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DATA SHEET
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
CONTENTS
Process Information..........................................................................................................................................2 Equipment........................................................................................................................................................2 Pre-Treatment Recommendation for Plating on Plastics...................................................................................4 Working Parameters.........................................................................................................................................4 Make-Up..........................................................................................................................................................6 Maintenance.....................................................................................................................................................7 Effect of the Additives....................................................................................................................................8 Chloride.....................................................................................................................................................8 Cupracid CuStrike Make-Up.......................................................................................................................8 Cupracid CuStrike Replenisher..................................................................................................................8 Characteristics of the Additives during Electrolyte Cleaning...........................................................................9 Application Guidelines......................................................................................................................................9 Anti-Pitting Additives...................................................................................................................................10 SAP No. for Make - Up and Maintenance Products.........................................................................................10 Analytical Instructions.....................................................................................................................................11 Determination of Copper by Titration...........................................................................................................11 Determination of Chloride by Titration.........................................................................................................13 Determination of Sulfuric acid by Titration...................................................................................................15
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Process Information
Cupracid CuStrike is an electrolytic copper strike process based on sulfuric acid basis for plating on plastic applications. Cupracid CuStrike produces a first highly conductive copper strike deposit with good metal throwing power directly onto electroless nickel or after immersion copper. Cupracid CuStrike can be used before plating with Cupracid HT, Cupracid 210, Cupracid Ultra, Cupracid 300, Cupracid 5000 and Cupracid PL. Cupracid CuStrike produces bright, fine-grained, ductile deposits even at deeply recessed areas. Cupracid CuStrike minimizes burn off problems on the intersection of rack contacts and plastic parts and burnings at rack contacts. Cupracid CuStrike is a high temperature process, which is operated at temperatures up to 35 C. Cupracid CuStrike is an easy to control process with only one additive for replenishment.
Equipment
Filtration Continuous filtration required. To remove solid impurities a filtration rate of 5 6 tank volumes per hour is recommended. Filter area should be 10 20 cm2 per liter electrolyte volume. Mild steel with hard rubber lining or PVC/Polyester-reinforced material. Polypropylene. Required. Heat exchanger made of Graphite, PTFE, PVC or Polyethylene. Heating or cooling coils made of titan (grounded or anodically biased (to prevent bipolarity effects)).
Tank
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Mechanical agitation
Recommended. Additional usage of cathode rod agitation is advantageous in order to reach all parts of the rack by the air stream. horizontal vertical length of stroke 100 mm 60 mm double stroke/min 20 25 25 30
Cathode agitation should be preferably horizontal. Air agitation Required. The volume of air required for this purpose is approx. 10 20 m3 per hour and meter cathode rod length. The air agitation pipes are situated parallel to the cathode rod, approx. 50 80 mm above the bottom of the tank. Depending on the size of the tank, they are equipped with holes with a diameter of about 3 mm drilled at intervals of 80 100 mm at an angle of 45 to the bottom of the tank. Each pipe has two rows of holes set opposite to each other at intervals of 40 50 mm. It is advisable to install at least two agitation pipes (internal diameter 20 40 mm) in the bath. The distance between the pipes should be 150 250 mm. Suitable materials are PP, PVC or polyethylene. Anodes Special copper anodes with a phosphorus content of 0.03 0.06 %, like bar anodes or copper balls or clippings in titanium anode baskets are required. The anodes must be provided with bags made of special acidresistant, fully synthetic material (e.g. PP). Anode bag frames with suitable bags made of special fully synthetic material are applicable.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Working Parameters
Metal content Acid content pH-value Bath temperature Plating time Filter aid approx. 30 g/l Cu approx. 140 g/l sulfuric acid Less than 1; does not need to be monitored 35 C (32 38 C) 6 min (4 10 min) Diatomaceous earth or filter cellulose (A minor increase of additive consumption might occur for usage of diatomaceous earth) 1.0 2.5 V
Voltage
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Current density
Cathodic: Anodic:
To form the required anode film an anodic current density greater than 0.5 A/dm2 is needed. Current efficiency Anode : Cathode ratio Rate of deposition 100 % for cathode and anode 1:1 0.7 m Cu at 0.5 A/dm in 6 minutes
The numbers in the following table have been rounded up and down respectively to the full minute: Current density 0.3 0.4 A/dm2 0.5 A/dm2 0.6 A/dm2 0.7 A/dm2 0.8 A/dm2 A/dm2 Layer thickness in m 1 m 15 min 11 min 9 min 8 min 6 min 6 min 1.5 m 23 min 17 min 14 min 11 min 10 min 8 min 2 m 30 min 23 min 18 min 15 min 13 min 11 min
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Make-Up
Make-up of 100 l Cupracid CuStrike Water, deionized Copper(II)sulfate 5 H2O* Sulfuric acid (chem. pure, 96 % (w/w), d = 1.84 kg/l) Sodium chloride (chem. pure) Cupracid CuStrike Make-Up Cupracid CuStrike Replenisher * Fe: max. 0.1 % (w/w); Cl: max. 0.02 % (w/w) Liter approx. 85.0 --7.61 --0.3 0.02 kg approx. 85.0 12.0 14.0 0.0165 (16.5 g) 0.3 0.02
IMPORTANT NOTE: In all work with Cupracid CuStrike, make sure that all regulations on operations with sulfuric acid solutions are carefully observed!
Make-Up Sequence The copper sulfate is dissolved in half the amount of required DI-water in an extra tank made of PVC, polyethylene or stainless steel. To accelerate the dissolution of the copper sulfate the water should be heated up to 50 60 C. As soon as the copper salt is completely dissolved, 5 g/l powdered, activated carbon (low sulfur, low iron; suitable activated carbon can be purchased from Atotech) is added and is allowed to react for about 1 hour while stirring frequently and thoroughly. Afterwards the agitation is turned off for 3 4 hours to allow the activated carbon to settle to the bottom of the tank. The solution is filtered into the plating tank and filled with DI-water to nearly the required amount. The filtration needs to be carried out very carefully as residues of activated carbon particles can cause matt copper deposits. It is also necessary to clean thoroughly the filter afterwards to avoid later contamination by residues of activated carbon if the filter is used for the continuous filtration of the bath. The sulfuric acid is added to the clear blue plating solution while stirring vigorously (Caution! Wear safety goggles!). Make sure that the temperature does not exceed 60 C. Allow the plating solution to cool down to about 38 C. Add while stirring thoroughly sodium chloride diluted in small amounts of water and add also Cupracid CuStrike Make-Up and Cupracid CuStrike Replenisher required for the bath make-up. After make-up it is absolutely necessary to dummy plate the electrolyte for 5 Ah/l to form the anode film.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Maintenance
On Make-Up (During Operation) Copper Sulfuric acid Chloride ions 30 g/l (28 33 g/l) 140 g/l (135 145 g/l) 100 mg/l (90 110 mg/l) Operation Limits 25 35 g/l 130 150 g/l 80 120 mg/l
4.0 g/l of copper sulfate (CuSO4 5 H2O) increase the copper content by about 1 g/l. The dry copper sulfate should be dissolved in warm (40 60 C) DI-water and then treated with 10 mg activated carbon per 1 g copper sulfate (for about 1 hour). Remember to filter before adding to avoid carrying carbon into the plating bath. 0.57 ml/l sulfuric acid (chem. pure, 96 % (w/w), d = 1.84 g/cm3) increase the sulfuric acid content by about 1 g/l. The sulfuric acid must be added while thoroughly stirring in order to avoid local overheating. 16.5 mg/l sodium chloride (chem. pure) increase the amount of chloride ions by about 10 mg/l. Prior to addition, the sodium chloride must be diluted in a small amount of water.
9.0 l (8.0 10.0 l) Cupracid CuStrike Replenisher The consumption depends on the average current density, type of work, chloride concentration and the temperature of the bath. It is recommended that additions of Cupracid CuStrike Replenisher be made on a frequent basis ex. every 200 400 Ah.
If the number of Ampere hours is not 0.1 0.2 l (100 200 ml) Cupracid CuStrike Replenisher known, the following amounts should be The addition should be done in steps of 100 ml additive per added to 1000 l electrolyte when excessive 1000 l electrolyte. burning occurs in the HCD. If the copper content of the solution decreases below the standard during operation it must be replenished by adding copper(II)sulfate 5 H2O. For that procedure the salt will be dissolved in warm, DI-water and the solution is then treated with activated carbon as described for Make-Up. After thorough filtration the solution can be added to the bath.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Application Guidelines
In order to maintain the quality of the deposition, we recommend to carry out the following: The components of the bath should be analyzed regularly, in order to avoid high fluctuations in concentration. For the same reason, it is recommended to run periodically Hull Cell tests. If new titanium baskets and anode bags (made of polypropylene) are used, the following must be observed: The anode baskets are to be cleaned by means of hot degreasing, to avoid contamination of the electrolyte by oil and metal cuttings. Anode bags are cleaned first in a hot sodium carbonate solution (1.5 % (w/w)) to remove the impregnation followed by a neutralization in a 1 % (w/w) sulfuric acid solution. Evaporation losses must be replenished with DI-water.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Anti-Pitting Additives
Adverse construction of the air agitation equipment or porous filter systems, among other things, can cause small air bubbles, which are distributed in the electrolyte. These air bubbles adhere preferably at the bottom of the parts and partially disturb the deposition of copper so that pores are formed. Cupracid Super Wet 42 can be used as soon as those air pores occur. Cupracid Super Wet 42 should be added according to its data sheet.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Analytical Instructions
Version: 03
Doc.-No.: EXT-0410-TIT-03
Principle:
Complexometric Titration
Reagents required*: Ammonia solution 5 M; (5 N); (375 ml/l Ammonia solution 25 %); density 0.91 g/cm3) Indicator PAN (0.1% in alcohol) EDTA volumetric solution 0.1 M (EDTA = disodium salt of ethylenediamine tetraacetic acid)
Be sure to observe all local regulations concerning the permitted limits for pollutants, including the general regulations for hazardous materials!
Procedure: 1.0 ml** of the sample is placed into a 500 ml volumetric flask and dilute with 100 ml DI water. Carefully add 5 M of ammonia solution until the colour of the solution turns dark-blue (pH-value of 9.5 10.0 is reached). If the copper bath contains a substantial amount of iron, which can be recognized by the precipitated iron hydroxide, a fresh sample must be taken and the iron hydroxide held in solution by adding about 3.0 g of sodium potassium tartrate (Seignette salt), before addition of 5 M ammonia solution. After addition of few drops of indicator solution titrate with 0.1 M EDTA volumetric solution, until the colour of the solution changes from dark blue to green
The number of ml of 0.1 M EDTA volumetric solution*** used - multiplied with 6.354 gives the content of copper in g/l.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Example: During titration of 1.0 ml bath, 8.4 ml of 0.1 M EDTA volumetric solution was used. Calculation: 8.4 x 6.354 = 53.4 g/l copper.
Quality assurance: For maintenance, calibration of measuring devices and the use of standards and reference materials please refer to the corresponding guidelines.
* Unless otherwise stated, these are always analytical grade substances. ** Volumes given exact to a decimal point must be measured with a volumetric pipette. *** For the purpose of calculation, the factor of the standard solution is assumed to be 1.000 and is therefore not taken into account in the examples.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Version: 02
Doc.-No.: EXT-0412-TIT-02
Principle: Potentiometric Titration Reagents required* Hydrochloric acid 0.1 M; (0.1 N); (8.3 ml/l HCl, density 1.19 g/cm3) Silver nitrate volumetric solution 0.01 M; (0.01 N) (produced by topping up 100.0 ml of 0.1 M silver nitrate volumetric solution in a 1000 ml volumetric flask)
Titroprocessor or voltmeter with a millivolt scale Ag/AgCl Electrode with silver chloride coating
Be sure to observe all local regulations concerning the permitted limits for pollutants, including the general regulations for hazardous materials!
Coating of the silver electrode The silver electrode (silver wire 2 mm) is thoroughly degreased and connected to the positive pole of a directcurrent generator. A platinum electrode (platinum coil, positive pole for electroanalytical metal deposition) is connected to the negative pole. The electrodes are now immersed to a depth of about 5 - 6 cm in 0.1 M hydrochloric acid and electrolysed while stirring continuously for about 1 - 2 hours, at 1 - 2 mA. After this period of time the silver electrode should have a uniform brown appearance.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Procedure 50.0 ml** copper bath are placed into a 150 ml beaker and mixed with 50 ml of fully demineralized water. The solution is titrated with 0.01 M silver nitrate volumetric solution until the first turning point (potential jump)
Note: The Titration can be conducted only a turning point titration using a titroprocessor / voltmeter equipped with a Ag/AgCl electrode to determine the endpoint. No visual indication is possible.
The ml of 0.01 M silver nitrate volumetric solution used*** - multiplied with 7.09 gives the content of chloride ions in mg/l. Example: Titration of 50.0 ml sample consumed 10.75 ml of 0.01 M silver nitrate standard solution. Calculation 10.75 x 7.09 = 76 mg/l chloride
Quality assurance: For maintenance,calibration of measuring devices and the use of standards and reference materials please refer to the corresponding guidelines.
* Unless otherwise stated, these are always analytical grade substances. ** Volumes given exact to a decimal point must be measured with a volumetric pipette. *** For the purpose of calculation, the factor of the standard solution is assumed to be 1.000 and is therefore not taken into account in the examples.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Version: 02
Doc.-No.: EXT-0411-TIT-02
Reagents required*: Methyl orange indicator solution 0.1 % Sodium Hydroxide volumetric solution 0.1 M; (0.1 N); (4 g/l NaOH)
Be sure to observe all local regulations concerning the permitted limits for pollutants, including the general regulations for hazardous materials!
Procedure: 1.0 ml** of the sample are placed into a 250 ml volumetric flask and diluted with 100 ml of DI water. Add 5 drops of methyl orange indicator solution and titrate against 0.1 M sodium hydroxide volumetric solution until the color of the solution changes from red to yellow. Alternatively a titration processor with a pH electrode can be used (titration to the first point of equivalence)
The number of ml of 0.1 M sodium hydroxide volumetric solution used*** - multiplied with 4.9 - gives the content of sulfuric acid in g/l.
Cupracid CuStrike
Acid pre copper plating process for plating on plastics
Example: During titration of 1.0 ml of the bath, 11.9 ml of 0.1 M sodium hydroxide volumetric solution was used. Calculation: 11.9 x 4.9 = 58.3 g/l sulfuric acid.
Quality assurance: For maintenance, calibration of measuring devices and the use of standards and reference materials please refer to the corresponding guidelines.
* Unless otherwise stated, these are always analytical grade substances. ** Volumes given exact to a decimal point must be measured with a volumetric pipette. *** For the purpose of calculation, the factor of the standard solution is assumed to be 1.000 and is therefore not taken into account in the examples.
This sheet shall serve for your information. The content of the sheet is based on our best knowledge. We do not undertake any duty to advise. The contents of the sheet shall not be considered as an agreement on condition and quality of the goods delivered. The decision to use our products for its production purposes is the responsibility of our customer. We can accept liability only for the quality of our products at delivery. If difficulties arise in the application of our products, we propose that you contact our technical service department.
Atotech Deutschland GmbH P.O. Box: 21 07 80 10507 Berlin, Germany Erasmusstrae 20 10553 Berlin, Germany phone +49 (0) 30 349 85 0 fax +49 (0) 30 349 85 777