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PRODUCT GUIDE
s Features
Rated at 1500 V and 80 A, Toshiba discrete IGBTs are excellent as power converters in such diverse applications as motor drives, uninterruptible power supply (UPS) units and induction heaters. Some features of Toshiba IGBTs are: (1) High switching speed (2) Low-saturation voltage (3) Built-in diode with optimal characteristics (4) High input impedance characteristics enable voltage drive (5) A variety of package types is available
s Construction
Basic structure (planar N-channel) consists of four layers (PNPN), as shown in the following figure. Low-saturation voltage is achieved by using the PNP transistor to modulate conductivity. Unlike a MOSFET, a four-layer transistor does not incorporate a reverse-conducting diode, since the P-layer forms the collector electrode.
Structure
Collector
N+
Equivalent Circuit
Emitter Electrode Gate
P N
N+
N+
N+
P+
Gate Emitter
P+
Collector IMOS
Collector
IIGBT
IT
B O N D IN G
PA D
IN S
P+
S IL IC O N
GA TE ME TAL
N+
+
U LA
G A TE
Gate
P
+
Gate
N N+ P+
P+ P+
P O LY
N+ N+ N+
P+
N+
P+
N+ N+ P
Co lle ct
M or
ET
AL
Emitter
Emitter
2.
Power MOSFETs have long provided both high-speed and high-input impedance. However, various disadvantages such as increased resistance with increased breakdown voltage, as well as difficulties handling high breakdown voltages and high currents, are also associated with MOSFETs. The cross-section of the IGBT on the previous page shows how IGBT resistance is reduced by injecting holes + into the N layer from the P substrate collector to change the conductivity. Toshiba have miniaturized unit cells and optimized wafers to decrease VCE(sat) switching loss. The following data demonstrates the progress made thus far: 2.5th-generation IGBTs (VCE(sat) = 2.5 V Type)
Structure
NN+ P+ Collector
Collector
2.5th Generation(GT60M104)
100
3rd-generation IGBTs (VCE(sat) = 2.3 V Type) Trench IGBTs (VCE(sat) = 2.1 V Type) In addition to wafer optimization, Toshiba are applying trench gater technology and developing improved lifetime control to optimize the VCE(sat) versus switching speed trade-off.
3rd Generation(GT60M301)
2.6
75
2.4 2.2 2 1.8 0.12
4th Generation(GT60M303)
35
0.2
0.28
0.36 tf (s)
0.44
0.52
(1) Soft switching: reduced trade-off between VCE(sat) and tf due to adoption of trench gate
(1) Third generation (standard): low VCE(sat) and high ruggedness due to miniaturization (up to 20 kHz). (2) Fast switching (FS): trench gate and carrier injection optimization (up to 50 kHz) (3) Ultra fast switching (UFS): trench gate, new wafer and new lifetime control (up to 150 kHz) (4) Soft switching: reduced trade-off between VCE(sat) and tf due to adoption of trench gate
1998
4
2000
2002
400 600
40 50 30 50 60 80 15 40 60 60 40 5 10 15 20 30 50
Pulse 150 GT8G131 GT5G102 130 GT5G103 130 GT8G103 150 GT8G121 150 170 150 100 100 100 100 120 160 30 80 120 120 80 10 20 30 40 60 100 20 30 50 10 20 30 40 60 100 30 60 -60 GT5J121 GT5J321 GT10J321 GT15J321 GT20J321 GT5J301 GT10J303 GT15J301
GT25G101 GT25G101 GT25G102 GT25G102 GT40G121 GT50G321 GT30J322 GT50J322 GT60J321 GT60J322 GT80J101A GT15M321 GT40M101 GT60M302 GT60M303 GT60N321 GT40T301 GT40T102 GT5J311 GT10J312 GT15J311 GT10J301 GT20J301 GT20J101 GT30J301 GT30J101 GT10J311 GT20J311 GT30J311 GT50J301 GT50J102 GT10Q301 GT10Q101 GT15Q301 GT15Q102
1000 1500 General-purpose motors General-purpose inverters Hard switching Operating frequencies up to 20 kHz High rugged products 600
1200
10 15 25
General-purpose inverters Fast switching Hard switching Operating frequencies up to 50 kHz FS series General-purpose inverters for low-VCE(sat) products Audio amplifiers
600
5 10 15 20 30 50
15 20 -20
GT 60 M 3 03 A
Version Type number 1: N-channel 2: P-channel 3: N-channel with built-in freewheel diode
Table 1
Mark C D E F G H J K L Voltage (V) 150 200 250 300 400 500 600 700 800 Mark M N P Q R S T U V Voltage (V) 900 1000 1100 1200 1300 1400 1500 1600 1700
Withstand voltage rating (see Table 1) Collector current rating (DC) Discrete IGBT
Characteristics
1. Industrial Inverters
The addition of the fast switching (FS) series to the third-generation devices (high ruggedness) allows the construction of more efficient electronic equipment.
General-Purpose Inverters
UPS
PL Output
Characteristics
As shown below, third-generation IGBT is low-loss and low-noise when it use for inverter applications because of high switching speed, Low-saturation voltage and high-efficiency diodes. (comparision with Toshiba MOSFET) Low-saturation voltage with minimal temperature dependence Superior reverse-recovery characteristics due to built-in diode with optimal characteristics
Turn-on waveform
VCE
GT50J301
40
Collector Current IC (A)
0V
MOSFET
30
MOSFET
@VGE = 15 V
20 GT50J301: Tj = 25C Tj = 125C MOSFET(500V/50A): Tch = 25C Tch = 125C 0 2 4 6 8 Collector - Emitter Voltage VCE (V) 10
IC @ Tj = 125C VCC = 300 V VGE = + 15 V GT50J301 - 5V dIC/dtr 300 A/s (@50 A) t : 0.1 s/div, VCE : 100 V / div IC : 10 A / div
10
0A
60
Loss (W/Tr)
GT50J301 40 MOSFET
20
16
20
24
Typical waveforms
GT20J321(FS)
VGE
Ta = 25C
VCE IC LOSS IC
VGE
Tc = 125C
VCE IC LOSS
(LOSS: 0.5 mJ/div) (VCE: 50 V/div, IC: 5 A/div, VGE: 10 V/div, LOSS: 0.2 mJ/div, t: 2 s/div)
Reduced switching loss of fast switching products in comparison with high rugged products IC = 20 A, VGE = 15 V, RG = 33 , TC = 125C with inductive load VCC = 300 V
Turn-on loss
0.
J .9 m
mJ 1.1
High-rugged product
GT20J321
Turn-off loss
GT20J301
mJ 0.54
mJ 1.0
High-rugged product
GT20J321
8
GT20J301
Characteristics
High-rugged products with 600-V and 1200-V withstanding voltages (third generation)
With built-in diode
Package Product No. GT5J301 GT10J303 GT15J301 GT5J311 GT10J312 GT15J311 GT10J301 GT20J301 GT30J301 GT10Q301 GT15Q301 GT10J311 GT20J311 GT30J311 GT15Q311 GT50J301 GT25Q301 VCES (V) max 600 IC (A) DC max 5 10 15 5 10 15 10 20 30 10 15 10 20 30 15 50 25 PC (W) VCE(sat) (V) max typ. 2.1 28 2.1 30 2.1 35 2.1 45 2.1 60 2.1 70 2.1 90 2.1 130 2.1 155 2.1 140 2.1 170 2.1 80 2.1 120 2.1 145 2.1 160 2.1 200 2.1 200 tr (ns) typ. 0.10 0.12 0.12 0.12 0.12 0.12 0.12 0.12 0.12 0.07 0.05 0.12 0.12 0.12 0.05 0.12 0.10 tf (ns) typ. 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.16 0.16 0.15 0.15 0.15 0.16 0.15 0.16 VF (V) max 1.8 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 3.0 3.0 2.0 2.0 2.0 3.0 3.5 3.0 trr (ns) Remarks max 200 200 200 200 200 200 200 200 200 350 350 200 200 200 350 200 350
TO-220NIS
TO-220SM
600
600
TO-3P(N)
1200
TO-3P(SM)
TO-3P(LH)
TO-3P(N)
TO-3P(LH)
Fast switching (FS) series with 600-V withstanding voltage (fourth generation)
With built-in diode
Package Product No. GT5J321 GT10J321 GT15J321 GT20J321 GT30J324 GT50J325 VCES (V) max IC (A) DC max 5 10 15 600 20 30 50 PC (W) VCE(sat) (V) max typ. 2.0 28 2.0 29 1.9 30 2.0 40 2.0 155 2.0 200 tr (ns) typ. 0.03 0.03 0.04 0.04 0.05 0.07 tf (ns) typ. 0.05 0.03 0.03 0.04 0.05 0.05 VF (V) max 2.0 2.0 2.0 2.0 3.0 3.0 trr (ns) Remarks max 200 200 200 200 150 150
TO-220NIS
TO-3P(N) TO-3P(LH)
Characteristics
2. Microwave Ovens, Rice Cookers and Induction Heaters
Soft-switching circuits (current and voltage resonance type) that exhibit low switching loss are used in applications such as induction heaters (IHs) and IH rice cookers and microwave ovens. Toshiba offers a line of IGBTs with optimally low VCE(sat) and high switching speed which are especially suited to soft-switching circuits.
Microwave Ovens
IH Rice Cookers
Induction Heaters
Circuit Waveform
IC VCE VCE
VCES = 1500 V IC = 40 A
200 V ~ 240 V
Current Resonance
IC IC VCE VCE
10
Characteristics
IGBTs and Diodes for Voltage Resonance Circuits (with soft switching)
IGBT
AC Input Voltage Product No. GT15M321 GT40M101 100 V~120 V GT60M302 GT60M303 GT60N321 200 V~240 V GT40T102 GT40T301 VCES / IC 900 V / 15 A 900 V / 40 A 900 V / 60 A 900 V / 60 A 1000 V / 60 A 1500 V / 40 A 1500 V / 40 A FRD tf (s) VCE (sat) max max 0.4 0.4 0.37 0.4 0.4 0.4 0.4 2.5 3.4 3.3 2.7 2.8 5.0 5.0 (V) VGE / IC 15 V / 15 A 15 V / 40 A 15 V / 60 A 15 V / 60 A 15 V / 60 A 15 V / 40 A 15 V / 40 A Package TO-3P (IS) TO-3P (IS) TO-3P (LH) TO-3P (LH) TO-3P (LH) TO-3P (LH) TO-3P (LH)
1000-V withstanding voltage 1500-V withstanding voltage 1500-V withstanding voltage
Remarks
For ultra-low capacitance For Low capacitance
Remarks
Compact package 400-V withstanding voltage
11
Characteristics
3. Strobes
Thyristors previously used in strobe control circuits are today increasingly being replaced by IGBTs which have the following advantages. As a voltage-controlled device, the IGBT requires few drive circuit components. The small circuits possible with IGBTs fit compactly into small camera bodies. Strobe flash IGBTs are capable of switching large currents.
Xe Lamp
Regulator Controller
12
Characteristics
4-V to 4.5 V Gate Drive Series
The IGBT can be operated using a 4 ~ 45-V gate drive voltage. A gate drive power supply can be used as the common 5-V internal power supply in a camera, enabling the power supply circuitry to be simplified. To protect against insulator layer of the gates, zener diodes are included between the gate and emitter.
470
VCES / ICP 400 V / 130 A 400 V / 150 A 400 V / 150 A 400 V / 150 A
(V) VGE / IC 4.5 V / 130 A 4.5 V / 150 A 4.0 V / 150 A 4.0 V / 150 A
Package DP DP DP SOP-8
Remarks
13
Package Dimensions
Unit: mm
SOP-8
8 5
6.0 0.3 4.4 0.2
DP (straight)
6.8 max 5.2 0.2
2.0 max
DP (lead bend)
2.0 max
TO-220NIS
10 0.3 3.2 0.2
3.9 3.0
0.6 max
2.7 0.2
0.6 max
5.5 0.2
1.5 0.2
0.25 M
12.0 max
2.5
0.15 0.05
+ 0.1
5.5 max
0.1 0.05 1.5 0.2
0.6 0.15
0.6 max
5.0 0.2
2.5 max
0.1
1, 2, 3. 4.
Emitter Gate
0.1 0.1
5, 6, 7, 8. Collector
TO-220AB
10.3 max
3.0
TO-220FL
1.32
TO-220SM
1.32
2.0
TO-3P (N)
15.9 max 3.2 0.2
1.0 2.0 2.8
1 2 3
3.6 0.2
10.3 max
2.5 max
6.7 max
0.1
3 0.2 1.5
12.6 min
1.5
2.5 max
12.6 min
2.6 0.5
0.6
2.54 0.25
4.7 max
2.54 0.25
0.5
2.54 0.25
4.7 max 0.5 2.6
5.45 0.2
4.8 max
1. Gate 2. Collector 3. Emitter
3
2.6
1 2 3
1
1. Gate 2. Collector 3. Emitter
3
1. Gate 2. Collector 3. Emitter 1. Gate 2. Collector 3. Emitter
TO-3P (SM)
15.9 max 11.0
15.3 max
TO-3P (IS)
15.8 0.5 3.6 0.2
5.5 21.0 0.5
TO-3P (L)
3.5
20.5 max 3.3 0.2
6.0 26.0 0.5
TO-3P (LH)
20.5 max 3.3 0.2
6.0 2.50 1.5 2.0 11.0 26.0 0.5 20.0 0.6
1. Gate 2. Collector 3. Emitter
1.5
3.6 max
4.0
13.5
15.5
2.50
0.1
3.0
2.0 11.0
1.5
4.0
20.5 0.5
15.7 max
3.3 max
4.5
4.5 0.2
1 2 3
+ 0.1
2.6
0.5 0.2
1.1 0.2
2.3 2.3
2.54 0.25
13.0 min
0.95 max
0.9
0.4 0.1
5.5 0.2
5.6 max
1.1
1.1
15 0.3
1.2
0.6
1.5
20.0 0.6
1.5
19.4 min
5.45 0.15
5.45 0.15
1.5 2.8 5.2 max
5.0 max
5.45 0.2
0.6 0.15
+ 0.25
5.45 0.2
1.0 5.0 0.3
3.4
3.15 0.1
+ 0.2
14
2.0
50 TO-3P(L) 50 TO-3P(L) 50 IH 50 IH 50 IH 60 60 60 60 60 60 60 80 TO-3P(L) TO-3P(L) TO-3P(L) TO-3P(L) TO-3P(L) TO-3P(LH) TO-3P(L) TO-3P(L)
Strobe flash
8 TO-220NIS 600 8 TO-220SM 600 8 TO-3P(N) 1000 8 TO-3P(N) 1200 8 TO-220SM 1200 15 TO-3P(N) 600 15 TO-220NIS 600 15 TO-220SM 600 15 TO-3P(N) 1000 1200 15 TO-3P(N) 25 TO-3P(N) 500 25 TO-3P(N) 600 600 25 TO-3P(IS) 25 TO-3P(LH) 1200 50 TO-3P(L) 600 400 130(pulse) NPM 400 130(pulse) NPM 400 150(pulse) NPM 400 400 400 400 400 400 400 400 130(pulse) 130(pulse) 170(pulse) 130(pulse) 130(pulse) 100(pulse) 100(pulse) 150(pulse) TO-220NIS TO-220NIS TO-220NIS TO-220FL TO-220FL TO-3P(N) TO-3P(N) TO-3P(N)
15
010124 (D)
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The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in this document shall be made at the customers own risk.
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