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1. General description
The TDA8920B is a high efciency class-D audio power amplier with very low dissipation. The typical output power is 2 100 W. The device is available in the HSOP24 power package and in the DBS23P through-hole power package. The amplier operates over a wide supply voltage range from 12.5 V to 30 V (32 V non operating) and consumes a very low quiescent current.
2. Features
s s s s s s s s s s s s s Zero dead time switching Advanced current protection: output current limiting Smooth start-up: no pop noise due to DC offset High efciency Operating supply voltage from 12.5 V to 30 V Low quiescent current Usable as a stereo Single-Ended (SE) amplier or as a mono amplier in Bridge-Tied Load (BTL) Fixed gain of 30 dB in Single-Ended (SE) and 36 dB in Bridge-Tied Load (BTL) High output power High supply voltage ripple rejection Internal switching frequency can be overruled by an external clock Full short-circuit proof across load and to supply lines Thermally protected
3. Applications
s s s s s Television sets Home-sound sets Multimedia systems All mains fed audio systems Car audio (boosters)
Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
5. Ordering information
Table 2: Ordering information Package Name TDA8920BTH TDA8920BJ HSOP24 DBS23P Description plastic, heatsink small outline package; 24 leads; low stand-off height plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) Version SOT566-3 SOT411-1 Type number
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
6. Block diagram
VDDA2 3 (20) VDDA1 10 (4) VDDP2 23 (16) VDDP1 14 (8) 15 (9)
BOOT1
IN1M IN1P
SWITCH1
mute STABI
OSCILLATOR MODE
MANAGER
TDA8920BTH (TDA8920BJ)
SGND2
2 (19) mute ENABLE2 CONTROL SWITCH2 AND HANDSHAKE RELEASE2 DRIVER HIGH 21 (14) DRIVER LOW 17 (11) VSSP1 20 (13) VSSP2 OUT2
IN2P IN2M
1 (18) VSSA2
12 (6) VSSA1
24 (17) VSSD
19 (-) n.c.
coa023
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
7. Pinning information
7.1 Pinning
OSC IN1P IN1M VDDA1 SGND1 VSSD 24 VDDP2 23 BOOT2 22 OUT2 21 VSSP2 20 n.c. 19 STABI 18 VSSP1 17 OUT1 16 BOOT1 15 VDDP1 14 PROT 13
001aab217
1 2 3 4 5 6 7 8 9
1 2 3 4 5
OUT1 10 VSSP1 11 STABI 12 VSSP2 13 OUT2 14 BOOT2 15 VDDP2 16 VSSD 17 VSSA2 18 SGND2 19 VDDA2 20 IN2M 21 IN2P 22 MODE 23
001aab218
TDA8920BTH
6 7 8 9
TDA8920BJ
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Pin description continued Description TDA8920BJ 5 6 7 8 9 10 11 12 13 14 15 16 17 signal ground for channel 1 negative analog supply voltage for channel 1 decoupling capacitor for protection (OCP) positive power supply voltage for channel 1 bootstrap capacitor for channel 1 PWM output from channel 1 negative power supply voltage for channel 1 decoupling of internal stabilizer for logic supply not connected negative power supply voltage for channel 2 PWM output from channel 2 bootstrap capacitor for channel 2 positive power supply voltage for channel 2 negative digital supply voltage TDA8920BTH
Table 3:
Symbol Pin SGND1 VSSA1 PROT VDDP1 BOOT1 OUT1 VSSP1 STABI n.c. VSSP2 OUT2 BOOT2 VDDP2 VSSD 11 12 13 14 15 16 17 18 19 20 21 22 23 24
8. Functional description
8.1 General
The TDA8920B is a two channel audio power amplier using class-D technology. The audio input signal is converted into a digital pulse width modulated signal via an analog input stage and Pulse Width Modulation (PWM) modulator. To enable the output power transistors to be driven, this digital PWM signal is applied to a control and handshake block and driver circuits for both the high side and low side. In this way a level shift is performed from the low power digital PWM signal (at logic levels) to a high power PWM signal which switches between the main supply lines. A 2nd-order low-pass lter converts the PWM signal to an analog audio signal across the loudspeakers. The TDA8920B one-chip class-D amplier contains high power D-MOS switches, drivers, timing and handshaking between the power switches and some control logic. For protection a temperature sensor and a maximum current detector are built-in. The two audio channels of the TDA8920B contain two PWM modulators, two analog feedback loops and two differential input stages. It also contains circuits common to both channels such as the oscillator, all reference sources, the mode functionality and a digital timing manager. The TDA8920B contains two independent amplier channels with high output power, high efciency, low distortion and a low quiescent current. The amplier channels can be connected in the following congurations:
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
The amplier system can be switched to one of three operating modes by pin MODE:
Standby mode; with a very low supply current Mute mode; the ampliers are operational; but the audio signal at the output is
suppressed by disabling the VI-converter input stages
Operating mode; the ampliers are fully operational with output signal
To ensure pop noise-free start-up, the DC output offset voltage is applied gradually to the output at a level between Mute mode and Operating mode levels. The bias current setting of the VI converters is related to the voltage on the MODE pin; in Mute mode the bias current setting of the VI converters is zero (VI converters disabled) and in Operating mode the bias current is at maximum. The time constant required to apply the DC output offset voltage gradually between Mute and Operating mode levels can be generated via an RC-network on the MODE pin. An example of a switching circuit for driving pin MODE is illustrated in Figure 4. If the capacitor C is left out of the application the voltage on the MODE pin will be applied with a much smaller time-constant, which might result in audible pop noises during start-up (depending on DC output offset voltage and loudspeaker used). In order to fully charge the coupling capacitors at the inputs, the amplier will remain automatically in the Mute mode before switching to the Operating mode. A complete overview of the start-up timing is given in Figure 5.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
audio output
> 4.2 V
mute
0 V (SGND)
audio output
> 4.2 V
mute
0 V (SGND)
standby 100 ms 50 ms
coa024
> 350 ms
time
Upper diagram: When switching from standby to mute, there is a delay of 100 ms before the output starts switching. The audio signal is available after Vmode has been set to operating, but not earlier than 150 ms after switching to mute. For pop noise-free start-up it is recommended that the time constant applied to the MODE pin is at least 350 ms for the transition between mute and operating. Lower diagram: When switching directly from standby to operating, there is a rst delay of 100 ms before the outputs starts switching. The audio signal is available after a second delay of 50 ms. For pop noise-free start-up it is recommended that the time constant applied to the MODE pin is at least 500 ms for the transition between standby and operating.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
8.3 Protections
The following protections are included in TDA8920B:
OverTemperature Protection (OTP) OverCurrent Protection (OCP) Window Protection (WP) Supply voltage protections: UnderVoltage Protection (UVP) OverVoltage Protection (OVP) UnBalance Protection (UBP)
The reaction of the device to the different fault conditions differs per protection.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
In case of an impedance drop (e.g. due to dynamic behavior of the loudspeaker) the same protection will be activated; the maximum output current is again limited to 8 A, but the amplier will NOT switch-off completely (thus preventing audio holes from occurring). Result will be a clipping output signal without any artefacts. See also Section 13.6 for more information on this maximum output current limiting feature.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Overview of TDA8920B protections Complete shut-down Y N [2] Y [3] Y Y Y Restart directly Y [1] Y [2] Y N Y N Restart every 100 ms N [1] N [2] N Y N Y
Protection name
Hysteresis of 20 C will inuence restart timing depending on heatsink size. Only complete shut-down of amplier if short-circuit impedance is below threshold of 1 . In all other cases current limiting: resulting in clipping output signal. Fault condition detected during (every) transition between standby-to-mute and during restart after activation of OCP (short to one of the supply lines).
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
OUT1
SGND
OUT2
power stage
mbl466
9. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VP Parameter supply voltage operating non operating IORM Tstg Tamb Tj
[1] [2]
[1] [2]
Conditions
Min 8 55 40 -
Unit V V A C C C
repetitive peak current in output pin storage temperature ambient temperature junction temperature
Overvoltage protection might be activated. Current limiting concept. See also Section 13.6.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Conditions
[1]
Typ 35 35
[1]
1.3 1.3
Parameter
Conditions
Min
Typ
Max 30 65
Unit V mA
12.5 27 50
standby supply current input voltage input current input voltage for Standby mode input voltage for Mute mode input voltage for Operating mode DC input voltage mute SE output offset voltage operating SE output offset voltage operating BTL output offset voltage stabilizer output voltage mute and operating; with respect to VSSP1
[4] [2]
A V A V V V V mV mV mV mV V
0 2.2 4.2 11
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Table 7: Static characteristics continued VP = 27 V; fosc = 317 kHz; Tamb = 25 C; unless otherwise specied. Symbol Tprot Thys
[1] [2] [3] [4]
Conditions
Min -
Typ 150 20
Max -
Unit C C
Temperature protection
The circuit is DC adjusted at VP = 12.5 V to 30 V. With respect to SGND (0 V). The transition between Standby and Mute mode has hysteresis, while the slope of the transition between Mute and Operating mode is determined by the time-constant of the RC-network on the MODE pin; see Figure 7. DC output offset voltage is applied to the output during the transition between Mute and Operating mode in a gradual way. The slope of the dV/dt caused by any DC output offset is determined by the time-constant of the RC-network on the MODE pin.
slope is directly related to the time-constant of the RC-network on the MODE pin
VO (V) Voo(on) STBY MUTE ON
Voo(mute)
0.8
2.2
3.0
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Min 29 40 45 [8]
Max 0.05 31 1 -
Unit W W W W W W W W % % dB dB dB dB dB k V V dB dB V dB
channel separation channel unbalance output signal in mute common mode rejection ratio Vi(CM) = 1 V (RMS)
RsL is the series resistance of inductor of low-pass LC lter in the application. Output power is measured indirectly; based on RDSon measurement. See also Section 13.3. Total harmonic distortion is measured in a bandwidth of 22 Hz to 20 kHz, using AES17 20 kHz brickwall lter. Maximum limit is guaranteed but may not be 100 % tested. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 . B = 22 Hz to 20 kHz, using AES17 20 kHz brickwall lter. B = 22 Hz to 22 kHz, using AES17 20 kHz brickwall lter; independent of Rs. Po = 1 W; Rs = 0 ; fi = 1 kHz. Vi = Vi(max) = 1 V (RMS); fi = 1 kHz.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Typ 174 210 138 173 0.02 0.03 36 80 80 80 80 34 300 220 200 75
Max 0.05 37 -
Unit W W W W % % dB dB dB dB dB k V V V dB
[3]
THD
Po = 1 W fi = 1 kHz fi = 6 kHz
35
[4]
Gv(cl) SVRR
closed loop voltage gain supply voltage ripple rejection operating fi = 100 Hz fi = 1 kHz mute; fi = 100 Hz standby; fi = 100 Hz
[4] [4]
70 22
Zi Vn(o)
Vo(mute) CMRR
[1] [2] [3] [4] [5] [6] [7]
RsL is the series resistance of inductor of low-pass LC lter in the application. Output power is measured indirectly; based on RDSon measurement. See also Section 13.3. Total harmonic distortion is measured in a bandwidth of 22 Hz to 20 kHz, using an AES17 20 kHz brickwall lter. Maximum limit is guaranteed but may not be 100 % tested. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 . B = 22 Hz to 20 kHz, using an AES17 20 kHz brickwall lter. B = 22 Hz to 20 kHz, using an AES17 20 kHz brickwall lter; independent of Rs. Vi = Vi(max) = 1 V (RMS); fi = 1 kHz.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
P o ( 1% )
(1)
Maximum current (internally limited to 8 A): V P ( 1 t min f osc ) I o ( peak ) = ----------------------------------------------------R L + 0.4 BTL:
2 RL ------------------- 2V P ( 1 t min f osc ) R L + 0.8 = -------------------------------------------------------------------------------------------2 RL
(2)
P o ( 1% )
(3)
Maximum current (internally limited to 8 A): 2V P ( 1 t min f osc ) I o ( peak ) = --------------------------------------------------------R L + 0.8 Variables: RL = load impedance fosc = oscillator frequency tmin = minimum pulse width (typically 150 ns) VP = single-sided supply voltage (so, if supply is 30 V symmetrical, then VP = 30 V) Po(1%) = output power just at clipping Po(10%) = output power at THD = 10 % Po(10%) = 1.24 Po(1%). (4)
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
If two or more class-D ampliers are used in the same audio application, it is strongly recommended that all devices run at the same switching frequency. This can be realized by connecting all OSC pins together and feed them from an external central oscillator. Using an external oscillator it is necessary to force pin OSC to a DC-level above SGND for switching from the internal to an external oscillator. In this case the internal oscillator is disabled and the PWM modulator will be switched on the external frequency. The frequency range of the external oscillator must be in the range as specied in the switching characteristics; see Section 12.1. In an application circuit:
Internal oscillator: ROSC connected between pin OSC and VSSA External oscillator: connect the oscillator signal between pins OSC and SGND; ROSC
and COSC removed
Pdiss is determined by the efciency () of the TDA8920B. The efciency measured in the TDA8920B as a function of output power is given in Figure 21. The power dissipation can be derived as a function of output power (see Figure 20). The derating curves (given for several values of Rth(j-a)) are illustrated in Figure 8. A maximum junction temperature Tj = 150 C is taken into account. From Figure 8 the maximum allowable power dissipation for a given heatsink size can be derived or the required heatsink size can be determined at a required dissipation level.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
30 Pdiss (W)
mbl469
(1)
20
(2)
10
(3) (4) (5)
(1) Rth(j-a) = 5 K/W. (2) Rth(j-a) = 10 K/W. (3) Rth(j-a) = 15 K/W. (4) Rth(j-a) = 20 K/W. (5) Rth(j-a) = 35 K/W.
Fig 8. Derating curves for power dissipation as a function of maximum ambient temperature
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
A typical value for the capacitor on the PROT pin is 220 pF. After a xed time of 100 ms the amplier is switched on again. If the requested output current is still too high the amplier will switch-off again. Thus the amplier will try to switch to the Operating mode every 100 ms. The average dissipation will be low in this situation because of this low duty cycle. If the overcurrent condition is removed the amplier will remain in Operating mode once restarted. In this way the TDA8920B amplier is fully robust against short circuit conditions while at the same time so-called audio holes as a result of loudspeaker impedance drops are eliminated.
Speaker impedance Supply voltage Audio signal frequency Value of decoupling capacitors on supply lines Source and sink currents of other channels
The pumping effect should not cause a malfunction of either the audio amplier and/or the voltage supply source. For instance, this malfunction can be caused by triggering of the undervoltage or overvoltage protection or unbalance protection of the amplier. Best remedy for pumping effects is to use the TDA8920B in a mono full-bridge application or in case of stereo half-bridge application adapt the power supply (e.g. increase supply decoupling capacitors).
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
A solid ground plane around the switching amplier is necessary to prevent emission 100 nF capacitors must be placed as close as possible to the power supply pins of the
TDA8920BTH
The internal heat spreader of the TDA8920BTH is internally connected to VSS The external heatsink must be connected to the ground plane Use a thermal conductive electrically non-conductive Sil-Pad between the backside of
the TDA8920BTH and a small external heatsink
The differential inputs enable the best system level audio performance with
unbalanced signal sources. In case of hum due to oating inputs, connect the shielding or source ground to the amplier ground. Jumpers J1 and J2 are open on set level and are closed on the stand-alone demo board
TDA8920B_2
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Product data sheet Rev. 02 07 November 2005
Koninklijke Philips Electronics N.V. 2005. All rights reserved. TDA8920B_2
Philips Semiconductors
R2
10
C3 470 F/35 V
R4 5.6 k C4
C7 100 nF
C5 47 F/35 V
C6 470 F/35 V
100 F/10 V
OPERATE/MUTE VDDP
C8
L2 BEAD
R5 10
VSSA
VSSP
VDDA
VSSA
C9 100 nF
R6 30 k C14 100 nF
FB GND
C12 100 nF
C13 100 nF
FB GND MODE
VDDP
C10 220 pF
VSSP
C11 220 pF
SINGLE ENDED OUTPUT FILTER VALUES LS1/LS2 L3/L4 C22/C31 2 4 6 8 10 H 22 H 33 H 47 H 1 F 680 nF 470 nF 330 nF
VDDA1
VDDP1
VSSA1
IN1
C17 1 nF
VSSP1
OSC
R8 5.6 k R10
IN1P 10 8
12
14
R7 10
L3
R9 22 C22 C24 100 nF
IN1M SGND1
9 11 U1
C23 1 nF C25 1 nF
5.6 k
15
FB GND SGND2
R11 5.6 k C26 470 nF C29 470 nF C28 220 pF
TDA8920BTH
2 5 21 OUT2
R13 10
IN2P
22
BOOT2 C27
15 nF
FB GND L4
OUT2M LS2
R14 22
IN2
C30 1 nF
R12 5.6 k
IN2M
OUT2P
FB GND
C34 100 nF
C35 100 nF
FB GND
C37 100 nF
C38 100 nF
C39 100 nF
FB GND
C32 100 nF
TDA8920B
001aab224
VDDA
VSSA
VSSA
VSSP
VDDP
VSSP
VDDP
VSSP
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
001aab226
1
(1)
1
(1)
101
(2)
101
(2)
102
(3)
102
(3)
103 102
101
10
103 102
101
10 Po (W)
102
Fig 10. (THD + N)/S as a function of output power; SE conguration with 2 3 load
102 (THD + N)/S (%) 10
001aab227
Fig 11. (THD + N)/S as a function of output power; SE conguration with 2 4 load
102 (THD + N)/S (%) 10
001aab228
101
(1) (2)
101
(1) (2)
102
(3)
102
(3)
103 102
101
10
103 102
101
10
Fig 12. (THD + N)/S as a function of output power; BTL conguration with 1 6 load
Fig 13. (THD + N)/S as a function of output power; BTL conguration with 1 8 load
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
001aab229
001aab230
101
(1)
101
(1)
102
(2)
102
(2)
103 10
102
103
104 f (Hz)
105
103 10
102
103
104 f (Hz)
105
101
(1)
101
(1)
102
(2)
102
(2)
103 10
102
103
104 f (Hz)
105
103 10
102
103
104 f (Hz)
105
Fig 16. (THD + N)/S as a function of frequency; BTL conguration with 1 6 load
Fig 17. (THD + N)/S as a function of frequency; BTL conguration with 1 8 load
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
0 cs (dB) 20
001aab233
0 cs (dB) 20
001aab234
40
40
60
(1)
60
(1)
80
(2)
80
(2)
100 10
102
103
104 f (Hz)
105
100 10
102
103
104 f (Hz)
105
001aab235
(3)
001aab236
(1) (3)
60 16
(4) (2)
40
8 20
0 102
101
10
VP = 27 V; f = 1 kHz. (1) 2 3 SE conguration. (2) 2 4 SE conguration. (3) 1 6 BTL conguration. (4) 1 8 BTL conguration.
VP = 27 V; f = 1 kHz. (1) 2 3 SE conguration. (2) 2 4 SE conguration. (3) 1 6 BTL conguration. (4) 1 8 BTL conguration.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
001aab237
240
(1)
001aab238
Po (W)
(2)
(2)
160 120
(3) (4)
(3)
80
(4)
80
40
0 10 15 20 25 30 VP (V) 35
0 10 15 20 25 30 VP (V) 35
f = 1 kHz. (1) 1 6 BTL conguration. (2) 1 8 BTL conguration. (3) 2 3 SE conguration. (4) 2 4 SE conguration.
f = 1 kHz. (1) 1 6 BTL conguration. (2) 1 8 BTL conguration. (3) 2 3 SE conguration. (4) 2 4 SE conguration.
001aab240
35
(1) (2)
35
(2)
30
(3) (4)
30
(3) (4)
25
25
20 10
102
103
104 f (Hz)
105
20 10
102
103
104 f (Hz)
105
Vi = 100 mV; Rs = 5.6 k; Ci = 330 pF; VP = 27 V. (1) 1 8 BTL conguration. (2) 1 6 BTL conguration. (3) 2 4 BTL conguration. (4) 2 3 BTL conguration.
Vi = 100 mV; Rs = 0 ; Ci = 330 pF; VP = 27 V. (1) 1 8 BTL conguration. (2) 1 6 BTL conguration. (3) 2 4 BTL conguration. (4) 2 3 BTL conguration.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
0 SVRR (dB) 20
001aab241
Vo (V)
10 1
001aab242
101 40
(1)
102 103
(2)
60
100 10
102
103
104 f (Hz)
105
VP = 27 V; Vripple = 2 V (p-p). (1) Both supply lines rippled. (2) One supply line rippled.
80
(2)
40
0 102
101
10
VP = 27 V; Rs = 5.6 k; 20 kHz AES17 lter. (1) 2 3 SE conguration and 1 6 BTL conguration. (2) 2 4 SE conguration and 1 8 BTL conguration.
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
E D x
A X
c y E2 HE v M A
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.7 2.2 8 0
+0.08 0.53 0.32 16.0 13.0 0.04 0.40 0.23 15.8 12.6
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT566-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)
SOT411-1
non-concave x D Dh
Eh
A5 A4
B j
E2 E
E1
L2 L1 L3
L 1 Z e e1 w M 23
Q m
c e2
v M
bp
5 scale
10 mm
Z (1)
12.2 4.6 1.15 1.65 0.75 0.55 30.4 28.0 12 2.54 1.27 5.08 11.8 4.3 0.85 1.35 0.60 0.35 29.9 27.5
14 10.7 2.4 1.43 2.1 4.3 0.6 0.25 0.03 45 13 9.9 1.6 0.78 1.8
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT411-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
16. Soldering
16.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch SMDs. In these situations reow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
for packages with a thickness 2.5 mm for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be xed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated ux will eliminate the need for removal of corrosive residues in most applications.
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
Soldering method Wave suitable suitable [3] not suitable not suitable Reow [2] not suitable suitable Dipping suitable
suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales ofce. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. Hot bar soldering or manual soldering is suitable for PMFP packages. These transparent plastic packages are extremely sensitive to reow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[6]
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by using a hot bar soldering process. The appropriate soldering prole can be provided on request.
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
In Section 9 Limiting values the maximum value for the supply voltage is given for both operating and non operating conditions (see Table 5) Preliminary data sheet 9397 750 13356 -
20041001
TDA8920B_2
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
III
Product data
Production
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.
21. Trademarks
Notice All referenced brands, product names, service names and trademarks are the property of their respective owners.
20. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
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Philips Semiconductors
TDA8920B
2 100 W class-D power amplier
23. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.3.4 8.4 9 10 11 12 12.1 12.2 12.3 13 13.1 13.2 13.3 13.4 13.5 13.6 13.7 13.8 13.9 14 14.1 15 16 16.1 16.2 16.2.1 16.2.2 16.3 16.3.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pulse width modulation frequency . . . . . . . . . . 8 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 OverTemperature Protection (OTP) . . . . . . . . . 8 OverCurrent Protection (OCP) . . . . . . . . . . . . . 8 Window Protection (WP). . . . . . . . . . . . . . . . . . 9 Supply voltage protections . . . . . . . . . . . . . . . 10 Differential audio inputs . . . . . . . . . . . . . . . . . 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal characteristics. . . . . . . . . . . . . . . . . . 12 Static characteristics. . . . . . . . . . . . . . . . . . . . 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 13 Switching characteristics . . . . . . . . . . . . . . . . 13 Stereo and dual SE application . . . . . . . . . . . 14 Mono BTL application . . . . . . . . . . . . . . . . . . . 15 Application information. . . . . . . . . . . . . . . . . . 15 BTL application . . . . . . . . . . . . . . . . . . . . . . . . 15 MODE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Output power estimation. . . . . . . . . . . . . . . . . 16 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 16 Heatsink requirements . . . . . . . . . . . . . . . . . . 17 Output current limiting. . . . . . . . . . . . . . . . . . . 18 Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 19 Application schematic . . . . . . . . . . . . . . . . . . . 20 Curves measured in reference design . . . . . . 22 Test information . . . . . . . . . . . . . . . . . . . . . . . . 26 Quality information . . . . . . . . . . . . . . . . . . . . . 26 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 27 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Through-hole mount packages . . . . . . . . . . . . 29 Soldering by dipping or by solder wave . . . . . 29 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 29 Surface mount packages . . . . . . . . . . . . . . . . 29 Reow soldering . . . . . . . . . . . . . . . . . . . . . . . 29 16.3.2 16.3.3 16.4 17 18 19 20 21 22 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Manual soldering . . . . . . . . . . . . . . . . . . . . . . Package related soldering information . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Data sheet status. . . . . . . . . . . . . . . . . . . . . . . Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . 30 30 31 32 33 33 33 33 33