Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
27
47
115
181
217
Satellite Filters
247
273
Spectrum-Shaping Filters
293
Bandpass Filters
303
325
Resonators
333
Low-Loss Filters for Mobile Communication Symbols and Terms Subject Index
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SAW Components
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Preface
Surface acoustic wave (SAW) components from Siemens Matsushita Components rank among the key devices of modern information and communication technology. Fabricated in submicron technologies they are high-tech devices that feature not only outstanding precision, but also small size, high reproducibility and excellent long-term stability. SAW components are used as bandpass filters, as frequency-stabilizing devices and for complex signal processing functions. The following summary gives you a survey of our product line and points out the benefits of the individual filter groups.
q Intercarrier, quasi/split sound, video and audio filters
Sophisticated design and production processes create extremely high precision in the passband and excellent adjacent-channel selectivity. As a consequence no cost-intensive matching elements and extra traps are necessary. Switchable SAW filters for multistandard applications enable switching of the transfer function for different TV standards. These filters come in miniaturized plastic packages (SIP 5 K and DIP 10 K) ready for automatic processing.
q Satellite filters
Satellite filters are applied in analog and digital satellite receivers for channel filtering on the IF level. Dual-channel filters allow the reception of signals from two satellites with different transponder bandwidths. Yet another benefit is switchover when reception deteriorates in poor weather like rain and snow. The smaller bandwidth means better signal/noise ratio and higher selectivity and thus much improved picture and sound reproduction.
q Bandpass, vestigial sideband and spectrum-shaping filters
Telecommunications makes high demands: precise bandpass characteristics, flat passbands, steep skirts and high selectivity. SAW filters offer the tailored solution. They are used as bandpass filters in digital satellite and cable receivers, as vestigial sideband filters in TV transmitters, cable headends and transposers, and for spectrum shaping in digital radio relay systems.
q Clock recovery filters
In digital telecommunications, on coaxial copper or fiber-optic cable, the signal has to be regenerated at regular intervals to avoid bit errores. For this S+M Components offers standard SAW filters for the frequency range 50 through 2500 MHz, assuring reliable clock recovery even at high transmission rates.
q Resonators
SAW resonators are key components in remote control and telemetry systems. They are used in heating energy controllers, garage door openers and keyless entry systems for cars, to name just a few examples. SAW resonators work in the fundamental mode, from 200 through 900 MHz, allowing small and highly stable oscillator circuits. They come in hermetically sealed TO 39 or SMD packages, as one-port and two-port resonators, covering all common frequencies.
q Low-loss filters for mobile communication
For designers of cellular and cordless phones, low weight and low space requirements are the outstanding advantages of SAW filters. Our RF and IF filters come in miniaturized SMD packages down to a size of only 3,8 3,8 mm. The ultra-small DCC 6 package has a weight of no more than 0,07 g. Furthermore the filters can do without external matching elements and promote compact, low-power circuit design. Steep passband skirts of the filter improve speech quality; low insertion loss means less power consumed and thus longer battery life, or smaller and therefore lighter batteries.
Preface
This data book presents the current product range of Siemens Matsushita Components, with exemplary specification of typical standard types in full detail. Filters which are only listed in the surveys without further specification are marked by the sign #. Detailed information on these types can be obtained from your nearest Siemens Sales Office. Although the data book is intended to give comprehensive information about our product range, its focus is necessarily on standard products. Our special strength are custom filter solutions. With a special design software, devised in-house, and advanced CAD methods SAW filters can be rapidly designed and modified to customer specifications. If you have any questions, if you need information on special applications not covered in this data book, or applications engineering support, do not hesitate to contact your nearest Siemens Sales Office, Passive Components and Electron Tubes Group; an address list is contained in the last chapter.
Contents
Page Selector guide Alphanumeric index of types General technical information 1 1.1 2 2.1 2.2 2.3 2.4 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4 4.1 4.2 4.3 4.4 4.4.1 4.4.2 4.5 4.6 5 5.1 5.2 5.3 5.4 6 6.1 6.1.1 6.1.2 6.2 7 7.1 7.2 Introduction Construction Operating principles of TV IF filters Fundamentals Phase velocity of surface acoustic waves Chip size Filter design Characteristics Feedthrough signals Triple-transit echo (TTE) Reflections (spurious signals) Pulse response Frequency response Group delay of TV IF filters Filter impedances Temperature coefficient of frequency Testing Final measurements Measurement results in the frequency range (e.g. TV IF filter for B/G standard) Minimum, maximum and typical values Pulse response (time-domain measurement) Test set-up for TV IF filters Method of computation Test circuits TV test signals Application notes for TV IF SAW filters Other operating conditions Matching and driver stage Switchable video/intercarrier SAW filters for multistandard applications Switchable audio SAW filters for multistandard applications Application notes for resonators and resonator filters Typical oscillation circuits Oscillators using a one-port resonator Oscillators using a two-port resonator Application for a wireless remote control system at 433,92 MHz Date codes, packing units Date codes Packing units (pcs) 9 22 27 27 27 27 27 28 28 28 29 29 29 29 29 30 30 30 33 33 33 33 34 34 35 35 35 37 39 39 39 39 40 41 41 41 42 43 45 45 45
Contents
Quality Delivery quality Certification Qualification Classification of defects Incoming inspection Quality data
46 46 46 46 46 46 46 47 115 181 217 247 273 293 303 325 333 347 349 350
IF filters for intercarrier applications IF filters for quasi/split sound applications IF filters for video applications IF filters for audio applications Satellite filters Vestigial sideband filters Spectrum-shaping filters Bandpass filters Clock recovery filters Resonators Symbols and terms Standards Subject index
Selector Guide
Standard
Package
Type
Remarks
Page
L B D/K D/K, B/G D/K, B/G D/K, B/G M/N D/K, B/G D/K B/G B/G B/G B/G B/G B/G B/G B/G B/G B/G B/G B/G NICAM I I I NICAM B/G, D/K B/G, D/K B/G, D/K B/G, D/K B/G D/K B/G B/G M/N
SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K
K 2962 M B 1952 M D 1952 M K 2953 M K 2954 M K 2958 M K 6265 K K 6265 K D 1990 M G 1872 M G 1875 M G 1960 M G 1961 M G 1962 M G 1963 M G 1965 M G 1966 M G 1967 M G 1968 M G 1980 M G 1984 M J 1952 M J 1955 M J 1980 M K 2951 M K 2955 M K 2960 M K 2962 M K 6255 K K 6255 K K 6256 K K 6259 K K 6259 K
90 49 52 55 47 58 61 61 47 47 66 47 47 69 47 72 75 47 78 47 47 81 47 84 47 87 47 90 93 93 98 47 47
38,90
For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC
2 Nyquist slopes (L/L) Internally switchable For CENELEC Internally switchable Internally switchable Also for video appl. Internally switchable Internally switchable
Selector Guide
Standard
Package
Type
Remarks
Page
IF filters for intercarrier applications (continued) B/G M/N M/N I I M/N M/N M/N M/N M/N M/N M DIP 10 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K K 6260 K K 6262 K M 1956 M J 1951 M J 1953 M M 1859 M M 1861 M M 1958 M M 1962 M M 1963 M M 1966 M N 1951 M Internally switchable Also for video appl. Internally switchable Also for video appl. For CENELEC 47 47 47 103 48 106 48 48 109 48 48 112
39,50 45,75
58,75
Standard
Package
Type
Remarks
Page
L B D/K D/K B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM
DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K
K 3261 K B 3250 K D 3650 K K 3264 K G 3254 K G 3255 K G 3258 K G 3264 K G 3270 K G 3354 K G 3355 K G 3356 K G 3357 K
For CENELEC For CENELEC For CENELEC For twin PLL ICs For CENELEC For CENELEC For CENELEC
116 115 115 120 115 115 124 128 115 115 132 115 115
10
Selector Guide
Standard
Package
Type
Remarks
Page
IF filters for quasi/split sound applications (continued) 38,90 B/G NICAM I NICAM I NICAM I NICAM L B/G, D/K, I B/G B/G, D/K I NICAM I NICAM M/N M/N M/N M/N M/N M/N M/N M/N M DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K SIP 5 K DIP 10 K SIP 5 K G 3652 K J 3251 K J 3351 K J 3652 K K 3252 K K 3258 K K 3261 K K 3350 K J 3252 K J 3352 K M 3251 K M 3271 K M 3352 K M 3353 K M 3354 K M 3355 K M 3561 M M 3654 K N 3561 M 115 136 140 115 115 144 116 148 152 156 115 160 115 115 164 115 168 172 177
39,50 45,75
For FCC
For FCC
58,75
Standard
Package
Type
Remarks
Page
L L
33,90
L L
2 Nyquist slopes (L/L) For CENELEC Internally switchable Also for intercarrier appl. 2 Nyquist slopes (L/L) For CENELEC Internally switchable Also for intercarrier appl.
11
Selector Guide
Standard
Package
Type
Remarks
Page
IF filters for video applications (continued) L DIP 10 K K 6257 K Internally switchable 2 Nyquist slopes (L/L) For CENELEC Internally switchable For CENELEC Internally switchable For CENELEC Internally switchable For CENELEC 2 Nyquist slopes (L/L) For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC For CENELEC Internally switchable Also for intercarrier appl. 2 Nyquist slopes (L/L) Internally switchable For CENELEC Internally switchable Internally switchable Also for intercarrier appl. Internally switchable Also for intercarrier appl. Internally switchable Internally switchable For CENELEC For FCC 188
L 38,00 B/G, D/K B/G, D/K M/N 38,90 B/G B/G, L B/G B/G B/G B/G B/G B/G, I, D/K, L D/K, I, L B/G
DIP 10 K SIP 5 K DIP 10 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K DIP 10 K
K 6263 K K 3955 M K 6266 K K 6266 K G 3956 M G 3957 M G 3962 M G 3963 M G 3964 M G 3965 M G 3967 M K 3953 M K 6256 K K 6257 K
181 193 196 196 201 182 181 181 181 204 181 185 181 188
DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K
K 6257 K K 6260 K K 6262 K K 6263 K K 6263 K M 3960 M J 3950 M M 3951 M N 3954 M N 3958 M
188 181 181 181 181 181 207 210 213 181
12
Selector Guide
Standard
Package SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K
Type K 9455 M K 9252 M K 9352 M L 9360 M L 9362 M L 9453 M L 9454 M L 9455 M L 9456 M L 9460 M L 9461 M K 9460 M K 9463 M K 9260 M K 9350 M K 9453 M K 9462 M K 9253 M K 4350 K K 9353 M G 9251 M G 9353 M K 4350 K K 9460 M K 9463 M J 9250 M K 9455 M K 9461 M K 9462 M L 9361 M L 9455 M L 9460 M L 9353 M
Remarks 2 channels
Page 219 217 217 217 223 217 225 217 228 217 217 217 217 231 217 233 217 217 217 217 217 237 217 217 217 217 219 217 217 217 218 218 218
31,50 32,50 D/K, I, B/G 31,50 33,50 D/K, I, B/G, M/N D/K, I, B/G, M/N 32,40 L L L L NICAM L NICAM L L L
32,40 32,90 D/K, L, I D/K, L, I NICAM 32,40 33,40 D/K, I, B/G D/K, L, I, B/G D/K, L, I, B/G D/K, L, I, B/G 32,40 34,40 D/K, I, B/G, M/N 32,90 33,40 I NICAM I NICAM B/G NICAM B/G, L NICAM B/G, L NICAM B/G, L NICAM B/G, L NICAM I NICAM M/N M/N M/N L L NICAM L L
13
Selector Guide
Standard
Package
Type
Remarks
Page
IF filters for audio applications (continued) 40,40 L NICAM SIP 5 K L SIP 5 K L NICAM SIP 5 K L SIP 5 K L SIP 5 K L SIP 5 K 41,00 41,25 54,25 L M/N M/N M M SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K
L 9354 M L 9453 M L 9454 M L 9456 M K 9453 M K 9461 M L 9461 M M 9260 M M 9352 M N 9260 M N 9350 M
218 218 225 228 233 218 218 240 242 218 245
Satellite filters
3 dB bandwidth MHz 27,0 + 31,0 26,9 + 32,1 31,3 27,0 + 18,0 27,0 + 32,0 27,0 + 36,0 21,5 + 27,0 15,0 + 27,0 33,5 + 36,1 15,7 32,0 22,5 36,2 26,6 17,6 26,6
Package
Type
Remarks
Page
TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39
B 609 B 629 B 682 B 611 B 615 B 619 B 621 B 625 B 635 B 662 B 674 B 680 B 686 B 692 B 694 B 696 Integr. shunt resistors Integr. shunt resistors Integr. shunt resistors
248 247 253 256 247 247 247 247 261 247 247 247 247 266 269 247
480,00
14
Selector Guide
Standard
Package
Type
Remarks
Page
L D/K D/K B/G B/G B/G B/G B/G B/G I D/K I B/G I B/G B/G D/K M/N M/N
DIP 24-06 DIP 24-06 SIP 6 M DIP 24-03 DIP 24-03 DIP 16 DIP 16 DIP 24-06 DIP 24-06 DIP 24-06 DIP 24-06 DIP 24-06 SIP 6 M SIP 6 M SIP 6 M SIP 5 K SIP 5 K DIP 24-06 SIP 5 K
B 540 B 542 B 587 B 522 B 523 B 530 B 531 B 534 B 537 B 541 B 543 B 576 B 585 B 586 B 588 G 4960 M K 4960 M B 545 M 4950 M With sound suppression With sound suppression With sound suppression With sound suppression With sound suppression
273 273 273 273 274 277 273 273 280 273 273 273 283 273 273 286 273 289 273
NICAM With sound suppression With sound suppression With sound suppression With sound suppression With sound suppression With sound suppression
45,75
15
Selector Guide
Spectrum-shaping filters
Nyquist frequency MHz 11,95 12,10 12,30 7,755 7,755 13,52 13,52 13,52 13,82
Package
Type
Page
DIP 16 DIP 16 DIP 16 DIP 16 DIP 16 DIP 24-06 DIP 16 DIP 16 DIP 16
Bandpass filters
Standard
Package
Type
Page
16
Selector Guide
Standard
Package
Type
Page
Bandpass filters (continued) 70,00 DIP 16 DIP 16 DIP 16 DIP 16 DIP 16 DIP 16 TO 8 B 504 B 519 B 590 B 521 B 1529 B 1505 B 558 313 303 303 316 303 319 322
Center frequency MHz 51,840 139,264 155,520 167,118 181,043 622,080 659,157 2488,320
Insertion attenuation (max) dB 29,5 21,0 18,5 19,5 17,0 17,5 19,5 20,5 18,0 21,0
Package
Type
Page
DIP 16 TO 8 TO 8 DIP 16 TO 8 TO 8 TO 39 TO 8 TO 8 TO 39
B 5545 B 5505 B 5533 B 5549 B 5506 B 5504 B 5531 B 5547 B 5513 B 5534
325 325 326 325 325 325 329 325 325 325
17
Selector Guide
Resonators
Center frequency MHz 1-port resonators 314,50 315,00 417,50 418,00 423,22 433,42 433,92
Insertion attenuation dB
Package
Type
Page
2,0 1,5 2,0 1,5 1,4 1,8 1,4 1,8 1,8 1,6 1,7 1,7
R 660 R 706 R 639 R 705 R 704 R 643 R 703 R 644 R 647 R 702 R 641 R 701
333 333 333 333 333 333 334 333 333 333 336 333
2-port resonators 213,80 224,50 304,35 315,05 403,55 407,35 414,25 418,00 418,05 423,22 433,92 849,25 9,1 8,5 7,3 5,5 7,5 8,6 7,0 7,5 9,2 8,3 7,3 7,8 9,2 11,0 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 QCC 8 TO 39 TO 39 TO 39 QCC 8 TO 39 R 2637 R 2523 R 2653 R 2622 R 2526 R 2635 R 2620 R 2528 R 2702 R 2630 R 2531 R 2632 R 2701 R 2533 333 333 333 333 333 333 333 333 338 333 333 340 333 333
18
Selector Guide
Insertion attenuation dB
Package
Type
Page
Frontend filters for remote control 314,00 315,00 403,55 433,92 2,5 2,5 2,5 2,3 TO 39 TO 39 TO 39 TO 39 B 3532 B 3531 B 3533 B 3530 333 333 333 343
19
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Type B 504 B 512 B 519 B 521 B 522 B 523 B 530 B 531 B 534 B 537 B 540 B 541 B 542 B 543 B 545 B 558 B 576 B 585 B 586 B 587 B 588 B 589 B 590 B 609 B 611 B 615 B 619 B 621 B 625 B 629 B 635 B 662 B 674 B 680 B 682 B 686 B 692 B 694 B 696 B 1505 B 1507
Page 313 304 304 316 273 274 277 273 273 280 273 273 273 273 289 322 273 283 273 273 273 303 303 248 256 247 247 247 247 247 261 247 247 247 253 247 266 269 247 319 303
Type B 1529 B 1952 M B 2540 B 2559 B 2565 B 2569 B 2570 B 2573 B 2578 B 2579 B 2580 B 3250 K B 3530 B 3531 B 3532 B 3533 B 5504 B 5505 B 5506 B 5513 B 5531 B 5533 B 5534 B 5545 B 5547 B 5549 D 1952 M D 1990 M D 3650 K G 1872 M G 1875 M G 1960 M G 1961 M G 1962 M G 1963 M G 1965 M G 1966 G 1967 G 1968 G 1980 G 1984 M M M M M
Page 303 49 293 293 293 294 297 293 293 300 293 115 343 333 333 333 325 325 325 325 329 326 325 325 325 325 52 47 115 47 66 47 47 69 47 72 75 47 78 47 47
Type G 3254 K G 3255 K G 3258 K G 3264 K G 3270 K G 3354 K G 3355 K G 3356 K G 3357 K G 3652 K G 3956 M G 3957 M G 3962 M G 3963 M G 3964 M G 3965 M G 3967 M G 4960 M G 9251 M G 9353 M J 1951 M J 1952 M J 1953 M J 1955 M J 1980 M J 3251 K J 3252 K J 3351 K J 3352 K J 3652 K J 3950 M J 9250 M K 2951 M K 2953 M K 2954 M K 2955 M K 2958 M K 2960 M K 2962 M K 3252 K K 3258 K
Page 115 115 124 128 115 115 132 115 115 115 201 182 181 181 181 204 181 286 217 237 103 81 48 47 84 136 152 140 156 115 207 217 47 55 47 87 58 47 90 115 144
Type K 3261 K K 3264 K K 3350 K K 3953 M K 3955 M K 4350 K K 4350 K K 4960 M K 6255 K K 6255 K K 6256 K K 6256 K K 6257 K K 6259 K K 6259 K K 6260 K K 6260 K K 6260 K K 6262 K K 6262 K K 6263 K K 6263 K K 6263 K K 6265 K K 6266 K K 9252 M K 9253 M K 9260 M K 9350 M K 9352 M K 9353 M K 9453 M K 9455 M K 9460 M K 9460 M K 9461 M K 9461 M K 9462 M K 9462 M K 9463 M K 9463 M
Page 116 120 148 185 193 217 217 273 93 98 181 181 188 47 47 181 181 47 181 47 181 181 181 61 196 217 217 231 217 217 217 233 219 217 217 217 218 217 217 217 217
Type L 9353 M L 9354 M L 9360 M L 9361 M L 9362 M L 9453 M L 9453 M L 9454 M L 9455 M L 9455 M L 9456 M L 9460 M L 9460 M L 9461 M L 9461 M M 1859 M M 1861 M M 1956 M M 1958 M M 1962 M M 1963 M M 1966 M M 3251 K M 3271 K M 3352 K M 3353 K M 3354 K M 3355 K M 3561 M M 3654 K M 3951 M M 3960 M M 4950 M M 9260 M M 9352 M N 1951 M N 3561 N 3954 N 3958 N 9260 N 9350 M M M M M
Page 218 218 217 217 223 217 218 225 217 218 228 217 218 217 218 106 48 47 48 109 48 48 115 160 115 115 164 115 168 172 210 181 273 240 242 112 177 213 181 218 245
Type R 639 R 641 R 643 R 644 R 647 R 660 R 701 R 702 R 703 R 704 R 705 R 706 R 2523 R 2526 R 2528 R 2531 R 2533 R 2620 R 2622 R 2630 R 2632 R 2635 R 2637 R 2653 R 2701 R 2702 X 6956 M X 6959 M X 6967 M
Page 333 340 333 333 333 333 333 333 334 333 333 333 333 333 333 333 333 333 333 333 340 333 333 333 333 338 310 307 303
S +M
COMPONENTS
the best of reliability too. It turns out chokes in different versions: flat and upright, with current rated from 0.4 to 16 A. UL and VDE approved, and complying with the latest EMC standards of course.
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Keep cool
No matter what the temperature, thats the promise behind our NTC chips in 0805 and 1206 sizes, available direct from SCS stock. These chips do valuable service in handies, ensuring clear contrast in the display and optimum reception in the crystal oscillator, besides proper charging of the battery. In hybrid and SMT circuits, NTC chips cover a temperature range of -55 C through +125 C.
UT UO
1,0 U 1,0
T
UO
0,2 0
Introduction
Surface acoustic wave filters (SAW filters) are integrated, passive components with bandpass filter characteristics. Their operation is based on the interference of mechanical surface waves. Compared to coil filters, surface acoustic wave filters provide a series of favorable characteristics:
q q q q q q q
High reproducibility High performance Stable characteristics No adjustment required Amplitude response and phase response can be specified independently of each other Close tolerances of data Small space requirements (a complete TV IF filter only takes up 0,5 cm2)
The user of a surface acoustic wave filter has a component which fully replaces complex LC combinations and yields superior picture and sound quality. 1.1 Construction
A metal layer (Al) is vapor-deposited onto a single-crystal, piezoelectric substrate. Using a photoetching technique, the metal is removed to obtain fine, finger-like interspersed electrodes (interdigital transducers), which serve as piezoelectrical input and output transducers. The substrate is then bonded to a metal base and connected to the terminals by means of bonding wires. An absorber prevents surface waves reflected from the edges of the substrate from causing spurious signals. The SAW filter is encapsulated to protect it from external influences.
Interdigital transducers
2 2.1
When electrical signals are applied to the input transducer, it launches mechanical (acoustic) surface waves which, due to reciprocity, in turn produce electrical signals in the output transducer. The transducers act as transmit/receive antennas for surface acoustic waves. Widely varying antenna characteristics can be achieved as a result of the transducer structure. The center frequency, amplitude response and group delay are determined by the number, length, arrangement and spacing of the transducer fingers (see para. 2.4). Superposing of the antenna characteristics of the input and output transducers results in the filter characteristic.
27
All TV IF filters included in this book consist of transducers with constant finger widths and spacings. One of the transducers has constant finger lengths (unweighted or unapodized transducer) whereas the other one has varying finger lengths (weighted or apodized transducer). In most cases the first one operates as output transducer and the second one as input transducer. The transfer function of the unweighted transducer is sin(x)/x-shaped; its center frequency depends on the spacing of the fingers and its bandwidth on the number of the fingers. The higher the number of the fingers, the smaller is the bandwidth of the transducer. The finger widths range from 27 m (G 1962 M: IF 38,9 MHz) to 1,2 m (B 696: IF 480,0 MHz). The amplitude and group delay of a weighted transducers transfer function can be set independently of each other. The transfer characteristic of the filter can be closely approximated by multiplying the transfer characteristics of the two transducers. 2.2 Phase velocity of surface acoustic waves
The phase velocity of surface acoustic waves is frequency-independent. Depending on the substrate material and the crystal cut, the phase velocity ranges from 3000 to 4000 m/s. 2.3 Chip size
The required chip size largely depends on the desired filter data. Narrowband performance, steep slopes and high group delay predistortion necessitate transducers with many fingers and, hence, with a long substrate. Filters with two inputs or outputs require broad substrates. 2.4 Filter design
The filter design is based on the specification of the filter and is performed in two steps. In the first step, the linear design, the center frequency and bandwidth of the filter are used to specify the unweighted transducer as well as the width and number of fingers for the weighted transducer. The finger lengths of this transducer, which determine its transfer function, are found by a linear optimization program (simplex algorithm). In this program, a smooth pass band, a tolerance scheme, continuity conditions, a Nyquist slope, single frequency points (e.g. color carrier) or derivatives of slopes (e.g. at the sound shelf) as well as the value to be optimized (e.g. stop band rejection or the amplitude of the color carrier) can be specified. If a solution is possible with respect to the given filter length, the algorithm finds the unique solution for which the specified conditions are satisfied exactly. If no solution is possible, the specifications must be relaxed or the filter length must be extended. In the filter just designed, none of the secondary order effects of a SAW filter have been taken into account, such as diffraction of the waves due to small radiating apertures (e.g. 0,1 to 15 wavelengths for G 1962 M), the influence of the circuitry (frequency-dependent voltage division on the load resistance), the distribution of electrical charges on the transducer fingers or reflection of the waves at the edges of the fingers. In the second step of design, these secondary order effects are calculated with the aid of a simulation program and their influence on the transfer function will be corrected by a predistortion in the weighted transducer. This modification of the transducer is performed by a least square optimization program. After compensation for the secondary order effects, the design of the SAW filter is complete, a mask can be made and the filter produced.
28
Characteristics
Surface acoustic wave TV IF filters are based on the interference of mechanical surface waves, i.e. on delay effects and not on resonance. This is the reason why some characteristics differ from those of coil filters. 3.1 Feedthrough signals
Surface acoustic wave TV IF filters have a basic delay of approx. 1 s. If unfavorable circuitry has been selected, it is quite possible for direct electrical feedthrough to be exhibited as a preecho. It is therefore advisable to terminate the filter asymmetrically at its input and symmetrically at its output. Moreover, the input and output circuitry should be appropriately spaced; long filter leads should also be avoided. 3.2 Triple-transit echo (TTE)
The triple-transit echo is an interfering signal typical of surface acoustic wave TV IF filters: the surface acoustic wave from the input transducer is reflected by the output transducer, returns to the input transducer where it is again reflected, and appears as an echo signal at the output with 3-times the basic delay. In principle, this signal is always present; however its level is not a filter constant, but is a function of the insertion loss, i.e. of internal filter attenuation and the source and load impedances. In practice, it is important to suppress the triple-transit echo at the input by low source impedance. The triple-transit echo virtually does not occur in filters designed for high-impedance loads (e.g. G1962M); if the filter is connected as specified, the TTE signal is prevented by an internal reflection compensation in the output transducer. In filters designed for low-impedance loads the TTE is suppressed by approximately double the insertion attenuation of the filter. 3.3 Reflections (spurious signals)
A transducer emits surface acoustic waves in both directions. The waves impinging on the substrate edge and reflected there can appear as echo signals. For this reason, the substrate edges are provided with an attenuator which absorbs the surface acoustic waves. In this way, reflections are reduced to a non-critical level. 3.4 Pulse response
The interfering effects mentioned above feedthrough, triple-transit echo and reflections are echo signals and are therefore in the time domain. During the design stage, such interfering effects will be calculated and kept as small as possible. In order to guarantee excellent picture and sound quality it is therefore important to record the time-domain performance, the so-called pulse response (see 4.3) in production. In the frequency domain such echos cause a ripple in the pass band of the filter. The ripple frequency is proportional to the distance in time and the ripple amplitude is proportional to the amplitude of the echo signal.
29
3.5
Frequency response
The frequency response complies with the relevant standard or with customer-specific requirements. It can be adjusted to the users applications, if permitted by the technology, state of the art and chip size. On account of the finite length of the transducers, which corresponds to a time-limited pulse response, the steepness of slope is limited. Since SAW filters consist of periodic finger structures, the interdigital transducers, these are also active at the harmonics of the basic frequency. However, not all harmonic waves are excited. With G 1962 M, for example, every fourth harmonic wave is excited. 3.6 Group delay of TV IF filters
The average group delay complies with the relevant standard or customer-specific requirements and is characterized in the data sheets as follows: e.g. standard B/G (G 1968 M) Group delay Reference frequency Maximum sag Color carrier 38,90 MHz 36,90 MHz 34,47 MHz
90 ns 165 ns
The typical value of the group delay ripple in the pass band is specified for filters with constant group delay. The group delay ripple depends on the echo signals, being proportional to amplitude and delay of the echo signals. Despite small amplitude and low signal power, distant echo signals may therefore lead to a considerable high-frequency group delay ripple without causing any critical phase shifts. Thus a sinusoidal group delay ripple of 100 ns peak-to-peak and a period of 800 kHz ( 1,25 s echo delay) results in a phase shift of only 2. Several non-critical reflections e.g. of 50 dB, in contrast, may add up to a conspicious group delay ripple of 50 ns. For this reason, specification of the group delay ripple for SAW filters with system-related, distant echo signals is only sensible when a frequency aperture is given. An aperture of 50 kHz is assumed for the group delay diagrams included in the data sheets. 3.7 Filter impedances
The input and output impedances of a SAW filter comprise the transducers basic capacitance, the electrical image of the acoustic wave emission and the influence of the reflection of the waves from other transducers, which cause a ripple. The transducer impedances are therefore strongly frequency-dependent and, in conjunction with the terminating impedances, can influence the frequency response of the filter. Heavy capacitive loading at the output can, for example, produce slopes in the transfer function. Therefore, the specified terminating impedance for which the filter was designed should be used.
30
a)
b)
Capacitance Capacitance
Admittance Admittance
Figure 2 a) Input transducer admittance of G 1968 M Output connected to 2 k in parallel to 3 pF b) Output transducer admittance of G 1968 M Input connected to 50
Figure 4 Schematic test circuit for TV IF filters Adjustment of resonant circuit (inductor and filter input capacitance) to picture carrier (38,9 MHz). Resistor R is chosen such that the inductor is attenuated by 1 k, 300 , 100 or 30 . For information on 2T and step signal refer to para. 4.6.
31
The effects of different drive impedances (30 to 1 k) on the pulse response are shown below, using G 1968 M as an example.
The response shown in Figure 5 is typical of many TV IF SAW filters. If the drive impedance is too high, 2T signals and rising edges become fuzzy, and the triple-transit also becomes noticeable (2,3 s after the main pulse). From about 100 the picture is perfect; a further reduction in drive impedance yields no improvement. We therefore recommend selecting drive impedances for TV IF filters as described in section 5.2. When driver stages with considerably different impedances are used (e.g. > 200 ), it should be checked which filter types are capable of producing the desired results. 3.8 Temperature coefficient of frequency
The temperature coefficient of frequency of a SAW filter is governed by the substrate material or crystal cut. With the lithium niobate Y/Z cut (standard cut), it is 94 ppm/K, and with the 128 Y/X cut (rotated cut) it is 72 ppm/K. The temperature coefficient causes the filter curve to shift towards lower frequencies as the temperature rises. For operation within a TV set, therefore, a frequency variation of the order of 50 kHz will be produced, compared to the frequency at room temperature. With the lithium tantalate 36 Y/X cut (rotated cut) it is 30 ppm/K and with the X/112 Y it is 18 ppm/K. 4 4.1 Testing Final measurements
SAW filters are subject to a 100 % final test in specially developed automatic measuring instruments. The RF section of this automatic measuring instrument consists of a network analyzer and a test jig. A computer controls all the data of the filters and determines a set of measured values in the frequency domain and in the time domain that guarantees characteristics which have not been measured directly, as, for example, the 2T response. Thus, minimum measuring time and maximum selectivity are favorably combined in this final measuring process.
Figure 6 Computer-controlled test station 4.2 Measurement results in the frequency range (e.g. TV IF filter for B/G standard)
Insertion attenuation at 37,40 MHz The attenuation value of the filter at 37,40 MHz is determined in the test circuit (see Figure 10). For this purpose a capacitive short circuit is placed between the outer connections (pins 1 and 5) and the inner connections (pins 2 and 4) instead of the filter; the insertion attenuation of the filter is given relative of the transmitted signal.
33
Relative attenuation The attenuation values rel given in the data sheets refer to the level at e.g. 37,40 MHz (for B/G standard filters). In the lower/upper sidelobe region, the minimum value of the attenuation is given in each case. Picture carrier Color carrier Sound carrier Adjacent picture carrier FTZ trap 4.3 38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 32,40 MHz Adjacent stereo sound carrier 40,15 MHz Adjacent sound carrier VHF 40,40 MHz UHF 41,40 MHz Lower sidelobe 25,00 ... 31,90 MHz Upper sidelobe 40,40 ... 45,00 MHz
UHF VHF
On account of unavoidable variations in the materials and the process, all measured values show certain scatters that often follow a standard distribution. The minimum and maximum values given in the data book correspond to the measurement limits of the final measurements allowing for uncertainties and which themselves take into account any scatter. The typical values specified correspond to the 50-%-points in the cumulative distribution of the corresponding measurement values. For normal (symmetrical) distributions of measurement values (e.g. in the case of picture carriers, color carriers, sound carriers), the typical value equals the arithmetic mean. In the case of asymmetrically distributed values (e.g. for traps, upper/lower sidelobe), the typical value is generally somewhat smaller than the arithmetic mean. The values given in the data book have each been determined from a large number of filters. These mean values may, however, also be subject to certain variations. 4.4 Pulse response (time-domain measurement)
In order to measure the pulse response, a burst is applied to the filter input and the output voltage is assessed according to the following diagram. Figure 7 shows the schematic envelope curve of the RF output voltage (oscilloscope trace).
Maximum main pulse
34
4.4.1
The circuit shown in Figure 8 allows the pulse response to be measured. In order to obtain the required dynamic range of 70 dB 80 dB, the measuring instrument consists of two electronic mixers. Figure 9 shows the burst used: the half pulse width t hw = 250 ns is matched to the filter bandwidth. The exact slope of the pulse is non-critical. The carrier frequency of the pulse is the frequency for which the rated insertion attenuation is specified.
t hw tr = tf T fr
4.4.2
Method of computation
In final measurements, a computation process equivalent to one of the methods described above is used to evaluate the transfer function of the filter (measurement values in the frequency range), which is measured by a vectorial network analyzer. For this the complex transfer function is multiplied by the spectrum of the burst and transformed into the time domain by means of a Fourier transform. The amplitude of the transformed signal is evaluated. 4.5 Test circuits
For the automatic measuring instrument mentioned in 4.1, special test circuits were designed for TV IF filters; all data sheet information relates to these circuits. Different circuits are used for SIP-5 and DIP-10 filters (Figure 10 and 11). In both cases, wideband drivers with an output impedance of 50 were used. Filters of all standards can thus be driven without switching or adjustment. Postamplifiers provide symmetrical filter termination. The test jigs have a common-mode rejection of 30 dB at up to 80 MHz; the frequency response is negligible, and the gain is set to 26 dB. The test jigs are thus fully interchangeable. For all other types of SAW filter, test jigs are used which ensure 50 drive and load impedance to the SAW filter or the combination SAW filter and matching network respectively.
35
Figure 10 Test circuit for SIP-5 filter Input impedance of the symmetrical post-amplifier: 2 k in parallel with 3 pF
Figure 11 Test circuit for DIP-10 filter Input impedance of the symmetrical post-amplifier: 2 k in parallel with 5 pF
36
4.6
TV test signals
To check the transmission quality of a TV system, there is a series of special test signals, which in part are continually transmitted by the transmitter in certain lines external to the actual picture. These test signals enable detailed and realistic conclusions to be drawn without special measuring equipment. To assess a SAW filter, two signals are of particular interest: the 2T signal (also cos2 2T or sin2 2T pulse) and the step signal. On the screen the 2T signal corresponds to a vertical white raster line. It approximates a sin2shaped pulse with a duration (= half-value width) of 2T = 1/fc , where f c is the upper rated cutoff frequency of the video band. For the B/G standard, f c = 5 MHz, thus resulting in 2T = 200 ns. Such a signal has a frequency spectrum lying mainly below f c. Clearly stated, the 2T pulse is the shortest signal that can still be processed by the system without distortion. The oscilloscope picture of the 2T signal, e.g. at the video output of the IF stage, enables the following conclusions to be drawn: If the amplitude of the 2T signal is too high or too low, this points to amplitude errors; e.g. a tilt in the pass band of the SAW. Unsymmetrical overshoot in front of or behind the 2T signal arises through group delay errors (long wavelength errors, e.g. too little sag). Echo signals after the 2T signal point to poor reflection attenuation, e.g. of the triple-transit echo. Naturally, these errors need not have been caused by the SAW filter. Unfavorable terminating filter impedances, detuned demodulator circuits, transmission errors from previous circuits and amplifiers, as well as power echos can cause the same effects.
37
In the simulated 2T signal shown in Figure 12, the measured transfer function is demodulated whilst taking into account the group delay predistortion taken as the basis, by conjugating the transfer function at the Nyquist point, complex mirroring it and summing it. The video frequency response is now obtained, which is multiplied by the spectrum of the 2T pulse; the result is transformed into the time domain. The real component of the transformed signal is the 2T pulse response of the filter. A figure of merit for the 2T signal is obtained from the K diagram, a tolerance diagram which is based on investigations of the interference effect of various transmission errors. Figure 14 shows the general K tolerance scheme for a 2T signal (time axis applies to the B/G standard).
Drawing corresponds to
Figure 14 K tolerance diagram S + M TV IF SAW filters comply with the K = 2 % diagram On the screen the step signal corresponds to a wide white bar at the left-hand edge. Mathematically speaking, it is the integral of the 2T signal; in principle, it therefore contains no additional information on the SAW filter. The different representation is often useful in assessing the interference effect of an error in the transmission system (see 3.7). In general, the following applies: the 2T signal is more suited for assessing a SAW filter, because it responds in a wide band to transmission errors in the pass band region. In addition, it reacts less noticeably to linearity errors in the IF IC and to envelope-curve effects in demodulation that could falsify the step signal more intensely. If reductions in the described errors are desired, to be able to better assess the effects generated by the SAW filter, it is recommended that the modulation factor of the IF modulator be reduced to 60 %.
38
5 5.1
All filter data quoted in the data sheets apply to the measuring conditions described. It is possible and sometimes necessary to operate the filters under different conditions. If you have any questions please contact your regional sales office. Upon request we are pleased to provide further information material, e.g. overall amplitude and time domain response. 5.2 Matching and driver stage
A low-impedance drive source is required in order to suppress the triple-transit signal. Base resistor R1 provides the defined input impedance of 50 . To obtain a wide range of linearity, a drive current of approx. 20 mA is recommended. The gain can be adjusted by R2, not lower than 470 (e.g. 29 dB with R2 = 1,8 k). To guarantee a signal-to-intermodulation ratio of 50 dB, the input voltage VIN should not exceed 80 mV. The inductivity L compensates the input capacitances of the SAW filter input and the transistor output.
Figure 15 Tuner IF matching circuit and driver stage 5.3 Switchable video/intercarrier SAW filters for multistandard applications
The family of switchable video/intercarrier filters K 62xx K offers the possibility of switching between two filter characteristics. Figure 16 shows an example of a switching network using an unsymmetrical driver (see above): To select the first channel the transistor T1 is in off-state and diode D1 connects pin 10 and pin 1. By activating T1 pin 10 is connected to ground and the other filter characteristic is selected. These filters provide the unique advantage of an optimized frequency response for multistandard concepts using a simple and inexpensive switching network.
39
Figure 16 Switching network for a multistandard video filter 5.4 Switchable audio SAW filters for multistandard applications
Figure 17 shows a proposal for a switchable audio filter for unsymmetrical input. Two different filter characteristics are available in a SIP 5 K package: To select channel 1 only diode D1 is activated, the corresponding transistor T1 is in off-state. That means that the input is connected to pin 1. Pin 2 is grounded by T2. Channel 2 can be chosen accordingly.
40
Principle: An oscillator is an amplifier with a signal feedback from the output to the input.
The amplitude condition means that the total gain G in the loop is greater than 1 and the phase condition postulates a total phase shift in the oscillator loop of n 360. 6.1 6.1.1 Typical oscillation circuits Oscillators using a one-port resonator
The common base Colpitz circuit is one of the preferably used oscillating circuits for one-port resonators.
41
To achieve oscillation, the resonance frequency of the parallel resonance circuit should be near the SAW resonance frequency. Neglecting the internal transistor capacitances, the load and the PCB parasitics, the parallel resonance Fp of ( C1 serial C2) and L1 is determined by: 1 --- --- --- --- --- --- --- --- Fp = - --- --- --- --- -- --- --- --C1 C2 2 L1 --- --- --- --- --- --C 1 + C2
R1, R2 and R3 are for DC biasing. C3 matches the high collector impedance to the load impedance. The signal feedback depends on the relation of C1 and C2.
The concrete values for C1, C2 C3 and L1 must be evaluated on the board to get the desired oscillation frequency. The SMD transistor should be a high-frequency type with a transit frequency of a few GHz. Often it is possible to design the inductivity L 1 like a copper line on the PCB (without ground on the backside). So you receive an antenna. 6.1.2 Oscillators using a two-port resonator
Figure 20 Pierce osillator The amplifier part of the oscillator is a transistor with grounded emitter. The SAW resonator is embedded between two -type tuning networks. These networks control the phase shift in the feedback loop to meet the oscillation conditions. Otherwise they match the input and output impedance of the tranistor to the desired impedance of the SAW resonator. In the tuning network the parallel capacitors Cp1, Cp2, Cp 3 and Cp4 are often substituted by the transistors and the SAW resonators input and output capacitors. The phase shift in the oscillating loop is controlled mainly by L s1/ Cp1 and L s2/Cp3 . C6 is for output matching and L 3 is for DC bypassing.
42
6.2
Fields of application for SAW resonators are remote control systems for keyless entry, security systems and wireless telemetry. Figure 21 and Figure 22 show an AM remote control system at 433,92 MHz. The transmitter is a SAW-stabilized oscillator with a PCB antenna, where a one-port SAW resonator is designed in, using the basic circuit of Figure 19. The modulation is OOK (On Off Keying). The receiver is a superheterodyne receiver with an IF of 10,7 MHz. For preselection and rejection of the image frequency a SAW filter is designed in at the input. The local oscillator is stabilized by a SAW resonator. For the transmitter and for the receiver it is necessary to provide a good common RF ground and short connections between the RF components. It is also recommended to separate the digital part from the RF part on the PCB. Both circuits are developed for small power consumption.
43
44
7 7.1
Date code information (year/month of production) is included in the marking of the SAW filters by using the codes below. As of 1 November 1996 most packages will also be marked with the day of production to enable better traceability. Example: 5H9 = 5 Sept 96 Year 1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 Code V W X A B C D E F H J K L Month January February March April May June July August September October November December Code 1 2 3 4 5 6 7 8 9 O N D Day 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Code 1 2 3 4 5 6 7 8 9 0 A B C D E F Day 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Code H J K L M N P R S T U V W X Z
7.2
Packing units (pcs) Package type TO 39 TO 39 TO 39 TO 39 TO 39 TO 8 DIP 14 DIP 16 DIP 24-06 DIP 24-03 SIP 5 M Packing unit 1000 1000 200 200 1000 200 100 100 80 80 400 (25) (25) (25) (25) (25) (20) (20) Package code Package type X110 SIP 6 M X210 SIP 4 M Z010 Z110 Z210 Z310 Z410 Z510 M100 (Mxxx) K100 T901 QCC 8 DCC 14 QCC 22 QCC 18 QCC 10 QCC 12 SIP 5 K DIP 10 K SIP 5 K SMD Packing unit 300 (75) 1000 3000 1500 1500 1500 1500 1500 1000 500 900
Package code B110 B210 B210 1) B410 1) B510 C210 D210 E110 G310 G410 X010
45
8 8.1
The term delivery quality designates the conformance with agreed data at the time of delivery. 8.2 Certification
The Quality Management System of the SAW Components Division is certified to ISO 9001. Certification was carried out by the VDE Testing and Certification Institute, Offenbach/Main. 8.3 Qualification
The components are subjected by type groups to a qualifying test procedure, which conforms to all important tests specified in the relevant standards. Types for industrial applications are tested in accordance with MIL-STD-883 and MIL-S-49433. The group of types intended for applications in consumer electronics is tested in accordance with IEC 862-1. 8.4 Classification of defects
A component is considered defective if it does not comply with the specification stated in the data sheets or in an agreed delivery specification. Defectives can be divided into inoperatives, which generally exclude a functional application of the component and defectives of less significance. Inoperatives are: short or open circuit broken components, broken package, broken terminals, broken encapsulation missing or incorrect marking intermixing with other component types
The remaining defectives can be divided into: electrical defectives (maximum ratings exceeded) mechanical defectives (incorrect dimensions, damaged package, illegible marking, bent leads) 8.5 Incoming inspection
If the user wishes to carry out an incoming inspection, the use of a sampling inspection plan in accordance with DIN 40 080 (content conforms to MIL-STD 105 D and IEC 410) is recommended. 8.6 Quality data
The information describes the type of component and shall not be considered as assured characteristics. As far as patents or other rights of third parties are concerned, liability is only assumed for the component per se, not for applications, processes and circuits implemented within components or assemblies. Conversely, an agreement as regards quality data does not exclude the possibility of the customer being able to claim replacement for individual defectives within the framework of the terms of delivery. The following information is required for the assessment of possible claims: test circuit, sample size, number of defectives found, sample defectives.
46
Survey Picture carrier MHz 33,90 36,88 38,00 Picture-tosound carrier distance MHz 6,5 5,5 6,5 5,5 6,5 5,5 6,5 5,5 6,5 4,5 5,5 6,5 6,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,85 6,0 6,0 6,0 6,55 5,5 6,5 5,5 6,5 5,5 6,5 5,5 6,5 5,5 6,5 5,5 5,5 6,5 4,5 5,5 4,5 4,5 Group Sound delay 1 ) carrier rejection dB F 50 C 20 N 21 C 20, 21 F 19, 21 F 20, 20 C 22 C 18, 21 F 15 N 20 C 20 C 20 C 20 C 20 C 18 F 20 C 19 F 20 N 20 F 16 C 14, 14 F 20 F 22 F 14, 14 F 21, 21 C 21, 20 C 14, 14 F 15, 15 C 19 C 20 C 20 C 18, 17 F 18 C 16 F 17 C 21 Standard 3)
2)
Package
Type
Page 4)
38,90
L B D/K D/K, B/G D/K, B/G D/K, B/G M/N D/K, B/G D/K B/G B/G B/G B/G B/G B/G B/G B/G B/G B/G B/G B/G NICAM I I I NICAM B/G, D/K B/G, D/K B/G, D/K B/G, D/K B/G D/K B/G B/G M/N B/G M/N M/N
SIP 5 K K 2962 M 90 SIP 5 K B 1952 M 49 SIP 5 K D 1952 M 52 SIP 5 K K 2953 M 55 SIP 5 K K 2954 M # SIP 5 K K 2958 M 58 DIP 10 K 5) K 6265 K 6) 61 DIP 10 K 5) K 6265 K 6) 61 SIP 5 K D 1990 M # SIP 5 K G 1872 M # SIP 5 K G 1875 M 66 SIP 5 K G 1960 M # SIP 5 K G 1961 M # SIP 5 K G 1962 M 69 SIP 5 K G 1963 M # SIP 5 K G 1965 M 72 SIP 5 K G 1966 M 75 SIP 5 K G 1967 M # SIP 5 K G 1968 M 78 SIP 5 K G 1980 M # SIP 5 K G 1984 M # SIP 5 K J 1952 M 81 SIP 5 K J 1955 M # SIP 5 K J 1980 M 84 SIP 5 K K 2951 M # SIP 5 K K 2955 M 87 SIP 5 K K 2960 M # SIP 5 K K 2962 M 90 DIP 10 K 5) K 6255 K 6) 93 DIP 10 K 5) K 6255 K 6) 93 DIP 10 K 5) K 6256 K 6) 98 DIP 10 K 5) K 6259 K 6) # DIP 10 K 5) K 6259 K 6) # DIP 10 K 5) K 6260 K 6) # DIP 10 K 5) K 6262 K 6) # SIP 5 K M 1956 M # continued on next page
1) N: Conforming with standard C: Customized F: Flat 2) Typ., referred to filter roof 3) For explanation of standards see individual data sheets or index on page 349 4) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request. 5) Pin configuration different from standard package 6) Internally switchable multistandard filter
47
Survey Picture carrier MHz 39,50 45,75 Picture-tosound carrier distance MHz 6,0 6,0 4,5 4,5 4,5 4,5 4,5 4,5 4,5 Group Sound delay 1 ) carrier rejection dB F 22 F 20 F 17 F 17 F 20 F 20 F 20 C 19 F 18 Standard 3)
2)
Package
Type
Page 4)
58,75
1) N: Conforming with standard C: Customized F: Flat 2) Typ., referred to filter roof 3) For explanation of standards see individual data sheets or index on page 349 4) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request.
48
Standard
q B-CCIR
Australia Features
q TV IF filter with Nyquist slope and sound shelf q Customized group delay predistortion
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type B 1952 M
25/+ 65 25/+ 85 12 10
C C V V
49
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,3 max. 18,8 dB
Relative attenuation Picture carrier 36,88 MHz Color carrier 32,45 MHz Sound carrier 31,38 MHz Adjacent picture carrier 29,88 MHz Adjacent sound carrier 38,38 MHz Lower sidelobe 25,00 29,88 MHz Upper sidelobe 38,38 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 35,38 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 35,38 MHz) Group delay predistortion (reference frequency 36,88 MHz) 34,38 MHz 32,45 MHz Impedance at 35,38 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,8 2,2 19,0 46,0 42,0 40,0 36,0 5,8 3,2 20,0 56,0 56,0 46,0 41,0 6,8 4,2 21,0 dB dB dB dB dB dB dB
42,0
52,0
dB
50,0
56,0
dB
35 80 ns ns ppm/K
TCf
50
Frequency response
51
Standard
q D/K-OIRT
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type D 1952 M
25/+ 65 25/+ 85 12 10
C C V V
52
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,7 max. 18,0 dB
Relative attenuation Picture carrier 38,00 MHz Color carrier 33,57 MHz Sound carrier 31,50 MHz Adjacent picture carrier 30,00 MHz Adjacent sound carrier 39,50 MHz Lower sidelobe 25,00 30,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 35,00 MHz) Feedthrough signal suppression 1,0 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 35,00 MHz) Group delay predistortion (reference frequency 38,00 MHz) 35,60 MHz 33,57 MHz Impedance at 35,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,3 0,3 19,7 46,0 44,0 41,0 35,0 5,3 1,3 20,7 51,0 52,0 45,0 39,0 6,3 2,3 21,7 dB dB dB dB dB dB dB
44,0
55,0
dB
50,0
56,0
dB
60 5 ns ns k || pF k || pF ppm/K
TCf
53
Frequency response
54
Standard
q D/K-OIRT
Eastern standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 2953 M
25/+ 65 25/+ 85 12 10
C C V V
55
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,3 max. 17,8 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier
rel 4,4 2,1 18,6 46,0 44,0 39,0 36,0 5,4 3,1 8,8 20,6 19,6 55,0 53,0 46,0 43,0 6,4 4,1 20,6 dB dB dB dB dB dB dB dB dB
38,00 MHz 33,57 MHz 33,20 MHz Sound carrier 31,50 MHz 32,50 MHz Adjacent picture carrier 30,00 MHz Adjacent sound carrier 39,50 MHz Lower sidelobe 25,00 30,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay predistortion (reference frequency 38,00 MHz) 34,20 MHz 33,57 MHz Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
55,0
dB
50,0
56,0
dB
85 30
ns ns k || pF k || pF ppm/K
TCf
56
Frequency response
57
Standard
q D/K-OIRT
Eastern standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 2958 M
25/+ 65 25/+ 85 12 10
C C V V
58
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,6 max. 19,1 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 5,0 0,4 18,7 18,3 46,0 42,0 41,0 37,0 6,0 1,4 20,2 19,8 60,0 55,0 47,0 43,0 7,0 2,4 21,7 21,3 dB dB dB dB dB dB dB dB
38,00 MHz 33,57 MHz 31,50 MHz 32,50 MHz Adjacent picture carrier 30,00 MHz Adjacent sound carrier 39,50 MHz Lower sidelobe 25,00 30,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay ripple (p-p) Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
59
Frequency response
60
Standard
q D/K-OIRT
Eastern standard
q B/G-CCIR
Europe partly
q M/N-FCC
USA Features
q TV IF filter switchable from M/N mode
to D/K mode
q M/N mode with Nyquist slope and sound
sound shelf for sound carriers at 31,50 MHz and 32,50 MHz q Customized group delay predistortion Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output Not connected Free Switching input
Type K 6265 K
25/+ 65 25/+ 85 12 10
C C V V
61
Characteristics in M/N mode (switching input pin 10 connected to input pin 1) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,9 max. 18,4 dB
Relative attenuation Picture carrier 38,00 MHz Color carrier 34,42 MHz Sound carrier 33,50 MHz Adjacent picture carrier 32,00 MHz Adjacent sound carrier 39,50 MHz Lower sidelobe 25,00 32,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay predistortion (reference frequency 38,00 MHz) 36,00 MHz 34,42 MHz Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 5,0 4,6 20,0 37,0 46,0 35,0 38,0 6,0 5,6 22,0 43,0 60,0 41,0 45,0 7,0 6,6 24,0 dB dB dB dB dB dB dB
42,0
49,0
dB
56,0
dB
0 0 ns ns k || pF k || pF ppm/K
TCf
62
63
Characteristics in D/K mode (switching input pin 10 connected to ground input pin 2) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,8 max. 18,3 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 5,3 0,8 18,7 15,9 46,0 40,0 44,0 39,0 37,0 6,3 1,8 20,7 17,9 54,0 50,0 55,0 45,0 43,0 7,3 2,8 22,7 19,9 dB dB dB dB dB dB dB dB dB
38,00 MHz 33,57 MHz 31,50 MHz 32,50 MHz Adjacent picture carrier 30,00 MHz 31,00 MHz Adjacent sound carrier 39,50 MHz Lower sidelobe 25,00 30,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay predistortion (reference frequency 38,00 MHz) 34,50 MHz 33,57 MHz Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
80 20
ns ns k || pF k || pF ppm/K
TCf
64
65
Standard
q B/G-CCIR
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 1875 M
25/+ 65 25/+ 85 12 10
C C V V
66
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,4 max. 18,9 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 4,5 1,6 18,7 44,0 44,0 36,0 40,0 40,0 40,0 36,0 5,5 2,6 19,7 55,0 57,0 44,0 50,0 50,0 47,0 43,0 6,5 3,6 20,7 dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,0 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,0 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,90 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
ns ns k || pF k || pF ppm/K
TCf
67
Frequency response
68
Standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 1962 M
25/+ 65 25/+ 85 12 10
C C V V
69
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,1 max. 16,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,9 1,3 18,5 46,0 48,0 46,0 48,0 42,0 46,0 42,0 42,0 38,0 5,9 2,3 19,5 52,0 54,0 52,0 56,0 49,0 58,0 52,0 47,0 43,0 6,9 3,3 20,5 dB dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 31,40 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,40 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,90 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
54,0
dB
50,0
56,0
dB
70 30
ns ns k || pF k || pF ppm/K
TCf
70
Frequency response
71
Standard
q B/G-CCIR
TV IF filter with Nyquist slope and sound shelf High color carrier level Constant group delay Suitable for CENELEC EN 55020
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 1965 M
25/+ 65 25/+ 85 12 10
C C V V
72
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,0 max. 16,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 5,0 0,0 18,9 45,0 48,0 46,0 48,0 38,0 44,0 42,0 40,0 38,0 6,0 1,0 20,4 57,0 55,0 61,0 55,0 48,0 55,0 53,0 47,0 48,0 7,0 2,0 21,9 dB dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 31,40 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,3 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
53,0
dB
50,0
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
73
Frequency response
74
Standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 1966 M
25/+ 65 25/+ 85 12 10
C C V V
75
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,3 max. 16,8 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,2 1,8 17,6 46,0 46,0 46,0 46,0 38,0 48,0 45,0 38,0 38,0 5,2 2,8 18,6 60,0 52,0 56,0 55,0 44,0 58,0 58,0 44,0 44,0 6,2 3,8 19,6 dB dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 31,40 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 32,40 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,80 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
52,0
dB
50,0
56,0
dB
50 60
ns ns k || pF k || pF ppm/K
TCf
76
Frequency response
77
Standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 1968 M
25/+ 65 25/+ 85 12 10
C C V V
78
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,1 max. 16,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,6 2,7 18,4 48,0 48,0 48,0 48,0 42,0 48,0 44,0 40,0 38,0 5,6 3,7 19,9 60,0 59,0 61,0 58,0 51,0 58,0 55,0 44,0 47,0 6,6 4,7 21,4 dB dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 31,40 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 32,40 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,3 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,90 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
50,0
dB
50,0
56,0
dB
90 165
ns ns k || pF k || pF ppm/K
TCf
79
Frequency response
80
Standard
q I
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type J 1952 M
25/+ 65 25/+ 85 12 10
C C V V
81
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,6 max. 17,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 38,90 MHz 34,47 MHz 32,90 MHz 30,90 MHz 30,40 MHz 31,40 MHz 40,90 MHz 25,00 30,90 MHz 40,90 45,00 MHz 5,5 1,2 19,4 46,0 45,0 42,0 44,0 42,0 38,0 6,5 2,2 20,4 56,0 56,0 52,0 53,0 50,0 44,0 7,5 3,2 21,4 dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,00 MHz) Feedthrough signal suppression 1,1 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 37,00 MHz) Group delay ripple (p-p) Impedance at 37,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
82
Frequency response
83
Standard
q I
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type J 1980 M
25/+ 65 25/+ 85 12 10
C C V V
84
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,5 max. 17,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 5,2 0,8 12,8 12,8 46,0 44,0 40,0 44,0 40,0 6,2 0,2 13,8 13,8 54,0 53,0 46,0 52,0 48,0 7,2 1,2 14,8 dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 32,90 MHz 32,35 MHz Adjacent picture carrier 30,90 MHz Adjacent sound carrier 40,90 MHz 40,35 MHz Lower sidelobe 25,00 30,90 MHz Upper sidelobe 40,90 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,00 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,00 MHz) Group delay ripple (p-p) Impedance at 37,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
56,0
dB
50,0
56,0
dB
30
ns k || pF k || pF ppm/K
TCf
85
Frequency response
86
Standard
q D/K-OIRT
Eastern standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 2955 M
25/+ 65 25/+ 85 12 10
C C V V
87
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,6 max. 19,1 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 4,7 2,8 18,8 19,4 48,0 43,0 42,0 40,0 36,0 5,7 3,8 20,3 20,9 66,0 56,0 52,0 51,0 42,0 6,7 4,8 21,8 dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 32,40 MHz 33,40 MHz Adjacent picture carrier 30,90 MHz Adjacent sound carrier 40,40 MHz 41,40 MHz Lower sidelobe 25,00 30,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,50 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
54,0
dB
50,0
56,0
dB
65 0
ns ns k || pF k || pF ppm/K
TCf
88
Frequency response
89
Standard
q B/G-CCIR
Eastern standard
q I
Great Britain
q L/L
France Features
q TV IF filter with two Nyquist slopes
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 2962 M
25/+ 65 25/+ 85 12 10
C C V V
90
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,9 max. 16,4 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier
rel 4,6 5,8 0,0 44,0 42,0 40,0 40,0 5,6 6,8 1,0 14,8 14,9 56,0 50,0 47,0 47,0 6,6 7,8 2,0 dB dB dB dB dB dB dB dB dB
38,90 MHz 33,90 MHz Color carrier 34,47 MHz Sound carrier 33,40 MHz 32,90 MHz Adjacent picture carrier 31,90 MHz Adjacent sound carrier 40,40 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
54,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
91
Frequency response
92
Standard
q B/G-CCIR
to D/K mode
q B/G mode with Nyquist slope and sound
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output Not connected Free Switching input
Type K 6255 K
25/+ 65 25/+ 85 12 10
C C V V
93
Characteristics in B/G mode (switching input pin 10 connected to input pin 1) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,9 max. 18,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,0 2,1 17,8 44,0 44,0 44,0 37,0 45,0 42,0 38,0 36,0 5,0 3,1 19,3 50,0 50,0 50,0 42,0 56,0 52,0 45,0 44,0 6,0 4,1 20,8 dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,60 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
43,0
50,0
dB
56,0
dB
60 20
ns ns k || pF k || pF ppm/K
TCf
94
95
Characteristics in D/K mode (switching input pin 10 connected to ground input pin 2) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,8 max. 18,5 dB
Relative attenuation Picture carrier 38,90 MHz Color carrier 34,47 MHz Sound carrier 32,40 MHz Adjacent picture carrier 30,90 MHz Adjacent sound carrier 40,40 MHz Lower sidelobe 25,00 30,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,60 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,1 0,2 18,7 44,0 44,0 38,0 36,0 5,1 0,8 20,2 53,0 56,0 47,0 43,0 6,1 1,8 21,7 dB dB dB dB dB dB dB
43,0
50,0
dB
56,0
dB
50 20 ns ns k || pF k || pF ppm/K
TCf
96
97
Standard
q B/G-CCIR
Eastern standard
q I
Great Britain
q L/L
France Features
q TV IF filter switchable from B/G mode
to L/L mode
q B/G mode with Nyquist slope and sound
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output Not connected Free Switching input
Type K 6256 K
25/+ 65 25/+ 85 12 10
C C V V
98
Characteristics in B/G mode (switching input pin 10 connected to ground input pin 2) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,0 max. 18,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,5 1,3 18,7 42,0 44,0 44,0 38,0 44,0 42,0 40,0 40,0 5,5 2,3 19,7 49,0 51,0 52,0 44,0 56,0 53,0 46,0 47,0 6,5 3,3 20,7 dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 32,40 MHz 40,15 MHz Adjacent sound carrier VHF 40,40 MHz Adjacent picture carrier UHF 41,40 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,80 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
65 30
ns ns k || pF k || pF ppm/K
TCf
99
100
Characteristics in L/L mode (switching input pin 10 connected to input pin 1) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,0 max. 18,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier
rel 38,90 MHz 33,90 MHz 34,47 MHz 30,90 MHz 32,40 MHz 32,90 MHz 40,40 MHz 40,90 MHz 41,90 MHz 25,00 32,90 MHz 40,40 45,00 MHz 4,3 5,5 0,2 42,0 46,0 42,0 43,0 40,0 40,0 5,3 6,5 0,8 47,0 53,0 56,0 53,0 49,0 54,0 46,0 46,0 6,3 7,5 1,8 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
101
102
Standard
q I
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type J 1951 M
25/+ 65 25/+ 85 12 10
C C V V
103
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,3 max. 17,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 39,50 MHz 35,07 MHz 33,50 MHz 31,50 MHz 31,00 MHz 32,00 MHz 40,95 MHz 41,50 MHz 25,00 31,50 MHz 41,50 45,00 MHz 4,8 2,8 21,1 48,0 45,0 45,0 36,0 44,0 44,0 36,0 5,8 3,8 22,1 60,0 52,0 52,0 42,0 54,0 50,0 40,0 6,8 4,8 23,1 dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,0 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Feedthrough signal suppression 0,9 s 0,8 s before main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Group delay ripple (p-p) Impedance at 38,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
52,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
104
Frequency response
105
Standard
q M/N-FCC
USA Features
q TV IF filter with Nyquist slope and sound shelf q Constant group delay
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type M 1859 M
25/+ 65 25/+ 85 12 10
C C V V
106
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,2 max. 14,7 dB
Relative attenuation Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Sound carrier 41,31 (41,25) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Feedthrough signal suppression 0,9 s 0,8 s before main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Group delay ripple (p-p) Impedance at 44,06 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,8 3,5 15,6 44,0 40,0 38,0 36,0 5,8 4,5 17,1 59,0 52,0 44,0 42,0 6,8 5,5 18,6 dB dB dB dB dB dB dB
40,0
46,0
dB
50,0
56,0
dB
ns k || pF k || pF ppm/K
TCf
107
Frequency response
108
Standard
q M/N-FCC
USA Features
q TV IF filter with Nyquist slope and sound shelf q Constant group delay q Suitable for FCC EIA/IS-31 regulations
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type M 1962 M
25/+ 65 25/+ 85 12 10
C C V V
109
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 11,4 max. 13,0 dB
Relative attenuation Picture carrier 45,75 MHz Color carrier 42,17 MHz Sound carrier 41,25 MHz Adjacent picture carrier 39,75 MHz Adjacent sound carrier 47,25 MHz Lower sidelobe 35,00 39,75 MHz Upper sidelobe 47,25 55,00 MHz Reflected wave signal suppression 1,0 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,00 MHz) Feedthrough signal suppression 1,1 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 44,00 MHz) Group delay ripple (p-p) Impedance at 44,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,1 4,2 18,7 50,0 50,0 44,0 42,0 5,1 5,2 19,7 62,0 61,0 49,0 47,0 6,1 6,2 20,7 dB dB dB dB dB dB dB
44,0
50,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
110
Frequency response
111
Standard
q M
Japan Features
q TV IF filter with Nyquist slope and sound shelf q Constant group delay
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type N 1951 M
25/+ 65 25/+ 85 12 10
C C V V
112
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 12,3 max. 13,8 dB
Relative attenuation Picture carrier 58,83 (58,75) MHz Color carrier 55,25 (55,17) MHz Sound carrier 54,33 (54,25) MHz Adjacent picture carrier 52,83 (52,75) MHz Adjacent sound carrier 60,33 (60,25) MHz Lower sidelobe 45,08 52,83 (45,00 52,75) MHz Upper sidelobe 60,33 65,08 (60,25 65,00) MHz Reflected wave signal suppression 1,0 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 57,08 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 57,08 MHz) Group delay ripple (p-p) Impedance at 57,08 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,0 3,0 17,0 42,0 38,0 36,0 35,0 5,0 4,0 18,0 50,0 43,0 42,0 41,0 6,0 5,0 19,0 dB dB dB dB dB dB dB
40,0
48,0
dB
50,0
56,0
dB
ns k || pF k || pF ppm/K
TCf
113
Frequency response
114
Survey Picture Picture-toGroup Sound Standard 3) carrier sound carrier delay 1) carrier distance rejection 2) MHz 33,90 36,88 38,00 38,90 MHz 6,5 5,5 6,5 5 ) 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 6,0 6,0 6,0 6,5 5 ) 4,5 5,5 5,5 6,0 6,0 4,5 4,5 4,5 5 ) 4,5 5 ) 4,5 5 ) 4,5 5 ) 4,5 5 ) 4,5 5 ) 4,5 5 ) ns F N F C C C C C F C C F C F F F F F C F C F F F F F F F F F C F dB 51 50 52 35, 39 33, 23 44, 46 37, 25 36, 23 43, 26 41, 23 48, 25 56, 45 50, 46 35, 23 44, 48 43, 47 56, 52 42 44, 56, 28 25 43, 55 59, 46 55, 51 43 29 40 28 32 40 34 39 29 L B D/K D/K B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM B/G NICAM I NICAM I NICAM I NICAM L B/G, D/K, I B/G B/G, D/K I NICAM I NICAM M/N M/N M/N M/N M/N M/N M/N M/N M DIP 10 K DIP 10 K DIP 10 K 6) DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K 6) DIP 10 K DIP 10 K DIP 10 K 6) DIP 10 K 6) DIP 10 K DIP 10 K 6) DIP 10 K 6) DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K DIP 10 K 6) SIP 5 K 6 ) DIP 10 K 6) SIP 5 K 6 ) K 3261 K B 3250 K D 3650 K K 3264 K G 3254 K G 3255 K G 3258 K G 3264 K G 3270 K 7) G 3354 K G 3355 K G 3356 K G 3357 K G 3652 K J 3251 K J 3351 K J 3652 K K 3252 K K 3258 K K 3261 K K 3350 K J 3252 K J 3352 K M 3251 K M 3271 K 7) M 3352 K M 3353 K M 3354 K M 3355 K M 3561 M M 3654 K N 3561 M 116 # # 120 # # 124 128 # # 132 # # # 136 140 # # 144 116 148 152 156 # 160 # # 164 # 168 172 177 Package Type Page
4)
6,5 5,85 5,85 5,85 5,85 5,85 5,85 5) 5,85 5) 5,85 5) 5,85 5) 5,85 5) 6,55 6,55 5) 6,55 5) 6,5 6,5 5) 6,55 6,55 5)
39,50 45,75
58,75
1) N: Conforming with standard C: Customized F: Flat 2) Typ., referred to filter roof 3) For explanation of standards see individual data sheets or index on page 349 4) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request. 5) Sound channel with sound passband only 6) Pin configuration different from standard package 7) Optimized for twin PLL ICs
115
Standard
q B/G-CCIR
Great Britain
q L, L'
France Features
q TV IF filter for quasi/split sound applications
carrier and sound carrier at 33,40 MHz and 33,05 MHz (NICAM) Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type K 3261 K
25/+ 65 25/+ 85 12 10
C C V V
116
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,5 max. 17,0 dB
Insertion attenuation Reference level for the following data Relative attenuation
rel 38,90 MHz 33,90 MHz 33,40 MHz UHF 30,90 MHz VHF 31,90 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 32,40 MHz 40,40 45,00 MHz 5,4 5,4 20,0 44,0 46,0 40,0 36,0 42,0 42,0 38,0 36,0 6,4 6,4 25,0 50,0 54,0 45,0 42,0 51,0 55,0 46,0 42,0 7,4 7,4 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
53,0
dB
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
117
Frequency response
118
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 20,5 max. 22,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
rel 33,05 MHz 33,40 MHz 34,47 MHz 31,90 MHz 40,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 1,8 0,5 24,0 36,0 32,0 28,0 28,0 0,8 0,5 38,0 41,0 39,0 34,0 35,0 50 5,3 || 3,5 72 0,2 1,5 dB dB dB dB dB dB dB ns k || pF ppm/K
Impedance at 38,90 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
119
Standard
q D/K-OIRT
carrier and sound carrier at 31,50 MHz and 32,50 MHz Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type K 3264 K
25/+ 65 25/+ 85 12 10
C C V V
120
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 1 9,5 max. 21,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 38,00 MHz 33,57 MHz 33,20 MHz 32,50 MHz 31,50 MHz 30,00 MHz 39,50 MHz 25,00 30,00 MHz 39,50 45,00 MHz 5,2 0,4 2,2 20,0 20,0 42,0 38,0 36,0 32,0 6,2 0,6 3,2 35,0 39,0 47,0 50,0 40,0 35,0 7,2 1,6 4,2 dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,2 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay predistortion (reference frequency 38,00 MHz) 35,20 MHz 33,57 MHz Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
56,0
dB
75 15
ns ns k || pF k || pF ppm/K
TCf
121
Frequency response
122
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 21,5 max. 23,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 31,50 MHz 32,50 MHz 33,57 MHz 30,00 MHz 39,50 MHz 25,00 30,00 MHz 39,50 45,00 MHz 1,6 0,8 18,0 36,0 30,0 30,0 24,0 0,6 0,2 24,0 41,0 38,0 36,0 31,0 4,6 || 3,2 72 0,4 1,2 dB dB dB dB dB dB dB k || pF ppm/K
Impedance at 38,00 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
123
Standard
q B/G-CCIR
carrier and sound carriers at 33,40 MHz and 33,05 MHz (NICAM) q Suitable for CENELEC EN 55020 Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type G 3258 K
25/+ 65 25/+ 85 12 10
C C V V
124
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,8 max. 17,3 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 38,90 MHz 34,47 MHz 33,40 MHz UHF 30,90 MHz VHF 31,90 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 5,2 0,8 28,0 45,0 46,0 42,0 37,0 45,0 42,0 42,0 38,0 6,2 0,2 37,0 56,0 58,0 49,0 42,0 58,0 55,0 49,0 44,0 7,2 1,2 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,40 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
54,0
dB
56,0
dB
35 40
ns ns k || pF k || pF ppm/K
TCf
125
Frequency response
126
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 19,8 max. 21,3 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 33,40 MHz 38,90 MHz 34,47 MHz UHF 30,90 MHz VHF 31,90 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 0,5 0,1 24,0 38,0 39,0 34,0 36,0 30,0 30,0 1,5 1,1 30,0 46,0 48,0 42,0 44,0 37,0 37,0 2,5 2,1 dB dB dB dB dB dB dB dB dB k || pF ppm/K
Impedance at 33,05 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
11,7 || 4,5 72
TCf
127
Standard
q B/G-CCIR
carrier and sound carriers at 33,40 MHz and 33,05 MHz (NICAM) q Suitable for CENELEC EN 55020 Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type G 3264 K
25/+ 65 25/+ 85 12 10
C C V V
128
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,0 max. 17,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 38,90 MHz 34,47 MHz 33,40 MHz UHF 30,90 MHz VHF 31,90 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 5,1 0,9 26,0 44,0 46,0 42,0 40,0 46,0 44,0 39,0 39,0 6,1 0,1 36,0 53,0 60,0 53,0 47,0 57,0 54,0 44,0 45,0 7,1 1,1 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,10 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
55,0
dB
56,0
dB
70 120
ns ns k || pF k || pF ppm/K
TCf
129
Frequency response
130
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 20,1 max. 21,6 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier NICAM sound carrier Color carrier In-band trap Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
rel 33,40 MHz 33,05 MHz 34,47 MHz 36,15 MHz 31,90 MHz 40,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 0,9 2,0 20,0 25,0 36,0 30,0 28,0 26,0 0,3 1,0 29,0 37,0 45,0 39,0 38,0 35,0 40 5,4 || 3,1 72 1,5 0,0 dB dB dB dB dB dB dB dB ns k || pF ppm/K
Impedance at 38,90 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
131
Standard
q B/G-CCIR
sound carriers at 33,40 MHz and 33,05 MHz (NICAM) q Suitable for CENELEC EN 55020 Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type G 3355 K
25/+ 65 25/+ 85 12 10
C C V V
132
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,0 max. 16,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 38,90 MHz 34,47 MHz 33,40 MHz UHF 30,90 MHz VHF 31,90 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 5,5 0,6 30,0 46,0 48,0 46,0 40,0 46,0 45,0 40,0 40,0 6,5 0,4 48,0 60,0 56,0 55,0 48,0 60,0 59,0 46,0 46,0 7,5 1,4 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,40 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
55 40
ns ns k || pF k || pF ppm/K
TCf
133
Frequency response
134
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,3 max. 17,8 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 33,40 MHz 38,90 MHz 34,47 MHz UHF 30,90 MHz VHF 31,90 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 38,90 45,00 MHz 1,0 42,0 28,0 30,0 32,0 42,0 42,0 28,0 38,0 2,0 56,0 35,0 37,0 41,0 53,0 54,0 34,0 46,0 4,1 || 2,6 72 3,0 dB dB dB dB dB dB dB dB dB k || pF ppm/K
Impedance at 33,05 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
135
Standard
q I
carrier and sound carriers at 32,90 MHz and 32,35 MHz (NICAM) Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type J 3251 K
25/+ 65 25/+ 85 12 10
C C V V
136
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,5 max. 18,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier NICAM sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 38,90 MHz 34,47 MHz 32,90 MHz 32,35 MHz 30,90 MHz 40,90 MHz 40,35 MHz 25,00 32,35 MHz 40,90 45,00 MHz 4,4 2,1 36,0 40,0 44,0 40,0 36,0 38,0 35,0 5,4 3,1 44,0 48,0 53,0 46,0 43,0 45,0 41,0 6,4 4,1 dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 0,8 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,00 MHz) Feedthrough signal suppression 1,0 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 37,00 MHz) Group delay ripple (p-p) Impedance at 37,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
137
Frequency response
138
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 24,2 max. 25,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier NICAM sound carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
rel 32,90 MHz 32,35 MHz 34,47 MHz 30,90 MHz 40,90 MHz 25,00 30,90 MHz 40,90 45,00 MHz 0,8 0,8 18,0 33,0 30,0 30,0 29,0 1,8 0,2 28,0 44,0 38,0 37,0 36,0 70 8,9 || 2,7 72 2,8 1,2 dB dB dB dB dB dB dB ns k || pF ppm/K
Impedance at 38,90 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
139
Standard
q I
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output picture Output sound Free Not connected
Type J 3351 K
25/+ 65 25/+ 85 12 10
C C V V
140
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 18,6 max. 20,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier NICAM sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 38,90 MHz 34,47 MHz 32,90 MHz 32,35 MHz 30,90 MHz 40,90 MHz 40,35 MHz 25,00 30,90 MHz 40,90 45,00 MHz 4,4 1,6 36,0 40,0 46,0 41,0 37,0 42,0 38,0 5,4 2,6 43,0 47,0 57,0 50,0 43,0 47,0 44,0 6,4 3,6 dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 0,8 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,0 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
141
Frequency response
142
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 23,2 max. 24,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
rel 32,90 MHz 31,95 MHz 38,90 MHz 34,47 MHz 30,90 MHz 40,90 MHz 25,00 30,90 MHz 40,90 45,00 MHz 0,8 0,1 40,0 25,0 28,0 38,0 28,0 35,0 0,2 1,1 53,0 30,0 40,0 50,0 33,0 42,0 70 4,4 || 3,2 72 1,2 2,1 dB dB dB dB dB dB dB dB ns k || pF ppm/K
Impedance at 32,35 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
143
Standard
q B/G-CCIR
Eastern standard
q I
carrier and sound carriers between 32,40 MHz and 34,40 MHz Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type K 3258 K
25/+ 65 25/+ 85 12 10
C C V V
144
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,8 max. 17,3 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 38,90 MHz 34,47 MHz 33,40 MHz UHF 30,90 MHz VHF 31,90 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 4,8 0,7 30,0 42,0 40,0 44,0 36,0 42,0 40,0 38,0 38,0 5,8 0,3 44,0 49,0 50,0 56,0 42,0 52,0 48,0 44,0 46,0 6,8 1,3 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,3 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,10 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
56,0
dB
30 40
ns ns k || pF k || pF ppm/K
TCf
145
Frequency response
146
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 25,9 max. 27,4 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier
rel 32,40 MHz 33,40 MHz 34,40 MHz 33,05 MHz 30,90 MHz 40,40 MHz 25,00 30,90 MHz 40,40 45,00 MHz 2,0 0,0 0,0 2,0 30,0 30,0 28,0 28,0 1,0 1,0 1,0 1,0 37,0 36,0 34,0 34,0 9,8 || 2,0 72 0,0 2,0 2,0 0,0 dB dB dB dB dB dB dB dB k || pF ppm/K
NICAM sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
Impedance at 38,90 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
147
Standard
q B/G-CCIR
sound carriers between 32,40 MHz and 33,40 MHz q Suitable for CENELEC EN 55020 Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type K 3350 K
25/+ 65 25/+ 85 12 10
C C V V
148
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,1 max. 16,6 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 38,90 MHz 34,47 MHz 33,40 MHz UHF 30,90 MHz VHF 31,90 MHz 31,40 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 5,6 0,0 34,0 45,0 47,0 47,0 43,0 45,0 43,0 39,0 34,0 6,6 1,0 43,0 53,0 57,0 60,0 55,0 59,0 56,0 55,0 44,0 40,0 7,6 2,0 dB dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,90 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
90 30
ns ns k || pF k || pF ppm/K
TCf
149
Frequency response
150
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,5 max. 17,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier B/G NICAM Sound carrier D/K Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 33,05 MHz 32,40 MHz 38,90 MHz 34,47 MHz 30,90 MHz 40,40 MHz 41,40 MHz 25,00 30,90 MHz 38,90 45,00 MHz 1,5 1,9 41,0 28,0 36,0 44,0 46,0 36,0 41,0 0,5 0,9 49,0 34,0 43,0 52,0 56,0 41,0 48,0 3,6 || 2,3 72 0,5 0,1 dB dB dB dB dB dB dB dB dB k || pF ppm/K
Impedance at 33,40 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
151
Standard
q I
picture carrier and sound carriers at 33,50 MHz and 32,95 MHz (NICAM) Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type J 3252 K
25/+ 65 25/+ 85 12 10
C C V V
152
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 19,0 max. 20,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 39,50 MHz 35,07 MHz 33,50 MHz 32,95 MHz 31,50 MHz 41,50 MHz 40,95 MHz 25,00 33,50 MHz 41,50 45,00 MHz 4,4 2,2 46,0 38,0 45,0 40,0 36,0 38,0 35,0 5,4 3,2 59,0 46,0 54,0 49,0 43,0 45,0 40,0 6,4 4,2 dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Feedthrough signal suppression 1,0 s 0,9 s before main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Group delay ripple (p-p) Impedance at 38,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
55,0
dB
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
153
Frequency response
154
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 21,3 max. 23,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier
rel 33,50 MHz 32,55 MHz 33,35 MHz 39,50 MHz 35,07 MHz 31,50 MHz 41,50 MHz 25,00 31,50 MHz 41,50 45,00 MHz 0,1 0,6 26,0 30,0 26,0 30,0 25,0 0,9 0,8 0,8 0,4 38,0 38,0 33,0 36,0 33,0 4,4 || 3,8 72 1,9 1,4 dB dB dB dB dB dB dB dB dB k || pF ppm/K
Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
Impedance at 32,95 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
155
Standard
q I
sound carriers at 33,50 MHz and 32,95 MHz (NICAM) q Suitable for CENELEC EN 55020 Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type J 3352 K
25/+ 65 25/+ 85 12 10
C C V V
156
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,8 max. 17,3 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier
rel 39,50 MHz 35,07 MHz 33,50 MHz 32,95 MHz 31,50 MHz 31,00 MHz 32,00 MHz 41,50 MHz 40,95 MHz 25,00 31,50 MHz 41,50 45,00 MHz 5,3 0,7 40,0 40,0 48,0 48,0 50,0 46,0 42,0 44,0 40,0 6,3 0,3 55,0 51,0 60,0 62,0 60,0 59,0 52,0 52,0 46,0 7,3 1,3 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Group delay ripple (p-p) Impedance at 38,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
54,0
dB
56,0
dB
30
ns k || pF k || pF ppm/K
TCf
157
Frequency response
158
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 11,6 max. 13,1 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 33,50 MHz 39,50 MHz 35,07 MHz 31,50 MHz 41,50 MHz 40,95 MHz 25,00 31,50 MHz 39,50 45,00 MHz 0,7 46,0 30,0 40,0 50,0 45,0 36,0 44,0 0,3 60,0 45,0 52,0 62,0 56,0 42,0 52,0 2,6 || 3,3 72 1,3 dB dB dB dB dB dB dB dB k || pF ppm/K
Impedance at 32,95 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
159
Standard
q M/N-FCC
USA Features
q TV IF filter for quasi/split sound applications
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type M 3271 K
25/+ 65 25/+ 85 12 10
C C V V
160
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,9 max. 15,4 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier
rel 45,81 42,23 41,73 41,31 39,81 47,31 (45,75) MHz (42,17) MHz (41,67) MHz (41,25) MHz (39,75) MHz (47,25) MHz 5,6 0,9 3,9 20,0 46,0 44,0 40,0 37,0 6,6 0,1 5,4 29,0 54,0 58,0 46,0 43,0 7,6 1,1 6,9 dB dB dB dB dB dB dB dB
Sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Phase difference referred to sound channel at 45,81 (45,75) MHz Group delay ripple (p-p) Impedance at 44,06 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
TCf
161
Frequency response
162
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 19,1 max. 20,6 dB
rel Relative attenuation Sound carrier 41,31 (41,25) MHz Color carrier 42,23 (42,17) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Impedance at 45,81 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
0,4
dB dB dB dB dB dB k || pF ppm/K
TCf
163
Standard
q M/N-FCC
USA Features
q TV IF filter for quasi/split sound applications
sound carrier
q Suitable for FCC EIA/IS-31 regulations
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Not connected
Type M 3354 K
25/+ 65 25/+ 85 12 10
C C V V
164
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,0 max. 16,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier
rel 45,81 42,23 41,73 41,31 39,81 47,31 (45,75) MHz (42,17) MHz (41,67) MHz (41,25) MHz (39,75) MHz (47,25) MHz 4,6 1,4 4,5 25,0 46,0 44,0 35,0 38,0 5,6 0,4 5,5 32,0 56,0 51,0 40,0 44,0 6,6 0,6 6,5 dB dB dB dB dB dB dB dB
Sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Group delay ripple (p-p) Impedance at 44,06 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
165
Frequency response
166
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,8 max. 15,3 dB
rel Relative attenuation Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Impedance at 41,31 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
dB dB dB dB dB dB k || pF ppm/K
TCf
167
Standard
q M/N-FCC
USA Features
q TV IF filter for quasi/split sound applications
Pin configuration 1 2 3 4 5 Input Chip carrier ground Output sound Output picture Output picture
Type M 3561 M
25/+ 65 25/+ 85 12 10
C C V V
168
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,7 max. 15,2 dB
rel Relative attenuation Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Sound carrier 41,31 (41,25) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Group delay ripple (p-p) Impedance at 44,06 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
6,9 3,2
dB dB dB dB dB dB dB
42,0
54,0
dB
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
169
Frequency response
170
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,1 max. 17,6 dB
rel Relative attenuation Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Impedance at 41,31 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
dB dB dB dB dB dB k || pF ppm/K
TCf
171
Standard
q M/N-FCC
USA Features
q TV IF filter for quasi/split sound applications
sound carrier
q Suitable for FCC EIA/IS-31 regulations
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output sound Output picture Free Input picture
Type M 3654 K
25/+ 65 25/+ 85 12 10
C C V V
172
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,8 max. 15,3 dB
rel Relative attenuation Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Sound carrier 41,31 (41,25) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Group delay predistortion (reference frequency 45,81 MHz) 42,23 (42,17) MHz Impedance at 44,06 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
6,7 1,5
dB dB dB dB dB dB dB
42,0
42,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
173
Frequency response
174
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 12,0 max. 13,5 dB
Insertion attenuation Reference level for the following data Pass bandwidth rel 3 dB rel 20 dB
B3dB B20dB
0,6 1,35
MHz MHz
Relative attenuation rel Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,06 (35,00 39,00) MHz 39,06 39,41 (39,00 39,35) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Group delay ripple (p-p) 41,01 41,61 (40,95 41,55) MHz Impedance at 41,31 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
dB dB dB dB dB dB dB
80
ns k || pF k || pF ppm/K
TCf
175
Frequency response
176
Standard
q M
Japan Features
q TV IF filter for quasi/split sound applications
Dimensions in mm, approx. weight 1,0 g Pin configuration 1 2 3 4 5 Input Chip carrier ground Output sound Output picture Output picture
Type N 3561 M
25/+ 65 25/+ 85 12 10
C C V V
177
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,5 max. 16,0 dB
rel Relative attenuation Picture carrier 58,83 (58,75) MHz Color carrier 55,25 (55,17) MHz Sound carrier 54,33 (54,25) MHz Adjacent picture carrier 52,83 (52,75) MHz Adjacent sound carrier 60,33 (60,25) MHz Lower sidelobe 45,08 52,83 (45,00 52,75) MHz Upper sidelobe 60,33 65,08 (60,25 65,00) MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 57,08 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 57,08 MHz) Group delay ripple (p-p) Impedance at 57,08 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
7,1 1,3
dB dB dB dB dB dB dB
42,0
51,0
dB
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
178
Frequency response
179
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 17,3 max. 18,8 dB
rel Relative attenuation Picture carrier 58,83 (58,75) MHz Color carrier 55,25 (55,17) MHz Adjacent picture carrier 52,83 (52,83) MHz Adjacent sound carrier 60,33 (60,25) MHz Lower sidelobe 45,08 52,83 (45,00 52,75) MHz Upper sidelobe 60,33 65,08 (60,25 65,00) MHz Impedance at 54,33 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
dB dB dB dB dB dB k || pF ppm/K
TCf
180
Survey Picture carrier MHz 33,40 33,90 Picture-toGroup sound carrier delay 1) distance MHz 6,5 6,5 6,5 6,5 6,5 6,5 5,5 6,5 5,5 6,5 4,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 6,0 5,5 6,0 6,5 5,5 5,5 4,5 4,5 6,0 4,5 4,5 4,5 6,5 F F F F F C F C C C F C F C F C F F C F F F C F F F C F F Sound carrier rejection dB 30 41 59 54 54 58 40, 56 48, 60 29 39 6, 45 54 56 51 51 61 24, 54, 62 53, 50 44 52, 58 51 44 42, 61 29 45 50 32 40 40 Standard 3)
2)
Package
Type
Page
4)
L L L L L L B/G, D/K B/G, D/K M/N B/G B/G, L B/G B/G B/G B/G B/G B/G, I, D/K, L D/K, I, L B/G D/K, I, L L B/G B/G, L M/N M/N I M/N M M
185 # 188 # 193 196 196 201 182 # # # 204 # 185 # 188 188 # # # # # 207 210 213 #
38,00
SIP 5 K K 3955 M DIP 10 K 5) K 6266 K DIP 10 K 5) K 6266 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K 5) DIP 10 K 5) DIP 10 K 5) DIP 10 K 5) DIP 10 K 5) DIP 10 K 5) DIP 10 K 5) SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K
6) 6)
38,90
6,5
G 3956 M G 3957 M G 3962 M G 3963 M G 3964 M G 3965 M G 3967 M K 3953 M K 6256 K 6 ) K 6257 K 6 ) K 6257 K 6 ) K 6260 K 6 ) K 6262 K 6 ) K 6263 K 6 ) K 6263 K 6 ) M 3960 M J 3950 M M 3951 M N 3954 M N 3958 M
1) C: Customized F: Flat 2) Typ., referred to filter roof 3) For explanation of standards see individual data sheets or index on page 349 4) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request. 5) Pin configuration different from standard package 6) Internally switchable multistandard filter
181
Standard
q B/G-CCIR
France Features
q TV IF filter with Nyquist slopes
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 3957 M
25/+ 65 25/+ 85 12 10
C C V V
182
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,9 max. 17,4 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier B/G, L Picture carrier L Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 38,90 MHz 33,40 MHz 30,90 MHz 31,90 MHz 40,40 MHz 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 4,8 5,0 48,0 48,0 46,0 41,0 40,0 38,0 5,8 6,0 60,0 62,0 56,0 46,0 46,0 43,0 6,8 7,0 dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
56,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
183
Frequency response
184
Standard
q B/G-CCIR
Eastern standard
q I
Great Britain
q L/L
France Features
q TV IF filter with Nyquist slopes
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 3953 M
25/+ 65 25/+ 85 12 10
C C V V
185
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,5 max. 15,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier
rel 4,7 6,3 20,0 48,0 48,0 36,0 47,0 46,0 46,0 45,0 38,0 5,7 7,5 24,0 62,0 59,0 40,0 59,0 60,0 59,0 52,0 44,0 6,7 8,7 dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 33,90 MHz Sound carrier 33,40 MHz Adjacent picture carrier UHF 30,90 MHz VHF 31,90 MHz 40,15 MHz Adjacent sound carrier VHF 40,40 MHz UHF 41,40 MHz 40,90 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
50,0
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
186
Frequency response
187
Standard
q B/G-CCIR
Eastern standard
q I
Great Britain
q L/L
France Features
q TV IF filter switchable from B/G mode
to L/L mode
q B/G mode with Nyquist slope
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output Not connected Free Switching input
Type K 6257 K
25/+ 65 25/+ 85 12 10
C C V V
188
Characteristics in B/G mode (switching input pin 10 connected to ground input pin 2) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,0 max. 17,5 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,7 0,3 35,0 44,0 46,0 46,0 38,0 43,0 40,0 42,0 38,0 5,7 1,3 44,0 60,0 60,0 60,0 45,0 54,0 48,0 48,0 45,0 6,7 2,3 dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 32,40 MHz 40,15 MHz Adjacent sound carrier VHF 40,40 MHz Adjacent picture carrier UHF 41,40 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,10 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
55 70
ns ns k || pF k || pF ppm/K
TCf
189
190
Characteristics in L/L mode (switching input pin 10 connected to input pin 1) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,1 max. 17,6 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier
rel 38,90 MHz 33,90 MHz 34,47 MHz 30,90 MHz 32,40 MHz 32,90 MHz 40,40 MHz 40,90 MHz 41,90 MHz 25,00 32,90 MHz 40,40 45,00 MHz 4,4 5,6 0,2 46,0 46,0 42,0 43,0 42,0 41,0 41,0 39,0 5,4 6,6 0,8 58,0 58,0 52,0 54,0 52,0 48,0 46,0 45,0 6,4 7,6 1,8 dB dB dB dB dB dB dB dB dB dB dB
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
191
192
Standard
q D/K-OIRT
Eastern standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 3955 M
25/+ 65 25/+ 85 12 10
C C V V
193
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,8 max. 16,3 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 4,7 0,2 46,0 30,0 48,0 50,0 46,0 44,0 41,0 38,0 5,7 0,8 56,0 40,0 60,0 62,0 56,0 58,0 48,0 43,0 6,7 1,8 dB dB dB dB dB dB dB dB dB dB
38,00 MHz 33,57 MHz 31,50 MHz 32,50 MHz Adjacent picture carrier 30,00 MHz 31,00 MHz Adjacent sound carrier 39,50 MHz 40,50 MHz Lower sidelobe 25,00 30,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay ripple (p-p) Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
55,0
dB
50,0
56,0
dB
40
ns k || pF k || pF ppm/K
TCf
194
Frequency response
195
Standard
q B/G-CCIR
Eastern standard
q M/N-FCC
USA Features
q TV IF filter switchable from M/N mode
to B/G mode
q M/N mode with Nyquist slope
Pin configuration 1 2 3, 8 4, 5 6, 7 9 10 Input Input ground Chip carrier ground Output Not connected Free Switching input
Type K 6266 K
25/+ 65 25/+ 85 12 10
C C V V
196
Characteristics in M/N mode (switching input pin 10 connected to input pin 1) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,9 max. 17,4 dB
Relative attenuation Picture carrier 38,00 MHz Color carrier 34,42 MHz Sound carrier 33,50 MHz Adjacent picture carrier 32,00 MHz Adjacent sound carrier 39,50 MHz Lower sidelobe 25,00 32,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay predistortion (reference frequency 38,00 MHz) 35,00 MHz 34,42 MHz Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,5 1,3 24,0 46,0 46,0 36,0 38,0 5,5 2,3 29,0 58,0 58,0 42,0 43,0 6,5 3,3 dB dB dB dB dB dB dB
42,0
51,0
dB
56,0
dB
20 70 ns ns k || pF k || pF ppm/K
TCf
197
198
Characteristics in B/G mode (switching input pin 10 connected to ground input pin 2) Ambient temperature Source impedance Load impedance
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,9 max. 17,4 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 4,6 1,2 38,0 27,0 48,0 46,0 46,0 44,0 42,0 42,0 36,0 5,6 2,2 48,0 32,0 60,0 56,0 56,0 54,0 51,0 46,0 49,0 41,0 6,6 3,2 dB dB dB dB dB dB dB dB dB dB dB dB
38,00 MHz 33,57 MHz 32,50 MHz 32,00 MHz 31,50 MHz Adjacent picture carrier 30,00 MHz 31,00 MHz Adjacent sound carrier 39,50 MHz 40,00 MHz 40,50 MHz Lower sidelobe 25,00 30,00 MHz Upper sidelobe 39,50 45,00 MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 36,50 MHz) Group delay predistortion (reference frequency 38,00 MHz) 36,00 MHz 33,57 MHz Impedance at 36,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
50,0
dB
56,0
dB
50 70
ns ns k || pF k || pF ppm/K
TCf
199
200
Standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 3956 M
25/+ 65 25/+ 85 12 10
C C V V
201
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,9 max. 15,4 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 5,1 0,0 26,0 48,0 48,0 44,0 48,0 42,0 44,0 41,0 42,0 40,0 6,1 1,0 39,0 25,0 7,0 58,0 56,0 52,0 60,0 51,0 51,0 46,0 49,0 46,0 7,1 2,0 dB dB dB dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 33,15 MHz 33,90 MHz Adjacent picture carrier UHF 30,90 MHz VHF 31,90 MHz 31,40 MHz 32,40 MHz Adjacent stereo sound carrier 40,15 MHz Adjacent sound carrier VHF 40,40 MHz UHF 41,40 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,90 MHz 34,47 MHz Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
85 70
ns ns k || pF k || pF ppm/K
TCf
202
Frequency response
203
Standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 3965 M
25/+ 65 25/+ 85 12 10
C C V V
204
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,6 max. 16,1 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier Adjacent picture carrier UHF VHF
rel 4,6 1,9 40,0 46,0 48,0 42,0 46,0 36,0 45,0 44,0 41,0 36,0 5,3 2,9 51,0 54,0 58,0 48,0 56,0 54,0 52,0 56,0 47,0 42,0 6,0 3,9 dB dB dB dB dB dB dB dB dB dB dB dB
38,90 MHz 34,47 MHz 33,40 MHz 30,90 MHz 31,90 MHz 31,40 MHz 32,40 MHz 40,15 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 32,40 MHz 40,40 45,00 MHz
Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 37,40 MHz) Group delay ripple (p-p) Impedance at 37,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
50
ns k || pF k || pF ppm/K
TCf
205
Frequency response
206
Standard
q I
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type J 3950 M
25/+ 65 25/+ 85 12 10
C C V V
207
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,7 max. 17,2 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Sound carrier
rel 4,5 1,2 43,0 44,0 48,0 46,0 46,0 44,0 42,0 42,0 37,0 5,5 2,2 50,0 58,0 62,0 60,0 60,0 57,0 54,0 52,0 44,0 6,5 3,2 dB dB dB dB dB dB dB dB dB dB dB
39,50 MHz 35,07 MHz 33,50 MHz 32,95 MHz Adjacent picture carrier 31,50 MHz 31,00 MHz 32,00 MHz Adjacent sound carrier 41,50 MHz 40,95 MHz Lower sidelobe 25,00 31,50 MHz Upper sidelobe 41,50 45,00 MHz Reflected wave signal suppression 1,0 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 38,00 MHz) Group delay ripple (p-p) Impedance at 38,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
57,0
dB
50,0
56,0
dB
30
ns k || pF k || pF ppm/K
TCf
208
Frequency response
209
Standard
q M/N-FCC
USA Features
q TV IF filter with Nyquist slope
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type M 3951 M
25/+ 65 25/+ 85 12 10
C C V V
210
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 12,5 max. 14,0 dB
Relative attenuation Picture carrier 45,81 (45,75) MHz Color carrier 42,23 (42,17) MHz Sound carrier 41,31 (41,25) MHz Adjacent picture carrier 39,81 (39,75) MHz Adjacent sound carrier 47,31 (47,25) MHz Lower sidelobe 35,06 39,81 (35,00 39,75) MHz Upper sidelobe 47,31 55,06 (47,25 55,00) MHz Reflected wave signal suppression 1,1 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Feedthrough signal suppression 1,2 s 1,1 s before main pulse (test pulse: 250 ns, carrier frequency: 44,06 MHz) Group delay predistortion (reference frequency: 45,81 MHz) 42,81 (42,75) MHz 42,23 (42,17) MHz Group delay ripple (p-p) Impedance at 44,06 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,6 1,2 25,0 48,0 46,0 38,0 36,0 5,6 2,2 32,0 61,0 56,0 42,0 41,0 6,6 3,2 dB dB dB dB dB dB dB
42,0
52,0
dB
50,0
56,0
dB
10 40 40 ns ns ns k || pF k || pF ppm/K
TCf
211
Frequency response
212
Standard
q M
Japan Features
q TV IF filter with Nyquist slope
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type N 3954 M
25/+ 65 25/+ 85 12 10
C C V V
213
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 12,1 max. 13,6 dB
Relative attenuation Picture carrier 58,83 (58,75) MHz Color carrier 55,25 (55,17) MHz Sound carrier 54,33 (54,25) MHz Adjacent picture carrier 52,83 (52,75) MHz Adjacent sound carrier 60,33 (60,25) MHz Lower sidelobe 45,08 52,83 (45,00 52,75) MHz Upper sidelobe 60,33 65,08 (60,25 65,00) MHz Reflected wave signal suppression 1,2 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 57,08 MHz) Feedthrough signal suppression 1,3 s 1,2 s before main pulse (test pulse: 250 ns, carrier frequency: 57,08 MHz) Group delay ripple (p-p) Impedance at 57,08 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
rel 4,9 0,7 25,0 44,0 42,0 38,0 38,0 5,9 0,3 40,0 50,0 50,0 44,0 44,0 6,9 1,3 dB dB dB dB dB dB dB
42,0
48,0
dB
50,0
56,0
dB
60
ns k || pF k || pF ppm/K
TCf
214
Frequency response
215
S +M
COMPONENTS
Survey Sound carrier Picture-toPicture sound carrier carrier distance level 1) MHz 5,5 6,5 4,5 6,5 4,5 6,5 6,5 6,5 6,5 6,5 6,5 6,5 6,5 6,5 6,0 6,5 6,0 6,5 5,5 5,5 5,5 5,5 6,0 6,0 5,5 5,5 5,5 5,5 5,5 6,0 4,5 4,5 4,5 6,5 6,5 6,5 6,5 6,5 dB 56 4) 0 52 4) 48 4) 49 4) 45 4) 57 4) 45 4) 48 4) 54 4) 50 4) 50 4) 49 4) 0 51 4) 49 4) 42 4) 0 47 4) 57 4) 0 55 4) 54 4) 56 4) 44 4) 0 56 4) 41 4) 48 4) 60 4) D/K, I, B/G D/K, I, B/G, M/N D/K, I, B/G, M/N L L L L NICAM L NICAM L L L D/K, L, I D/K, L, I NICAM D/K, I, B/G D/K, L, I, B/G D/K, L, I, B/G D/K, L, I, B/G D/K, I, B/G, M/N I NICAM I NICAM B/G NICAM B/G, L NICAM B/G, L NICAM B/G, L NICAM B/G, L NICAM I NICAM M/N M/N M/N L SIP 5 K 5 ) SIP 5 K SIP 5 K SIP 5 K SIP 5 K SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K SIP 5 K SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K DIP 10 K SIP 5 K SIP 5 K SIP 5 K DIP 10 K SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K K 9455 M K 9252 M K 9352 M L 9360 M L 9362 M L 9453 M L 9454 M L 9455 M L 9456 M L 9460 M L 9461 M K 9460 M K 9463 M K 9260 M K 9350 M K 9453 M K 9462 M K 9253 M K 4350 K K 9353 M G 9251 M G 9353 M K 4350 K K 9460 M K 9463 M J 9250 M K 9455 M K 9461 M K 9462 M L 9361 M 219 # # # 223 # 225 # 228 # # # # 231 # 233 # # # # # 237 # # # # 219 # # # Standard 2) Package Type Page
3)
4,5 6,5
1) 2) 3) 4) 5)
Typ., referred to filter roof For explanation of standards see individual data sheets or index on page 349 Filters marked by the sign # are only listed in the survey. Detailed information on these types on request. Only sound transmission Pin configuration different from standard package
217
Survey Sound carrier Picture-toPicture sound carrier carrier distance level 1) MHz 6,5 6,5 6,5 6,5 6,5 6,5 6,5 6,5 6,5 6,5 4,5 4,5 4,5 4,5 dB 51 4) 42 4) 55 4) 62 4) 52 4) 50 4) 50 4) 52 4) 52 4) 52 4) 0 59 4) 0 50 4) L NICAM L L L NICAM L L NICAM L L L L M/N M/N M M SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K SIP 5 K SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K 5 ) SIP 5 K SIP 5 K SIP 5 K SIP 5 K L 9455 M L 9460 M L 9353 M L 9354 M L 9453 M L 9454 M L 9456 M K 9453 M K 9461 M L 9461 M M 9260 M M 9352 M N 9260 M N 9350 M # # # # # 225 228 233 # # 240 242 # 245 Standard 2) Package Type Page
3)
1) 2) 3) 4) 5)
Typ., referred to filter roof For explanation of standards see individual data sheets or index on page 349 Filters marked by the sign # are only listed in the survey. Detailed information on these types on request. Only sound transmission Pin configuration different from standard package
218
Standard
q D/K-OIRT
Eastern Standard
q I
Great Britain
q B/G-CCIR
Europe partly
q M/N-FCC
USA Features
q TV IF audio filter with two channels q Channel 1 (B/G, D/K, I) with pass band for
sound carriers between 31,95 MHz and 32,50 MHz q Channel 2 (M/N) with pass band for sound carrier at 33,50 MHz Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input channel 1 / Input ground Input ground / Input channel 2 Chip carrier ground Output Output
Type K 9455 M
25/+ 65 25/+ 85 12 10
C C V V
219
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,1 max. 15,6 dB 32,50 MHz 12,6
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier
rel 31,45 MHz 31,50 MHz 32,00 MHz 38,00 MHz 33,57 MHz 30,00 MHz 39,50 MHz 40,00 MHz 40,50 MHz 25,00 30,00 MHz 38,00 45,00 MHz 1,8 1,8 1,2 44,0 32,0 42,0 42,0 40,0 39,0 36,0 38,0 0,8 0,8 0,2 56,0 48,0 56,0 54,0 46,0 45,0 42,0 44,0 0,2 0,2 0,8 dB dB dB dB dB dB dB dB dB dB dB k || pF k || pF ppm/K
Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier
Impedance at 32,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
TCf
220
Frequency response
221
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,3 max. 15,8 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 38,00 MHz 34,42 MHz 32,00 MHz 39,50 MHz 25,00 32,00 MHz 38,00 45,00 MHz 42,0 30,0 40,0 42,0 25,0 35,0 56,0 41,0 54,0 56,0 30,0 41,0 dB dB dB dB dB dB k || pF k || pF ppm/K
Impedance at 33,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
222
Standard
q L
France Features
q TV IF audio filter with pass band for
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type L 9362 M
25/+ 65 25/+ 85 12 10
C C V V
223
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 5,5 max. 7,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier NICAM sound carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 38,90 MHz 33,05 MHz 34,47 MHz 30,90 MHz 40,40 MHz 25,00 30,90 MHz 38,90 45,00 MHz 43,0 17,0 38,0 42,0 50,0 33,0 42,0 49,0 20,0 57,0 51,0 67,0 37,0 49,0 dB dB dB dB dB dB dB k || pF k || pF ppm/K
Impedance at 32,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
224
Standard
q L, L'
France Features
q TV IF audio filter with two channels q Channel 1 with pass band for sound carriers
Pin configuration 1 2 3 4 5 Input channel 1 / Input ground Input ground / Input channel 2 Chip carrier ground Output Output
Type L 9454 M
25/+ 65 25/+ 85 12 10
C C V V
225
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 15,5 max. 17,0 dB 40,40 MHz 14,0
Insertion attenuation Reference level for the following data Relative attenuation
rel 39,75 MHz 38,40 MHz 33,90 MHz 41,90 MHz 32,40 MHz 25,00 33,90 MHz 41,90 45,00 MHz 1,3 27,0 40,0 31,0 36,0 33,0 30,0 0,3 37,0 50,0 37,0 43,0 39,0 37,0 50 0,7 dB dB dB dB dB dB dB ns k || pF k || pF ppm/K
Picture carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
Impedance at 40,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
226
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,6 max. 16,1 dB 32,40 MHz 13,1
Insertion attenuation Reference level for the following data Relative attenuation
rel 33,05 MHz 34,40 MHz 38,90 MHz 30,90 MHz 40,40 MHz 25,00 30,90 MHz 38,90 45,00 MHz 0,7 27,0 40,0 37,0 37,0 37,0 34,0 0,3 34,0 57,0 47,0 43,0 45,0 39,0 50 1,3 dB dB dB dB dB dB dB ns k || pF k || pF ppm/K
Picture carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
Impedance at 32,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
227
Standard
q L, L'
France Features
q TV IF audio filter with two channels q Channel 1 (L') with pass band for
Pin configuration 1 2 3 4 5 Input channel 1 Input channel 2 Chip carrier ground Output Output
Type L 9456 M
25/+ 65 25/+ 85 12 10
C C V V
228
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,1 max. 15,6 dB
Insertion attenuation Reference level for the following data Relative attenuation NICAM sound carrier Picture carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 39,75 MHz 33,90 MHz 41,90 MHz 32,40 MHz 25,00 38,40 MHz 41,90 45,00 MHz 12,0 42,0 34,0 39,0 33,0 32,0 18,0 50,0 42,0 48,0 38,0 38,0 dB dB dB dB dB dB k || pF k || pF ppm/K
Impedance at 40,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
229
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,3 max. 15,8 dB
Insertion attenuation Reference level for the following data Relative attenuation NICAM sound carrier Picture carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 33,05 MHz 38,90 MHz 30,90 MHz 40,40 MHz 25,00 30,90 MHz 34,40 45,00 MHz 15,0 38,0 38,0 36,0 33,0 32,0 20,0 48,0 52,0 41,0 38,0 38,0 1,1 || 9,5 2,8 || 6,5 72 dB dB dB dB dB dB k || pF k || pF ppm/K
Impedance at 32,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
230
Standard
q D/K-OIRT
Eastern Standard
q I
Great Britain
q B/G-CCIR
picture carrier and sound carriers between 31,95 MHz and 33,40 MHz Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type K 9260 M
25/+ 65 25/+ 85 12 10
C C V V
231
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 18,3 max. 19,8 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier
rel 32,90 MHz 32,35 MHz 33,40 MHz 34,47 MHz 30,90 MHz 40,90 MHz 40,35 MHz 25,00 30,90 MHz 38,90 45,00 MHz 0,9 1,4 0,9 25,0 37,0 38,0 35,0 32,0 32,0 0,1 0,4 0,1 32,0 45,0 51,0 48,0 38,0 38,0 1,1 0,6 1,1 dB dB dB dB dB dB dB dB dB k || pF k || pF ppm/K
Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
Impedance at 38,90 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
232
Standard
q L/L'
France
q D/K-OIRT
Eastern Standard
q I
Great Britain
q B/G-CCIR
Pin configuration 1 2 3 4 5 Input channel 1 / Input ground Input ground / Input channel 2 Chip carrier ground Output Output
Type K 9453 M
25/+ 65 25/+ 85 12 10
C C V V
233
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,5 max. 15,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 33,90 MHz 38,40 MHz 41,90 MHz 32,40 MHz 25,00 38,40 MHz 41,90 45,00 MHz 42,0 40,0 36,0 42,0 38,0 32,0 52,0 56,0 44,0 50,0 46,0 38,0 0,8 || 8,5 2,1 || 5,3 72 dB dB dB dB dB dB k || pF k || pF ppm/K
Impedance at 40,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
234
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,5 max. 16,0 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier
rel 33,05 MHz 32,90 MHz 32,40 MHz 38,90 MHz 34,47 MHz 30,90 MHz 40,40 MHz 40,90 MHz 41,40 MHz 25,00 30,50 MHz 38,90 45,00 MHz 1,3 0,9 1,2 39,0 25,0 31,0 34,0 36,0 38,0 38,0 32,0 0,3 0,1 0,2 49,0 32,0 37,0 40,0 43,0 48,0 44,0 37,0 0,7 1,1 0,8 dB dB dB dB dB dB dB dB dB dB dB k || pF k || pF ppm/K
Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier
Impedance at 33,40 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response curve on next page
TCf
235
Frequency response
236
Standard
q B/G-CCIR
France Features
q TV IF audio filter with pass band for
sound carriers at 33,40 MHz (B/G) and 33,05 MHz (B/G, L NICAM) Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 9353 M
25/+ 65 25/+ 85 12 10
C C V V
237
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 13,6 max. 15,1 dB
Insertion attenuation Reference level for the following data Relative attenuation Sound carrier Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
rel 33,40 MHz 32,80 MHz 38,90 MHz 34,47 MHz UHF 30,90 MHz VHF 31,90 MHz VHF 40,40 MHz UHF 41,40 MHz 25,00 31,90 MHz 40,40 45,00 MHz 0,4 40,0 26,0 31,0 33,0 40,0 40,0 30,0 37,0 1,4 0,9 55,0 34,0 36,0 41,0 55,0 56,0 36,0 46,0 40 2,4 dB dB dB dB dB dB dB dB dB dB ns k || pF k || pF ppm/K
Impedance at 33,05 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
TCf
238
Frequency response
239
Standard
q M/N-FCC
USA Features
q TV IF audio filter with pass bands for
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type M 9260 M
25/+ 65 25/+ 85 12 10
C C V V
240
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 14,4 max. 15,9 dB
Insertion attenuation Reference level for the following data Relative attenuation Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe
rel 45,75 MHz 42,17 MHz 39,75 MHz 47,25 MHz 35,00 39,75 MHz 47,25 55,00 MHz 1,0 22,0 42,0 40,0 40,0 36,0 0,0 28,0 50,0 48,0 46,0 42,0 0,4 || 9,5 3,3 || 6,3 72 1,0 dB dB dB dB dB dB k || pF k || pF ppm/K
Impedance at 41,25 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
TCf
241
Standard
q M/N-FCC
USA Features
q TV IF audio filter with pass band
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type M 9352 M
25/+ 65 25/+ 85 12 10
C C V V
242
TA = 25 C ZS = 50 ZL = 50
min. typ. 18,5 max. 20,0 dB
Insertion attenuation Reference level for the following data Relative attenuation
rel 40,95 MHz 41,55 MHz 39,17 MHz 45,75 MHz 42,17 MHz 39,75 MHz 47,25 MHz 35,00 39,75 MHz 45,75 55,00 MHz 0,5 0,3 40,0 46,0 20,0 40,0 46,0 36,0 42,0 1,5 0,7 54,0 59,0 28,0 45,0 62,0 41,0 52,0 90 2,5 1,7 dB dB dB dB dB dB dB dB dB ns k || pF k || pF ppm/K
Picture carrier Color carrier Adjacent picture carrier Adjacent sound carrier Lower sidelobe Upper sidelobe Group delay ripple (p-p)
Impedance at 41,25 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response curve on next page
TCf
243
Frequency response
244
Standard
q M
Japan Features
q TV IF audio filter with pass band
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type N 9350 M
25/+ 65 25/+ 85 12 10
C C V V
245
TA = 25 (45) C ZS = 50 ZL = 2 k || 3 pF
min. typ. 16,2 max. 17,7 dB
rel Relative attenuation Picture carrier 58,83 (58,75) MHz Color carrier 55,25 (55,17) MHz Adjacent picture carrier 52,83 (52,75) MHz Adjacent sound carrier 60,33 (60,25) MHz Lower sidelobe 45,08 52,83 (45,00 52,75) MHz Upper sidelobe 60,33 65,08 (60,25 65,00) MHz Impedance at 54,33 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency Frequency response
50,0 32,0 48,0 54,0 36,0 48,0 0,8 || 8,6 2,7 || 2,1 72
dB dB dB dB dB dB k || pF k || pF ppm/K
TCf
246
Satellite Filters
Survey Center frequency MHz 402,78 403,18 479,50 3 dB bandwidth MHz 27,0 + 31,0 26,9 + 32,1 31,3 27,0 + 18,0 27,0 + 32,0 27,0 + 36,0 21,5 + 27,0 15,0 + 27,0 33,5 + 36,1 15,7 32,0 22,5 36,2 26,6 17,6 26,6 Insertion attenuation dB 24,7 + 23,4 24,8 + 24,8 22,0 20,4 + 21,0 21,3 + 21,3 22,1 + 22,7 21,0 + 21,0 21,8 + 22,0 23,2 + 22,2 18,4 20,0 19,0 21,0 20,0 19,5 18,5 no yes no no no no no no yes yes no no no yes yes no TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 B 609 B 629 B 682 B 611 B 615 B 619 B 621 B 625 B 635 B 662 B 674 B 680 B 686 B 692 B 694 B 696 248 # 253 256 # # # # 261 # # # # 266 269 # Shunt resistors Package
1)
Satellite Filters
Type
Page
2)
480,00
1) Integrated shunt resistors for improved ESD capability 2) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request.
247
Features
q Two-channel satellite receiver filter q IF filter for DSB receivers q Constant group delay
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Type B 609
20/+ 80 25/+ 85 0 5
C C V V
248
Characteristics of channel 1 Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 24,7 max. 26,0 dB
Insertion attenuation Reference level for the following data Pass bandwidth (rel 3 dB) Relative attenuation
402,78 MHz
B3dB
rel
27,00
MHz
389,28 MHz 416,28 MHz 350,00 372,78 MHz 432,78 450,00 MHz
30,0 30,0
4,0 4,0
dB dB dB dB
Reflected wave signal suppression 0,06 s 3,0 s after main pulse Amplitude Amplitude ripple (p-p) 397,78 407,78 MHz
40,0
52,0
dB
0,4
0,7
dB
Group delay Group delay ripple (p-p) 389,28 416,28 MHz Impedance at 402,78 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
15
ns || pF || pF ppm/K
TCf
249
Frequency response
250
Characteristics of channel 2 Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 23,4 max. 25,0 dB
Insertion attenuation Reference level for the following data Pass bandwidth (rel 3 dB) Relative attenuation
402,78 MHz
B3dB
rel
31,00
MHz
387,28 MHz 418,28 MHz 350,00 372,78 MHz 432,78 450,00 MHz
30,0 30,0
4,0 4,0
dB dB dB dB
Reflected wave signal suppression 0,07 s 3,0 s after main pulse Amplitude Amplitude ripple (p-p) 396,78 408,78 MHz
40,0
51,0
dB
0,4
0,7
dB
Group delay Group delay ripple (p-p) 387,28 418,28 MHz Impedance at 479,50 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
15
ns || pF ppm/K
1380 || 1,6 86
TCf
251
Frequency response
252
Features
q IF filter for DSB receivers q Constant group delay q Optimized group delay time
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Type B 682
20/+ 80 25/+ 85 0 5
C C V V
253
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
Insertion attenuation 403,18 (402,78) MHz Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation 387,67 (367,28) MHz 418,70 (418,28) MHz Lower sidelobe 350,35 376,17 MHz (350,00 375,78) MHz Upper sidelobe 430,21 450,45 MHz (429,78 450,00) MHz Reflected wave signal suppression 0,16 s 3,0 s after main pulse Amplitude Amplitude ripple (p-p)
fc B3dB
rel
402,18 30,30
403,18 31,30
404,18 32,30
MHz MHz
3,0 3,2
4,7 4,7
dB dB
36,0
40,0
dB
35,0
38,0
dB
40,0
48,5
dB
0,3 282 11
0,5 18
dB ns ns || pF || pF ppm/K
Group delay 403,18 MHz Group delay ripple (p-p) 388,17 418,20 MHz Impedance at 403,18 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
TCf
254
Frequency response
255
Features
q Two-channel satellite receiver filter q IF filter for DSB receivers q Constant group delay
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Type B 611
20/+ 80 25/+ 85 0 5
C C V V
256
Characteristics of channel 1 Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 21,0 max. 22,5 dB
Insertion attenuation Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation
479,50 MHz
fc B3dB
rel 466,00 MHz 493,00 MHz 430,00 452,00 MHz 507,00 530,00 MHz
478,50
479,50 27,00
480,50
MHz MHz
36,0 34,0
4,5 4,5
dB dB dB dB
Reflected wave signal suppression 0,13 s 2,0 s after main pulse Amplitude Amplitude ripple (p-p) 471,00 488,00 MHz
40,0
49,0
dB
0,3
0,6
dB
Group delay Group delay ripple (p-p) 466,00 493,00 MHz Impedance at 479,50 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
11
18
ns || pF || pF ppm/K
TCf
257
Frequency response
258
Characteristics of channel 2 Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 20,4 max. 22,1 dB
Insertion attenuation Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation
479,50 MHz
fc B3dB
rel 470,50 MHz 488,50 MHz 430,00 457,50 MHz 500,50 530,00 MHz
478,50
479,50 18,00
480,50
MHz MHz
36,0 34,0
4,5 4,5
dB dB dB dB
Reflected wave signal suppression 0,13 s 2,0 s after main pulse Amplitude Amplitude ripple (p-p) 476,00 483,00 MHz
40,0
44,0
dB
0,3
0,6
dB
Group delay Group delay ripple (p-p) 470,50 488,50 MHz Impedance at 479,50 MHz Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
11
18
ns || pF ppm/K
130 || 3,3 86
TCf
259
Frequency response
260
Features
q q q q
Metal package TO 39
Two-channel satellite receiver filter IF filter for DSB receivers Constant group delay Improved ESD capability by integrated shunt resistors
Terminals
q Gold-plated NiFeCo alloy
Type B 635
20/+ 80 25/+ 85 0 5
C C V V
261
Characteristics of channel 1 Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 23,2 max. 25,0 dB
Insertion attenuation Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation
480,00 MHz
fc B3dB
rel 463,50 MHz 496,50 MHz 430,00 455,00 MHz 505,00 530,00 MHz
479,00
480,00 33,50
481,00
MHz MHz
36,0 36,0
dB dB dB dB
Reflected wave signal suppression 0,135 s 2,0 s after main pulse Amplitude Amplitude ripple (p-p) 470,50 489,50 MHz
40,0
45,0
dB
0,2 300 9
0,6 18
dB ns ns || pF || pF ppm/K
Group delay 480,00 MHz Group delay ripple (p-p) 464,00 496,00 MHz Impedance at 480,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T DC resistance Input: RIN Output: ROUT Temperature coefficient of frequency
TCf
262
Frequency response
263
Characteristics of channel 2 Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 22,2 max. 25,0 dB
Insertion attenuation Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation
480,00 MHz
fc B3dB
rel 462,00 MHz 498,00 MHz 430,00 453,50 MHz 506,50 530,00 MHz
479,00
480,00 36,10
481,00
MHz MHz
36,0 36,0
dB dB dB dB
Reflected wave signal suppression 0,13 s 2,0 s after main pulse Amplitude Amplitude ripple (p-p) 469,00 491,00 MHz
40,0
45,0
dB
0,4 300 10
0,7 18
dB ns ns || pF || pF ppm/K
Group delay 480,00 MHz Group delay ripple (p-p) 462,50 497,50 MHz Impedance at 480,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T DC Resistance Input: RIN Output: ROUT Temperature coefficient of frequency
TCf
264
Frequency response
265
Features
q q q q
Metal package TO 39
IF filter for DSB receivers Constant group delay Optimized group delay time Improved ESD capability by integrated shunt resistors
Terminals
q Gold-plated NiFeCo alloy
Type B 692
20/+ 80 25/+ 85 0 5
C C V V
266
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 20,0 max. 21,5 dB
Insertion attenuation Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation
480,00 MHz
fc B3dB
rel 466,50 MHz 493,50 MHz 430,00 455,50 MHz 504,50 530,00 MHz
479,00 25,60
480,00 26,60
481,00 27,60
MHz MHz
40,0 38,0
4,6 4,6
dB dB dB dB
Reflected wave signal suppression 0,11 s 2,0 s after main pulse Amplitude Amplitude ripple (p-p) 473,50 486,50 MHz
40,0
47,0
dB
0,3 250 9
0,5 15
dB ns ns || pF || pF ppm/K
Group delay 480,00 MHz Group delay ripple (p-p) 467,00 493,00 MHz Impedance at 480,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T DC resistance Input: RIN Output: ROUT Temperature coefficient of frequency
TCf
267
Frequency response
268
Features
q q q q
Metal package TO 39
IF filter for DSB receivers Constant group delay Optimized group delay time Improved ESD capability by integrated shunt resistors
Terminals
q Gold-plated NiFeCo alloy
Type B 694
20/+ 80 25/+ 85 0 5
C C V V
269
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 0,25 MHz
min. typ. 19,5 max. 21,0 dB
Insertion attenuation Reference level for the following data Center frequency Pass bandwidth (rel 3 dB) Relative attenuation
480,00 MHz
fc B3dB
rel 471,00 MHz 489,00 MHz 430,00 461,00 MHz 499,00 530,00 MHz
479,00 16,60
480,00 17,60
481,00 18,60
MHz MHz
38,0 38,0
5,4 5,4
dB dB dB dB
Reflected wave signal suppression 0,13 s 2,0 s after main pulse Amplitude Amplitude ripple (p-p) 476,00 484,00 MHz
40,0
46,0
dB
0,3 281 12
0,6 18
dB ns ns || pF || pF ppm/K
Group delay 480,00 MHz Group delay ripple (p-p) 471,50 488,50 MHz Impedance at 480,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T DC resistance Input: RIN Output: ROUT Temperature coefficient of frequency
TCf
270
Frequency response
271
S +M
COMPONENTS
Survey Picture carrier MHz 32,70 38,00 38,90 Vestigial sideband MHz 0,7 0,75 0,75 0,75 0,75 0,75 0,75 0,75 0,75 1,25 0,75 1,00 0,75 1,25 0,75 0,75 0,75 0,75 0,75 no yes yes yes no yes no yes no no no NICAM yes yes yes yes yes no yes L D/K D/K B/G B/G B/G B/G B/G B/G I D/K I B/G I B/G B/G D/K M/N M/N DIP 24-06 DIP 24-06 SIP 6 M DIP 24-03 DIP 24-03 DIP 16 DIP 16 DIP 24-06 DIP 24-06 DIP 24-06 DIP 24-06 DIP 24-06 SIP 6 M SIP 6 M SIP 6 M SIP 5 K SIP 5 K DIP 24-06 SIP 5 K B 540 B 542 B 587 B 522 B 523 B 530 B 531 B 534 B 537 B 541 B 543 B 576 B 585 B 586 B 588 G 4960 M K 4960 M B 545 M 4950 M # # # # 274 277 # # 280 # # # 283 # # 286 # 289 # Sound Standard 1) Package Type Page
2)
45,75
1) For explanation of standards see individual data sheets or index on page 349 2) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request.
273
Standard
q B/G
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 15 14 1, 4, 8, 9, 12, 13, 16, 17, 21, 24 10, 11, 22, 23 Input Input ground Output Output ground Case ground Not connected
Type B 523
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
274
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 120 kHz
min. typ. 38,90 30,0 max. 32,0 MHz dB
Nominal frequency Insertion attenuation at f N Relative attenuation (relative to N ) 33,40 MHz 34,00 MHz 34,10 MHz 39,65 MHz 25,00 32,00 MHz 32,00 32,65 MHz 32,65 33,30 MHz 40,15 41,20 MHz 41,20 45,00 MHz Amplitude ripple (p-p) 34,30 39,00 MHz 34,20 39,40 MHz Reflected wave signal suppression 2,5 s 12,0 s after main pulse Group delay at f N Group delay ripple (p-p) 33,80 39,60 MHz Temperature coefficient of frequency
fN
N rel
28,0
dB dB dB dB dB dB dB dB dB
0,3 0,6
0,5 1,0
dB dB
50,0 N
55,0 3,6
dB s
40 87
50
ns ppm/K
TCf
275
Frequency response
276
Standard
q B/G
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 6, 7, 14, 15 Input Input ground Output Output ground Case ground Not connected
Type B 530
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
277
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 50 C ZS = 50 ZL = 50 80 kHz
min. typ. 38,90 30,0 max. 31,0 MHz dB
Nominal frequency Insertion attenuation at f N Relative attenuation (relative to N ) 31,90 MHz 33,40 MHz 39,65 MHz 40,15 MHz 40,40 MHz 20,00 31,00 MHz 31,00 31,90 MHz 40,40 41,90 MHz 41,90 50,00 MHz Amplitude ripple (p-p) 34,30 39,00 MHz Reflected wave signal suppression 2,7 s 12,0 s after main pulse Group delay at f N Group delay ripple (p-p) 34,30 39,60 MHz Temperature coefficient of frequency
fN
N rel
29,0
0,4 2,5
dB dB dB dB dB dB dB dB dB
0,2
0,4
dB
50,0 N
60,0 2,2
dB s
30 87
50
ns ppm/K
TCf
278
Frequency response
279
Standard
q B/G
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 15 14 1, 5, 7, 8, 12, 13, 17, 18, 20, 24 4, 9, 10, 11, 16, 21, 22, 23 Input Input ground Output Output ground Case ground Not connected
Type B 537
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
280
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 60 C ZS = 50 ZL = 50 80 kHz
min. typ. 38,90 30,0 max. 31,0 MHz dB
Nominal frequency Insertion attenuation at f N Relative attenuation (relative to N ) 33,80 MHz 33,90 MHz 39,65 MHz 15,00 31,90 MHz 31,90 33,40 MHz 40,05 40,15 MHz 40,15 40,65 MHz 40,65 55,00 MHz Amplitude ripple (p-p) 34,15 39,50 MHz Reflected wave signal suppression 3,5 s 13,0 s after main pulse Group delay at f N Group delay ripple (p-p) 33,90 39,65 MHz Temperature coefficient of frequency
fN
N rel
29,0
dB dB dB dB dB dB dB dB
0,2
0,4
dB
50,0 N
63,0 4,4
dB s
40 87
50
ns ppm/K
TCf
281
Frequency response
282
Standard
q B/G-CCIR
Terminals
q Tinned NiFeCo alloy
Pin configuration 2 3 6 5 4 Input Input ground Output Output ground Case ground
Type B 585
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
283
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 80 kHz
min. typ. 38,90 34,9 max. 36,4 MHz dB
Nominal frequency Insertion attenuation at f N Relative attenuation (relative to N ) 39,65 MHz Sound carrier 33,40 MHz 2nd sound carrier 33,15 MHz Adjacent picture carrier 31,90 MHz 40,15 MHz Adjacent sound carrier 40,40 MHz 44,40 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,5 s 6,0 s after main pulse Feedthrough signal suppression 1,6 s 1,5 s before main pulse Group delay ripple (p-p) 33,40 39,65 MHz Impedance at fN Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
fN
N rel
33,4
dB dB dB dB dB dB dB dB dB
42,0
52,0
dB
50,0
56,0
dB
55
80
ns k || pF k || pF ppm/K
TCf
284
Frequency response
285
Standard
q B/G-CCIR
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type G 4960 M
25/+ 65 25/+ 85 12 10
C C V V
286
TA = 25 C ZS = 50 ZL = 2 k || 3 pF
min. typ. 19,9 max. 21,4 dB
Insertion attenuation Reference level for the following data Relative attenuation
rel 2,7 1,2 1,4 34,0 32,0 40,0 32,0 32,0 3,9 0,2 0,4 49,0 42,0 49,0 42,0 38,0 5,1 0,8 0,6 dB dB dB dB dB dB dB dB
39,65 MHz Sound carrier 33,40 MHz 2nd sound carrier 33,15 MHz Adjacent picture carrier 31,90 MHz Adjacent sound carrier 40,40 MHz 44,40 MHz Lower sidelobe 25,00 31,90 MHz Upper sidelobe 40,40 45,00 MHz Reflected wave signal suppression 1,3 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 38,90 MHz) Feedthrough signal suppression 1,4 s 1,3 s before main pulse (test pulse: 250 ns, carrier frequency: 38,90 MHz) Group delay predistortion (reference frequency 38,90 MHz) 36,90 MHz 34,47 MHz Impedance at 38,90 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
42,0
52,0
dB
50,0
56,0
dB
95 100
ns ns k || pF k || pF ppm/K
TCf
287
Frequency response
288
Standard
q M/N
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 15 14 1, 5, 7, 8, 12, 13, 17, 18, 20, 24 4, 9, 10, 11, 16, 21, 22, 23 Input Input ground Output Output ground Case ground Not connected
Type B 545
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
289
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 60 C ZS = 50 ZL = 50 80 kHz
min. typ. 45,75 27,5 max. 29,0 MHz dB
Nominal frequency Insertion attenuation at f N Relative attenuation (relative to N ) 41,65 MHz 46,50 MHz 20,00 40,15 MHz 40,15 41,20 MHz 47,00 47,70 MHz 47,70 60,00 MHz Amplitude ripple (p-p) 41,85 46,25 MHz Reflected wave signal suppression 3,5 s 13,0 s after main pulse Group delay at f N Group delay ripple (p-p) 41,85 46,25 MHz Temperature coefficient of frequency
fN
N rel
26,5
2,0 2,0
dB dB dB dB dB dB
0,3
0,5
dB
50,0 N
63,0 4,4
dB s
30 87
50
ns ppm/K
TCf
290
Frequency response
291
S +M
COMPONENTS
a transmitter to a receiver outside the domicile, thus doing away with readings on all the radiators. Transmitter and receiver are both fitted with a SAW resonator.
Spectrum-Shaping Filters
Survey
Spectrum-Shaping Filters
fc 1 )
MHz 70,00
fY
MHz 11,95 12,10 12,30 7,755 7,755 13,52 13,52 13,52 13,82
a
0,35 0,30 0,33 0,40 0,40 0,34 0,32 0,32 0,45
p
0,4 0,5 0,5 0,5 0,5 0,5 0,5 0,5 0,5
k
0,0 0,5 0,5 1,0 0,0 0,5 0,5 0,5 0,0
33 34 34 30 27 40 31 27 27
rel 41 34 40 35 40 54 50 50 50
Package DIP 16 DIP 16 DIP 16 DIP 16 DIP 16 DIP 24-06 DIP 16 DIP 16 DIP 16
Type B 2540 B 2559 B 2565 B 2569 B 2570 B 2573 B 2578 B 2579 B 2580
2)
1) For explanation of symbols see individual data sheets or index on page 347 2) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request.
293
Spectrum-Shaping Filter
Features
q q q q
Spectrum-shaping filter for digital radio systems High-performance passband Constant group delay Hermetically sealed metal package
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 6, 7, 14, 15 Input Input ground Output Output ground Case ground Not connected
Type B 2569
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
294
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 1 MHz
min. typ. 70,0 max. 70,15 MHz
fc
c
69,85
30,0
31,0
dB
Deviation from theoretical frequency response f c f c 0,8 f Y f c 0,8 f Y f c 1,1 f Y Relative attenuation (relative to c ) 6,00 58,00 MHz 58,00 58,80 MHz 81,20 86,50 MHz 86,50 110,00 MHz Reflected wave signal suppression 1,0 s 2,7 s after main pulse Group delay at f c Group delay ripple (p-p) 62,00 78,00 MHz Nyquist frequency Roll-off-factor Partitioning factor sinx/x compensation factor Temperature coefficient of frequency Theoretical frequency response: H(x) = (S(x))p/(sinc(x /2)) k c rel
0,15 0,2
0,2 0,3
dB dB
dB dB dB dB
50,0
55,0 1,54
dB s
fY a p k TCf
1 for |x | 1 a S(x) = (1+ cos( ( | x| 1+ a )/2a ))/2 for 1 a < |x | < 1+ a 0 for |x | 1 + a H(x) = (f f c)/ f Y
295
Frequency response
296
Spectrum-Shaping Filter
Features
q q q q
Spectrum-shaping filter for digital radio systems High-performance passband Constant group delay Hermetically sealed metal package
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 6, 7, 14, 15 Input Input ground Output Output ground Case ground Not connected
Type B 2570
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
297
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 1 MHz
min. typ. 70,0 max. 70,15 MHz
fc
c
69,85
27,0
29,0
dB
Deviation from theoretical frequency response f c f c 1,05 f Y fc 1,05 f Y f c 1,1 f Y Relative attenuation (relative to c ) 6,00 58,80 MHz 81,20 88,00 MHz 88,00 110,00 MHz Reflected wave signal suppression 0,9 s 4,5 s after main pulse Group delay at f c Group delay ripple (p-p) 62,00 78,00 MHz Nyquist frequency Roll-off-factor Partitioning factor Temperature coefficient of frequency Theoretical frequency response: H(x) = (S(x))p c rel
0,1 0,15
0,2 0,3
dB dB
dB dB dB
50,0
55,0 1,45
dB s
ns MHz
fY a p TCf
ppm/K
1 for |x | 1 a S(x) = (1+ cos( ( | x| 1+ a )/2a ))/2 for 1 a < |x | < 1+ a 0 for |x | 1 + a H(x) = (f f c )/f Y
298
Frequency response
299
Spectrum-Shaping Filter
Features
q q q q
Spectrum-shaping filter for digital radio systems High-performance passband Constant group delay Hermetically sealed metal package
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 6, 7, 14, 15 Input Input ground Output Output ground Case ground Not connected
Type B 2579
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
300
TA = 45 C ZS = 50 ZL = 50
min. typ. 157,50 max. 157,70 MHz
fc
c
157,30
25,8
26,8
27,8
dB
Deviation from theoretical frequency response (tilt removed) fc fc f Y Pass band tilt Deviation from linear phase
0,1 0,02
0,2
dB dB/MHz
fc fc f Y
Relative attenuation (relative to c ) 85,00 138,00 MHz 177,00 215,00 MHz Reflected wave signal suppression 0,8 s 4,8 s after main pulse Group delay at f c Nyquist frequency Roll-off-factor Partitioning factor sinx/x compensation factor Temperature coefficient of frequency Theoretical frequency response: H(x) = (S(x))p/(sinc(x /2)) k
0,75
1,0
50,0 50,0
dB dB
50,0 c
dB s MHz
fY a p k TCf
ppm/K
1 for |x | 1 a S(x) = (1+ cos( ( | x| 1+ a )/2a ))/2 for 1 a < |x | < 1+ a 0 for |x | 1 + a H(x) = (f f c )/f Y
301
Frequency response
302
Bandpass Filters
Survey
Bandpass Filters
fc 1 )
MHz 36,00 36,20 38,912 44,00 45,00 60,00 70,00
B3dB
MHz 1,35 2,7 1,25 1,7 0,27 20,1 1,62 11,3 2,5 11,9 2,6 1,07 1,9
B40dB
MHz 2,25 4) 4,0 4 ) 2,1 4 ) 2,9 4 ) 0,81 24,1 4 ) 3,79 7,5 4,0 15,55 7,0 2,6 4) 4,1
Package
Type
Page
3)
SIP 6 M SIP 5 K SIP 6 M SIP 5 K DIP 24-03 SIP 5 K DIP 16 DIP 16 DIP 16 DIP 16 DIP 16 DIP 16 TO 8
B 589 X 6967 M B 512 X 6959 M B 1507 X 6956 M B 504 B 519 B 590 B 521 B 1529 B 1505 B 558
1) 2) 3) 4)
For explanation of symbols see individual data sheets or index on page 347 For explanation of standards see individual data sheets or index on page 349 Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request. 30 dB bandwidth
303
Bandpass Filter
Standard
q DAB
Terminals
q Tinned NiFeCo alloy
Type B 512
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
304
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
Nominal frequency Insertion attenuation at f N Pass rel rel rel rel bandwidth 3 dB 10 dB 20 dB 30 dB
fN
N
Relative attenuation (relative to N ) rel Lower sidelobe 30,00 37,40 MHz Upper sidelobe 40,40 42,40 MHz 42,40 50,00 MHz Reflected wave signal suppression 2,0 s 6,0 s after main pulse Group delay at f N N
dB dB dB
40,0
dB s ns ppm/K 2
Group delay ripple (p-p) 38,30 39,50 MHz Temperature coefficient of frequency Matching network: Input: Serial coil; L 1 = 3,3 H, Q = 30 Output: Serial coil; L 2 = 6,8 H, Q = 30
TCf
305
Frequency response
306
Bandpass Filter
Standard
q Interactive TV
Features
q IF filter for Interactive TV applications q Low group delay ripple
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type X 6959 M
25/+ 65 25/+ 85 12 10
C C V V
307
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 2 k || 3 pF 50 kHz
min. typ. 44,00 max. MHz
Center frequency (center between 3 dB points) Insertion attenuation Reference level for the following data Pass rel rel rel bandwidth 3 dB 6 dB 30 dB
fc
44,00 MHz
13,5
15,0
16,5
dB
B3dB B6 dB B30 dB
rel 35,00 41,30 MHz 41,30 42,30 MHz 45,80 47,20 MHz 47,20 55,00 MHz 43,00 45,00 MHz 40,0 36,0 34,0 40,0
dB dB dB dB
Group delay ripple (p-p) Impedance at 44,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
45
ns k || pF k || pF ppm/K
TCf
308
Frequency response
309
Bandpass Filter
Standard
q DSS
Terminals
q Tinned CuFe alloy
Pin configuration 1 2 3 4 5 Input Input ground Chip carrier ground Output Output
Type X 6956 M
25/+ 65 25/+ 85 12 10
C C V V
310
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 2 k || 3 pF 3,6 MHz
min. typ. 27,0 max. 28,5 dB
Insertion attenuation Reference level for the following data Center frequency (center between 3 dB points) Relative attenuation Passband ripple Lower sidelobe Upper sidelobe Pass bandwidth rel 3 dB rel 30 dB Stopband alpha
fc
59,88 rel 60,00 60,12 MHz
34,0 33,0
0,70
dB dB dB
20,65 24,65
MHz MHz
Reflected wave signal suppression 0,8 s 6,0 s after main pulse (test pulse: 250 ns, carrier frequency: 60,00 MHz) Feedthrough signal suppression 1,1 s 1,0 s before main pulse (test pulse: 250 ns, carrier frequency: 60,00 MHz) Group delay ripple (p-p) 51,50 68,50 MHz Impedance at 60,00 MHz Input: ZIN = RIN || CIN Output: ZOUT = ROU T || COU T Temperature coefficient of frequency
44,0
56,0
dB
56,0
dB
ns k || pF k || pF ppm/K
TCf
311
Frequency response
312
Bandpass Filter
Features
q High-performance IF bandpass filter q Constant group delay q Hermetically sealed metal package
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 6, 7, 14, 15 Input Input ground Output Output ground Case ground Not connected
Type B 504
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
313
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 400 kHz
min. typ. 70,00 max. 70,04 MHz
Center frequency (center between 3 dB points) Insertion attenuation at f c Pass rel rel rel bandwidth 1 dB 3 dB 40 dB 69,70 70,30 MHz
fc
c
69,96
38,3
39,3
40,3
dB
B1 dB B3 dB B40 dB
Relative attenuation (relative to c ) rel 25,00 67,90 MHz 72,10 77,00 MHz 77,00 100,00 MHz Reflected wave signal suppression 1,1 s 6,1 s after main pulse Group delay at f c c
dB dB dB
55,0
62,0 2,0
dB s
Group delay ripple (p-p) 68,70 71,30 MHz Temperature coefficient of frequency Frequency inversion temperature
10
ns ppm/K 2 C
TCf T0
0,035 25
314
Frequency response
315
Bandpass Filter
Features
q High-performance IF bandpass filter q Constant group delay q Hermetically sealed metal package
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 Input Input ground Output Output ground Case ground
Type B 521
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
316
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 35 C ZS = 50 ZL = 50 200 kHz
min. typ. 118,00 max. 118,20 MHz
Center frequency (center between 3 dB points) Insertion attenuation at f c Amplitude ripple (p-p) 112,80 123,00 MHz Pass rel rel rel bandwidth 1 dB 3 dB 40 dB
fc
c
117,80
20,0
22,0 0,8
24,0 1,0
dB dB
B1 dB B3 dB B40 dB
Relative attenuation (relative to c ) rel 100,00 107,00 MHz 107,00 108,70 MHz 108,70 109,80 MHz 126,20 136,00 MHz Reflected wave signal suppression 0,9 s 4,7 s after main pulse Group delay at f c c
dB dB dB dB
48,0
52,0 1,3
dB s
Group delay ripple (p-p) 112,00 124,00 MHz Temperature coefficient of frequency
25 87
35
ns ppm/K
TCf
317
Frequency response
318
Bandpass Filter
Features
q High-performance IF bandpass filter q Constant group delay q Hermetically sealed metal package
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 3 2 11 10 1, 5, 8, 9, 12, 16 Input Input ground Output Output ground Case ground
Type B 1505
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
319
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 120 kHz
min. typ. 287,35 max. 287,45 MHz
Center frequency (center between 3 dB points) Insertion attenuation at f c Pass rel rel rel bandwidth 1 dB 3 dB 30 dB
fc
c
287,25
19,5
20,5
21,5
dB
B1 dB B3 dB B30 dB
Relative attenuation (relative to c ) rel 45,00 280,00 MHz 280,00 285,70 MHz 288,80 295,00 MHz 295,00 400,00 MHz Reflected wave signal suppression 1,4 s 4,6 s after main pulse Group delay at f c c
dB dB dB dB
40,0
48,0 1,3
dB s
Group delay ripple (p-p) 286,50 288,00 MHz Temperature coefficient of frequency Frequency inversion temperature
30 0,035 20
50
ns ppm/K 2 C
TCf T0
320
Frequency response
321
Bandpass Filter
Features
q High-performance IF bandpass filter q Constant group delay q Hermetically sealed metal package
Metal package TO 8
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 1 2 5 6 3, 4, 7, 8 Input Input ground Output Output ground Case ground
Type B 558
TA Tstg VDC Ps
25/+ 85 40/+ 85 0 15
C C V dBm
source impedance 50
322
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 100 kHz
min. typ. 439,85 max. 440,1 MHz
Center frequency (center between 3 dB points) Insertion attenuation at f c Amplitude ripple (p-p) 439,70 440,00 MHz Pass rel rel rel bandwidth 1 dB 3 dB 40 dB
fc
c
439,6
21,0
22,0
dB
0,2
0,4
dB
4,30
Relative attenuation (relative to c ) rel 390,00 434,85 MHz 434,85 437,50 MHz 442,20 444,85 MHz 444,85 490,00 MHz Reflected wave signal suppression 1,0 s 3,0 s after main pulse Group delay at f c c
dB dB dB dB
40,0 1050
45,0 1090
1130
dB ns
Group delay ripple (p-p) 439,70 440,00 MHz Temperature coefficient of frequency Frequency inversion temperature
10
20 0,03 20
25 30
ns ppm/K 2 C
TCf T0
323
Frequency response
324
Survey
fc 1 )
MHz 51,840 139,264 155,520 167,118 181,043 622,080 659,157 2488,320
B3dB
kHz 450 850 610 230 600 600 925 2930 1460 6300 3)
c (max.) dB 29,5 21,0 18,5 19,5 17,0 17,5 19,5 20,5 18,0 21,0
ns 1520 820 1130 2200 1180 1085 720 270 580 155
Package
Type
Page 2)
DIP 16 TO 8 TO 8 DIP 16 TO 8 TO 8 TO 39 TO 8 TO 8 TO 39
B 5545 B 5505 B 5533 B 5549 B 5506 B 5504 B 5531 B 5547 B 5513 B 5534
# # 326 # # # 329 # # #
1) For explanation of symbols see individual data sheets or index of symbols on page 347 2) Filters marked by the sign # are only listed in the survey. Detailed information on these types upon request. 3) 6 dB bandwidth
325
Features
q Passive or active timing recovery
Metal package TO 8
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 1 2 5 6 3, 4, 7, 8 Input Input ground Output Output ground Case ground
Type B 5533
TA Tstg VDC Ps
45/+ 85 45/+ 85 5 0
C C V dBm
source impedance 50
326
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 300 kHz
min. typ. 155,520 max. 155,551 MHz
Center frequency (center between 3 dB points) Insertion attenuation at f c Pass bandwidth rel 3 dB Phase at 155,52 MHz Relative attenuation (relative to c ) First sidelobes Group delay at f c Ageing of f c Temperature coefficient of frequency Frequency inversion temperature Temperature dependance of f c: Phase tolerance N:
fc
c
155,489
16,0
17,0
18,5
dB
B3 dB
N rel
580
610 70
640
kHz
23 c 1100
25 1130
1160
dB ns ppm/K 2 C
TCf T0
80
0,03 90
327
Frequency response
328
Features
q Passive or active timing recovery
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Pin configuration 1 2 3 4 Input Not connected Output Input ground Output ground Case ground
Type B 5531
TA Tstg VDC Ps
45/+ 85 45/+ 85 5 0
C C V dBm
source impedance 50
329
Characteristics Ambient temperature Source impedance Load impedance Group delay aperture
TA = 25 C ZS = 50 ZL = 50 250 kHz
min. typ. 622,08 max. 622,23 MHz
Center frequency (center between 6 dB points) Insertion attenuation at f c Pass bandwidth rel 3 dB Phase at 622,05 MHz Relative attenuation (relative to c ) First sidelobes Group delay at f c Aeging of f c Temperature coefficient of frequency Frequency inversion temperature Temperature dependance of f c: Phase tolerance N:
fc
c
621,93
16,5
18,0
19,5
dB
B3 dB 840
N rel 22,0 c 660
925 0
1010
kHz
780
dB ns ppm/K 2 C
+50/100 ppm 45
TCf T0
25
330
Frequency response
331
S +M
COMPONENTS
Resonators
Survey Center frequency MHz Tolerance kHz Unloaded QU Insertion Package attenuation dB Type Page
1)
Resonators
1-port resonators 314,50 315,00 417,50 418,00 423,22 433,42 433,92 75 100 75 85 100 75 75 75 75 75 75 75 12300 15000 12300 15000 9000 10500 9000 11000 10500 8200 10500 8200 2,0 1,5 2,0 1,5 1,4 1,8 1,4 1,8 1,8 1,6 1,7 1,7 TO 39 QCC 8 TO 39 QCC 8 QCC 8 TO39 QCC 8 TO 39 TO 39 QCC 8 TO 39 QCC 8 R 660 R 706 R 639 R 705 R 704 R 643 R 703 R 644 R 647 R 702 R 641 R 701 # # # # # # 334 # # # 336 #
2-port resonators 213,80 224,50 304,35 315,05 403,55 407,35 414,25 418,00 418,05 423,22 433,92 849,25 64 67 75 100 120 100 100 80 75 100 75 75 75 300 10000 9300 8400 7550 6700 8800 6800 6700 7200 7400 6800 7200 7800 4900 9,1 8,5 7,3 5,5 7,5 8,6 7,0 7,5 9,2 8,3 7,3 7,8 9,2 11,0 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 TO 39 QCC 8 TO 39 TO 39 TO 39 QCC 8 TO 39 R 2637 R 2523 R 2653 R 2622 R 2526 R 2635 R 2620 R 2528 R 2702 R 2630 R 2531 R 2632 R 2701 R 2533 # # # # # # # # 338 # # 340 # #
Frontend filters for remote control 314,00 315,00 403,55 433,92 150 150 150 150 700 700 950 950 2,5 2,5 2,5 2,3 TO 39 TO 39 TO 39 TO 39 B 3532 B 3531 B 3533 B 3530 # # # 343
1) Types marked by the sign # are only listed in the survey. Detailed information upon request.
333
Resonator
Features
q 1-port resonator q Hermetically sealed ceramic SMD package
Terminals
q Gold-plated Ni
Type R 703
Maximum ratings Ambient temperature Storage temperature DC voltage AC voltage Power dissipation
45/+ 85 45/+ 85 12 12 0
C C V V dBm
334
TA = 25 C ZS = 50 ZL = 50
min. typ. max. MHz dB ppm fF H pF ppm/K2 C
Center frequency Minimum insertion attenuation Unloaded quality factor Ageing of f c Equivalent circuit elements Motional capacitance Motional inductance Motional resistance Parallel capacitance Temperature coefficient of frequency Frequency inversion point
fc
min QU
417,925 6000
418,000 418,075 1,4 9000 2,0 72,5 23,0 3,4 0,03 2,0 50 50
C1 L1 R1 C0 TCf T0
20
Center frequency is defined as maximum of the real part of the admittance Temperature dependance of f C: f C(TA ) = f C( T0)(1 + TCf(T A T0)2 )
335
Resonator
Features
q 1-port resonator
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Type R 641
Maximum ratings Ambient temperature Storage temperature DC voltage AC voltage Power dissipation
45/+ 85 45/+ 85 12 12 0
C C V V dBm
336
TA = 25 C ZS = 50 ZL = 50
min. typ. max.
Center frequency Minimum insertion attenuation Unloaded quality factor Ageing of f c Equivalent circuit elements Motional capacitance Motional inductance Motional resistance Parallel capacitance Temperature coefficient of frequency Frequency inversion point
fc
min QU
433,845 6000
433,920 433,995 MHz 1,4 10500 1,2 112,1 26 3,6 0,03 2,4 50 50 ppm fF H pF ppm/K2 C dB
C1 L1 R1 C0 TCf T0
20
Center frequency is defined as maximum of the real part of the admittance Temperature dependance of f C: f C(TA ) = f C( T0)(1 + TCf(T A T0)2 )
337
Resonator
Features
q 2-port resonator q Hermetically sealed SMD package
Terminals
q Gold-plated NiFeCo alloy
Type R 2702
Maximum ratings Ambient temperature Storage temperature DC voltage AC voltage Power dissipation
45/+ 85 45/+ 85 12 12 0
C C V V dBm
338
TA = 25 C ZS = 50 ZL = 50
min. typ. max.
Center frequency (center between 3 dB points) Insertion attenuation at f c Phase at f c Loaded quality factor Unloaded quality factor Ageing of f c Equivalent circuit elements Motional capacitance Motional inductance Motional resistance Parallel capacitance Temperature coefficient of frequency Frequency inversion point
fc
QL QU
417,925
5000 8000
10,5 50
dB el.
ppm fF mH pF ppm/K2 C
C1 L1 R1 C0 TCf T0
Center frequency is defined as maximum of the real part of the admittance Temperature dependance of f C: f C(TA ) = f C( T0)(1 + TCf(T A T0)2 ) Frequency response
339
Resonator
Features
q 2-port resonator
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Type R 2632
Maximum ratings Ambient temperature Storage temperature DC voltage AC voltage Power dissipation
45/+ 85 45/+ 85 12 12 0
C C V V dBm
340
TA = 25 C ZS = 50 ZL = 50
min. typ. max.
Center frequency (center between 3 dB points) Insertion attenuation at f c Phase at f c Loaded quality factor Unloaded quality factor Ageing of f c Equivalent circuit elements Motional capacitance Motional inductance Motional resistance Parallel capacitance Temperature coefficient of frequency Frequency inversion point
fc
QL QU
433,845
5000 9000
9,5 50 2,0 45
dB el.
ppm fF mH pF ppm/K2 C
C1 L1 R1 C0 TCf T0
1,4 35
Center frequency is defined as maximum of the real part of the admittance Temperature dependance of f C: f C(TA ) = f C( T0)(1 + TCf(T A T0)2 ) Note For use as 1-port resonator connect pin 1 and pin 2: Pin configuration 1,2 3 Input Ground
341
Frequency response
342
Resonator Filter
Features
q Resonator filter for remote control receivers
Metal package TO 39
Terminals
q Gold-plated NiFeCo alloy
Type B 3530
Maximum ratings Ambient temperature Storage temperature DC voltage AC voltage Power dissipation
45/+ 85 45/+ 85 0 12 0
C C V V dBm
343
Center frequency (center between 3 dB points) Insertion attenuation at f c Pass bandwidth (rel 3 dB) Relative attenuation 10,00 300,00 444,00 550,00 Ageing of f c Temperature coefficient of Frequency inversion point frequency 1) 300,00 MHz 426,00 MHz 550,00 MHz 1000,00 MHz
fc
433,770
880
2,3 950
4,0 1000
dB kHz
B3dB
rel
45 40 40 45
60 50 50 60 0,03 30
50
dB dB dB dB ppm ppm/K2 C
TCf T0
344
Frequency response
345
S +M
COMPONENTS
The following symbols and terms are used in the data sheets and in the chapter General Technical Information: Symbols Symbole a English English Roll-off factor Pass bandwidth (rel x dB) Capacitance Parallel capacitance Motional capacitance Input capacitance Output capacitance Electrostatic Sensitive Device Frequency Center frequency Nominal frequency Nyquist frequency sinx/x compensation factor Inductance Motional inductance Power dissipation Input power Source power (source impedance 50 ) Partitioning factor Quality factor Loaded quality factor Unloaded quality factor Resistance Motional resistance Input resistance Output resistance Frequency inversion temperature Ambient temperature Storage temperature Temperature coefficient of frequency Time DC voltage German Deutsch Roll-off-Faktor Durchlabandbreite (rel x dB) Kapazitt Parallelkapazitt Dynamische Kapazitt Eingangskapazitt Ausgangskapazitt Elektrostatisch gefhrdetes Bauelement Frequenz Mittenfrequenz Nennfrequenz Nyquistfrequenz sinx/x Kompensationsfaktor Induktivitt Dynamische Induktivitt Verlustleistung Eingangsleistung Generatorleistung (Quellimpedanz 50 ) Aufteilungsfaktor Gte Betriebsgte Leerlaufgte Widerstand Resonanzwiderstand Eingangswiderstand Ausgangswiderstand Frequenzumkehrtemperatur Umgebungstemperatur Lagertemperatur Temperaturkoeffizient der Frequenz Zeit Gleichspannung
347
English English AC voltage (p-p) Input impedance Load impedance Output impedance Source impedance Insertion attenuation Average insertion attenuation Insertion attenuation at f c Maximum insertion attenuation Minimum insertion attenuation Insertion attenuation at f N Relative attenuation Amplitude ripple (p-p) Group delay Group delay at f c Group delay at f N Group delay ripple (p-p) Group delay predistortion Phase at f c Phase at f N Deviation from linear phase
German Deutsch Wechselspannung (Spitze-Spitze) Eingangsimpedanz Lastimpedanz Ausgangsimpedanz Quellimpedanz Einfgungsdmpfung Durchschnittliche Einfgungsdmpfung Einfgungsdmpfung bei f c Maximale Einfgungsdmpfung Minimale Einfgungsdmpfung Einfgungsdmpfung bei f N Relative Dmpfung Amplitudenwelligkeit (Spitze-Spitze) Gruppenlaufzeit Gruppenlaufzeit bei f c Gruppenlaufzeit bei f N Gruppenlaufzeitwelligkeit (Spitze-Spitze) Gruppenlaufzeitvorverzerrung Phase bei f c Phase bei f N Abweichung von der linearen Phase (Spitze-Spitze) Alterung von f c Frequenzgang
ZIN ZL ZOUT ZS
avg c ma x min N rel c N c N
Frequency response with recommended Frequenzgang mit empfohlener matching network Anpaschaltung Group delay aperture Pass band tilt Feedthrough signal suppression Reflected wave signal suppression Gruppenlaufzeitapertur Durchlabereich-Schrglage Unterdrckung des bersprechens Unterdrckung nachlaufender Signale
348
Standards
Range of validity / Full text Australia CCIR, Germany, Europe OIRT, eastern standard, China France Great Britain Japan FCC, USA, South America
Mobile telephone, USA (Advanced Mobile Phone System) Cordless telephone, Europe (Cordless Telephone, 1st Generation) Cordless telephone, Europe (Cordless Telephone, 2nd Generation) Cordless telephone, USA (Cordless Telephone, Industrial, Scientific, Medical) Cordless telephone, Europe (Digital European Cordless Telephone) Mobile telephone, Europe (Extended Global System for Mobile Communication) Mobile telephone, Europe, Asia (Extended Total Access Communication System) Mobile telephone, Europe (Global System for Mobile Communication) Mobile telephone, Japan (Nippon Total Access Communication System) Mobile telephone, Europe (Personal Communication Network) Mobile telephone, USA (Personal Communication Services)
349
Subject Index
A
application notes for resonators oscillation circuits remote control system application notes for TV IF filters matching and driver stage switchable audio filters switchable video/intercarrier filters 42 42 44 40 40 41 40
R
reflections resonators 29 333
S
satellite filters spectrum-shaping filters spurious signals step signal 247 293 29 39
B
bandpass filters 303
T
temperature coefficient of frequency testing final measurements insertion attenuation pulse response relative attenuation scatter test circuits test set-up TV test signals time domain transducer triple-transit echo TTE 33 33 33 33 35 35 35 36 36 38 29 27 29 29
C
characteristics chip size clock recovery filters construction 29 28 325 27
E
echo signals 29
F
feedthrough signals filter design filter impedances frequency domain frequency response 29 28 30 29 30
V
vestigial sideband filters 273
G
group delay 30
Numerics
2T signal 38
I
IF filters for audio applications 217 IF filters for intercarrier applications 47 IF filters for quasi/split sound applications 115 IF filters for video applications 181 input transducer 27
O
operating principles output transducer 27 27
P
phase velocity pulse response 28 29
350