must be input negative voltage to Vo when temperature below -10.

3.General Specification
Item Number of Characters Module dimension View area Active area Dot size Dot pitch Character size Character pitch LCD type Duty View direction Backlight Type Dimension 16 characters x 2 Lines 122.0 x 44.0 x 9.3(MAX) 99.0 x 24.0 94.84 x 20.0 0.92 x 1.1 0.98 x 1.16 4.84 x 8.06 6.0 x 9.66 STN Positive, Gray , Reflective 1/16 6 oclock N/A Unit mm mm mm mm mm mm mm

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4.Absolute Maximum Ratings


Item Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD-VSS VDD-V0 Min -20 -30 VSS -0.3 -0.3 Typ Max +70 +80 VDD 7 6.0 Unit V V V

5.Electrical Characteristics
Item Supply Voltage For Logic Symbol VDD-VSS Condition Ta=-20 Supply Voltage For LCD VDD-V0 Ta=25 Ta=70 Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current VIH VIL VOH VOL IDD VDD=5.0V Min 4.5 3.8 0.7 VDD 0 3.9 1.2 Typ 5.0 4.3 1.5 Max 5.5 5.5 VDD 0.6 0.4 1.8 Unit V V V V V V V V mA

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6.Optical Characteristics
Item Symbol (V) View Angle (H) Contrast Ratio CR T rise Response Time T fall 150 200 ms CR2 -30 3 150 30 200 deg ms Condition CR2 Min 20 Typ Max 40 Unit deg

Definition of Operation Voltage (Vop)


Intensity 100 Selected Wave Non-selected Wave

Definition of Response Time ( Tr , Tf )


Non-selected Conition Intensity 10 Selected Conition Non-selected Conition

Cr Max Cr = Lon / Loff


100 90

Vop

Driving Voltage(V)

Tr

Tf

[positive type]

[positive type]

Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR2)


b f = 180

= 270

= 90

= 0

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7.Interface Pin Function


Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VSS VDD VO RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K Level 0V 5.0V GND Supply Voltage for logic Description

(Variable) Contrast Adjustment H/L H/L H,HL H/L H/L H/L H/L H/L H/L H/L H/L H: DATA, L: Instruction code H: Read(MPUModule) L: Write(MPUModule) Chip enable signal Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line NC NC

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8.Contour Drawing &Block Diagram


8.1 11.5 13.58 122.0 0.5 105.8 99.0(VA) 94.84(AA)

2.4 8.0 10.0

44.0 0.5 35.2 24.0(VA) 20.0(AA)

K A 14 1 15 16 2.0 P2.54*15=38.1 16- 1.0 PTH 2.5 4- 3.5 PTH 4- 6.5 PAD

3.5 10.98

7.0 15.0 37.0

K A

16.5 12.5 3.5

9.3 MAX 4.7

2.5

3.5

1.6 EL or NO B/L

6.0 4.84 0.98 0.92

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Vss Vdd Vo RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K

10.34 9.66 8.06 1.16 1.1

The non-specified tolerance of dimension is

0.3mm.

0.5

DOT SIZE

MPU
80 series or 68 series

RS R/W E DB0~DB7

Com1~16

Controller/Com Driver HD44780 or Equivalent

16X2 LCD
Seg1~40 Seg41~80

VR 10K~20K

Vdd Vo Vss

Bias and Power Circuit

D M CL1 CL2 Vdd,Vss,V1~V5

Seg Driver

Vee External contrast adjustment.

Optional

Character located DDRAM address DDRAM address

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F

N.V. Generator

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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected.

RS 0 0 1 1

R/W 0 1 0 1

Operation IR write as an internal operation (display clear, etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0

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Display position DDRAM address 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

00 01 02 03 04 05 06 07 40 41 42 43 44 45 46 47

08 09 0A 0B 0C 0D 0E 0F 48 49 4A 4B 4C 4D 4E 4F

2-Line by 16-Character Display

Character Generator ROM (CGROM) The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be written, and for 510 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.

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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C h a ra c te r p a tte rn ( 1 )

H ig h

Low

* 0

* 0

Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1

H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

Low

0 0 0 0 0 0

C u rs o r p a tte rn

C u rs o r p a tte rn

F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 0 0 0 0 0 0 0 0 1 1 1 1 4 3 2 0 0 0 0 1 1 1 1 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * 6 * * * * * * * * * * * * 5 4 3 0 0 0 0 0 0 0 0 0 * 2 Low 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 * C h a ra c te r p a tte rn 0 0 0 1 0

H ig h

Low

Low

H ig h * 0 * 0 * * * * * * * * * 0 * *

* 0

C u rs o r p a tte rn

: " H ig h "

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10.Character Generator ROM Pattern


Table.2
Upper 4 bit Lower 4 bit

LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH

LLLL

CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8)

LLLH

LLHL

LLHH

LHLL

LHLH

LHHL

LHHH

HLLL

HLLH

HLHL

HLHH

HHLL

HHLH

HHHL

HHHH

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11.Instruction Table

Instruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Write 00H to DDRAM and set

Execution time

Description
(fosc=270Khz)

Clear Display

1
DDRAM address to 00H from AC Set DDRAM address to 00H from AC

1.53ms

Return Home

and return cursor to its original position

1.53ms
if shifted. The contents of DDRAM are not changed.

Entry Mode 0 Set Display 0 0 0 0 0 0 1 I/D SH

Assign cursor moving direction and

39s
enable the shift of entire display.

Set display (D), cursor (C), and blinking

ON/OFF Control

B
of cursor (B) on/off control bit.

39s

Set cursor moving and display shift

Cursor or 0 Display Shift 0 0 0 0 1 S/C R/L

control bit, and the direction, without


changing of DDRAM data. Set interface data length

39s

Function Set

DL

(DL:8-bit/4-bit), numbers of display line

39s
(N:2-line/1-line)and, display font type (F:511 dots/58 dots)

Set CGRAM 0 Address Set DDRAM 0 Address


Whether during internal operation or not

AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.

39s

AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.

39s

Read Busy
can be known by reading BF. The

Flag and Address

BF AC6 AC5 AC4 AC3 AC2 AC1 AC0


contents of address counter can also be read.

0s

Write Data to 1 RAM Read Data 1 from RAM 1 D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0

Write data into internal RAM

43s
(DDRAM/CGRAM). Read data from internal RAM

43s
(DDRAM/CGRAM).

dont care

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12.Timing Characteristics
12.1 Write Operation

Ta=25, VDD=5.0 0.5V Item Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time Symbol TC TPW TR,TF tAS tAH tDSW tH Min 1200 140 0 10 40 10 Typ Max 25 Unit ns ns ns ns ns ns ns

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12.2

Read Operation

Ta=25, VDD=5.0 0.5V Item Enable cycle time Enable pulse width (high level) Symbol TC TPW TR,TF tAS tAH tDDR tH Min 1200 140 0 10 10 Typ Max Unit ns ns

Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time

25 100

ns ns ns ns ns

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13.Initializing of LCM
Power on Wait for more than 40 ms after VDD rises to 4.5 V
BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 * * * * Wait for more than 39us
BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 1 0 * 0 0 0 0 * * * N F * * * 0 0 * * * Wait for more than 39 s

Function set

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 1 0 * * * * Function set 0 0 0 0 0 0 N F * * * * * * Wait for more than 37us

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control * * * * 0 0 0 0 0 0 * 1 D C B * * * 0 0 Wait for more than 37 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear * * * * 0 0 0 0 0 0 1 * * * * 0 0 0 0 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set * * * * 0 0 0 0 0 0 1 I/D SH * * * * 0 0 0 Initialization ends

4-Bit Ineterface

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Power on W for more than 40 ms after VDDrises to 4.5 V ait


BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * Wait for more than 39us
BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * Wait for more than 37us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D Wait for more than 37 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends

8-Bit Ineterface

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14.Reliability
Content of Reliability Test (wide temperature, -20~70) Environmental Test
Test Item
High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 10 cycles 30min 5min 1 cycle Total fixed amplitude : 1.5mm Endurance test applying the vibration during transportation and using. 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF 1 time Vibration Frequency : 30min 25 70 -20/70 time. Endurance test applying the high storage temperature for a long time. Endurance test applying the electric stress (Voltage & Current) and the thermal stress to the element for a long time.

Content of Test
Endurance test applying the high storage temperature for a long

Test Condition
80 200hrs -30

Note
2

1,2 200hrs 70 200hrs 1

Endurance test applying the electric stress under low temperature -20 for a long time. The module should be allowed to stand at 60,90%RH max 200hrs 60,90%RH

1,2 96hrs

Vibration test

Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.

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15. Inspection specification


NO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL

01

Electrical Testing

0.65

02

Black or white 2.1 White and black spots on display 0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm

2.5

3.1 Round type : As following drawing =( x + y ) / 2 SIZE 0.10 0.100.20 LCD black spots, white spots, contamination (non-display) 0.200.25 0.25 3.2 Line type : (As following drawing) Length --L3.0 L2.5 --Width W0.02 0.02W0.03 0.03W0.05 0.05W

Acceptable Q TY Accept no dense 2 1 0 2.5

03

Acceptable Q TY Accept no dense 2.5 2 As round type

04

Polarizer bubbles

If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.

Size 0.20 0.200.50 0.501.00 1.00 Total Q TY

Acceptable Q TY Accept no dense 3 2 0 3 2.5

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NO 05

Item Scratches

Criterion Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness 06 Chipped glass Z1/2t 1/2tz2t

y: Chip width Not over viewing area Not exceed 1/3k

x: Chip length x1/8a x1/8a 2.5

If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:

z: Chip thickness Z1/2t 1/2tz2t

y: Chip width Not over viewing area Not exceed 1/3k

x: Chip length x1/8a x1/8a

If there are 2 or more chips, x is the total length of each chip.

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NO

Item Symbols :

Criterion x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

AQL

y: Chip width y0.5mm 6.2.2 Non-conductive portion: Glass crack

x: Chip length x1/8a

z: Chip thickness 0 zt

06

2.5

y: Chip width y L

x: Chip length x1/8a

z: Chip thickness 0 zt

If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa

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NO 07

Item Cracked glass

Criterion The LCD with extensive crack is not acceptable.

AQL 2.5 0.65 2.5 0.65

08

8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. Backlight elements 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X Y

09

Bezel

2.5 0.65 2.5 2.5 0.65 2.5

10

PCBCOB

2.5 0.65

0.65 2.5 2.5

X * Y<=2mm2 2.5 2.5 2.5 0.65

11

Soldering

11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.

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NO

Item

Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.

AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65

12

General appearance

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winstar LCM Sample Estimate Feedback Sheet Module Number

Page: 1

1Panel Specification
1. Panel Type 2. View Direction 3. Numbers of Dots 4. View Area 5. Active Area 6. Operating Temperature 7. Storage Temperature 8. Others Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG ,

2Mechanical Specification
1. PCB Size 2. Frame Size 3. Materal of Frame 4. Connector Position 5. Fix Hole Position 6. Backlight Position 7. Thickness of PCB 9. Height of Module 10. Others Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , Pass NG , NG , NG , NG , NG ,

8. Height of Frame to PCB Pass

3Relative Hole Size


1. Pitch of Connector 2. Hole size of Connector 3. Mounting Hole size 4. Mounting Hole Type 5. Others 4Backlight Specification 1. B/L Type 2. B/L Color 4. B/L Driving Current 5. Brightness of B/L 6. B/L Solder Method 7. Others

3. B/L Driving Voltage (Reference for LED Type)

Go to page 2
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winstar Module Number

Page: 2

5Electronic Characteristics of Module


1. Input Voltage 2. Supply Current 3. Driving Voltage for LCD 4. Contrast for LCD 5. B/L Driving Method 6. Negative Voltage Output 7. Interface Function 8. LCD Uniformity 9. ESD test 10. Others Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,

6Summary

Sales signature Customer Signature


26 26

Date

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