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RC1602B-BIW-ESX
SPECIFICATION CUSTOMER:
DATE
FOR CUSTOMER USE ONLY
SALES BY
APPROVED BY
CHECKED BY
PREPARED BY
ISSUED DATE:
RC1602B-BIW-ESX
Contents
1. Revision History 2. General Specification 3. Module Coding System 4. Interface Pin Function 5. Outline dimension & Block Diagram 6. Display Control Instruction 7. Character Generator ROM Pattern 8. Instruction Table 9. Timing Characteristics 10. Initializing of LCM 11. Optical Characteristics 12. Absolute Maximum Ratings 13. Electrical Characteristics 14. Backlight Information 15. Reliability 16. Inspection specification 17. Precautions in use of LCD Modules www.DataSheet4U.com 18. Material List of Components for RoHs Page 3 4 5 6 7 8 11 12 13 15 17 18 18 19 20 21 25 26
1. Revision History
DATE 2008.06.17 VERSION 1 REVISED PAGE NO. Note First issue
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2. General Specification
The Features is described as follow: Module dimension: 80.0 x 36.0 x 13.2 (max.) mm3 View area: 66.0 x 16.0 mm2 Active area: 56.20 x 11.5 mm2 Number of Characters: 16 characters x 2 Lines Dot size: 0.55 x 0.65 mm2 Dot pitch: 0.60 x 0.70 mm2 Character size: 2.95 x 5.55 mm2 Character pitch: 3.55 x 5.95 mm2 LCD type: STN Negative, Blue Transmissive, Duty: 1/16 View direction: 6 oclock Backlight Type: LED white
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Item Description RRaystar Optronics Inc. 1 CCharacter Type 2 Display GGraphic Type Number of dotsCharacter 16 words, 2 Lines. 3 4 Serials code PTN Positive, Gray NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green BSTN Negative, Blue FFSTN Positive TFSTN Negative AReflective, N.T, 6:00 KTransflective, W.T,12:00 DReflective, N.T, 12:00 1Transflective, U.T,6:00 GReflective, W. T, 6:00 4Transflective, U.T.12:00 JReflective, W. T, 12:00 0Reflective, U. T, 6:00 3Reflective, U. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 NWithout backlight PEL, Blue green TEL, Green DEL, White CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 2Transmissive, U. T, 6:00 5Transmissive, U.T,12:00 YLED, Yellow Green ALED, Amber WLED, White OLED, Orange
LCD
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Backlight
FCCFL, White GLED, Green ES: English and European standard font. Special code X: Without Negative Voltage.
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16
A 4-O1.0 2.5 40.55 75.0 3.55 2.95 0.6 0.55 4- 2.5 PTH 4- 5.0 PAD 1.6 LED B/L 0.6
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Vss Vdd Vo RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K
12.55
10.3
5.7
15.76
18.3
31.0
0.3mm.
0.4
Com1~16
16X2 LCD
Seg1~40 Seg41~80
VR 10K~20K
Vdd Vo Vss
Seg Driver
Optional
N.V. Generator
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM. Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0
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Character Generator ROM (CGROM) The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be written, and for 510 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C h a ra c te r p a tte rn ( 1 )
H ig h
Low
* 0
* 0
Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1
H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
Low
0 0 0 0 0 0
C u rs o r p a tte rn
C u rs o r p a tte rn
H ig h www.DataSheet4U.com
Low
Low
H ig h * 0 * 0 * * * * * * * * * 0 * *
* 0
C u rs o r p a tte rn
: " H ig h "
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8)
LLLH
LLHL
LLHH
LHLL
LHLH
LHHL
LHHH
HLLL
HLLH
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HLHL
HLHH
HHLL
HHLH
HHHL
HHHH
8. Instruction Table
Instruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display Return Home Entry Mode Set Display ON/OFF Control Cursor or Display Shift Function Set Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM
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Description
Write 00H to DDRAM and set DDRAM address to 00H from AC Set DDRAM address to 00H from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift
1.53ms
1.53ms
0 0
0 0
0 0
0 0
0 0
0 0
0 1
1 D
I/D C
SH B
39s 39s
S/C R/L
39s
DL
39s
0 0
0 0
0 1
39s 39s
0s
1 1
0 1
D7 D7
D6 D6
D5 D5
D4 D4
D3 D3
D2 D2
D1 D1
D0 D0
43s 43s
9. Timing Characteristics
9.1 Write Operation
Typ
Max 25
Unit ns ns ns ns ns ns ns
Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time
9.2
Read Operation
Ta=25, VDD=5V Item Enable cycle time Enable pulse width (high level)
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Typ
Max 25
Unit ns ns ns ns
Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time
tAH tDDR tH
10 10
100
ns ns ns
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 1 1 0 * * * * Wait for more than 39us
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 * * * * 0 0 N F * 0 * * * * * 0 Wait for more than 39 s
Function set
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * Function set 0 1 0 * 0 0 0 * * * 0 0 N F * * * Wait for more than 37us
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control * * * 0 0 * 0 0 0 0 * * * 0 * 1 D C B 0 Wait for more than 37 s
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RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 * * 0 * 0 0 * 0 0 0 * * * 0 1 0 * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 * * * 0 0 * 0 * * * 0 1 0 0 I/D SH * Initialization ends
4-Bit Ineterface
RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 39us ait
BF can not be checked before this instruction.
RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 s ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear www.DataSheet4U.com 0 0 0 0 0 0 0 0 0 1 W for more than 1.53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends
8-Bit Ineterface
Intensity 100
Selected Wave
Selected Conition
Non-selected Conition
Non-selected Wave
10
Cr Max
Cr = Lon / Loff
100
90
Vop
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Driving Voltage(V)
Tr
Tf
[positive type]
[positive type]
Conditions : Operating Voltage : Vop Viewing Angle() : 0 0 Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias
= 270
= 90
= 0
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ILED32mA 25,50-60%RH, (Note 1)
Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum). www.DataSheet4U.com
pin15 pin16
A K
B/L
LCM
(Will never get Vee output from pin15)
15. Reliability
Content of Reliability Test (wide temperature, -20~70) Environmental Test
Test Item
High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. time. and the thermal stress to the element for a long time. Endurance test applying the electric stress under temperature for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 30min 5min 1 cycle fixed amplitude: 15mm Vibration.
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Content of Test
Condition
200hrs 200hrs 200hrs low -20 200hrs 60,90%RH 96hrs
Note
2 1,2 1
Endurance test applying the high storage temperature for a long 80 Endurance test applying the high storage temperature for a long -30 Endurance test applying the electric stress (Voltage & Current) 70
1,2
25
70
-20/70 10 cycles
30min
Frequency: Endurance test applying the vibration during transportation and 10~55Hz. using. One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS= 1.5k CS=100pF 1 time 3
Vibration test
Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container. Page 20 , Total 28 Pages
01
Electrical Testing
0.65
02
2.1 White and black spots on display 0.25mm, no more Black or white spots than three white or black spots present. on LCD 2.2 Densely spaced: No more than two spots or lines within (display only) 3mm 3.1 Round type : As following drawing =( x + y ) / 2
2.5
2.5 LCD black spots, white spots, 03 contaminatio www.DataSheet4U.com n 3.2 Line type : (As following drawing) (non-display) Length Width --L3.0 L2.5 --If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. W0.02 0.02W0.03 0.03W0.05 0.05W
2.5
04
Polarizer bubbles
2.5
NO 05
Item Scratches
AQL
Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:
06
Chipped glass
y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:
2.5
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y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is the total length of each chip.
NO
Item
Criterion
AQL
Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :
z: Chip thickness 0 zt
06
Glass crack
2.5
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z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa
y: Chip width
x: Chip length
NO 07
Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X Y
AQL 2.5 0.65 2.5 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5
08
09
Bezel
10
PCBCOB
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11
Soldering
11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.
NO
Item
Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it causes the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.
AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65
12
General appearance
Above limited value is set up according to RoHS. 2. Process for RoHS requirement (1) Use the Sn/Ag/Cu soldering surface the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp. Reflow250, 30 seconds Max. Connector soldering wave or hand soldering320, 10 seconds max. (3) Temp. curve of reflow, max. Temp.2355 www.DataSheet4U.com Recommended customers soldering temp. of connector280, 3 seconds.
Page: 1
1Panel Specification
Pass 1. Panel Type Pass 2. View Direction Pass 3. Numbers of Dots Pass 4. View Area Pass 5. Active Area 6.Operating Pass Temperature 7.Storage Temperature Pass 8.Others 2Mechanical Specification Pass 1. PCB Size Pass 2.Frame Size Pass 3.Materal of Frame Pass 4.Connector Position Pass 5.Fix Hole Position Pass 6.Backlight Position Pass 7. Thickness of PCB 8. Height of Frame to Pass PCB Pass 9.Height of Module Pass 10.Others www.DataSheet4U.com NG , NG , NG , NG , NG , NG , NG ,
NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,
Page: 2 Module Number 5Electronic Characteristics of Module Pass NG , 1.Input Voltage Pass NG , 2.Supply Current NG , 3.Driving Voltage for LCD Pass Pass NG , 4.Contrast for LCD Pass NG , 5.B/L Driving Method 6.Negative Voltage Pass NG , Output Pass NG , 7.Interface Function Pass NG , 8.LCD Uniformity Pass NG , 9.ESD test Pass NG , 10.Others
6Summary
Date