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Real-Time Operating Systems Displays Mil/Aero Electronics In This Issue...
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e tools for the busy EE
JANUARY 2012
p. 31
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MeaWelREV_LEDS_1003 1 3/2/10 1:26 PM
Vol. 54, No. 8 JANUARY 2012
coNteNts
PRODUCT
UPDATE
Connectors
and sockets
56
OUTLOOK
A new Co-Fe alloy
for MEMS
COVER STORY
36th ANNUAL Product of the Year Awards
31
ADN3000-06/11 Optical Receivers from Analog Devices
3LG Family of CrystalFree CMOS Oscillators
from Integrated Device Technology
IR3550 Buck Gate Driver from International Rectifier
KJ-33000 MEMS Joystick from Knowles Acoustics
LabMaster 9 Zi-A Modular Oscilloscope System
from LeCroy
LTC5569 Dual Active Downconverting Mixer
from Linear Technology
MAX44007 / MAX44009 Digital Ambient-Light Sensor ICs
from Maxim Integrated Products
MXC6226XC MEMS Thermal Accelerometer from MEMSIC
PXIe-5665 14-GHz PXIe VSA from National Instruments
EPIC PS25x01 Series Electric-potential Sensors
from Plessey
QHS710 802.11n 4x4 MIMO Chipset
from Quantenna Communications
22-in. Transparent Color LCD Panel
from Samsung Electronics LCD Business
SF-2200 SSD Processor from SandForce
MHP30-36 Metal Hybrid PPTC Circuit Protection
from TE Connectivity
PlanarMag E2101 10/100 Ethernet Media Filter
from TE Connectivity
BQ25504 Boost Charger IC from Texas Instruments
National LM5113 GaN Gate Driver from Texas Instruments
TMP006 MEMS IR Temperature Sensor
from Texas Instruments
Virtex-7 2000T Field-Programmable Gate Array from Xilinx
FEATURES
18
Displays
Changing the capacitive touch-sensing methodology
22
Real-Time Operating Systems
RTOS facilitates MCU power management
28
Using a RTOS in multicore-based MCU designs
ENERGY-SAVING INITIATIVE SERIES
46
sic MosFets offer superior switching
48
Power-efficient comm engines in FPGAs
C
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g
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a
p
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DEPARTMENTS
6
Viewpoint: Yeah, it may just be that simple
8
Product of the Year Story Behind the Story:
Judging the Product of the Year entries
11
OUTLOOK (Technology News)
Advanced electrode may aid large-scale power
storage
Alloy sensitive to magnetic fields could produce
new MEMS devices
Team demos control of magnetic thermal
fluctuations using current
APEC 2012 brings latest in power to Orlando
DesignCon 2012 begins Jan. 30
50
Product Teardown: Whats Inside
Apple iPhone 4S Mobile Handset
52
Product Application: Mil/Aero Electronics
Multicore DSPs support power-efficient,
high-performance UAVs
56
Product Update: Connectors and sockets
NEW PRODUCTS
62
Intergrated Circuits
64
Components & Subassemblies
71
Power Sources
74
Test & Measurement
77
Packaging & Interconnections
Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553.
Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or
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Want to see what the Editors are thinking?
www2.electronicproducts.com/electronicProductsBlogs.aspx
environmental benefits of smart meters
Maxim Integrated Products
From the education center:
5 things to know: IBMs racetrack memory chip
whats ONLINE...
11
Whats Inside
Apple iPhone 4S
Mobile Handset
50
ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012 5
VIEWPOINT
ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012
W
hen I was in China a month or so ago, I was
headed to lunch. I was in Beijing, and like with
many other big cities, the restaurant
was on an upper floor of the building. The
lobby of the building was under construc-
tion, not an uncommon thing in big
cities either. There were rickety-look-
ing scaffolding and construction
debris everywhere. There was
no back entrance, and the
building was not closed
off in any way. No sepa-
rate walkway, no tape
or ropes blocking it
off. Nothing. In fact,
anyone coming to
and fro just kept to
the side.
As I was passing
the site, one of the
workers dropped
a crowbar from 30
feet up or so. It
landed maybe three
feet to the left of my group.
No Chinese OSHA here, I
thought. No harm, no foul. We all
went on our way.
Two weeks later I was in New York
City. Like Beijing, there are always build-
ings under construction. There was a build-
ing, similar to the one in Beijing, that also
had its lobby under construction. The big dif-
ference was that the areas of the building being worked
on were completely sealed off to the public by boards. I
was hard-pressed to see a worker on the interior, almost
Yeah, it may just be
that simple
having to go out of my way to sneak a peek, and the only
debris I saw was what was already in a Dumpster.
My point is not to debate the value of human
life or safety, or whether hard hats should be
worn on a construction site. What occurred
to me is that we, in the United States,
have a lot of laws around safety. Hell,
we have a lot of laws around every as-
pect of life, government, technology,
etc. In China and many other coun-
tries there are noticeably fewer regu-
lations around certain areas.
There are pros and cons of
both. Really there are pros and
cons with any extremes. Few-
er laws and restrictions may
mean being able to produce
products more efficiently
and less expensively. More
laws mean human safety,
better products, and more
consumer rights.
Would we as Ameri-
can be willing to take a
little risk for cheaper
products? I mean, we do
it with smoking in some
ways. We know smoking
is bad for consumers
health, but we choose to sell
cigarettes. Im not really sure.
Maybe some of the laws we have
in place are all a bunch of Voodoo
anyway. Maybe its time to rethink so we can reinvent.
Bryan DeLuca
To comment on this Viewpoint visit www.eebeat.com
Or maybe its all a bunch of Voodoo anyway
Redefining energy measurement for the smart grid
Simply Brilliant
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EDITORIAL STAFF
516-227-1300 FAX: 516-227-1901
Content Operations Director Bryan DeLuca
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Managing Editor John Filippelli
516-227-1381 jfilippelli@hearst.com
Senior Editor Paul OShea
Power Sources, Power Management,
Discrete Semiconductors, Circuit Protection,
Cooling Devices
941-359-8684 poshea@hearst.com
Editor Christina Nickolas
Analog/Mixed-Signal ICs, Analog EDA Software,
Oscillators, Electromechanical Switches,
Prototyping Tools, Microwave Components
516-227-1459 cnickolas@hearst.com
Technical Editor Jim Harrison
Digital ICs, Boards & Peripherals, Development
Tools, Motors & Controls
415-456-1404 jpharrison@hearst.com
Editor Richard Comerford
Test & Measurement, Optoelectronics, Sensors &
Transducers, Enclosures, Cabinets, Chassis
516-227-1433 rcomerford@hearst.com
Contributing Editors Carolyn Mathas
Michael Kawa
Steve Evanczuk
Chief Copy Editor Leonard Schiefer
Custom Media Editor Beth Croteau
Online Researcher and Editor Jeffrey Bausch
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Electronic
products
Judging the Product of
the Year entries
PRODUCT OF THE YEAR
The STory Behind The STory
O
nce again, the editors of Elec-
tronic Products spent the past
couple of months research-
ing, analyzing, and debating with
each other for one purpose: Finding
products worthy of being called one
of Electronic Products 2011 Products
of the Year.
Our in-house team of experts pored
through hundreds of entries using
a strict set of criteria to select those
which reflected the pinnacle of inno-
vation, as well as a significant ad-
vancement in technology or its appli-
cation, and a substantial achievement
in price and performance.
This years crop of POY entrants
were extremely strong, making the
judging very difficult, and were very
excited to unveil the winners of this
years competition, said Bryan De-
Luca, Content Operations Director
for Hearst Electronics Group.
What resulted is a select group of
19 winners that not only stand alone,
but collectively reflect emerging
product trends for the industry in
2011 while offering a glimpse into
what we might expect in the future.
Cellular communications
One of the standout trends was a
move toward small-cell cellular
networks and communication con-
trollers to fit that application area.
The MEMSIC MSC6226XC Digi-
tal Accelerometer is one such prod-
uct, notable as it is not only consid-
ered the smallest production MEMS
accelerometer today, but also one of
the lowest-priced accelerometers on
the market.
Overall, many digital ICs were
submitted, especially DSPs, FPGAs,
and communication chips. Our edi-
tors noted that the FPGAs are larger,
lower cost, and faster, while the DSPs
are lower power and feature floating-
point operations.
Meanwhile, Ethernet and network
processors remained well represent-
ed, such as the E2101 single-port
10/100 Ethernet media filter and iso-
lation transformer from TE Connec-
tivity that embeds magnetic ferrites
into a single surface package. This
product is the first in a series of de-
vices configured for high-speed data
communications applications.
Other trends
Sensor technology also had a strong
showing this year. Specifically,
Plesseys EPIC sensor measures chang-
es in an electric field as a magnetom-
eter detects changes in a magnetic
field. The EPIC sensor will enable in-
novative new products to be made,
such as medical scanners that are sim-
ply held close to a patients chest to
obtain a detailed ECG reading or de-
vices that can see through walls, the
company notes.
Of course green is still in demand,
as our editors see companies provid-
ing higher power density, higher ef-
ficiency, more circuit integration,
better light-load efficiency, intelli-
gent power management, and small-
er packages, among other features.
There are many trends and prod-
ucts to absorb from this years win-
ners. To see all of the winners of the
2011 Product of the Year Awards,
turn to page 31 and visit www.elec
tronicproducts.com/productyear.aspx.
If you are searching for the most
innovative products to complete
your next design, start with this list
as each represents the best of 2011.
John Filippelli
Managing Editor
(L. to R.) EP Senior Editor Paul O Shea, Editor Richard Comerford, and
Technical Editor Jim Harrison debate POY candidates during this years judging.
ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012
COMMUNITY: element14.com
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News about Products... Product Technology... Product Applications OUTLOOK
Alloy sensitive to magnetic fields
could produce new MEMS devices
A
rare-earth-element-free al-
loy of cobalt and iron could
be the basis for a new class of
sensors and micromechanical sys-
tem (MEMS) devices controlled by
magnetism. The alloy was created
by a team led by researchers from
the University of Maryland (UMd)
and including researchers from Or-
egon State University, Rowan Uni-
versity, the National Institute of
Standards and Technology (NIST),
and the Russian Institute of Metal Physics, Urals Branch
of the Academy of Science.
The Co-Fe alloy exhibits gi-
ant magnetostriction, the phe-
nomenon in which an amplifed
change in dimensions occurs
when the material is placed in a
suffciently strong magnetic
feld. The effect can be used in
various ways, such as for creat-
ing sensitive magnetic-feld de-
tectors and micromechanical
actuators. Unlike piezoelectrics,
magnetostrictive elements can
be controlled by an external magnetic feld and dont
need to be wired up.
Advanced electrode may aid
large-scale power storage
T
he sun doesnt always shine and the
breeze doesnt always blow and therein
lie perhaps the biggest hurdles to making
wind and solar power usable on a grand scale.
Stanford researchers have developed a new
electrode that employs crystalline nanoparti-
cles of a copper compound that could be part
of a dream battery to store large quantities of
excess power generated on windy or sunny
days until we needed it.
The average lithium-ion battery can han-
dle about 400 charge/discharge cycles before
it deteriorates too much to be of practical use.
Grid tied batteries would have to handle
much more that this. In laboratory tests, the
new electrode survived 40,000 cycles of charging and dis-
charging, and after which could still be charged to more
than 80% of its original capacity.
Colin Wessells, a graduate student in materials science
and engineering, is the lead author of a paper describing
the research, published in Nature Communications. That
is a breakthrough performance a battery that will keep
running for tens of thousands of cycles and never fail,
said Yi Cui, an associate professor of materials science and
engineering, who is Wessells adviser and a coauthor of
the paper.
The electrodes durability derives from the atomic
structure of the crystalline copper hexacyanoferrate used
to make it. The crystals have an open framework that al-
lows ions to easily go in and out without damaging the
electrode. Most batteries fail because of accu-
mulated damage to an electrodes crystal struc-
ture. Because the ions can move so freely, the
electrodes cycle of charging and discharging is
extremely fast, which is important because the
power you get out of a battery is proportional
to how fast you can discharge the electrode.
To maximize the beneft of the open struc-
ture, the researchers needed to use the right
size ions. Too big and the ions would tend to
get stuck and could damage the crystal struc-
ture. Too small and they might end up sticking
to one side of the open spaces between atoms,
instead of easily passing through. The right-
sized ion turned out to be hydrated potassium,
a much better ft compared with other hydrated ions such
as sodium and lithium.
The researchers used a water-based electrolyte which
is basically free compared to the cost of an organic elec-
trolyte in lithium ion batteries. The signifcant limitation
to the new electrode is that its chemical properties cause
it to be usable only as a high-voltage electrode. But every
battery needs two electrodes a high-voltage cathode
and a low-voltage anode. The researchers need to fnd an-
other material to use for the anode before they can build
an actual battery. But Cui said they have already been
investigating various materials for an anode and have
some promising candidates. For more information see
http://mse.stanford.edu.
Jim Harrison
Fig. 1. This TEM
image taken at NIST
shows the two-
phase iron-rich
(shaded blue) and
cobalt-rich (shaded
red) structure of an
annealed cobalt-iron
alloy. The high
magnetostriction of
the alloy is due to
this structure and
the nanoscale
segregation.
Yi Cui, associate professor
of materials science and
engineering.
(Credit: Linda A. Cicero /
Stanford News Service)
OUTLOOK
APEC 2012 brings latest in power
to Orlando
T
he Applied Power Electronics Conference and expo-
sition (APEC) takes place at Disney Coronado
Springs Resort, Orlando, FL, from February 5 to 9. It
should be typical balmy, sunshiny days to help offset the
blues for engineers from the northern climes.
APEC 2012 will continue its tradition of addressing
Team demos control of magnetic
thermal fluctuations using current
A
team of researchers from the NIST Center for Na-
noscale Science and Technology, the University of
Muenster, and West Virginia University has dem-
onstrated control of magnetic thermal fuctuations us-
ing current. This development promises insight into
the complexity of spin current phenomena and
suggests a route for controllably manipu-
lating fuctuations in future magnetic
nanodevices. The complete work, reported
in the September 2 issue of Physical Review
Letters, represents an important step to-
ward manipulating the noise properties
of magnetic nanosensors and memory
devices.
The researchers measured the mag-
netic fuctuations of a 2-m-diameter
disk of a NiFe alloy (permalloy) using
microfocus Brillouin light scattering
while a current passed through a sup-
porting Pt strip. The current generated
a spin current, which was injected into the permalloy
disk through its back surface. While the electrons move
through the Pt strip, they scatter differently, depending
on each electrons spin. The electrons with up spin scat-
ter slightly toward the top surface and the electrons with
down spin scatter slightly toward the bottom.
This spin Hall effect drives a spin current, but not a
charge current, into the bottom of the magnetic disk.
The researchers were able to show that the thermal
fuctuations of the disks magnetization are sup-
pressed if the injected spins are parallel to the
magnets spins, and that the fuctuations are
strongly amplifed if the injected spins and
the magnets spins are antiparallel. By
changing the current down the Pt strip,
the fuctuations were controllably re-
duced to 0.5 times or increased to 25
times their thermal level. The measured
population of the disks magnetic excita-
tions is different from a thermal distribu-
tion, showing that the effect is not
simply cooling or heating. This re-
search gives an insight into the com-
plexity of spin current phenomena
and suggests a route for controllably manipulating fuc-
tuations in future magnetic nanodevices. For more infor-
mation, call Robert McMichael at 301-975-5121.
Christina Nickolas
The team of researchers used microfocus
Brillouin light scattering spectroscopy to study
the interaction of spin current with magnetic
fluctuations in a Permalloy microdisk located
on top of a Pt strip carrying an electric current.
The alloy might also offer both size and processing ad-
vantages over piezoelectric microdevices, says NIST mate-
rials scientist Will Osborn. Magnetorestriction devices
are less developed than piezoelectrics, but theyre becom-
ing more interesting because the scale at which you can
operate is smaller, he says. Piezoelectrics are usually ox-
ides, brittle and often lead-based, all of which is hard on
manufacturing processes. These alloys are metal and
much more compatible with the current generation of in-
tegrated device manufacturing. Theyre a good next-gen-
eration material for microelectromechanical machines.
To fnd the best mixture of metals and processing, the
team fabricated hundreds of 10-mm-long test cantilever
and coated them with a thin flm of alloy, gradually vary-
ing the ratio of cobalt to iron across the array of cantile-
vers. The researchers found that by heating the alloy to
annealing temperature and then quenching it, they cre-
ated a delicate, heterogeneous, nanoscale structure in
which cobalt-rich crystals were embedded throughout an
iron-rich crystal structure (see Figure 1).
The best annealed alloy showed a sizeable magneto-
striction effect in magnetic felds as low as about 0.01
Tesla. Magnetostriction was determined by measuring
the amount by which the alloy bent the tiny silicon can-
tilever in a magnetic feld,
According to team leader, Professor Ichiro Takeuchi of
UMd, the results are lower than, but comparable to, the
values for the best known magnetostrictive material (ter-
bium-dysprosium-iron, or Tb-Dy-Fe) but with the advan-
tage that the new alloy doesnt use any rare-earth ele-
ments, which are sometimes diffcult to obtain. Freezing
in the heterogeneity by quenching is an old method in
metallurgy, but our approach may be unique in thin
flms, he observes. Thats the beauty: a nice, simple
technique, but you can get these large effects. For further
information, contact Ichiro Takeuchi at takeuchi@umd.
edu, or 301-405-6809.
Richard Comerford
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V
FLOAT
= 10.8V
OUTLOOK
DesignCon 2012 begins Jan. 30
D
esignCon will be held at the Santa Clara Conven-
tion Center starting January 30, with the exhibits
area opening the following day. A
hundred-plus exhibitors will vie for your
attention as will eighty-eight 40-minute
technical sessions with topic such as
chip-level design for signal/power integ-
rity, PCB design tools and methodolo-
gies, and high-speed signal processing,
equalization and coding.
Other important events include the
daily keynotes held from 12 to 12:30.
These include Ilan Spillanger, Vice Presi-
dent of Hardware and Technology at Microsoft, on Mon-
day; Prith Banerjee, Senior Vice President of Research and
Director of HP Labs at Hewlett-Packard, on Tuesday; and
Joe Macri, Corporate Vice President and CTO of the Client
Division at Advanced Micro Devices, on Wednesday.
To give you a favor of what the exhibit foor (open Tues-
day and Wednesday 12:30 to 6:00 p.m.) will offer, here are
just three of the products that will be on display:
The IT5 high-speed next-gen mezzanine connector se-
ries from Hirose is structured with a helix contact inter-
poser and a new, better-grounding BGA receptacle. It han-
dles 25-Gbit signal lines. An embedded dc capacitor on the
interposer will be also available for easy board routing. The
company also has the IT-P high-power mezzanine connec-
tor which provides 50 A with a safety guiding wall for UL
1977 and wide foating range features also available.
FCI will feature its high-speed backplane connector
systems, high-speed I/O connections copper with optical
cable links, and Power SolutionsSM power distribution
connectors and cable assemblies at DesignCon 2012. Visit
Booth #414 to see AirMax VSe high-
speed backplane connectors, Mini-SAS
HD high-speed cable link products, Pwr-
Blade+ power distribution connectors,
and more.
The folks from Rohde & Schwarz will
be featuring their RTO series of oscillo-
scopes that is said to have the lowest noise
and highest dynamic range in their class.
The instruments include a real-time spec-
trum analysis function with 16 digital
channels that are all
tightly synchronized to
provide true multi-do-
main signal analysis. The
scopes also feature indus-
trys frst real time digital
trigger offers nearly zero
trigger jitter in all modes
and the instrument ac-
quires up to 1 M wave-
form acquisitions per sec-
ond, which enables the capture of rare signal events.
Jim Harrison
FCIs Mini-SAS HD high-speed cable link
backplane connectors
The RTO series of oscilloscopes from
Rohde & Schwarz
DesignCon 2012 will be held at the Santa Clara Conven-
tion Center. The conference extends from January 30 to
February 2. The exhibit hall is open Tuesday, January 31,
and Wednesday, February 1, from 12:30 to 6:00 p.m.
immediate and long-term interests for the power elec-
tronics engineer. Heres your chance catch up and keep
up to date with events in power. Include in that the per-
sonal attention you get when you
visit with the companies at their
booths or talk one-on-one with
presenters and technology ex-
perts. Here is where you can gath-
er insight into the trends with the
details you need. You can hear
speakers from the industry as well
as hear what researchers in the
universities are doing for the fu-
ture designs and products.
The plenary session starts at 1:30 and fnishes at 5:30
p.m. followed immediately by the exhibit hall welcome
reception. The exhibit hours on Tuesday are from noon to
5 p.m. and 10:15 a.m. until 2 p.m. on Wednesday.
The education seminars include tracks on topologies
and control, digital control, battery management, compo-
nents, EMI and surge protection, and sustainable energy.
There will be industry sessions that tackle energy harvest-
ing, power in hybrid electric vehicles, design for reliabil-
ity, LED lighting, Trends for ac-power loss of power mag-
netics, power electronics for electric vehicles, system
design, nanotechnology applications, components and
semiconductors, presentations on the electric grid.
The APEC lectures offer presentations on dc/dc con-
verters, solar energy harvesting,
lighting, inverters, converters,
electric machines and drives,
power supply on chip magnetics,
power electronics, rectifer and
inverter modeling, GaN and SiC
applications, grid connected in-
verter applications, EMI, model-
ing and simulation, and ac/dc
converters.
Poster sessions provide snap-
shots of presentations with access to the authors. They
will include posters investigating ac/dc converters, dc/dc
converters, power electronics for utility interfaces, motor
drives, system integration, modeling, renewable energy,
vehicular electronics, packaging, and more.
APEC also provides some fun times for attendees.
Wednesday night attendees with a social event ticket will
be transported to Universal Orlando and have access to
all the rides within The Wizarding World of Harry Potter
area.
Paul OShea
>>
Find out how LabVIEW can make you better at ni.com/labview/better 800 453 6202
2010 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, and ni.com are trademarks of National Instruments.
Other product and company names listed are trademarks or trade names of their respective companies. 2807
NI LabVIEW
Name
Dr. Laurel Watts
Job Title
Principal Software
Engineer
Area of Expertise
Chemical Engineering
LabVIEW Helped Me
Control multiple
instruments operating in
harsh conditions
Latest Project
Engineer the ultimate
storm chaser
LabVIEW makes me better because the
with hardware is so seamless
2807.indd 1 3/9/11 4:27:15 PM
Engineering
Distribution
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Semiconductors and electronic
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hile you cant always trust statistics a wise
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Displays
Changing the capacitive
touch-sensing methodology
Bring the touch functionality of consumer electronics to
industrial-grade displays can be highly challenging
BY MARK CAMBRIDGE
CEO
Zytronic
www.zytronic.com
T
he unbridled success of touch-
enabled user interfaces in
products such as smart-
phones, MP3 players, desk top
monitors, and tablet computers
over the last few years has been
driven by the all-round perfor-
mance and increased availability of
projected capacitive touch sensors.
Now manufacturers of industrial-
grade equipment are keen to bring
the same levels of touch function-
ality to their products with small
touch displays.
Achieving this functionality can
be highly challenging when using
the identical mutual capacitance
sensing methodology currently used
in consumer devices as the require-
ments for durability and longevity
are often very different and it can
be a struggle to deliver the neces-
sary overall robustness required for
some applications. An alterna-
tive projected capacitive sens-
ing methodology is needed,
which enables touchscreens to
cope with harsher environ-
mental conditions.
Touch sensor alchemy
A very large proportion of por-
table consumer touchscreens
rely on indium tin oxide (ITO) as
their active, conductive element.
With its combination of good
electrical conductivity and near
invisibility when deposited as a
thin film, this material has been
widely used in display and
touchscreen manufacture for many
years and is well understood.
ITOs ready availability has aided
the explosive growth of the touch-
screen market, with Table 1 testify-
ing to the current size and expected
growth in this dynamic market. The
combination of performance and
availability has resulted in ITO be-
coming the material of choice for
almost all consumer electronic
touchscreen applications, initially
with resistive, surface-capacitive,
and now projected-capacitive touch
sensor types.
Although these impressive fig-
ures are dominated by the expected
continued growth in portable con-
sumer devices, other application
areas will inevitably be addressed.
Until now, the ability for conven-
tional ITO-based small-format, pro-
jected capacitive touchscreens to
make inroads into the more de-
manding, industrial applications
has been hampered by the sensing
mechanism it relied on.
For all its benefits outperform-
ing both conventional surface capac-
itive and resistive alternatives mu-
tual capacitive ITO sensors
(where the capacitance be-
tween two electrodes is mea-
sured) exhibit relatively limit-
ed through-glass performance.
They are typically only capable
of reliably detecting touch
through overlays that are less
than 2 to 3 mm thick, which
cannot adequately protect the
display from the more exact-
ing physical strains found out-
side the relatively trouble-free
sphere of portable consumer
design.
For ITO to make real head-
way within more demanding
industrial applications, the domi-
nant mutual capacitance sensing
technique will not always be appro-
priate. An alternative sensing tech-
2009 2010 2011 2012 2013 2014 2015
Shipments
(million units)
607 800 987 1,161 1,341 1,538 1,735
Year on year
growth (%)
29.6 31.8 23.3 17.6 15.6 14.7 12.8
Revenue (million $) 4,332 6,177 7,646 8,900 10,146 11,331 12,432
Year on year
growth (%)
19 42.6 23.8 16.4 14.0 11.7 9.7
Source: 2010 Touch Market Analysis, DisplaySearch
Table.1: Touch module shipment and revenue forecast
(2009-2015)
Displays
For all its benefits, mutual
capacitive ITO sensors exhibit
relatively limited through-glass
performance. They are typically
only capable of reliably detecting
through overlays less than 3 mm
thick, which cannot adequately
protect the display from more
exacting physical strains
nique needs to offer the same
levels of touch performance and
functionality, but simultaneous-
ly provide a far greater degree of
ruggedness, handling high hu-
midity levels, extremes of tem-
perature, liquid ingress, and ex-
posure to chemicals.
A new perspective
The shortcomings of mutual
capacitive screens based on
ITO in industrial or other
challenging applications can
be overcome if, instead of bas-
ing the sensing mechanism
on mutual capacitance, a self-
capacitance approach is used.
Self-capacitance touch sensing
measures the capacitance of a
single electrode to ground,
with the field generated by the user
inducing alterations in the field
around the sensor matrix.
Frequency modulation across the
ITO electrodes (see Fig. 1) in the sen-
sor matrix means that, when the us-
ers finger approaches the surface of
the screen, a change in the waveforms
passing through the electrodes can be
determined. By measuring where this
change is most profound, the posi-
tion touch event on the x and y axes
can be accurately located.
Methodology benefits
Detecting picofarad-level changes
in capacitance means this approach
Fig. 1: With the frequency modulation technique used in projected
capacitive touch sensing, the frequency of the signal when the
finger far from the sensor (red) decreases when the finger is close
to the sensor (blue)
is extremely sensitive, and
provides the touchscreen
with greater dynamic z-axis
(depth) touch control. This
in turn allows activation to
be tuned to respond to the
lightest of touches, even
through a heavily gloved
hand, and through very
thick overlays of glass, plas-
tic and similarly non-con-
ductive materials.
The greater through-glass
performance of self-capaci-
tance ITO sensors means
they are far better suited to
heavy duty use. In addition,
with suitable touch control-
lers and application software,
gesture recognition and dual
touch functionality can be
incorporated into a wide range of
everyday industrial scenarios.
The benefits derived from ITO
touch sensors using self-capacitance
will allow small display and porta-
ble industrial devices with more ro-
bust user interfaces to enter the
market.
Changing the capacitive touch-sensing methodology
Displays
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RTOS facilitates MCU
power management
Power-aware real-time operating systems
take full advantage of available hardware facilities
BY ARVIND RAGHURAMAN
Embedded Software Engineer
Mentor Graphics
www.mentor.com
and
MIGUEL MORALES
Marketing Manager
Stellaris ARM Cortex-M
Texas Instruments
www.ti.com
A
pervasive trend in the embed-
ded space today is the relent-
less demand for increased end-
device functionality. The advent of
32-bit microcontrollers with en-
hanced features such as network con-
nectivity and advanced human-ma-
chine interfaces has drastically
increased the processing power and
functional capability available to
MCU-based devices. System designers
today are taking advantage of this de-
velopment to design fully functional,
feature-rich applications. However,
they still face challenges when it
comes to optimizing devices to oper-
ate within tight power budgets im-
posed by battery life and heat dissipa-
tion constraints of the system.
In order to help designers opti-
mize systems for power-efficiency,
silicon vendors provide various hard-
ware facilities to optimize and man-
age MCU power consumption. Pow-
er-aware real-time operating systems,
such as the Nucleus RTOS from Men-
tor Graphics, take full advantage of
these hardware facilities and provide
built-in power management capabili-
ties that enable developers to effec-
tively drive MCU power consump-
tion from application level. Its
important that system designers
have a good understanding of what
an RTOS can do for them for applica-
tion-driven power management.
There are four key aspects to re-
ducing MCU power consumption.
The first two process technology
and IC design are managed by sili-
con vendors. The last two applica-
tion-driven power management (en-
abled by a power-aware RTOS) and
system-level design (that is, the
placement of other electronic com-
ponents) are under the control of
the system designer.
Process technology/IC
design for optimized power
Process technology has traditionally
been the means for reducing power
consumption in an MCU, since
shrinking a design and lowering its
internal voltage yields significant
savings. For example, TIs Stellaris
LM4F Cortex-M4 based microcon-
troller implemented in a 65-nm pro-
cess balances high performance (up
to 80 MHz plus an FPU) with good
power efficiency (375 A/MHz ac-
tive, standby modes as low as 1.6 A)
to provide superior efficiency com-
pared to previous generations.
Silicon vendors have developed
innovative IC design techniques to
create distinct power domains with-
in the MCU and enable various low-
power operating modes. This allows
developers to shut down those sec-
tions of the MCU that are not in
use, based on the dynamic needs of
the application.
Some architectures even inte-
grate hibernate blocks with a com-
pletely independent voltage domain
from the rest of the microcontroller.
These hibernate blocks enable very
low power consumption by includ-
ing only the minimum number of
gates required (such as a low-fre-
quency oscillator, a real-time clock,
a small amount of RAM to save state,
and a wakeup mechanism to exit
from hibernate) to keep the system
breathing on a backup battery.
A system will consume the most
power in active state. The faster the
system can complete its tasks and
transition to a low-power mode,
the more efficient it will be (see Fig.
1a). Transitioning to low-power
modes causes systems to suffer loss-
es. The CPU takes time and power
to transition between power modes
(see Fig. 1b).
Developers can minimize mode
switching losses by reducing switch-
ing frequency. Silicon manufacturers
further improve power efficiency by
reducing the actual mode transition
time. For example, the Stellaris LM4F
microcontroller series supports wake
times as fast as 500 s. For ultra-low-
power applications that can operate
under 30 MHz, TIs 16-bit MSP430
MCU family can achieve operation at
less than 1 A with a 5-s wakeup.
Fig. 1: Silicon vendors have made significant progress in minimizing wake time to improve
power efficiency.
Real-Time Operating System
The importance of
a power-aware RTOS
With the addition of network con-
nectivity and advanced HMI func-
tionality, even simple applications are
no longer single-threaded systems. To
coordinate operation, as well as maxi-
mize use of an MCUs low-power ar-
chitectural capabilities, applications
need a power-aware RTOS.
An RTOS-based design provides
two key advantages for developing
power-efficient applications. First, the
multi-threaded application model en-
abled by using an RTOS provides an
enabling framework to switch the
system to low-power operating modes
during system idle time. Second, a
power-aware RTOS equips developers
with proven, well abstracted, ready-
to-use APIs for application-level con-
trol of peripheral power states, system
power states, and operating voltage
and frequency.
Optimizing dynamic power
consumption
During periods of low or no system ac-
Fig. 2a: Power
savings achieved by
Nucleus when
transitioning to
low-power states in
idle time.
32.768kHz
Crystals & Oscillators
FEATURES:
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Ultra miniature SMD packages
Available 20.0ppm & 10.0ppm set tolerance
Operating temperature range of -40C +85C
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Tel: 949.546.8000 | www.abracon.com
Offered in a variety of package and tolerance options, Abracons
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3.2 x 1.5 x 0.9 mm
4.9 x 1.8 x 1.0 mm
6.9 x 1.4 x 1.3 mm
8.0 x 3.8 x 2.5 mm
6.0 x 1.9 mm
Surface Mount Ultra Miniature packages for YOUR application
The Power of Linking Together
2.0 x 1.2 x 0.6mm
4.1 x 1.5 x 0.9 mm
3.2 x 1.5 x 1.0mm
3.2 x 2.5 x 0.9 mm
8.0 x 2.5 mm
tivity, the low-power modes provided
by the MCU can be effectively exploit-
ed by the operating system to achieve
run-time power savings. In addition to
switching the MCU to low-power
mode, other power-hungry blocks
present in the system can be transi-
tioned to low-power operating states
to maximize power savings.
For example, SDRAM modules can
be put in self-refresh mode during
long periods of inactivity. An OS
scheduler can make intelligent deci-
sions on the best low-power state to
switch to, based on the expected sys-
tem idle time and power cost of switch-
ing in and out of the low-power state
as compared to the expected power
savings.
Note that the calculated power sav-
ings may not be fully realized if the
CPU is frequently interrupted during
idle time. Figure 2a illustrates the pow-
er savings achieved by placing CPU in
idle mode and SDRAM in self-refresh
mode during system idle time.
Techniques such as OS tick sup-
pression can be used to prolong the
duration of CPU idle time, thereby
multiplying idle-time power savings.
Typical real-time kernels use a peri-
odic OS tick timer interrupt to evalu-
ate internal state and to make sched-
Fig. 2b: The Nucleus RTOS can
provide a 50x reduction in tick
frequency during periods of
system inactivity.
ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012 24 ELECTRONIC PRODUCTS www2.electronicproducts.com JANUARY 2012 24
From an Antarctic 55 C chill up to a 450 V electromotive
force and capacitance to 47,000 F the MLP atpack capacitor
delivers electrical energy for power holdup. The MLP is a high
performance aluminum electrolytic capacitor in a convenient
box shape that ts the square holes of power electronics and
is easily stackable into high energy modules. The 20-MLP
module shown can deliver 600 joules of energy. The MLPs
less than inch height makes it great for tight pitch rack as-
semblies too.
Full specs are at http://www.cde.com/catalogs/MLP.pdf
CAPACI TOR SOLUTI ONS FOR POWER ELECTRONI CS
Flatpack Blocks of Capacitance for Energy Storage
TYPE MLP and MLS CAPACITORS
TYPE MLP and MLS CAPACITORS
DSCC DRAWINGS 05018, 05019
LOW PROFILE 1/2 HEIGHT
NEAR HERMETIC LONG-LIFE WELDED SEAL
MLP: 50 YEAR LIFE, MLS: 100 YEAR LIFE
MLP and MLS > 25 YEAR SHELF LIFE
WITHSTANDS > 80,000 FEET ALTITUDE
COLD TO 55 C 250 V; 40 C, 300450 V
Hi g h E n e r g y S t o r a g e f o r Vo l t a g e Ho l d Up
uling decisions. Tick suppression
enables the kernel to dynamically
change the time period of the OS
tick timer interrupt based on the ex-
pected idle time, enabling the sys-
tem to stay in low-power modes for
longer periods of inactivity. Figure 2b
illustrates OS tick profiles with and
without tick suppression enableFor
longer periods of system inactivity,
such as when a device can go into hi-
bernation mode, RTOS systems will
use any hibernate facilities provided
by hardware to save and restore sys-
tem state. Most applications require
the peak processing capability of the
Fig. 3: Illustration
of power savings
achieved by
system power
state control.
underlying CPU
for only a small
percentage of its
o p e r a t i o n a l
time. Consider-
able power savings can be obtained
using dynamic frequency and volt-
age-scaling (DVFS) techniques. The
system developer can make applica-
tion-level decisions to pick an opti-
mal operating point depending on
the functionality required. A switch
from one operating point to another
requires:
1. all concerned peripherals be noti-
fied of the operating point change
request
2. peripheral activity be stopped
3. CPU clock, bus clocks, and periph-
eral clocks be changed for the new
operating point
4. CPU and peripheral activity be re-
sumed
A power-aware RTOS should ab-
stract these details and enable the
user to make application level DVFS
decisions.
Optimizing static power
consumption
Static power consumption in a sys-
tem can be directly attributed to the
number of peripheral blocks that are
active (clocked and powered ON) at a
given point in time. Although pow-
ering off peripherals that are not be-
ing used sounds fairly simple, the
implementation details of safely
switching between peripheral power
states during run-time in a multi-
threaded environment could get
complicated.
Power-aware RTOSes abstract these
implementation details and enable
developers to make high-level deci-
sions on peripheral power states. Fig-
ure 3 illustrates a hypothetical MP3
player leveraging Nucleus RTOS sys-
tem power states to optimize static
power consumption.
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Using a RTOS in multicore-

based MCU designs
A real-time operating system provides a framework for
multicore that can dramatically reduce time to market
BY JEAN J. LABROSSE
Founder, President, and CEO
Micrium
www.micrium.com
R
ecently introduced multicore-
based MCUs have raised the
complexity level of embedded
system designs. The use of an RTOS,
however, provides a framework for
multicore that can dramatically re-
duce time to market.
RTOS fundamentals
A real-time kernel is software that
manages the time of a CPU and en-
sures that critical tasks are processed
in a timely manner. The term real-
time operating system (RTOS) is of-
ten confused with real-time kernels; a
kernel is actually a subset of an RTOS.
An RTOS thus consists of a kernel and
possibly such additional services as a
file system (FS), a TCP/IP-stack, USB
stacks (device and/or host), a graphical
user interface (GUI), CANbus, and
possibly other components.
A full-featured RTOS is generally
not necessary for most embedded sys-
tems and in fact, its quite possible to
design a product using a subset of the
services available from an RTOS. For
example, a digital SLR camera might
only use a kernel, an FS, a GUI, and a
USB device stack.
Most 32-bit embedded designs
would benefit from the use of a real-
time kernel, given that a kernel offers
a framework to build upon as well as
the ability to split application code
into smaller, more manageable chunks.
The framework includes many useful
services for the application program-
mer such as multitasking; interrupt
management, intertask communica-
tion and signaling, resource manage-
ment, time management, memory
partition management, and more.
Most kernels used for embedded sys-
tems are preemptive, meaning that
the kernel always executes the most
important task that is ready to run.
Preemptive kernels are also event driv-
en, which basically means that tasks
are designed to wait for events to oc-
cur in order to execute. For example, a
task could wait for a timer to expire
and another task can wait for a packet
to be received on an Ethernet control-
ler, or another for a character to be re-
ceived on a UART.
Many embedded programmers shy
away from using a kernel because
they fear that kernels add too much
complexity to their application. It
turns out that you only need a hand-
ful of services to get your project off
the ground with a kernel. It is possible
to write fairly complex multitasking
application with the use of only five
API functions out of the nearly 70 API
calls offered by C/OS-III, for exam-
ple. You can thus build your kernel
knowledge as you are bringing your
application up.
Multicore in MCUs
Microcontrollers have traditionally
been equipped with single cores. How-
ever, using NXP Semiconductors
LPC4300 series as an example, there
are Cortex-M4 and Cortex-M0 cores
besides a full complement of peripher-
als including an Ethernet controller,
dual USB 2.0, quad UART, LCD con-
troller, motor control PWM, timers,
CAN 2.0, dual I
2
C, 10-bit ADC, 10-bit
DAC, AES decryption, and an Inter
Processor Communication (IPC).
This dual-core configuration is
called asymmetrical multiprocessing
(AMP) since the cores are not identi-
cal. AMP is generally the preferred
architecture when designing embed-
ded systems, given the dedicated na-
ture of such systems. Thus, unlike
general-purpose computers that are
used for different applications at dif-
ferent times, embedded systems gen-
erally have known functions at de-
sign time.
Performance is the first thing one
thinks about when considering the use
of a multicore device, but, just as im-
portant especially for battery-operated
embedded systems, multiple cores al-
low you to run your product slower and
thus reduce the power consumption
with basically the same performance as
a single-core system running at a much
higher frequency.
For the LPC4300, the Cortex-M0 is
designed as a slave to the Cortex-M4.
The CortexM0 core, used as an I/O
controller, offloads I/O and interrupts
from the Cortex-M4, which can be
used, unbothered, to perform control
algorithms (PID loops, state machines,
etc.) and computationally intensive op-
erations (audio compression/decom-
pression, image processing, filtering,
encryption, etc.). Figure 1 shows the re-
lationship between the Cortex-M4 and
the Cortex-M0 in the LPC4300 for a
possible industrial control system.
NXP provides code for the IPC, but
this does not preclude the use of other
IPCs such as the one defined by the
Fig. 1:
Industrial
controller
running on an
NXP LPC4300.
Multicore Association called Multicore
Communication Application Pro-
gramming Interface (MCAPI).
MCAPI provides a lightweight and
efficient communication stack. Com-
munication is performed using chan-
nels and a channel can be used to send
scalars or packets. The transport
mechanism for MCAPI is flexible and
can be shared memory, I/O ports, or
other on-board devices.
MCAPI, as well as tools to config-
ure and optimize multicore applica-
tions, is available from third parties
such as Polycore Software. Scalable to
any number of cores, it should be con-
sidered when migrating applications
to different CPU architectures using a
standard API instead of being locked
into a vendor-specific one.
Multicore and RTOSs
Having multiple cores doesnt render
obsolete the need for an RTOS kernel as
shown in Fig. 1. A kernel is still highly
desirable to make optimum use of both
cores. In fact, in the above example,
both cores run their own instance of
the same or possibly different kernels
to manage the multiple tasks.
Debugging a multiple-core system
is certainly more complicated than a
single-core system, but if you keep a
clean separation of functionality be-
tween cores then each can be de-
bugged in isolation and possibly by
different development teams. One
team could work on the Cortex-M4
code and another on the I/O devices
and then get together to integrate both
pieces. Obviously, each team would
have its own evaluating board so it
could develop and test software sepa-
rately prior to merging both pieces.
A kernel such as C/OS-III allows a
designer to determine CPU use on a
per-task basis and thus better optimize
the design by load balancing the tasks
between cores. This load balancing
would typically be done at design time
as opposed to run time. In other words,
having an RTOS kernel makes it easier
to move functionality between cores.
Ideally, both cores would be identi-
cal since that would allow both teams
to use the exact same tools and kernel
port. This would make development
slightly easier since you would not
have to deal with the slightly different
cores. Its quite possible that NXP and/
or other semiconductor manufactur-
ers will be introducing such devices in
a not so far future. Also, its quite un-
likely that these devices will be limited
to only two cores. AMP is very scalable
and in the coming years, we should
see MCUs with many cores showing
up on the market.
Multicore-based MCUs increase the
complexity of embedded system de-
signs but offers the benefit of increased
performance as well as lower power
consumption. Each core should use an
RTOS to make better use of the CPU
and its associated resources and func-
tions. Intercore communication
should be kept to a minimum to avoid
interdependencies.
About the author
Jean Labrosse is the founder, president,
and CEO of Micrium and the creator of
the C/OS-III family of products. He
has published several books including
C/OS-III, The Real-Time Kernel, avail-
able as a free PDF download at www.
micrium.com.
Using an RTOS in multicore-based MCU designs
JANUARY 2012
36th Annual
Product of the Year
Awards
Elect ronic
PRODUCTS PRODUCTS
Elect ronic
Analog Devices
ADN3000-06/11
Optical Receivers
Integrated Device
Technology
3LG Family of
CrystalFree CMOS
Oscillators
International
Rectifier
IR3550
Buck Gate Driver
Knowles Acoustics
KJ-33000
MEMS Joystick
LeCroy
LabMaster 9 Zi-A
Modular Oscilloscope System
Linear Technology
LTC5569
Dual Active
Downconverting Mixer
Maxim Integrated
Products
MAX44007 I MAX44009
Digital Ambient-Light
Sensor ICs
MEMSIC
MXC6226XC
MEMS Thermal
Accelerometer
National Instruments
PXIe-5665
14-GHz PXIe VSA
Plessey
EPIC PS25x01 Series
Electric-potential Sensors
Quantenna
Communications
QHS710
802.11n 4x4 MIMO
Chipset
Samsung
Electronics
LCD Business
22-in. Transparent
Color LCD Panel
SandForce
SF-2200
SSD Processor
TE Connectivity
MHP30-36
Metal Hybrid PPTC
Circuit Protection
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PlanarMag E2101
10/100 Ethernet
Media Filter
Texas
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BQ25504
Boost Charger IC
Texas
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National LM5113
GaN Gate Driver
Texas
Instruments
TMP006
MEMS IR
Temperature Sensor
Xilinx
Virtex-7 2000T
Field-Programmable
Gate Array
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mouser.com | The Newest Products for Your Newest Designs
Crystal-free
oscillators finally
enable quartz
device
replacement
36th Annual
Product of the Year Awards
As semiconductor technology contin-
ues to advance, the limitations of
quartz technology do not scale well
High-speed
optical receiver
ICs integrate
photodiode
The industrys first
commercially avail-
able 6- and 11-Gbit/
s integrated opti-
cal receivers, the
ADN3000- 06
and ADN3000-
11, consume
only 65 mW from a sin-
gle 3.3-V power supply while offering
typical sensitivity of -19 dBm OMA
(optical modulation amplitude) at 6
Gbits/s and 17 dBm OMA at 11 Gbits/
s. The 0.84 x 0.68 11-pad die-packaged
devices include the detector, tran-
simpedance amplifier, and power
monitor.
Manufactured on ADIs XFCB high-
speed complementary bipolar process
on bonded SOI, the ICs significantly
reduce system component count and
cut power consumption by at least
half, as compared to current solutions.
The devices cost only $3.95 and $5.95
each in 1,000 quantities. They are
wavelength agnostic and work across
all key optical wavelengths, including
850, 1310, and 1550 nm. With their
monolithic approach, they have a ful-
ly characterized interface between the
photo detector and the transimped-
ance amplifier, so designers dont have
to worry about bond wires interac-
tions.
Analog Devices
Wilmington, MA
Sales 800-262-5643
www.analog.com
60-A power stage
is cool-running,
targeting next-gen
servers
The IR3550 PowIRstage is a synchro-
nous buck gate driver with an inte-
grated synchronous MOSFET, and a
Schottky diode available in a 6 x 6 x
0.9-mm PQFN package. It targets
high-current multiphase buck regu-
lators and simplifies dc/dc converter
design for next-generation servers,
storage, and communication sys-
tems.
The gate driver delivers the high-
est benchmarked efficiency in the
marketplace for high current multi-
phase solutions and it does it at the
highest useful current rating of 60 A.
This allows customers to: 1. Increase
the main CPU dc/dc efficiency sig-
nificantly, saving energy and total
cost of ownership or, 2. Meet a simi-
lar efficiency to previous generations
but without a heat sink, saving space
and cost; or 3. Meet a similar effi-
ciency to previous generations but
with at least one, possibly two fewer
phases (For example, converting a
six-phase design to a five- or even
four-phase design) because of the
high current-handling capability
The MOSFET device achieves up
to a 97% efficiency at 1.2 V, has an
input voltage range to 25 V, and out-
put range from
0.25 to 3.3 V,
and a switching
frequency up to
1.0 MHz. It inte-
grates a current-
sense amplifier
and features a
synchronous di-
ode-emulation that removes the
zero-current detection and control
burden from the PWM controller.
The layout of the IR3550 allows few-
er decoupling capacitors compared
to other monolithic and multichip
devices that perform a similar func-
tion. IR shows cases where the heat is
removed from the printed circuit
board, without airflow or a heatsink
required, and to prove this capabili-
ty, the company provides reference
designs comparing the IR3550 to
competitive devices using the exact
same size, copper thickness, stackup,
and via configuration.
International Rectifier
El Segundo, CA
Sales 310-252-7105
www.irf.com
in price, size, fre-
quency, capacity,
and lead-time
like silicon-based
technology does.
Leveraging semi-
conductor econ-
omies of scale to
enable high performance, low price,
and short lead time, the 3LG family
of CrystalFree CMOS oscillators (see
www2.electronicproducts.com/Low_
power_CMOS_oscillator_offers_50_
ppm_frequency_accuracy-article-
hlcn03_dec2011-html.aspx) feature a
breakthrough 50-ppm frequency ac-
curacy while replacing traditional
quartz crystal-based oscillators for up
to 75% power savings in a broad range
of applications, including computing,
communications, and consumers
products.
They generate stable frequencies
up to 125 MHz and offer high-per-
formance phase jitter of less than 1
ps over the wide frequency offset of
12 kHz to 20 MHz. In addition, they
are the only technology and product
capable of replacing active XOs and
passive XTALs as both packaged de-
vices and die.
Integrated Device Technology
San Jose, CA
Sales 408-284-8200
www.idt.com
MEMS-based device
brings the feel of
a real joystick to
mobile devices
Its no surprise that one of the more
popular pastimes for the owners of
smartphones and tablets is playing
electronic games think Angry
Birds and serious gamers are eager
36th Annual Product of the Year Awards
Oscilloscope
system rises above
the pack, to 45 GHz
Among top oscilloscopes manufactur-
ers, there has rarely been a time when
one has been ahead of
its competition for
long. But in the past
year, the introduction
of a new oscilloscope
by LeCroy has left oth-
ers far behind. Not only
does the LabMaster 9
Zi-A provide a band-
width 45 GHz that is about 50%
greater than what its competition can
offer, but it also provides the highest
to embrace mobile technology too.
The problem is, the touch interface
such devices rely on is awkward; your
fingers are likely to get in the way of
the action. And while some hand-
held devices are employing optical
sensors, their lack of physical feed-
back slows down reaction times.
Enter the KJ-33000 from Knowles
Acoustics an ultra-low-power
MEMS-based joystick in a package
thats only 9.8 x 9.8 x 1.6 mm. The
device converts the joystick button
movement up to 1 mm from its
center into two 4-bit digital values
representing X and Y displacements,
while giving the user the feel of a
real stick with 360 variable-speed
scrolling and navigation.
To support hours of play and
work, the KJ-33000 has been de-
signed to operate at extremely low
power. Its current consumption is
only 40 A during active mode and a
mere 3 A in sleep mode. That re-
duces battery drain by a factor of 25
compared to optical joysticks and by
200 compared to Hall-effect sensors.
Knowles, Itasca, IL
Information 630-250-5100
info@knowles.com
www.knowles.com
sample rate of 120 Gsamples/s, and
can be configured with as many as 20
full-performance channels. This con-
figurability seriously lowers the cost of
multichannel oscillography, while
earning the instrument the right to
truly be called a modular oscilloscope
system.
The 9 Zi-A accomplishes all this
with a system architecture that sepa-
rates the oscilloscope signal acquisi-
tion function from the display, con-
trol, and processing functions.
Master acquisition modules contain
the display and control, as well as a
single acquisition module, while ser-
vant acquisition modules contain
add-on acquisition systems. Chan-
nelSync technology enables the mas-
ter and servants to synchronize per-
fectly, and a server-class CPU is in a
third module provides processing
power for the immense amounts of
data the system can collect.
The scopes higher bandwidth is
not merely an engineering tour de
force; it is needed by engineers devel-
oping and installing systems with
the high data rates demanded by
cloud computing and mobile com-
Ambient-light
sensors raise bar on
power consumption
and dynamic range
Digital ambient-light sensors (ALS)
control backlighting in LCD displays
Accelerometer
follows different
path to shrink size,
increase rugged-
ness, and more
Accelerometers
have become a
mainstay in con-
sumer electron-
ics, turning up
in devices from
s ma r t phone s
and tablets to
kids toys and steam irons. So for a
new company to make headway in a
market dominated by large players, it
has to offer something unique and
truly valuable. The MEMSIC MX-
C6226XC MEMS-based dual-axis ac-
celerometer does both, in spades.
The monolithic sensor is built us-
ing the manufacturers proprietary
MEMS thermal accelerometer tech-
nology and wafer-scale packaging
High-performance
VSA moves into
PXIe realm
Traditionally, the highest perform-
ing instruments have always been
monolithic, box instruments, be-
cause trying
to get high-
speed perfor-
mance from a
rack of card-
modules con-
nected by a
copper back-
plane has been a stumbling block.
The NI PXIe-5665 14-GHz three-
stage RF vector signal analyzer (VSA)
upsets that tradition by outperform-
ing box VSAs in several areas, at the
same time significantly reducing the
cost of such instrumentation.
The modulular VSA exceptionally
low phase noise of 129 dBc/Hz at a
10-kHz offset at 800 MHz, and an av-
erage noise level of 165 dBm/Hz, are
backed by other high-performance
specifications such as an industrys
best third-order intercept point of 24
dBm with an absolute amplitude ac-
curacy of 0.10 dB, as well as error
vector magnitude of 0.33% for a 256-
QAM modulated signal.
The VSA has a multicore comput-
ing architecture and uses NI Lab-
VIEW to employ its parallel program-
ming capabilities. It also offers
Dual-broadband RF
mixer enables 4G
MIMO multimode
receivers by drawing
300 mW/ch
In order to make LTE,
a 4G (fourth-genera-
tion) high-data-rate
wireless technology
attractive to the car-
rier for deployment,
basestation manufacturers worldwide
are trying to build a multiband, multi-
mode platform that is easily field con-
figured for use in any frequency band
and standard to make the deployment
cost attractive. The 26.8-dBm IIP3
LTC5569 dual-broadband RF mixer ac-
complishes this by combining 26.8
dBm IIP3, 300mW/ch, and a wide 300-
MHz to 4-GHz frequency range (see
www2.electronicproducts.com/26_8_
dBm_IIP3_dual_broadband_RF_mix-
er_draws_300_m W_charticlehlcn07_
jul2011-html.aspx).
So a receiver such as that based on
the LTC5569, is capable of working
in all of the 700-MHz, 880-MHz,
1.7-GHz, 1.8-GHz, 1.9-GHz, 2.4-
GHz, and 2.6-GHz bands. In addi-
tion, within each band, the receiver
must receive signals that are 60 MHz
wide, compared to the previous 20
MHz wide without sacrificing per-
formance. The LTC5569 meets both
of these requirements with outstand-
ing performance.
Linear Technology , Milpitas , CA
Sales Office 408-428-2050
www.linear.com
(WLP), a combination that produces
a very small, rugged device. At 1.2 x
1.7 x 1.0 mm, it is the smallest MEMS
accelerometer now in production.
And while other accelerometers may
withstand shocks to 10,000 G, the
MEMSIC device holds up under
50,000-G shocks. As a point of refer-
ence, a 10,000-G shock can be gener-
ated by simply banging a product on
a desktop; imagine how many Gs an
angry kid can generate by throwing
his electronic toy at a wall.
The monolithic IC includes all
the electronics needed for signal
conditioning as well as an embedded
microprocessor core to provide pro-
grammability and an 8-bit digital
output. And did I mention that, at
$0.35 in OEM quantities, its also the
lowest-priced accelerometer on the
market today?
MEMSIC, Andover, MA
info@memsic.com
www.memsic.com
munication. These designers really
need affordable multichannel scopes
with the highest bandwidths, and
they wont find a comparable instru-
ment anyplace else.
LeCroy, Chestnut Ridge, NY
Customer Care Center
800-453-2769
www.lecroy.com
that are used in
tablets, smart-
phones, and TVs.
Manufact urers
today not only
continue to strive
for lower power
with a wider dynamic range, but they
are also trying to improve spectral re-
sponse to closely match the human
eye for accurate light measurements,
especially when the top display glass is
tinted or dark in color. As a solution to
this concern, the MAX44007/
MAX44009 digital ALSs cut power
consumption by over 100 times that
of the nearest competitor (124 W).
The sensors feature an integrated
adaptive-gain block that automati-
cally selects the optimum gain range.
The MAX44009 can measure light
levels from 0.045 lux to 188,000 lux,
yielding a dynamic range of more
than 4,000,000 to 1. High sensitivity
becomes important when these sen-
sors are put behind black glass in
products. The black glass attenuates
almost 90% of the light. The signal is
reduced almost by a factor of 10, and
high sensitivity is needed to get a
better result.
Maxim Integrated Products
Sunnyvale, CA
Customer Service 800-998-8800
sales-us@maxim-ic.com
www.maxim-ic.com
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Electric-potential
sensor offers
fundamentally new
measurement
approach
Based on technology licensed from
the University of Sussex, U.K., the
EPIC (electrical potential integrated
peer-to-peer data streaming for sig-
nal processing and a flexible MIMO
architecture for phase-coherent mea-
surements. Priced starting at $49,999,
typical configurations cost about a
third less then monolithic instru-
ments.
National Instruments
Austin, TX
info@ni.com
www.ni.com/
circuit) PS25x01 series sensors are the
first to measure changes in an electric
field much as a magnetometer detects
changes in a magnetic field, requiring
no physical or
resistive con-
tact to take
readings. As
such, the sen-
sors enable all
sorts of new
products, the first being medical de-
vices that are simply held close to a pa-
tients chest, without wetting or shav-
ing off hair, to obtain a detailed ECG.
Traditional laboratory electrome-
ters and field mills have issues that
prevent their widespread use in elec-
tric potential sensing. Unlike them,
EPIC technology works at normal
room temperatures and functions as
an ultra-high-input impedance sen-
sor, using active feedback techniques
to both lower the effective input ca-
pacitance of the sensing element and
boost its input resistance. in effect, it is
a near-perfect voltmeter, highly stable
and able to measure tiny changes in
an electric field down to milliVolts.
The basic sensor technology itself
has great potential. It could enable de-
vices that can see through walls, con-
trol artificial limbs from a simple pad
on the skins surface, and detect eye
muscle movements for new human-
machine interfaces, all without the
need to implant electrodes. Further,
the sensors ability to detect move-
ment over distances ranging from a
few centimeters to several meters en-
ables applications in security systems
and for proximity control of lighting
and other electric appliances.
Plessey Semiconductors
Plymouth, U.K.
Sales 858-324-1086
sales@plesseysemi.com
www.plesseysemi.com
4x4 MIMO chipset
with digital dynamic
beamforming enables
wire-like performance
for challenging home
environments
Unleashing a new realm of wireless
video distribution that promises to
transform the way millions of people
transmit, share, and watch HDTV in
the home, the Quantenna QHS710
www.micropowerdirect.com
MicroPower Direct
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MPD offers over 2,500 standard,
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And new models are being added
all the time.
More Performance
At MPD we provide fast delivery,
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our products. When you need prod-
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issue, give us a call. We follow up.
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At MPD, low prices plus high per-
formance equals great value. So
dont sacrifice performance or
service for price. Call MPD today
for a surprisingly fast and low cost
quotation. For product datasheets
or free samples, go to:
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STRETCH YOUR BUDGET!
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T: (781) 344-8226 F: (781) 344-8481 E: sales@micropowerdirect.com
Color LCD is
transparently
unique
The transformation of the computer/
television display from cathode-ray
tube to solid-state device has brought
many new attributes to viewing
technology; larger and thinner
screens, more detailed and colorful
images, and better and more varied
touch control. But now a new LCD
technology has created a display
characteristic never before seen in
this space: transparency. At the same
time, the display is actually more
friendly to the environment than
previous devices.
The Samsung Transparent Color
Liquid Crystal Display Panel lets
viewers see through a vivid-color,
high-definition still or video to
whatever is behind it, and to interact
with the display through a transpar-
ent touch screen. Initially available
in a 22-in. size, larger versions, to 46
in., are also available now. Due to its
light weight, the panel is easy to at-
tach to other glass surfaces. Another
bonus of the design is that the panel
uses only about 90% of the power
consumed by conventional backlit
LCD panels, allowing it to operate
wirelessly on solar-replenished bat-
tery power.
In addition to notebook PCs, it is
expected that the transparent dis-
play will be used in a variety of new
applications, such as on coolers or
commercial freezers in supermar-
kets, on vending machines, in vari-
ous touch-accessed retail storefront
showcase applications, for smart
windows in homes or offices, or as
interfaces to interactive museum dis-
solution was offered as the
first fully compliant 802.11n
chipset with 4x4 MIMO, dy-
namic digital beamforming,
and support for four spatial
streams with unequal mod-
ulation. Support for four
spatial streams with un-
equal modulation per
stream enables up to 600
Mbit/s PHY data rates and
best-in-class performance.
Support for low-density
parity check (LDPC) en-
ables efficient error cor-
rection coding for superi-
or coverage and improved
range. The QHS710 chip-
set has a wide variety of
interfaces including dual
RGMII/MII, PCI-e, and SPI
flash, and its dual embed-
ded ARC processors pro-
vide full wireless Media
Access Control (MAC) and network
processing support.
Quantenna Communications
Sunnyvale, CA
Sales 408-331-9289
info@quantenna.com
www.quantenna.com
Visit our new website at:
www.datel.com
MIL/Aero & HI REL
40 Years of Innovation
SHM-14
MIL-STD-883
Sample/Hold
Amplifers
High speed:
10ns to 0.1%
25ns to 0.012%
35ns to 0.003%
Accurate: 0.5 LSB to 14-bit over Mil Temp. range
DAC-12100
MIL-STD-883
Digital-to-Analog
Converters
Ultra-high speed:
100MHz conversion rate
Low power: 650mW (typ.)
Low glitch energy: 3.0pV-s
Functionally complete:
16-bit, 20MHz sampling A/D
converter
Optimized dynamic performance:
signal-to-noise ratio (SNR) of 82dB.
Total harmonic distortion (THD) of
96dB at the Nyquist frequency.
ADS-938
MIL-STD-883
Analog-to-Digital
Converters
SSD processor accelerates
newest drives
The second-generation SandForce
SF-2200 SSD processor features a 6-
Gbit/s SATA host interface with an
unprecedented sustained sequential
read and write performance of 500
Mbytes/s. The chip targets SSDs used
in client computing applications
and supports state-of-the-art high-
speed ONFi2, and Toggle flash interfaces in single-level and
multi-level cell NAND flash SSDs, and has enabled a num-
ber of new SSDs to attain new performance milestones this
past year.
The IC also provides trusted Computing Group OPAL se-
curity with 256-bit AES encryption and automatic, line-rate
double encryption with a drive-level password. It has an ad-
vanced ECC engine correcting up to 55 bits per 512-byte
sector to assure high data integrity. The IC optimizes writes
to the flash and highly intelligent block management and
wear leveling extends flash endurance. PCB layout using the
SF-2200 is also enhanced because external DRAM is not
needed. SandForce has set a new standard for flash interface.
I wonder what the next year will bring.
SandForce, Milpitas, CA
OEM Sales 408 372-9000
sales@sandforce.com
www.sandforce.com
Best features of bimetal
breaker, PPTC device protect
battery-based tools
The MHP30-36 is a metal hybrid polymeric positive tem-
perature coefficient (PPTC) device that combines a bimetal
protector in parallel with a PPTC device. The hybrid device
offers 30-A hold current and an initial resistance of less
than 2 m. The PolySwitch (PPTC) polymeric positive
temperature coefficient provides resettable overcurrent,
overtemperature protection. The PolySwitch PPTC device
is a conductive polymer-based
thermistor. It is characterized by
either negative temperature coef-
ficient behavior (NTC) where the
resistance of the device decreases
with temperature, or positive tem-
perature coefficient (PTC), behav-
ior where the device resistance in-
creases with temperature. The
PPTC is made from a composite of semi-crystalline poly-
mer and conductive particles.
The MHP (Metal Hybrid PPTC) device combines a bi-
metal protector and a PolySwitch PPTC device. This com-
bination incorporates the best features of a bimetal break-
er and PPTC and allows the PPTC technology to be used
plays. In reality, potential applications for this new tech-
nology are only limited by the designers imagination.
Samsung Electronics LCD Business, San Jose, CA
www.samsung.com/us/business/oem-solutions/lcdpan-
els/index.html
Superior Solutions
for Industrial
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An IR temperature sensor
that opens up new apps
In todays smartphones, no contact-type sensor can be built
in to measure case temperature because of assembly con-
straints, and contact-less solutions have been too large and,
at prices greater that $5 in high volumes, cost-prohibitive.
Housed in a 1.6 x 1.6 x 0.625-mm WCS package, the TMP006
MEMS-based infrared temperature sensor changes that by
offering a low-cost, easy-to-add
solution for monitoring case
temperature. The device can not
only provides greater safety and
better system performance, but
it opens up a range of new possi-
bilities for cellular devices.
The highly integrated device
it incorporates a complete
thermopile sensor, signal conditioning, analog-to-digital
converter, and local temperature and voltage references on
a single monolithic IC can monitor the passive infrared
energy radiated by any object in front of it without physi-
cal contact. Thus the sensor can let consumer electronics
products measure temperature in the real world. For ex-
ample, if placed in smartphone adjacent to the camera
module, the sensor transforms the phone into a complete
A component that
marks the end of
hand-wound coils in datacom
Today, magnetic coils used for inductors and transformers
are traditionally wound by people, either by hand or by
winding machines that people control. Consistency var-
ies depending on the ex-
pertise of the workers, and
variations in the work force
has lead to extensive prod-
uct supply shortages and
quality issues. As a result,
the datacom industry, which has relied upon such coils
for its current high-speed data products, is looking for a
new coil solution that will let it advance reliably to high-
er, multi-gigahertz rates. Which is where the PlanarMag
E2101 Ethernet single-port media filter comes in.
The E2101 is a 10/100-MHz device that, for the first
time, eliminates the hand-wound coils by embedding
lithographically encoiled magnetic ferrites into an FR4
substrate and enclosing it into a small surface-mount
package. This filter, the first in a series of high-speed-
data-communication devices, can be placed on a printed
circuit board adjacent to a high-speed data interface, or
even integrated into a complete RJ-45 connector. While
the process by which these devices are made is similar to
the way in which semiconductors are manufactured, it is
a tightly kept secret, surrounded by numerous patents
both granted and pending. But the proof of its effective-
ness is available to anyone today in the E2101.
TE Connectivity, Harrisburg, PA
Product Information Center 800-522-6752
www.te.com/planarmag
in higher current applications. The MHP device can be
useful in dc-rated designs that require arc-suppressed,
latched, high-current protection. The resettable MHP30-
36 device provides excellent arc suppression characteris-
tics compared to standard breaker devices that must limit
the number of switching cycles since arcing between con-
tacts may damage them. During normal operation, be-
cause contact resistance is very low, most of the current
goes through the bimetal. When the contact begins to
open, contact resistance increases quickly. If the contact
resistance is higher than the PPTC devices resistance,
most of the current goes to the PPTC device and no (or
less) current remains on the contact, therefore preventing
arcing between the contacts. When current shunts to the
PPTC device, its resistance rapidly increases to a level
much higher than the contact resistance and the PPTC
heats up. After the contact opens, the PPTC device starts
to heat up the bimetal and keeps it open until the over-
current event ends or the power is turned off.
The MHP device is used for high-power Li-ion technol-
ogy such as portable or motive applications including
cordless power tools, medical devices, and e-bikes. In ad-
dition, customer interest in the core MHP technology has
led to some extensions of the technology to create three-
terminal MHP devices that enable external electronic ac-
tivation of the device via a signal line.
TE Circuit Protection Group
Menlo Park, CA
Technical assistance 800-227-7040
www.circuitprotection.com
Integrated POL Voltage Regulator
Product Selection Guide
Product Line Overview
Integrated design platforms that
enable customers to add energy-
conserving features that achieve
lower operating energy costs and
manufacturing Bill of Material
(BOM) costs.
Appliances
Audio
Display
Industrial
Lighting
SMPS
Product Line
Energy Saving Products
Optimized power management sys-
tem solutions that deliver bench-
mark power density, effciency and
performance in enterprise power.
Enterprise Power
Automotive grade power manage-
ment solutions qualifed to meet the
needs of 12V, 24V and HEV/EV appli-
cations with a zero defect goal.
Automotive
IR continues to lead the industry by
offering power MOSFETs with the
lowest R
DS(on)
and widest range of
packages up to 250V for a diverse
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Benchmark MOSFETs
Our discrete components, complex
hybrid power module assemblies
and rugged DC-DC converters uti-
lize leading-edge power technology
which, together with demanding
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engineers to meet their toughest
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Servers
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SupIRBuck
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07-11 | 10969A
Untitled-8 1 12/12/11 12:55 PM
SupIRBuck
Online Design Tool

Simplifes Design
Comprehensive online design
tool featuring parametric search,
schematic capture, AC, Steady State,
Transient Analysis, Thermal Analysis,
BOM creation, and more
The IR Advantage
Best-in-class efficiency over entire
load range
Common series footprint enables
cut and paste design, and scalability
allowing for faster time to market
Integrated solution offers high power
density with reduced component count
and improved performance
Single stage POL conversion saves energy,
size and cost by eliminating the need for an
intermediate bus
Low profile and excellent thermal
performance allows for back-side board
mounting for additional space savings
Wide input and output voltage range(s)
maximizes appeal for broadest
range of applications
Integrated Voltage Regulator Product Offering
Design Confguration Simulation
PCB Layout and
Thermal Analysis
Summary Design Requirements
mypower.irf.com/supirbuck
1 - 16V 1.5 - 21V 3 - 27V
5V bias required Integrated LDO 5V bias required
1-4A IR3843W IR3897* IR3853
4-6A
IR3842 IR3839* IR3863 IR3473
IR3842W IR3898* IR3856
IR3832W*
6-10A
IR3831W* IR3838* IR3859 IR3475
IR3841 IR3899* IR3865
IR3841W
10-15A
IR3840 IR3837* IR3476
IR3840W IR3477
15-35A
iP1827
iP1837
*DDR Tracking
15 35
Current (A)
SupIRBuck
1-10A
2-15A
12-35A
iPOWIR
Size(mm)
7.7x7.7
5x6
4x5
IR3840 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---
IR3841 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---
IR3842 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---
IR3840W 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---
IR3841W 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---
IR3842W 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---
IR3843W 5x6mm 2 16 5 0.7 PWM Y Y --- --- --- ---
IR3831W 5x6mm 8 16 5 0.7 PWM --- Y --- --- Y ---
IR3832W 5x6mm 4 16 5 0.7 PWM --- Y --- --- Y ---
IR3837 5x6mm 14 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---
IR3838 5x6mm 10 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---
IR3839 5x6mm 6 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---
IR3859 4x5mm 9 21 5 0.7 PWM Y Y Y --- --- Y
IR3856 4x5mm 6 21 5 0.7 PWM Y Y Y --- --- Y
IR3853 4x5mm 4 21 5 0.7 PWM Y Y Y --- --- Y
IR3899 4x5mm 9 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y
IR3898 4x5mm 6 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y
IR3897 4x5mm 4 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y
iP1837 7.7x7.7mm 35 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y
iP1827 7.7x7.7mm 25 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y
IR3473 4x5mm 6 27 5 0.5 COT* --- Y --- --- --- Y
IR3475 4x5mm 10 27 5 0.5 COT* --- Y --- --- --- Y
IR3476 5x6mm 12 27 5 0.5 COT* --- Y --- --- --- Y
IR3477 5x6mm 15 27 5 0.5 COT* --- Y --- --- --- Y
IR3863 4x5mm 6 21 5 0.5 COT* --- Y --- --- --- Y
IR3865 4x5mm 10 21 5 0.5 COT* --- Y --- --- --- Y
* Constant On Time control offers improved light load effciency
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Untitled-8 2 12/12/11 12:55 PM
SupIRBuck
Online Design Tool

Simplifes Design
Comprehensive online design
tool featuring parametric search,
schematic capture, AC, Steady State,
Transient Analysis, Thermal Analysis,
BOM creation, and more
The IR Advantage
Best-in-class efficiency over entire
load range
Common series footprint enables
cut and paste design, and scalability
allowing for faster time to market
Integrated solution offers high power
density with reduced component count
and improved performance
Single stage POL conversion saves energy,
size and cost by eliminating the need for an
intermediate bus
Low profile and excellent thermal
performance allows for back-side board
mounting for additional space savings
Wide input and output voltage range(s)
maximizes appeal for broadest
range of applications
Integrated Voltage Regulator Product Offering
Design Confguration Simulation
PCB Layout and
Thermal Analysis
Summary Design Requirements
mypower.irf.com/supirbuck
1 - 16V 1.5 - 21V 3 - 27V
5V bias required Integrated LDO 5V bias required
1-4A IR3843W IR3897* IR3853
4-6A
IR3842 IR3839* IR3863 IR3473
IR3842W IR3898* IR3856
IR3832W*
6-10A
IR3831W* IR3838* IR3859 IR3475
IR3841 IR3899* IR3865
IR3841W
10-15A
IR3840 IR3837* IR3476
IR3840W IR3477
15-35A
iP1827
iP1837
*DDR Tracking
15 35
Current (A)
SupIRBuck
1-10A
2-15A
12-35A
iPOWIR
Size(mm)
7.7x7.7
5x6
4x5
IR3840 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---
IR3841 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---
IR3842 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---
IR3840W 5x6mm 12 16 5 0.7 PWM Y Y --- --- --- ---
IR3841W 5x6mm 8 16 5 0.7 PWM Y Y --- --- --- ---
IR3842W 5x6mm 4 16 5 0.7 PWM Y Y --- --- --- ---
IR3843W 5x6mm 2 16 5 0.7 PWM Y Y --- --- --- ---
IR3831W 5x6mm 8 16 5 0.7 PWM --- Y --- --- Y ---
IR3832W 5x6mm 4 16 5 0.7 PWM --- Y --- --- Y ---
IR3837 5x6mm 14 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---
IR3838 5x6mm 10 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---
IR3839 5x6mm 6 16 4.5 - 16 0.6 PWM Y --- Y Y Y ---
IR3859 4x5mm 9 21 5 0.7 PWM Y Y Y --- --- Y
IR3856 4x5mm 6 21 5 0.7 PWM Y Y Y --- --- Y
IR3853 4x5mm 4 21 5 0.7 PWM Y Y Y --- --- Y
IR3899 4x5mm 9 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y
IR3898 4x5mm 6 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y
IR3897 4x5mm 4 16 4.5 - 16 0.5 PWM Y --- Y Y Y Y
iP1837 7.7x7.7mm 35 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y
iP1827 7.7x7.7mm 25 16 3.3 / 5 0.6 PWM --- Y --- --- --- Y
IR3473 4x5mm 6 27 5 0.5 COT* --- Y --- --- --- Y
IR3475 4x5mm 10 27 5 0.5 COT* --- Y --- --- --- Y
IR3476 5x6mm 12 27 5 0.5 COT* --- Y --- --- --- Y
IR3477 5x6mm 15 27 5 0.5 COT* --- Y --- --- --- Y
IR3863 4x5mm 6 21 5 0.5 COT* --- Y --- --- --- Y
IR3865 4x5mm 10 21 5 0.5 COT* --- Y --- --- --- Y
* Constant On Time control offers improved light load effciency
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Untitled-8 3 12/12/11 12:55 PM
Integrated POL Voltage Regulator
Product Selection Guide
Product Line Overview
Integrated design platforms that
enable customers to add energy-
conserving features that achieve
lower operating energy costs and
manufacturing Bill of Material
(BOM) costs.
Appliances
Audio
Display
Industrial
Lighting
SMPS
Product Line
Energy Saving Products
Optimized power management sys-
tem solutions that deliver bench-
mark power density, effciency and
performance in enterprise power.
Enterprise Power
Automotive grade power manage-
ment solutions qualifed to meet the
needs of 12V, 24V and HEV/EV appli-
cations with a zero defect goal.
Automotive
IR continues to lead the industry by
offering power MOSFETs with the
lowest R
DS(on)
and widest range of
packages up to 250V for a diverse
range of applications.
Benchmark MOSFETs
Our discrete components, complex
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and rugged DC-DC converters uti-
lize leading-edge power technology
which, together with demanding
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engineers to meet their toughest
design challenges.
HiRel
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DirectFET
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FETKY
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Power Modules/Hybrid Solutions
Motor Control Solutions
DC-DC Converters
Digital Control ICs
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10328C
www.irf.com
07-11 | 10969A
Untitled-8 4 12/12/11 12:55 PM
Stacked silicon
interconnect
technology yields
huge FPGA
The Xilinx Virtex-7 2000T field-pro-
grammable gate array is the worlds
highest-capacity pro-
grammable logic
device. It has
6.8 billion
transis-
tors and 2
million logic
cells equivalent
to 20 million ASIC
gates. This capacity is made possible
by stacked silicon interconnect tech-
nology, or whats known as 2.5D IC
stacking. The FPGA uses through-hole
vias and an interposer.
The devices silicon interposer lay-
er acts as a sort of microcircuit board
in silicon on which multiple die are
set side by side and interconnected.
SSI technology avoids the power and
reliability issues that can result from
stacking multiple dies on top of each
other. Engineers are using the 2000T
FPGA to replace large capacity ASICs
and for the all-important prototyp-
ing and emulation of advanced ASIC
designs. Having a large ASIC simu-
lated in one FPGA chip increases
timing accuracy and thus reduces
the risk of very costly re-spins.
The price of this device has not
been released - but you can be as-
sured this chip is not what you would
call low cost.
Xilinx, San Jose, CA
Sales 408-559-7778
www.xilinx.com
Driving GaN FETs
becomes reality
The National LM5113 is the industrys
first 100-V half-bridge gate driver opti-
mized for use with enhancement-
mode GaN power field-effect transis-
tors (FETs) in high-voltage power
converters. This is significant because
GaN FETs have an absolute maximum
gate-to-source voltage rating of 6 V.
Any voltage above this value will dam-
age the device. GaN FETs also have a
low threshold voltage that could be
triggered during
transient events
that, through
PCB parasitic,
could cause the
device to prema-
turely turn on
and cause dam-
age. This device
includes a low-impedance gate drive
source, which helps to minimize this
false triggering.
The device is a highly integrated
high-side and low-side GaN FET driver
that reduces component count by 75%
and shrinks PCB area by 85% com-
pared to discrete driver designs. The
half-bridge gate driver meets the strin-
gent requirements of enhancement-
mode GaN FETs. Using proprietary
technology, the device regulates the
high-side floating bootstrap capacitor
voltage at approximately 5.25 V to op-
Boosting extremely
low power makes
energy harvesting
very attractive
The bq25504 boost charger IC pro-
vides a simple innovative solution in
a single IC for boosting power for en-
ergy-harvesting applications. It
solves several energy-harvesting is-
sues customers have been struggling
with, and that
have prevent-
ed them from
offering end
e q u i p me nt
that fully use
e ne r g y- ha r-
vesting capa-
bilities. The
boost charger manages the micro-
watts to milliwatts of power generat-
ed from a number of sources, such as
solar, thermal electric, electromag-
netic and vibration, and stores the
extracted energy in various storage
elements, including Li-ion batteries
and super capacitors. It includes cir-
cuitry to protect the energy storage
element from over voltage and under
voltage conditions, and to kick-start
the system when the battery is deep-
ly discharged. Other specs include a
power range from 5 W to 300 mW,
The boost charger increases the us-
able harvested energy 30% to 70% in
a solar panel compared to a linear
regulator, to power a handheld de-
vice operating in indoor light condi-
tions. It has a 330-nA typ quiescent
current and a conversion efficiency
of >80%. The programmable device
can be used with a variety of energy
sources and energy storage elements,
such as different battery chemistries
or super capacitors, and features a
330-mV cold-start voltage.
The boost converter interfaces to
various energy sources such as ther-
moelectric generators, electromag-
netic coils, single photovoltaic cells,
and infrared emitters. The device
does not distinguish between imped-
ance of sources as it modulates the ef-
fective impedance of the energy
transfer circuitry to regulate the in-
put voltage to the sampled reference
voltage and effectively maximizes the
power extracted from the energy
source. Some solutions on the market
have essentially half the function of
the bq25504 without the optional
full-wave rectifier, which means a
regulation and battery charging cir-
cuit is still needed. This 9-mm2 de-
vice has all the specs to aid your en-
ergy-harvesting designs but add to
that the very competitive price and
minimal supporting parts needed, in-
cluding the Li-ion cell, an inductor,
resistors, and capacitors, and youre
looking at a very attractive sum of
about $5 for the whole BoM.
Texas Instruments
Dallas, TX
www.ti.com
timally drive eGaN power FETs with-
out exceeding the maximum gate-
source voltage rating. It offers
independent sink and source outputs
for flexibility of the turn-on strength
with respect to the turn-off strength.
A low-impedance pull-down path of
0.5 provides a fast turn-off mecha-
nism for the voltage, and features an
integrated high-side bootstrap diode
to further reduce PCB real estate. The
device also provides independent logic
inputs for the high-side and low-side
drivers.
Texas Instruments
Dallas, TX
www.ti.com
portable measurement system. Just
point the phone at what youd like to
measure and use the camera to aim.
So you could use your phone for tasks
ranging from checking to see if a ba-
bys milk is at a safe temperature to
basic medical diagnosis.
Texas Instruments
Dallas, TX
www.ti.com
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an electronic products special series
EnErgy-saving
InItIatIve
SiC MOSFETs offer
superior switching
The commercialization of SiC technology for switching devices
represents a revolutionary change in power electronics
BY BOB CALLANAN, SiC Power
Products Applications Manager
Cree
www.cree.com
I
n power electronics applications,
the compound semiconductor sili-
con carbide (siC) has been demon-
strated in published literature to be a
superior material to silicon (si) in
many properties for the construction
of power switching devices. With a
bandgap that is approximately 3X
wider than silicon, siC devices also
exhibit significantly lower leakage
current at high-temperature opera-
tion by more than two orders of
magnitude.
in Figs. 1 and 2, the forward con-
duction characteristics of si MOs-
FETs, trench field stop (TFs) insulated
gate bipolar transistors (igBTs), non-
punch-through (nPT) igBTs are com-
pared with those of siC MOsFETs at
25C and at 150C.
as shown in Fig. 3, the silicon MOs-
FETs normalized on-state resistance
(r
Ds(on)
) increases by more than 250%
from 25C to 150C, while the r
Ds(on)
of
the siC MOsFET increase just 20%
over the same temperature range. The
impact of this characteristic on the
thermal design of a power electronics
system is significant, including the re-
duction of up to 50% of the thermal
management hardware (fans and/or
heatsinks).
The siC MOsFET, as a majority
carrier switch, effectively eliminates
the minority carrier current tail ex-
perienced with silicon igBTs (see Fig.
4), resulting in much lower switching
losses and facilitates much easier par-
alleling of switching devices.
at the 1,200-v rating, siC MOsFETs
may be specified in virtually any ap-
plication that currently employs
1,200-v silicon igBTs, especially for
those applications requiring higher
operating frequency and higher sys-
tem efficiencies. Figure 5 graphically
depicts the application area for siC
MOsFETs vs. silicon igBTs, including
solar power inverters, wind turbine in-
verters, motor drives, induction heat-
ing systems, as well as high-voltage
dc/dc converters.
There are two design characteris-
tics that must be observed when ap-
plying siC MOsFETs in a power elec-
tronics circuit the elimination of
the turn-off tail current exhibited
by silicon igBTs; and a modest trans-
conductance that needs to be factored
into the gate drive circuit design.
although the
elimination of the
tail current is a
significant advan-
tage of the siC
MOsFET over the
silicon igBT, it is
also critical to
take into account
Fig. 5: SiC MOSFET application areas
Fig. 4:
Switching loss
vs. temperature
comparison
(V
DD
= V
CC
=
800 V,
I
D
= I
C
= 20 A,
R
G
= 10 )
Figs. 1 and 2: Forward conduction characteristics comparison
Fig. 3: Normalized R
DS(on)
vs. temperature
T
j
= 25C T
j
= 150C
that the IGBTs tail current does have
the effect of dampening parasitics
during turn-off. It is vital to design
sufficient snubber circuits to manage
output interconnection parasitics and
prevent the ringing from reaching
damaging levels.
Compensating for the modest
transconductance in the SiC MOSFET
requires that gate-source voltage (V
GS
)
must be 20V to ensure optimal perfor-
mance from the device. This transcon-
ductance characteristic can also im-
pact the transition between where the
MOSFET operates as a voltage-con-
trolled resistance device to where it
becomes a voltage-controlled current
source, as a function of V
DS
. This tran-
sition will typically occur at higher
V
DS
values than with conventional sili-
con MOSFETs or IGBTs.
The transconductance effect
must also be considered in the
gate drive circuit design, most
notably in the requirement that
the gate driver be capable of
voltage swing of 22 V or higher
(for example, a recommended
on-state V
GS
of +20 V, with an
off-state V
GS
of 2 V or -5 V).
Careful consideration must
be given to controlling the fidel-
ity of the gate drive pulse, re-
quiring a nominal threshold
voltage of 2.3 V when the device
is not fully on (dV
DS
/dt 0), un-
til gate-source voltage reaches 16
V or higher. The first-order gate
circuit is approximated in Fig. 6,
depicting a voltage pulse driv-
ing a simple series RLC circuit.
By minimizing L
LOOP
, the val-
ue of R
LOOP
necessary for critical
dampening can be minimized,
along with the rise/fall time of
the circuit. This can be best accom-
plished by ensuring that the gate drive
is located as closely as possible to the
SiC MOSFET.
To illustrate the advantages of SiC
MOSFETs in power electronics, con-
sider the following solar power in-
verter application. The B6 topology
employs a split-link dc-capacitor with
the neutral conductor of each capaci-
tor connected at the center point,
with the unit connected to a 400-V
grid. The 1,200-V silicon IGBTs origi-
nally designed into the system were
directly replaced with 1,200-V SiC
MOSFETs, without any optimization
of the drive circuit. As shown in Fig.
7, the result was a dramatic increase
in system efficiency.
Replacement of the silicon IGBTs
with SiC MOSFETs achieved the sys-
tems maximum efficiency by 1.92%
and boosted the overall European ef-
ficiency rating by 2.36%, translating
into a 50% reduction in overall system
losses and a reduction in heatsink
temperature by 43C. Allowing the
three-phase grid-connected system to
achieve a 99% maximum rating.
To demonstrate the potential for
SiC MOSFETs in motor drive applica-
tions, engineers at Cree performed an
experiment by substituting SiC MOS-
FETs for the original silicon IGBTs in a
230 Vac, 2-kW three-phase motor
drive operating at 16 kHz. The SiC
MOSFETs produced a 2% overall effi-
ciency improvement and a 50% reduc-
tion in heatsink temperature, enabling
a significant reduction and/or simpli-
fication of thermal management sys-
tems, such as fans. In addition, the
ability to operate at higher frequencies
(48 kHz and higher), allowed for dra-
matically reducing the size and weight
of magnetic components such as EMI
filters and inductors.
For applications in three-phase
480-V power factor correction circuits
requiring 1,200-V switching devices,
SiC MOSFETs are expected to find
wide application. At these voltages,
traditional silicon MOSFETs have ex-
cessive conduction losses, and silicon
IGBTs exhibit significantly higher
switching losses, thus putting a limit
on their operating frequency. The SiC
MOSFETs, however, exhibit both low
switching losses and low conduction
losses, making them ideal for these
types of applications.
High-voltage industrial equipment,
including plasma cutters and welders
will also be prime applications for the
1,200-V SiC MOSFET. By using the SiC
MOSFETs, a 10-kW, 1-kV dc/dc con-
verter operating at 32 kHz has been
demonstrated with an efficiency of
more than 97%.
The commercialization of SiC tech-
nology for switching devices repre-
sents a revolutionary change in the
field of power electronics. Beyond
the device costs, the following
system considerations need to be
evaluated for a true picture of the
potential cost savings:
1. Passive component reduction.
Because of their relative numbers,
passive power components often
comprise the majority of the over-
all bill of materials costs in a pow-
er electronics application. By in-
creasing the operating frequency,
both the number of these compo-
nents (and their corresponding
size and cost) can be reduced.
2. Cooling requirement reduc-
tion. By reducing heatsink tem-
peratures by more than 50% (as
demonstrated by experiments
presented in this article), the
adoption of SiC technology has
the potential to significantly re-
duce the size and number of heat-
sinks, as well as a reduction or
elimination of cooling fans.
3. Energy-cost reduction over the
equipment lifecycle. Looking beyond
the simple component costs and
manufacturing expenses of a system,
the true value proposition of SiC
technology comes only if the overall
energy savings over the lifecycle of
the equipment is considered; and in
some cases can be the majority of the
savings potential. In systems such as
a solar inverter, where cost savings
are directly dependent on inverter
technology, the elimination of 40%
to 50% of switching losses can be the
determining factor in the adoption of
SiC technology.
Fig. 6: First-order analysis of gate drive circuit
Fig. 7: Comparison of three-phase PV inverter efficiency
Alternative Energy
an electronic products special series
EnErgy-saving
InItIatIve
Power-efficient comm
engines in FPGAs
BY RAJESH TRIVEDI, Brand Manager
Lattice Semiconductor
www.latticesemi.com
T
he rapid pace of innovation
across industries is driving new
approaches to electronic system
design. Designers are increasingly
seeking to build their next-generation
electronic products on flexible plat-
forms that can be customized quickly
to create additional, derivative prod-
ucts to meet diverse customer needs.
in addition, in a networked
world, electronic equipment
of all types must continuous-
ly communicate with each
other. These two trends are
encouraging system engineers
to look for flexible design
platforms with industry-stan-
dard communication inter-
faces. End-customers as well
want low-cost, low-power de-
sign platforms that can be
manufactured in volume and
are competitive in the mar-
ketplace.
Efficient communication
engines
Field-programmable gate arrays offer a
flexible design platform with a variety
of resources high-speed configurable
interfaces, embedded memory, digital
signal processing and a programmable
logic fabric. The cost and power con-
sumption of FPga platforms can be
reduced by selecting widely used func-
tional blocks, which do not vary from
application to application, for imple-
mentation in hard standard-cell logic
gates. FPgas that provide a balance
between a soft programmable fabric
and hard, but configurable functional
blocks are ideal design platforms for
system manufacturers.
One set of functional blocks that is
an ideal candidate for hard imple-
mentation in FPgas are communica-
tion interfaces. an increasing variety
of electronic equipment use industry
standard communication interfaces
such as PCi Express, gigabit Ethernet,
Tri-speed Ethernet and serial rapi-
diO. an ideal solution will implement
Osi Layer-2 (Link Layer) functional-
ity for each protocol and additional
Osi Layer-1 physical layer functional-
ity in hard logic as efficient commu-
nication engines.
The primary benefit of using hard-
wired communication engines is a
dramatic reduction in power con-
sumption. an average two-input
nanD gate consumes power in
nanowatts, whereas a four-input look-
up table (LUT4) in FPgas consumes
power in hundreds of nanowatts. But
the FPga LUT4 performs the function
of at least 10 standard cell gates and
therefore a standard cell gate imple-
mentation yields a net power reduc-
tion of a factor of 10.
The hardwired implementation of
popular communication protocols
also reduces the required semiconduc-
tor die area by a factor of 30, which
leads to lower cost. The logic fabric in
typical midrange FPgas runs at speeds
up to 250 MHz. The hard implementa-
tion of communication protocols al-
lows the same FPgas to process data at
speeds up to 600 MHz. Thus, the hard-
wired communication engines enable
low-cost midrange FPgas to process
high-speed data.
FPGA implementation
an example FPga family with avail-
able hard-coded logic is the recently
announced LatticeECP4 FPga
family, with up to four 6 gbit/s
sErDEs (see Fig. 1). Each com-
munication engine offers up
to a tenfold power and cost re-
duction over similar FPga im-
plementations. The 6-gbit/s
sErDEs channels take less
than 175 mW each. They are
designed and characterized to
meet the rigorous data and
control plane timing require-
ments of each protocol.
The configurable commu-
nication engines can be cus-
tomized by embedding propri-
etary code in the surrounding FPga
logic fabric. The complete solution
also includes an easy-to-use software
tool to connect the communication
engine with the surrounding logic
fabric and with high-speed serial in-
terfaces. Designers can also access net-
work control and statistics vectors
within the engines.
an FPga-based design platform
with efficient communication engines
allows design engineers to build so-
phisticated networking equipment
with lower power and lower cost. and,
though the communication engines
are hardwired, they can be configured
using the soft logic in the FPga fabric.
This approach permits designers to en-
joy the best of both worlds.
Fig. 1: The LatticeECP4 FPGA has 4 to 16 SERDES organized in quads
of four each and up to 22 hard-wired communication engines.
FPGA cost and power consumption can be reduced
using hard standard cell logic gates
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The iPhone 4S is, as it implies, a souped-up iPhone 4 ver-
sion, just as the 3GS was a souped-up version of the
iPhone 3G. In fact, with the introduction of the 4S, Apple
now has a portfolio of 3 iPhone 4Ss, two downgraded iPhone
4s (8GB configuration only), and a downgraded iPhone 3GS.
Murata makes the module, Broadcom makes the chip. In the past
these always included the ubiquitous-most-popular-chip-seen-in-tear-
downs BCM4329, and now Broadcoms newer BCM4330 chip is implement-
ed which upgrades Bluetooth functionality to Rev 4.0. Texas Instruments
maintains their touchscreen controller slot but now that chip is naked (flip-
chip), helping further reduce the size. It appears to offer very similar function-
ality as the touch control IC they supplied in the iPhone 4.
Product Teardown:
Apple iPhone 4S
(16GB) Mobile Handset
% of Total Cost by Function
Integrated Circuit
40.27 %
Display
12.39 %
% of Total Cost by Assembly
Display
12.67%
Mechanical
11.48%
% of Total Cost by Component type
The information in this feature represents a small sample of the data available from the iSuppli Teardown Analysis service. This service provides complete,
detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown analyses
on products including wireless handsets, digital still cameras, PDAs, and laptop computers. ISuppli delivers complete assessments of all electronic,
electro-mechanical, and mechanical components in such products, from semiconductors to passives to displays. Component data includes parts
and estimated pricing and is broken down by assembly, function, component family, and type.
For more information on the IHS iSuppli Teardown Analysis service, e-mail iSuppli at Info@isuppli.com
For more information on the IHS iSuppli Teardown Analysis service, e-mail iSuppli at Info@isuppli.com
To get the complete teardown analysis and parts list of the Apple iPhone 4S, including datasheets, go to...
www2.electronicproducts.com/whatsinside.aspx
Integrated Circuit
41.18%
Camera
9.70%
Discrete
Semiconductor 0.15%
Optical
Semiconductor 0.39%
Passive 2.20%
Battery 3.41%
Module 4.61%
Electro-
Mechanical 6.50%
Touchscreen 7.71%

Mechanical
11.22%
Camera
9.48%
Discrete
Semiconductor 0.15%
Optical
Semiconductor 0.38%
Passive 2.15%
Accessories 2.23%
Battery 3.33%
Module 4.50%
Electro-
Mechanical 6.36%
Touchscreen 7.54%
WHATS INSIDE?
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T
here is no doubt that the role of
unmanned aerial vehicles
(UAVs) in military and commer-
cial applications is increasing beyond
reconnaissance and attack, to new ar-
eas such as fire fighting and provid-
ing supplies and munitions to troops
in battlefield (see Fig. 1). Over the last
decade, UAVs have finally evolved
from lab testing to field-tested proven
technologies.
In a recent study, the Teal Group
estimated that overall UAV expendi-
tures will double within a decade
from $5.9 billion annually to $11.3
billion, with more than $94 billion
spent over the next 10 years. In addi-
tion to the cost savings of unmanned
flights and real time intelligence, sur-
veillance and reconnaissance benefits
they bring, the move to UAVs reduces
fatalities of the pilots and support
personnel that would normally man
such aircraft.
Since UAVs allow for a more pre-
cise and targeted attack, they also re-
sult in fewer civilian casualties. The
always on sensing elements in such
aircrafts make it easier to provide
proof to refute claims of undesired
military action. With the growing
presence of hyper spectral imaging
systems as part of the payload, UAVs
Multicore DSPs are for reducing size,
weight, cost and power, as well as
developing very high-performance systems
Multicore DSPs
support
power-efficient,
high-performance
UAVs
BY SANDEEP KUMAR,
Product Line Manager,
Multicore and Media Infrastructure
Texas Instruments
www.ti.com
also provide the additional benefit of
monitoring for biohazards and mali-
cious chemical agents.
On-board processing
As more manned aircrafts transition
to UAVs, expectations are growing
that these aircrafts will be able to
take advantage of automated air traf-
fic management systems, as well as
automated navigation and landing
systems, while following flight pro-
cedures. Thus, the appetite for great-
er onboard processing will increase,
while the power envelope continues
to stay the same or shrink.
With growing interest in credit-
card-sized board form factors and
computing platforms, the strain on
power budget does not appear to be
letting up anytime soon. Power effi-
cient, software programmable solu-
tions like multicore digital signal
processors (DSPs) will play a key role
in providing solutions to this power-
performance dilemma.
Multicore DSPs have been around
for a long time, but recent advances
have helped them evolve into SoCs
that pack a performance punch with-
out losing touch with their legacy of
power efficiency. In UAVs, they play
a vital role in providing support for
data acquisition and processing from
various sensor types and establish-
ing secure ground communications.
UAV developers, particularly
those focusing on military applica-
tions, are constantly striving for lon-
ger endurance units with greater
functionality and lower fuel con-
sumption. This results in very tight
size, weight, power and cost (SWaP-
C) requirements as combat pressures
dictate that UAVs integrate an in-
credible array of subsystems, includ-
ing sensors, mission compute sys-
tems, radio communications and
navigation systems.
The tight, confined spaces and
small form factors coupled with
smaller modular enclosures make
power a particularly challenging
problem, with some smaller systems
having sub-200-W power budgets.
Today, this is solved by having large
onboard power generation systems
to relieve the energy challenge and
exotic materials as well as heat col-
lection and heat rejection technolo-
PRODUCT
application
Fig. 1: Unmanned aerial vehicle are finding uses
for military reconnaissance, fire-fighting, and
supporting ground troops with supplies.
Military/Aerospace
Electronics
Military tough.
Medically precise.
Power inductors that meet spec, even when operating conditions dont.
Whether your mission-critical application
is military, medical or something else, new
Coilcraft CPS ML563PKA high-reliability
power inductors should be in your sights.
These low-profle surface mount induc-
tors provide a very high performance-to-
size ratio for utmost design
fexibility.
High-temperature materials
exceed the requirements
of most military, aerospace and medical
applications, such as DC link, DC-DC
converters, and switching power supplies.
Ferrite core and exclusive geometry provide
high Q with very low DCR values for
excellent current handling.
Inducroncc vo|uc rongc from 0.3 pH 4/0 pH
Ocrorono| rcmcrorurc rongc of ro -1 C
Sc|fFcononr rcucncc rongc ro 238MHz
Iorgcr gougc vndng rovdc hgh
currcnr hond|ng
So|dcrcd c|f|codcd conrrucron for
cxcc||cnr o|dcroh|ry
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Learn more about the ML563PKA Series
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gies to handle heat dissipation.
Rather than providing a short term
fix, the use of power efficient multi-
core DSPs can reduce the reliance on
large onboard power generation sys-
tems and eliminate costly heat sinks
and other power dissipation materi-
al, leading to a very attractive SWaP-
C for such systems. For example, Fig.
2 shows a half-length PCI Express
(PCIe) board (smaller than 5 x 7-in.)
that is available with 500 or more
GFLOPs of performance at 54-W of
total power consumed.
Multicore DSPs for UAVs
More and more, UAVs are being
dominated with a plethora of sen-
sors that are generating a vast
amount of raw data. Infrared and
visible imaging, coupled with full
motion video, create hours and hours
of footage. In many instances, there
is growing demand for high-defini-
tion video and images with greater
detail and resolution. With lower
cost CMOS cameras improving in
characteristics, there can be any-
where from 10 to 100 cameras per
UAV, with image capturing resolu-
tion going up to several hundred
megabytes per camera.
Once the image has been ac-
quired, the system must perform im-
age stabilization and compression on
board. If the image is being further
processed in the air, image enhance-
ment, and analytics must also be
performed. Multicore DSPs excel at
high-data-rate signal processing in-
tensive functions such as image sta-
bilization, noise reduction, image
enhancement and restoration.
Also, multicore DSPs with a lot of
distributed real time processing ca-
pability coupled with large memory
and interchip and intrachip band-
width can significantly reduce the
latency in analyzing and categoriz-
ing images. This can prove especially
critical in getting real-time responses
from the ground decision maker in
case an imminent threat is detected.
If further analysis means simply
transmitting images to the ground
in a lossless fashion, advanced co-
decs such as JPEG2000 allow for best
possible image quality, low latency
and no inter-frame dependencies.
With multicore DSPs, UAV designers
can quickly and efficiently imple-
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A2_EP_2_06x9_5_A2.qxd 7/5/11 10:07 AM Page 1
ment codecs like JPEG2000 in the
software or start by using off the
shelf proven building blocks such as
those in vision, imaging and signal
processing libraries.
For full-motion video, in addition
to support for existing video stan-
dards such as H.264, the added ben-
efit of using a multicore processor is
that its programmable nature allows
support for proprietary video for-
mats and emerging standards such
as H.265.
Another important consideration
is IO bandwidth and the ability to
support packetized compresses vid-
eo. A typical HD video needs up to
10-Mbps, so the Ethernet interface
required to support multiple com-
pressed video channels should be a
Gigabit Ethernet or higher port. But
GigE is not the only choice for trans-
porting video as both PCIe and
RapidIO are both good choices for
high-bandwidth video.
For example, if PCIe lanes are
used to carry video, then each PCIe
Gen2 can carry 5-GB of data, which
is enough for four channels of
1080i60, 24 channels of D1, or more
than 300 channels of QCIF at 30 fps.
RapidIO, designed for embedded sys-
tems, allows for more payload and
the creation seamless scalable fabric
of processing capability for video
and image processing.
Another application on board
UAVs is radar, generally synthetic ap-
erture radar (SAR) that provides an
additional mechanism for picking
up objects not visible to electro-opti-
cal or infrared cameras. When com-
bined with a ground moving target
indicator (GMTI), such systems can
be beneficial in locating and track-
ing targets in environments such as
deserts and densely forested areas, as
well as in adverse weather condi-
tions, such as rain or fog.
The greater precision of output re-
quired in such systems, along with
the need for larger dynamic range,
make these functions perform sig-
nificantly better on a floating point
machine. Variable size, floating
point, Fast Fourier Transforms (FFT)
are all key in SAR processing and
perform very well on advanced mul-
ticore DSPs. Some multicore DSPs are
also architected to provide a very ef-
ficient mechanism for performing
PRODUCT
application
corner-turns or matrix transpose,
which can be a significant part of an
efficient SAR algorithm.
The UAV communications dat-
alink is a critical subsystem and
provides two-way communication
through a low data rate channel for
commands and status and a
high-data-rate channel for payload
such as SIGINT, video, and radar.
The datalink should have protec-
tion against threats including, jam-
ming, interference, interception,
radiation etc.
In addition, it is important the
communication link be always avail-
able which translates to support of
non-line-of-sight, multiple bands,
multiple waveforms and other ad-
vanced capacity and coverage en-
hancement techniques. DSPs have
long been used in commercial com-
munications, more specifically in
providing secure, low latency, real-
time communications. They are well
suited for UAV communications that
require support for low bandwidth,
proprietary channels all the way up
to commercial broadband wireless
air-interfaces such as LTE, WCDMA,
and WiMAX.
Multicore DSPs make the system
easy to reconfigure through a sim-
plified programming model (usu-
ally C based). Todays multicore
processors provide a good combi-
nation of software programmable
cores and hardware acceleration to
cost effectively meet the stringent
requirements of such communica-
tions systems.
In a defense market with shrink-
ing budgets, the use of multicore
DSPs also provide for software in-
vestment protection through soft-
ware compatibility and portability as
well as through the use of open tools
such as GNU C Compiler, open oper-
ating systems such as Linux and
open multicore programming mod-
els such as OpenMP.
Fig. 2:
Advantech PCIe
card with four
Texas Instruments
TMS320C6678
multicore DSPs - 512 GFLOP @54W
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PowerResAd_EP12_11_Layout 1 11/10/11 4:49 PM Page 1
Military/Aerospace
Electronics
Product
UPDATE
Product
UPDATE
Connectors and sockets
Itt (www.itt.com) developed the Nemesis Series Space
Saver connector designed for wearable and portable mili-
tary equipment used in todays warfare. the connector
withstands harsh conditions in the field, and features
anti-reflective roHS-compliant salt-spray-resistant plat-
ing and Pogo Pin/Pad and breakaway design. Maximum
current rating for the Nemesis Series connector is 2 A and
the voltage rating is 50 Vdc with a minimum insulation
resistance of 5,000 M. operating temperature ranges
are from 40 to 100c, and the connectors have a life
span of more than 2500 cycles. Portable computers,
weapons, vision systems, headsets, radios, and GPS
equipment are applications for the Nemesis series.
ErNI Electronics (www.erni.com) dual-row Microcon se-
ries SMt connector family with 0.8mm pitch addresses de-
manding applications in industrial, medical, lighting, auto-
motive, and
consumer seg-
ments. the 50-
pin male con-
nectors are
only 24.2 x 4.7
mm, and fea-
ture reinforced
side walls and
b l i nd - ma t e
guide align-
ments for secure mating. A double-sided spring contact en-
ables installation in space-limited applications. the connec-
C
onnectors provide the glue that enables a variety of technologies to work together effectively and efficiently. From
connectors used in rugged or toxic environments to those that span consumer and industrial applications, con-
nectors adhere to a multitude of standards and specifications. they are not only necessary, but they are also an
enabling technology and gains in connector miniaturization, strength, life span and flexibility further electronics ad-
vances across a wide range of applications.
ITTs Nemesis Series Space Saver connector
ERNI Electronics Dual-Row SMT Connector Family
www.belfuse.com 1-800-BELFUSE
4VK\SHY
*VUULJ[VYZ
For innovative,cost-effective solutions
to 10/100BT, 1GBT, 10GBT and PoE
+
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MagJack

Integrated Connector Modules
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house Bels magnetics in 1 to 16 port
designs with LED, USB, and 10GBT
filtered options.

Single, 1xN, 2xN and Combo Single Port

Vertical, Right Angle & Compressed-Height

Meet IEEE 802.3 & ANSI X3.263 Standards

Yellow, Green, Orange, Bi-Color LEDs

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EMI Tab Options

CAT 3 to 7a Connectors

Bristol, PA 19007-6810
(215) 781-9956 fax: (215) 781-9845
e-mail: info@arieselec.com
The Proof
Awaits You.
Correct-A-Chip isnt magic.
It just works like it.
Want proof? Visit our
comprehensive web site
or call us. Well show
you how easy it is to
changefor the good.
Change is what drives your business... and its also what can drive
you crazy when it comes to designing new devices into your existing
products or replacing obsolete chips.
That's precisely why Aries Correct-A-Chip
technology is so popular
with designers who are always looking to upgrade or to avoid the
problems of chip obsolesence: it lets them (and you) take advantage
of device enhancements without board rework, redesign or delays.
Change is good. With Correct-A-Chip, its also easy!
With Correct-A-Chip, you can change from one footprint or package
type to another, from surface mount to through-hole, from one pinout
to another, from oneyou get the picture. If theres a way to upgrade
your product with a new chip, theres a Correct-A-Chip that lets you
do it quickly and economically.
With Correct-A-Chip, you can even add additional componentry and
circuitry while you upgrade to a new device all in the same space!
Now available in both standard and RoHS compliant versions!
www. a r i e s e l e c . c o m
Product
UPDATE
tors offer a high mating tolerance with
allowed misalignment tolerances of
longitudinal and transverse axes of
0.7 mm and an allowed angular incli-
nation tolerance of 4. the class 1
connectors are specified for. 500 mat-
ing cycles and current capacity per
contact is up to 0.5 A at 20c.
API technologies new API Spec-
trum control Firewall Series (www.
apitechnologies.com) is designed to
prevent fire or sparks from penetrat-
ing sealed bulkheads in high-perfor-
mance aircraft, aircraft engines, and
military ships. capable of operating
up to 260c/500F, the connectors
adhere to a variety of such military
specifications as MIL-dtL-38999,
MIL-dtL-836723, and MIL-dtL-
5015.
Supporting total bandwidth of
120 Gbits/s through 12 channels of
10 Gbits/s, tE connectivitys en-
hanced-footprint cXP pluggable
connector and cage are housed in a
one-piece convenient press-fit as-
sembly. targeting high-speed data
environments, the cXP assembly
supports the latest high-speed In-
finiBand cXP 12XQdr standard and
IEEE 100-Gbit/s Ethernet specifica-
tions. the one-piece design prevents
EMI leakage at the bezel opening
and at the cage-to-plug interface and
allows for quick and easy placement
onto PcB boards, eliminating the
extra steps involved with connector
and cage assembly. An enhanced,
dual-sourced footprint increases
space between vias for cross-talk re-
duction and improved electrical per-
formance. options include lightpipe
and EMI/dust plug and three high-
sink heights for a variety of thermal
applications. Belly-to-belly mount-
ing options for use on both sides of
pc boards are also offered.
IP 67 Bayonet Style rJ45/Ether-
net field wireable connectors by
turck (www.turck.us.com) provide su-
perior protection in washdown and
high impact applications. the bayo-
net style of mating prevents over or
under tightening that typically
www.harwin.com/shield-clips
P I C K & P L A C E R E A D Y B Y D E S I G N
SMT shield clips
simplify RFI shielding
Eliminates cost of hand soldering
fences or cans to a PCB
Tape & reel packaging
for automatic placement
Three clips sizes for cans
with wall thickness of .005-.040
O
r
d
e
r
F
r
e
e
S
a
m
p
le
s
N
O
W
Harwin EP Half Island Shield Clips Dec 11 2/12/11 16:24 Page 1
Turck IP 67
RJ45 Ethernet
field wireable
connector
TE Connectivity Enhanced-Footprint CXP
Interconnects
Connect to Innovation Nation
Inspired ideas come from technology partners who have the creativity and foresight to bring your
ideas to life. Thats what drives our performance at HARTING putting our best foot forward by
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HARTING, Inc. of North America
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visit HARTING-usa.com
for information
11-8574 HARTINGad-August-EP_Layout 1 7/15/11 11:49 AM Page 1
www.fciconnect.com
The right connection for your app
Whatever your application need, FCI offers innovative connectors and cable
assemblies for high speed, power, board-to-board, wire-to-board, input/output,
exible circuit, or storage connections whether in communications, data,
industrial, or consumer electronics. Quickly nd the right interconnect solution
for your app at www.fciconnect.com/electronics
Visit booth 414 at the DesignCon
Show to see innovative high speed
and power connector and cable
assembly solutions
and more
damages connectors and pins. Wa-
ter resistant to depths of 1 meter for
up to 30 minutes, the CAT 5e per-
formance of the connectors allows
data transmission at 1,000 Mbits/s
and performance in harsh environ-
ments including toxic chemicals.
Available in plastic and metal mod-
els, the connector works in all Eth-
ernet applications.
Miniature microwave coax con-
tact assemblies that fit into small
standard Size 20 contact cavities of
D-Subminiature connectors and
Size 20 and larger contact cavities
for standard MIL-DTL-38999 circu-
lar connectors are addressed by a
family of SSBP microwave connec-
tors by Southwest Microwave (www.
southwestmicrowave.com). The SSBP-
20 connectors can be used inter-
changeably with non-coax sig-
nal contact assemblies in such
applications as airborne, medi-
cal, test, mobile communica-
tions, missiles, and space.
Features include minia-
turization, increased reliabil-
ity, reduced system cost, and
resistance to vibration and
shock. The SSBP-20 interface, al-
though targeted for miniaturized
packaging, can be used in RF and
extreme millimeter-wave applica-
tions and combinations thereof in
the same connector. Connectors are
RoHS compliant, lead free, and have
DFARS steel and raw material trace-
ability.
Horizontal and vertical blade in-
sertion and increased flexibility are
two of the features of Yokowo Amer-
icas (www.yokowoconnector.com) two-
piece battery connectors. Dual-
beam contact in both insertion
directions improves reliability,
while two tabs are fitted on the re-
ceptacle providing a secure grip
around the blade for insertion. Bi-
axial torsion and floating function
absorb the batter gab, reducing in-
termittent power outage risk. Used
in devices where uninterrupted
power is critical, the connector fea-
tures a 30-m max contact resis-
tance, 40 to 85C operating tem-
perature range, and a 2,000-cycle
operational durability. The blade is
11.5 x 5.4 x 18 mm, and the recep-
tacle is 9.1 x 5.5 x 19.1 mm. Each
blade consists of six contacts with
a 3-mm pitch.
The RFA-4013-WB 7-16 DIN
adapter kit from RF Connectors
(www.rfindustries.com) is now avail-
able in white bronze plating in ad-
dition to silver. Applications in
PCS, cellular, GPS, and digital
communications are finding great-
er use for 7-16 DIN adapters. The
7-16 DIN connector interface can
carry high power at high frequency,
are larger and extremely precise,
and offer stable electrical and me-
chanical connections with tight tol-
erances. White bronze plating offers
a way to bridge type N devices to 7-
16 DIN interfaces. All white bronze
7-16 DIN adapters are machined to
exact specifications. In comparison,
silver plating offers exceptional
electrical performance and low pas-
sive intermodulation (PIM) perfor-
mance. The foam-lined zippered kit
contains six adapters.
Carolyn Mathas
RF Connectors
RFA-4013-WB 7-16 DIN
adapter kit
Southwest Microwave SSBP-20 microwave
connectors
SFP+, QSFP+ and Mini-SAS/SATA
cable systems
FCIs new SFP+ and QSFP+ direct-attach
copper cable assemblies, connectors and
cages enable 10 Gb/s or 4x10 Gb/s pluggable
links to support 8G Fibre Channel, 10G
Ethernet, FCoE, 40G Ethernet, or 40G
Infniband QDR applications. The cable
assemblies include EEPROM memory map
capability per the SFF specifcations. FCIs
external Mini-SAS/SATA cable solutions meet
INCITS T10 SAS or SATA-IO and SFF
requirements.
For more information please visit
www.fciconnect.com/hsio
TwinMezz
Mezzanine Connector
System
FCIs TwinMezz
connector system provides

industry-leading signal integrity performance
for 20+ Gb/s mezzanine applications and the
highest signal density with 25 differential
signal pairs/cm
2
, or 161 pairs/in
2
. The effcient
hermaphroditic design supports stack heights
ranging from 12mm to 40mm with 200-800
total contacts. The versatile open pin feld
design allows for mixed differential, single-
ended or power pin assignments. Proven FCI
BGA termination technology enables reliable,
SMT-compatible attachment.
For more information please visit
www.fciconnect.com/twinmezz
AirMax VS
High-Speed Connectors
Innovative crosstalk optimization and edge-
coupling technology enable differential pairs
to support data rates to beyond 12.5 Gb/s
without the use of interleaving metal shields.
The versatile AirMax VS system features
a broad range of signal module options,
including receptacles and headers in both
right-angle and vertical orientations, power
modules, and accessories. The available
connector options support backplane,
orthogonal midplane, coplanar,
mezzanine and cabling applications.
www.fciconnect.com/airmax
fw593 EP 03/10 Sat Strip AF.indd 1 1/29/10 12:10:05 PM
PRoDUCT
UPDATE
ADveRtISeMeNt
HIGHLIGHTS
Next-gen ECP4 FPGAs up performance profile
Featuring up to 250 KLUTs that operate 30% faster
than the previous version and cost less, the Lat-
ticeECP4 FPGA family steps up to higher-perfor-
mance applications. The ICs come in six versions
starting at 30 KLUTs and have 1.2 to 10.6 Mbytes of
memory, 1,066-Mbit DDR3 memory interfaces, and
up to 576 DSP blocks 7x the previous version.
The chips up their communication profile with sixteen 6-Gbit/s SERDES
channels that take less than 175 mW each and forty 1.25-Gbit/s CDRs. They
feature MACO lower-power hard-IP communication engines for many pro-
tocols, including SRIO 2.1, PCIe 2.1, and 10G Ethernet. The devices are
available in 485 to 1,152-pin low-cost wire-bond or flip-chip BGA packages.
(ECP4-130, $20 ea/100,000 samples 2nd qtr 2012.)
Lattice Semiconductor , Hillsboro , OR
Sales 503-268-8000 sales@latticesemi.com www.latticesemi.com
SPDT switches offer 50-
terminated outputs
The SKY13348-374LF and SKY13370-
374LF 0.5 to 0.6-GHz SPDT switches
are high power 50- terminated,
single-pole, double throw devices
that are ideal for high
power access points
and router applica-
tions given their
matched ports which
reduce low noise ampli-
fier pulling and deliver
better system performance. Addi-
tional features include low insertion
loss, high isolation and high lineari-
ty for improved data throughput.
Housed in a 6-pin DFN package,
the SKY13370-374LF features an in-
sertion loss of 0.7 dB at 2.5 GHz, an
isolation of 31 dB at 2.5 GHz, and an
IP1dB of 39 dBm. Housed in a MLPD
package, the SKY13348-374LF offers
an insertion loss of 0.6 dB at 2.5 GHz,
an isolation of 27 dB at 2.5 GHz, and
an IP1dB of 37 dBm.(Contact compa-
ny for pricing and availability)
Skyworks Solutions , Woburn , MA
Sales 781-376-3000
sales@skyworksinc.com
www.skyworksinc.com
SAR pseudo-dif ADC
achieves 96.5-dB SNR
The LTC2369-18, a serial 18-bit, 1.6
Msamples/s pseudo-differential SAR
A/D converter, achieves 96.5 dB SNR
and 120 dB THD while supporting a
0 to 5-V unipolar input range. Oper-
ating from a 2.5-V supply, the part
consumes only 18 mW, with a low
power shutdown mode that con-
sumes just 2.25 W.
Additional features include, guan-
ranteed 18-bit no missing codes, a
maximum INL of 2.5 LSB with no
missing codes and guaranteed speci-
fications over the 40 to 125C tem-
perature range. Housed in a 16-lead
MSOP and 4 x 3-mm DFN package,
the ADC offers a user-friendly SPI in-
terface, explicit Busy and Chain pins,
I/O voltages from 1.8 to 5 V, and an
internal oscillator that simplifies
digital timing and minimizes exter-
nal component count. ($29.95
ea/1,000 available now.)
Linear Technology , Milpitas , CA
www.linear.com
Signal cond ICs process
IR remote control signals
Announced as the first signal condi-
tioning ICs suitable for processing
IR remote control signals from dis-
crete photodiodes, the VSOP383
and VSOP584 signal conditioning
ICs are offered in small QFN pack-
ages measuring 2 x 2 x 0.76 mm.
The parts are capable of processing
continuous data transmission and
feature a supply voltage range from
2.7 to 5.5 V and a supply current
down to 0.35 mA.
Manufactured using CMOS tech-
nology, the VSOP383 and VSOP584
feature a narrow band-pass filter for
36 and 38 kHz carrier frequencies
and intelligent AGC to suppress dis-
turbances from fluorescent lamps
and other disturbing light sources.
The devices are insensitive to supply
voltage ripple and noise. The RoHS-
compliant ICs operate over a temper-
ature range of 25 to 85C.(From $1
ea available now.)
Vishay Intertechnology , Malvern , PA
info@vishay.com
www.vishay.com
Electronic fuses provide
adjustable protection
The STEF05 and STEF12 are electron-
ic fuses in 3 x 3mm IC packages that
provide overvoltage and overcurrent
protection for 5 and 12V electron-
ics. They can re-
place larger con-
ventional fuses
or other protec-
tion devices such
as transils or diodes. They do not cut
the power suddenly or require re-
placement like fuses.
The electronic fuses restrict the
current supplied when a fault occurs,
protects the connected circuitry, and
turns the protected equipment off if
the fault persists. It can be reset by a
signal from the system or by restart-
ing the power supply. The devices
also integrate circuitry that limits
voltage fluctuations applied to the
protected load, and programmable
startup time, allowing use in hot-
swappable modules for equipment
such as enterprise servers, storage or
telecom systems. (From $0.75
ea/1,000 available now.)
STMicroelectronics , Lexington , MA
www.st.com
Buck-boost converter
offers 2.7 to 40-V range
The LTC3115-1, a synchronous buck-
boost dc/dc converter delivers up to
2-A continuous output for single-cell
Li-ion, 24/28-V industrial rails, and
40-V automotive inputs. The con-
verters 2.7 to 40-V input and output
range provides a regulated output
with inputs above, below, or equal to
NEW
PRODUCTS
POWER MaNagEMENt
aNalOg/MiXED SigNal
edited by christinanickolas, jimharrison and pauloshea
See more online at electronicproducts.com/ic
Ethernet switch chip
has advanced features
The VSC7418 Serval Ethernet switch
engine is optimized for power and
cost-sensitive applications at the net-
work edge, and is said to provide 75%
lower power and 50% lower BOM
cost than competitive options. The
device has nine 10/100/1,000-Mbit/s
SGMII/SerDes ports and two 2.5-G
SGMII/SerDes ports.
The IC features a 416-MHz MIPS
Low-cost 16-bit MCUs
are AEC certified
The MSP430G2xx and MSP430F2xx
16- or 12-MHz microcontrollers offer
AEC-Q100 certification for automo-
tive applications.
They have up to
32 Kbytes of flash
and 128, 512, or
1,024 bytes of
SRAM. The MCUs feature active mode
current of 220 A at 1 MHz, 2.2 V
and standby current of only 0.5 A.
The 430G2 series have optional
capacitive touch and 8 channel 10-
bit A/D converter and come in 14
and 20-TSSOP or 16-QFN packages.
The 430F2 series have a 12-channel
10-bit A/D converter and come in a
larger 38-TSSOP, 40-VQFN package.
The devices wake-up from standby
mode in less than 1 s and operate
from 40 to 105C. (From $0.30
ea/50,000 samples available now.)
Texas Instruments, Dallas, TX
www.ti.com
the regulated output.
The buck-boost topology provides
a continuous, jitter-free transition
between buck and boost modes,
making it suitable for RF and other
noise-sensitive applications. The
switching frequency is user program-
mable between 100 kHz and 2 MHz,
and can be synchronized to an ex-
ternal clock. The device incorporates
four internal low R
DS(on)
n-channel
MOSFETs to deliver efficiencies of up
to 95%. A user-selectable burst-mode
operation lowers quiescent current
to 50 A, to improve light load effi-
ciency. (Ea/1,000: LTC3115EDHD-1,
$5.35; thermally enhanced LT-
C3115EFE-1, $5.55 available now.)
Linear Technology, Milpitas, CA
www.linear.com
processor with DDR2/3 external
memory and DMA-based frame ex-
traction and insertion support. It
also supports MPLS/MPLS-TP LER
and LSR and LTE-advanced-ready
IEEE 1588v2, along with advanced
TCAM-based service SLA guarantees.
The chip has full OAM in hardware
and comes in a 24 24-mm thermal-
ly enhanced TQFP package. It takes 3
W typ over a 40 to 125C operat-
ing range. (Price not available
samples December.)
Vitesse Semiconductor
Camarillo, CA
Sales 805-388-3700
prodinfo@vitesse.com
www.vitesse.com
Digital
Integrated Circuits
HIGHLIGHTS
Tri-axial accelerometers are half
the size of previous devices
The LIS2DH and LIS2DM ultra-low-power, high-per-
formance three-axis MEMS accelerometers come in
2 x 2 x 1-mm packages, reducing the footprint by a
factor of 2 over current-generation three-axis devic-
es, Consuming as little as 2 A in normal operating mode, the units enable
motion sensing on smaller and sleeker gadgets than currently available, as
well as mobile phones, tablets, and gaming controls that can run longer.
Both devices provide highly accurate outputs across user-selectable rang-
es of 2, 4, 8, and 16 g, and have an embedded temperature sensor to
ensure excellent stability over temperature (0.01%/C). The LIS2DM has a
sensitivity of 16 mg/digit in low-power mode in the 2 g range, and the
LIS2DH has a high-resolution mode with sensitivity as low as 1 mg/digit in
the same range.
The sensors have 4D/6D orientation detection and two programmable
interrupt signals that enable immediate notification of motion detection,
free fall, and other conditions. The units also feature power-down and sleep
modes, a FIFO memory block for smarter power management, software-
compatibility with the companys current 3-axis accelerometers, and a self-
test function that allows functional verification at the board level. (LIS2DH,
$1.05 ea / 1,000; LIS2DM, $0.98 ea / 1,000 available now.)
STMicroelectronics, Lexington, MA
www.st.com
NEW
PRODUCTS
Pushbutton switch is
splash-, vandal-proof
Offering both splash- and vandal-
proof construction, the DH series of
panel-mount pushbutton switches is
now available in 22- and
25-mm sizes. It is of-
fered as momentary
or latching in both
SPST and DPST, nor-
mally open and
normally closed.
Flush actuator styles
offer non-illuminated,
bi-color ring illumina-
tion or dot illumination.
The electrical rating of the DH se-
ries is 2 A at 24 or 125 Vac and 1 A at
250 Vac. Sealing is IP65. Additional
features include an electrical life of
50,000 cycles with contact resistance
of less than 50 m and a dielectric
strength of 2,000 Vrms contact to
contact and 2,000 Vrms contact to
LED. Insulation resistance is greater
than 100 M, and actuation force is
550 50 gF with actuator travel of
2.0 0.3 mm. Also operating and
storage temperature is 25 to 70C.
(Contact company for pricing
available now.)
CIT Relay & Switch
Minneapolis , MN
Tony Schisler 763-535-2339
tschisler@citrelay.com
www.citrelay.com
600-V IGBTs target
UPS, solar apps
The IRGP4067DPbF and IRGP-
4066DPbF 600-V insulated gate bi-
polar transistors (IGBTs) target unin-
terruptible power supplies, solar,
industrial mo-
tor and welding
appl i cat i ons .
They use trench
wafer technolo-
gy, are co-pack-
aged with a
soft-recovery diode, and are opti-
mized for 8 to 30-kHz switching
with 5-s short-circuit rating.
The 600-V IGBTs suit a wide range
of switching frequencies due to their
low Vce(on) and low switching loss-
es. They are offered as both die and
packaged devices, and are available
for FREE PICO Catalog
Call toll free 800-431-1064
in NY call 914-738-1400
Fax 914-738-8225
PICOElectronics, Inc.
143 Sparks Ave. Pelham, N.Y. 10803
E Mail: info@picoelectronics.com
www.picoelectronics.com
Over 2500 Std.
DC-DC Converters
Surface Mount
From 2V to 10,000
VDC Output
1-300 Watt Modules
Isolated/ Regulated/
Programmable Models
Available
Military Upgrades Available
Custom Models,
Consult Factory
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A29_EP_1-3V_2-06x9-5_A29.qxd 7/5/11 10:17 AM Page 1
Components &
Subassemblies
edited by j.harrison, p.oshea, c.nickolas, r.comerford and c.mathas
See more online at electronicproducts.com/cs
EMI Filter
Line
Rectifier IC and Switches LEDs
IC
310
320
330
340
350
360
370
380
390
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7
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Input Voltage
LED Current (mA)
LEDrivIR
IRS2980
IRS2980 Features
Internal high voltage regulator
Hysteretic current control
High side current sensing
PWM dimming with analog or PWM
control input
Free running frequency with maximum
limiting (150kHz)
IRS2980 Benets
Low component count
Off-line operation
Very simple design
Inherent stability
Inherent short circuit protection
Demo Board Specications
Input Voltage 70V to 250V (AC)
Output Voltage 0V to 50V (DC)
Regulated Output Current: 350mA
Power Factor > 0.9
Low component count
Dimmable 0 to 100%
Non-isolated Buck regulator
for more information call 1.800.981.8699 or visit us at www.irf.com
High-Voltage Buck Control ICs for
Constant LED Current Regulation
Part
Number
Package Voltage
Gate
Drive Current
Startup
Current
Frequency
IRS2980S SO-8 450V +180 / -260 mA <250 A <150 kHz
IRS25401S SO-8 200V +500 / -700 mA <500 A <500 kHz
IRS25411S SO-8 600V +500 / -700 mA <500 A <500 kHz
IRPLLED7 Demo Board
LED Current vs Input Voltage
IRPLLED7 Demo Board
THE POWER MANAGEMENT LEADER
Disneys Coronado Springs Conference Center
06-08 Feb 2012
Visit us at Booth 501
BODY ARMOR
FOR SWITCHES
Standard black or gray
or matched to any color
IP66/68 Rated.
High tear-strength hostile
environment-resistant
silicone rubber.
Temperature range
-94F to +400F
Patented perimeter
sealing rib prevents
leakage past mounting
hole. No O-ring
required.
Molded-in mounting nut
100,000 min. actuations
Switch/Circuit
Breaker housing
Back-up secondary seal
HEXSEAL
HERMETIC BOOTS DEFEND

AGAINST HOSTILE ENVIRONMENTS
HEXSEAL boots increase reliability & prolong life by
hermetically protecting unsealed switches, circuit breakers,
potentiometers and encoders from hostile contaminants
& actuator-function interference by blocking water, dust,
dirt, ice, solvents, etc. Many HEXSEAL
sealing boots can

also suppress EMI/RFI. Meets MIL-DTL-5423 specs. Toggle,
pushbutton, rotary, rocker & armored versions.
CUS
UL Recognized
Call/click for catalog & samples

The Worlds Most Hostile Environments
Are Our Proving Grounds
800.498.9034 apmhexseal.com
APM_EP_BodyArmorJan2012 11/30/11 10:21 AM Page 1
3-phase filters suit
renewable-energy apps
The HCWMGF series of filters targets renewable-energy
equipment applications. The filters remove RF noise in
the 10-kHz to 30-MHz range and are
available in three-phase-version L1,
L2, and L3 (without neutral) from
150 to 2,500 A, with power losses of
less than 0.02%.
The filters are designed specifically
for windmill power generation, UPS, inverters, and power
inverters, with a maximum operating voltage up to 720
Vac. (Contact company for price available now.)
PREMO, Barcelona, Spain
Rocio Arrupe +34-934-098-980
Rocio.arrupe@grupopremo.com
www.grupopremo.com
Digital power module delivers 17 A
The ZL9117M encapsulated digital power module deliv-
ers 17-A output current. It is configured using the point-
and-click PowerNavigator GUI. Built-in auto-compensa-
tion algorithms optimize transient response over
varying load conditions. The modules operate from 4.5
to 13.2 Vin and provide outputs from 0.6 to 3.6 V, which
NEW
PRODUCTS
with or without short-circuit rating. They have an operat-
ing temperature of 175C. (Ea/10,000: $5.58, IRGPS4067D;
$4.80, IRGP4066DPbF available now.)
International Rectifier, El Segundo, CA
Sales 310-252-7105 www.irf.com
Secure antenna fits space constraints
The WRT-MON Series monopole antenna is compact and
tamper-resistant, targeting such applications as wireless
vending machines, traffic equipment, and power equip-
ment where space is limited and security is important. The
antenna takes up much less space than dipole alternatives.
It installs through a small hole on the product and is an-
chored by a threaded metal base connected to the coax ca-
ble shield and requires a proximity ground plane.
Available in 2.4 GHz, the antenna is attached to an
8.5-in.-long coax cable with an RP-SMA-, SMA-, or U.FL/
MHF-compatible connector on the other end. The RP-
SMA and SMA connectors use an RG-174 coax, and the
U.FL/MHF connector uses a 1.32-mm micro-coax. (Con-
tact company for price and availability.)
Antenna Factor, Merlin, OR
Information 800-489-1634 info@antennafactor.com
www.antennafactor.com
C-band amps are 43% more power
efficient
Designed to be used in satellite earth stations, the MG-
FC50G5867 and MGFC47G5867 gallium nitride (GaN) high-
electron-mobility transistor (HEMT) C-band (4 to 8-GHz) am-
plifiers feature power outputs of 100 and 50 W, respectively.
The internally impedance-matched amplifiers also fea-
ture low distortion, with output power meeting third-or-
der inter modulation (IM3) = 25 dBc of 46 dBm. (Contact
company for pricing and availability.)
Mitsubishi Electric USA, Cypress, CA
Customer Service 714-220-2500
CustomerCare@meus.mea.com
www.mitsubishielectric.com
VCO offers excellent linearity
The CVCO55CW-3050-4250 voltage-controlled oscillator
(VCO) operates from 3,050 to 4,250 MHz with a control
voltage range of 1.5 to 18.5 V. The VCO has a typical
phase noise of 84 dBc/Hz at 10 kHz offset. Output power
is typically 1.5 dBm.
The part has an input voltage of 5 V
and a maximum current consumption
of 16 mA, and comes in an industry-
standard 0.5 x 0.5-in. SMT package.
Pulling and pushing are at 5.0 MHz and
4.0 MHz/V, respectively. (Contact company for price
available now.)
Crystek, Fort Myers, FL
sales@crystek.com www.crystek.com
can be set by external resistors or the PMBus.
The power module features a low-profile 15 x 15mm
QFN package that provides a power density of 1275 W/
in.
3
The 94% peak efficiency and thermal resistance of
11C/W helps eliminate the need for a heat sink or air
flow for most applications. The modules can be connect-
ed in parallel for higher-current needs. ($19.11 ea/1,000
available now.)
Intersil, Milpitas, CA
Sales 408-432-8888 www.intersil.com
Relay & Switch
CIT January.indd 1 12/8/2011 10:20:50 AM
Dc motor yields 150
mNm at 8,000 rpm
The 3863 CR dc micro motor has
ZHN48 magnet material for torque
performance of 150 mNm at 8,000
rpm. The motor is available for 12-,
18-, 24-, 36-, 48-V operation and can
be equipped with a three-channel
encoder and combined with a wide
range of precision gearheads.
The motors low-friction torque
and high thermal resistance allows
for con-
t i nuo u s
operation
at 6.9 A in
the 12-V
ve r s i on.
No load
current is 0.48 A in the 12-V version,
with a stall torque of 1,200 mNm.
The unit uses ball bearings preload-
ed, and its weight is 400 g. ($295
ea/100 available now.)
MICROMO Electronics
Clearwater, FL
Sales 800-807-9166
info@micromo.com
www.micromo.com
Inrush current limiters
extend range
The resistance range of EPCOS in-
rush current limit-
ers is now expand-
ed with the addition
of a P11 series
(B57211Px) that
covers a resistance
range from 4 to 25
(R25) for currents
from 2.5 to 5 A in
the temperature
range of 0 and
25C. The P13 se-
ries (B57213Px) has a resistance range
from 3 to 5 and is designed for
higher currents of 6 or 7 A.
The parts have disk diameters of 13
and 14.5 mm with coating. (Through
distribution: P11 series, $0.30 each;
P13, $0.32 each available now.)
TDK-EPC, Iselin, NJ
James Borsh 732-906-4390
www.epcos.com
NEW
PRODUCTS
Chip resistors operate
up to 240C
The HTH series of ultra-high-preci-
sion Bulk Metal Z1-Foil hybrid sur-
face-mount chip resistors connect-
ed using gold wire bonding targets
high-temperature applications to
240C. The series also offers im-
proved heat dissipation, providing
nearly a 100C extension in operat-
ing temperature range over preci-
Polyacene capacitors
feature 0.9-mm height
PAS2126FR2R5504 polyacene ca-
pacitors measure 26 mm x 20 mm
with a maximum height of 0.9
mm. They have a high capacitance
of 0.5 F.
The devic-
es are suited
for pulse cur-
rent discharge
of LED flash,
enabling clear
photographic images at low light
conditions required by mobile
phones, smartphones, digital still
cameras and digital camcorders.
(The sample price is $3.90 ea/sample
available now.)
Taiyo Yuden
Schaumburg, IL
Sales 800-348-2496
sales@t-yuden.com
www.t-yuden.com
sion thin-film chip resistors.
The devices provide an order of
magnitude reduction in bulk metal
foil elements sensitivity to external
and internal temperature changes,
while providing long-term stability
in high-temperature environments.
HTH devices offer TCR of 1 ppm/
C from 55 to 125C and 2.5
ppm/C from-55 to 220C, 25C
ref. The resistors feature exception-
al load-life stability to 0.05% at
220C for 2,000 hours at working
power, long-term stability to 0.05%
at 240C for 2,000 hours (no pow-
er), and tight tolerances to 0.02%.
(Contact company for price and
availability).
Vishay Precision Group
Malvern, PA
Marti Spalding 919-374-5515
marti.spalding@vishaypg.com
www.vishaypg.com/foil-resistors/
Power capacitors aim
at wind power plants
The MKP AC HP B25360 power ca-
pacitor series features high rated
voltage, long operating life, and high
current-handling capability, suiting
them for renewable energy genera-
tion applications, such as ac output
filters in offshore wind turbines. The
Clare, Inc.
78 Cherry Hill Drive
Beverly, MA 01915
978-524-6768
For more information on Clares IGBT & MOSFET Gate Drivers visit:
www.clare.com/Products/IGBT-MOSFETDvr.htm
Part Number Sink / Source
Drive Current
(A)
Rise / Fall
Times
(ns)
Propagation
Delay On / Off
(ns)
Available
Packages
Low-Side Gate Drivers (Operating Voltage: 4V to 35V)
IXD_602 Family 2 7.5 / 6.5 35 / 38 DFN, DIP, SOIC
IXD_604 Family 4 9 / 8 29 / 35 DFN, DIP, SOIC
IXD_609 Family 9 22 / 15 40 / 42 DFN, DIP, SOIC, TO-220, TO-263
IXD_614 Family 14 25 / 18 50 / 50 DIP, SOIC, TO-220, TO-263
IXD_630 Family 30 11 / 11 46 / 46 TO-220, TO-263
High-Side Gate Driver (Offset Voltage: -5V to +600V)
IX2127 0.5 / -0.25 23 / 20 100 / 73 DIP, SOIC
Optocoupler Gate Driver (3750V
rms
Input to Output Isolation)
IX3120 2.5 100 / 100 300 / 300 DIP, Surface Mount
RoHS
2002/95/EC Pb
e3
Highest Drive Current Available
Highest Voltage Capability
Low-Side and High-Side Drivers
Automotive Temperature Range
Fast Rise & Fall Times
Very Low Quiescent Supply Current
Surface Mount & Power Packages
From 2A to 30A!
Clare offers the largest line of Low-Side Gate Drivers
Industrys Broadest Supplier of
IGBT & MOSFET Gate Drivers
IN
V
CC
GND
OUT
Power transformers
are 50% lighter
The LW series of custom-designed
power and isola-
tion transformers
is designed for
400-Hz frequency
operations of up to
600 Vac onboard
aircraft and in ma-
rine applications of up to 10-kVA
power rating for single phase, 30 kVA
for three-phase systems.
It offers a 50% weight reduction
over conventional C-core transform-
ers. Weight of transformers in the
series range from 4.5 lbs for 1,000 VA
to 28 lbs for 10 kVA, and for three-
phase systems from 13.5 lbs for 3
kVA to 84 lbs for 30 kVA. (Contact
company for pricing available
now.)
Bridgeport Magnetics
Bridgeport, CT
salest@bridgeportmagnetics.com
www.bridgeportmagnetics.com
Hybrid caps have low
ESR, wide temp range
The MXCPB and MXCPT Series alu-
minum-polymer hybrid capacitors
combine super-low equivalent series
resistance advantages of polymer ca-
pacitors with low leakage current
characteristics of aluminum electro-
lytic capacitor technology. Operat-
ing temperatures range from 55 to
135C, and load life ratings are 2,000
hours. Devices have voltage options
ranging from 6.3 to 63 Vdc and ca-
pacitance values from 10 to 560 F.
Dimensions are from 6.3 (Dia) x 7.7
(L) mm l to 10 x 12.5 mm.
The solvent-resistant products en-
able low impedance at high frequen-
cies, supporting excellent noise sup-
pression and ripple absorption in a
wide range of such consumer, indus-
trial, and automotive electronics ap-
plications. (MXCPB, from approx.
$0.35 to $0.45; MXCPT, from $0.55
to $0.95 available now.)
Tecate Industries
San Diego, CA
tiinfo@tecategroup.com
www.tecategroup.com
capacitors feature rated voltages from
550 to 1,000 Vrms ac and a capaci-
tance range from 10 to 150 F. High
dielectric strength is enabled by a
castor oil filling.
The capacitor design improves
heat dissipation from the capacitors
interior to the alu-
minum can, and
hot spots reduc-
tion and superior
insulation proper-
ties extend the op-
erating life to
100,000 hours (to
IEC 61071). The ca-
pacitors are designed for tempera-
tures from 40 to 70C. (Contact
company for price and availability.)
TDK-EPC, Iselin, NJ
Suresh Chandran 732-906-4318
www.epcos.com
TEN- 8WI Series
8W in DIP 24 metal package
TEN- 20WIR Series
20W in 2 x 1 metal package
Single and dual output models
Excellent line load regulation
No minimum load required
Remote On/Off control
UL60950-1 approval
TEP-160WIR Series
160W, half brick package
TEP- 200WIR Series
200W, chassis mount package
with screw terminal blocks
Very high efficiency up to 91%
No minimum load required
Adjustable output voltage +10/-20%
Sense line
Remote On/Off control
Reverse input voltage protection
Over-temperature protection
UL60950-1 approval
TRACOPOWER launches new DC/DC converters that meet the stringent requirements
for mobile and stationary railway applications in accordance to EN50155 standard.
Main upgrades for railway capability:
Increased EMC immunity against surge, burst, radiated and conducted disturbances
Input voltage ranges cover the nominal 24, 36, 72 and 110 VDC with 40 % tolerance
Shock and vibration / thermal shock in accordance to EN61373 and MIL-STD-810F
New DC/DC-Converters
for Railway Applications
www.tracopower.com
POWERGATE LLC 866-588-1750 www.powergatellc.com
Power Sources Unlimited 800-966-7784 www.psui.com/traco
NEW
PRODUCTS
G l o b T e k s
expanded power
line now includes
multiple families
of Wall Plug-in &
Desktop Level V
Power Supplies.
Designs have reg-
ulated outputs
voltage from: 3.3-
48 Vdc in 0.1V increments, up to 120W.
Features: O.C., S.C., O.V., Thermal Protection;
meets multiple International Safety Agency for
ITE & Medical applications. All Models carry
agencies logos and CE-Mark. GlobTek offers
a 5-year warranty.
GlobTek, Inc., N.J.
Sales 201.784.1000
sales@globtek.com
http://www.globtek.com
GlobTeks series of Smart Li-On chargers
offers a compact &cost effective, solution for
charging GlobTek* Lithium-Ion and Lithium
Polymer battery
packs. Features:
single or multiple
bay cradle, custom
charging schemes,
battery condition
before bulk charg-
ing, programmable
charge timer back-
up, charge status
LEDs. Multiple bay chargers have the option of
an MCU incorporated for battery identification,
status & temperature using HDQ from
BQ27000. *or equal
GlobTek, Inc., N.J.
Sales 201.784.1000
sales@globtek.com
GlobTeks Li-On Battery Packs are comprised
of single or multiple cells rated 3.7V up to
5200 mAh each. Cells can be packaged
with Seiko S-8232AKFT-T2 control chip
protection & TI
BQ27000 based
fuel gauge circuitry
included. Addi-
tional features:
protection from
Short Circuit, Over
voltage, Over cur-
rent, Under Voltage, Overcharge, Over dis-
charge, Over Temperature. The packs are a
Polycarbonate/ABS mixture frame or case,
contacts made of nickel & frames designs are
sealed in an ET label material. Modified and
Custom Designs available.
GlobTek, Inc., N.J.
Sales 201.784.1000
sales@globtek.com
Level V Ad 1.12 QR_Layout 1 12/7/2011 11:25 AM Page 1
70-W buck-driver
powers LED-strings
The RCD-48 series is a step-down con-
stant current source for driving high-
power LED applica-
tions. With input
voltage up to 60
Vdc and constant
current outputs of
350, 500, 700 and
1,200 mA, the device
provides power up to 70 W.
This enables a fixture using the full
wattage to replace a conventional light
that could have used up to 350 W.
The buck-driver suits long LED-
chains and larger multi-chip arrays.
The devices are dimmable down to
zero with external digital (PWM) or
analog control. The PWM control in-
put can be directly connected to a
microcontroller. Efficiency is rated at
96%, with an operating temperature
range 40 and +85C. The modules
are available with pins for PCB
mounting or with flying leads for
non-PCB applications. (Samples
available now.)
Recom Power, Brooklyn, NY
information 718-855-9710
www.recom-power.com
350-W supplies feature
3 x 5-in. footprint
The EMH250 and EMH350 series of
single output 250 W and 350 W ac/
dc power supplies meet IT equipment
safety specifications UL/TUV/EN
60950-1 and the medical safety stan-
dards of UL/TUV/EN 60601-1. The 3
x 5 x 1.43 in supplies suit informa-
tion technology, industrial, medical
equipment, and surgical life support
applications. They are also BF rated.
The ac/dc power supply series fea-
ture an input range from 80 to 275
Vac and are available in four output
models of +12, +18, +24 or +48 Vdc. A
trim function allows adjustment of
the output voltage to within 10% of
the stated nominal. A +12-Vdc, 0.6-A
fan supply is also provided across the
range. The EMH350 series also in-
cludes a +5-Vdc, 2.0-A standby sup-
ply. Full power is available from 90
Vac input, they do not derate until
+50C, and require only 12cfm
forced airflow to deliver full output
power. (From $99.84 ea/500 avail-
able now.)
XP Power, Sunnyvale, CA
Duane Darrow 408-732-7777
ddarrow@xppower.com
www.xppower.com
Convection-cooled
supply offers active PFC
The XL375 series of single-output
260-W convection-cooled ac/dc
power supplies has an area of 3.3 x 5
x 1.5 in. The single- and multiple-
output versions have
a universal active
PFC 90 to 264-Vac
input, and output
voltages of 12, 24,
28, 36, 40, 48, 54,
and 56 Vdc.
The ac/dc power supply can de-
liver 375 W with 10cfm of air. The
ADVERTISEMENT
Power
Sources
edited by pauloshea
See more online at electronicproducts.com/ps
40-W dc/dc converters
feature 2 x 1.6-in. footprint
The F4000RW series of 40-W dc/dc
converters offer regulated output pow-
er in a 2 x 1.6-in.case. They target ap-
plications requiring high power densi-
ty, robust performance and long term
reliability. Seven standard models op-
erate from 48-Vdc (36 to 75-V range)
inputs, providing single outputs of 1.8,
2.5. 3.3, 5, 12, 15, or 24 Vdc.
Standard features of the dc/dc
converters include line/load regula-
supplies feature up to 93% efficiency,
have active current sharing for n,
n+1 with an ORing Board option,
and have remote on/off, and active
in-rush current protection. ($190 ea/
large qty available now.)
Power Sources Unlimited
Wrentham, MA
Sales 800-966-7784
sales@psui.com
www.psui.com
Medical, ITE supplies meet
Level V requirements
The GT(M)91099 series of desktop
power supplies feature IEC 320/
C8,C6 changeable blades and have
double-enforced
insulation. The
supplies offer reg-
ulated outputs
from 12 to 24 Vdc
in 0.1V incre-
ments, up to 60W of continuous
output power. The enclosed power
supplies are housed in an impact re-
sistant non-vented polycarbonate
case that provides thermal conduc-
tion cooling, with dimensions 118.5
x 53.5 x 34.2-mm.
The power supplies feature over-
current, over-voltage, short circuit,
and thermal protection. They accept
90 to 264Vac input, meet UL /cUL
and IEC/EN 60950 & 60601.1 for ITE
& medical applications, and they
comply with EMI/RFI Regulations,
EMC Directives/ CE and FCC Class B
for ITE applications. ($16 ea/large
qty available now.)
GlobTek, Northvale, NJ
Sales 201-784-1000
sales@globtek.com
www.globtek.com
tion <1.0%, input/output isolation of
1,600 Vdc, continuous short circuit
protection, and a remote control in-
put. The operating temperature
range extends from 25 to +70C.
($43.75 ea/100 available now.)
MicroPower Direct
Stoughton, MA
Sales 781-344-8226
sales@micropowerdirect.com
www.micropowerdirect.com
65-W switcher features
2 x 4-in. footprint
The MWS65 series 65-W open-frame,
medical/ITE ac/dc power supply of-
fers a 2 x 4-in. footprint, with a 1-in.
profile, and features a 4-kVac rein-
forced input-to-output isolation and
output-to-ground isolation of 1,500
Vac. All models comply with UL/
EN60601-1 editions 2 and 3 safety ap-
provals for medical equipment and
include onboard dual fusing, making
them ideal for use in body and body-
floating-type medical applications.
The medical/ITE power supply
consumes <0.3 W under no-load
conditions. The convection-cooled
Total Power International, Inc
Your Partners in Power

Total Power International oIIers a wide range oI
Power Supplies including DC/DC, External, Energy Star,
LED, Medical, and we can design your Iull Custom supply.
Call, Fax, or Email today Ior more inIormation or visit
our website Ior speciIications, to obtain a quote or to
view our e-Ilip on line catalog!
Ph: 978-453-7272 Toll Free Hotline: 877-646-0900
Fax: 978-453-7395 Email: salestotal-power.com
Website: www.total-power.com

Untitled-3 1 4/19/11 3:29 PM
NEW
PRODUCTS
unit is also suitable for light indus-
trial point-of-sale terminals/displays,
test and measurement, and broadcast
equipment applica-
tions. It operates
from 90 to 265-Vac
input, and offers
five models with
nominal outputs of
5, 12, 15, 24, or 48
Vdc. All outputs are user adjustable
by 10%. The supply operates at full
load from 20 to +50C ambient
temperature and up to +70C with
suitable derating. ($32 ea/50 avail-
able now.)
TDK-Lambda Americas
San Diego, CA
Sales 619-575-4400
FAX 619-429-1011
www.us.tdk-lambda.com
10-W converter meets
IEC60601 medical spec
The JHM10 series of board-mounted
compact isolated 10-W dc/dc convert-
ers meet the ANSI/AAMI ES60601-
1:2005, IEC60601-1 3rd edition medi-
cal safety standard for patient
connected medical equipment. The
converters have a maximum leakage
current of 2 A and have a reinforced
input to output insulation at a working
voltage of 250 Vac and provide an iso-
lation of up to 4,000 Vac for up to 1
minute, and up to 5,000 Vac for up to
10 ms. They have an isolation capaci-
tance of 20 pF.
The dc/dc con-
verter series offers a
2:1 input range from
4.5 to 9 Vdc, 9 to 18
Vdc or 18 to 36 Vdc
with either single or
dual outputs. Single
outputs are 5, 12, or 15 Vdc, and dual
outputs provide 5, 12, or 15 Vdc.
The regulated outputs vary no more
than 0.3% under all input condi-
tions and less than 2.0% under all
load conditions. Outputs can be
trimmed up to 10% of stated nomi-
nal output. (Ea/500: single output,
from $35.00; dual output, $38.22
available now.)
XP Power, Sunnyvale, CA
Duane Darrow 408-732-7777
ddarrow@xppower.com
www.xppower.com
A D V A N C E D P O WE R S O L U T I O N S
a d v p o w e r . c o m
( 855) 664-2134
T O L L - F R E E N U M B E R
APS151MP
150 Watts 1-4 Outputs
3 x 5 x 1.40 Open-Frame
100 pcs*
APS303
300 Watts Single Output
3.3 x 5 x 1.50 U-Frame
Power Good, Inhibit and
100 pcs*
OEM quantities*
* pricing valid till 3/1/2012
POWER
S U P P L I E S
HI GH- QUALI TY AT LOW PRI CES
MEDICAL
MEDICAL
APS250EMG
250 Watts
Medical & ITE Approvals
Level V Efficiency
7.46 x 3.74 x 1.89
Toll Free: 1-866-997-3853
Email: sale-usa@pduke.com
WWW.PDUKE.COM
PDUKE TECHNOLOGY, INC
A Ulvl3l0N 0l P0wLR MA1L 1LCN0L00 C0., L1U
- High emciency standard, modifed
standard and custom build
- Up to 200 watt single, double & triple
output
- 2:1 or 4:1 ultra-wide range input
- Cost efective small possible sizes for
board mount
- Extensive technical support
DC to DC Converters
Power Sources
HIGHLIGHTS
Module/software make iPhone a spectrum
analyzer/ power meter
Made in Taiwan by Oscium, the WiPry-Combo module and software turn
an iOS device (iPad, iPod Touch, and iPhone) into an spectrum analyzer and
dynamic power meter
with a touch interface.
Data is collected at up
to 12 MSa/s and can
be logged in csv for-
mat, while screen-shot
results can be emailed
via an iPhone host.
In spectrum-analyzer mode, the instrument can identify interference or
open channels in the 2.4-GHz ISM band (2.400 to 2.495 GHz), or unauthor-
ized WiFi access points. It measures signals from 40 dBm to +20 dBm with
an amplitude resolution of 2.0 dBm and a bandwidth resolution of 1 MHz
with a 200-ms sweep. As a dynamic power meter mode, the device works as
a 100 MHz to 2.7-GHz RF power meter graphically displaying RF power
levels. Time scale is adjustable from 2 s/div to 1 s/div and amplitude dis-
play is from 45 dBm to +20 dBm with a resolution of 2.0 dBm.
Display configurations can be saved for on-the-go measurements, and
iOSs two finger stretch allows zooming in and out of scaling without the
need for buttons or knobs. A demo package that does not require the mod-
ule is available free at Apples AppStore. ($199.95 available now in the U.
S. from Saelig.)
Saelig , Pittsford , NY
Information 585-385-1750 info@saelig.com www.saelig.com
NEW
PRODUCTS
2012 Measurement Computing Corporation
10 Commerce Way, Norton, MA 02766
info@mccdaq.com
MEASUREMENT
COMPUTING
150 DAQ Products
under $500
Support for Linux
,
Windows
, Mac
Unmatched
Warranties
Free Tech Support
OEM Options
Out-of-the-Box
Software & Drivers
For over 20 years Measurement
Computing has offered quality
DAQ solutions that are not only
priced right, but are engineered to
exceed the needs and expectations
of our customers.
LOW
-
COST
DAQ
Engineered with
Innovation.
mccdaq.com/selguide
Contact us
1.800.234.4232
PXIe modules simplify
multi-chassis config
The NI PXIe-8364 and -8374 remote-
control modules let engineers inter-
face multiple PXI Express chassis di-
rectly to a single host computer using
any expansion
topology, elimi-
nating the need
for complex cus-
tom solutions. By
simplifying in-
terconnect ion,
the modules increase the efficiency
of test system configuration in high-
channel-count data acquisition and
high-speed automated test applica-
tions, including RF and semiconduc-
tor test.
The modules support complex
USB daq has
low price
Priced under $500, the OM-DAQ-
USB-2401 USB 2.0 data acquisition
(daq) module accepts thermocouple
and voltage inputs on its 8-differen-
tial/16-single-ended channels, se-
q u e nt i a l l y
reading in-
puts at rates
to 1,000 rdg/s
with 24-bit
r e s ol ut i on.
Users can pro-
gram each channel independently
for one of 10 voltage ranges from
30 mV to 10 V or for type J, K, T,
E, R, S, B, or N thermocouple inputs.
The module has four cold-junc-
tion-compensation temperature sen-
sors built in, as well as open-thermo-
couple detection. The unit can be
powered using either the USB port or
an optional external dc supply. Win-
dows software, drivers for custom
programming, and hardware for wall
or DIN-rail mounting are included.
($495 available now.)
Omega Engineering
Stamford , CT
info@omega.com
www.omega.com
Test &
Measurement
edited by richardcomerford and carolynmathas
See more online at electronicproducts.com/tm

Digital Oscilloscopes
DS4000
Check out the Best Value in Scopes, call 877-4-RIGOL-1
or visit RIGOLNA.com/DS4
RIGOL DS4000 Series
Tektronix DPO3000
Analog Bandwidth
100MHz, 200MHz
350MHz, 500MHz
100MHz, 300MHz
500MHz
Max
Sample Rate
4 GSa/s
2.5 GSa/s
Max
Memory Depth
140 Mpts
COMPARE & SAVE
Starting at
$
1999
A fast, versatile general purpose scope that sets a
new standard for performance and value!
Debugging and testing your latest design has never been easier or more affordable! New DS4000
series scopes, the latest addition to Rigol's family of fast, easy-to-use, ultra-modern test instruments,
deliver a feature set unmatched by any scope in its class, at a fraction of the cost. Compare our 140 Mpts
memory depth, up to 200,000 frames of waveform recording and 4 GSa/s sample rate and you'll like
what you see. These scopes come in 2 or 4 channels and feature a 9 inch WVGA display for excellent
resolution. Rigol is quickly earning a reputation for fast, dependable, high performance test instruments...
check us out, we guarantee you'll be satisfied!
NEW!
Agilent DSOX-3000
100MHZ, 200MHz
350MHz, 500MHz
4 GSa/s
5 Mpts
2 Mpts, standard
or 4 Mpts, optional
Waveform Recording & Analysis
Search & navigate within one
triggered waveform
Search & navigate within up to
200,000 triggered waveforms with
mask tests - all standard
Search & navigate within one triggered
waveform with options for 1000
memory segments & mask testing
Data references for competitive products from Tektronix publication 3GW-21364-7 and Agilent publication 5990-6119EN.
Rigol__DS4000Ad_EP_1_12_Layout 1 12/9/11 9:06 AM Page 1
NEW
PRODUCTS
Water treatment control system
targets chemical automation
The CDCN 13 fully programmable water treatment con-
troller is designed for complete chemical automation in-
cluding conductivity, pH and ORP, and control of chem-
ical additives, all with datalogging.
The controller handles cooling
tower, boiler, industrial process wa-
ter, food processing, and drinking
and wastewater treatment applica-
tions. Engineering units are dis-
played in U.S. or metric values using
a 16-button keypad and 8-line LCD readout with scroll-
through menus. The CDCN13 has eight control relay
outputs, for up to four chemical additives, fill valve,
bleed valve, probe rinse, remote alarm, and NEMA 4X
wall mount enclosures. (From $2,550 available now.)
Omega Engineering, Stamford, CT
Information 203-359-1660 info@omega.com
www.omega.com
star, line, or tree complex topologies, using cabled x1
(8364) or x4 (8374) MXI-Express links to provide 250-
Mbyte/s and 1-Gbyte/s maximum data rates, respectively.
All PXI modules in the downstream chassis appear as lo-
cal devices in the upstream chassis and, since MXI-Ex-
press links are software transparent, no additional pro-
gramming is required. (From $799 available now.)
National Instruments, Austin, TX
Information 800-258-7022 info@ni.com
www.ni.com//mxiedc
Data converter handles
BWs up to 240 MHz
The Model 71651 delivers more than
twice the bandwidth of the companys
previous data converters, providing tun-
ing bandwidths from 10 kHz to 240 MHz.
A member of the Cobalt family of high-
performance XMC modules, the convert-
er is based on a Virtex-6 FPGA preconfig-
ured with data acquisition and playback
IP, giving turnkey functionality as well as room for user
customization.
The card features two input and two output RF chan-
nels, transformer-coupled to allow direct connection to
HF or IF radio stages. Input channels feature 12-bit, 500-
MHz ADCs, while the output channels have a TI DAC5688
digital upconverter that translates real or complex base-
band signals to any IF frequency up to 380 MHz. Dual
JTAG Embedded Test extends to i.
MX51 processors
ScanExpress JTAG Embedded Test (JET) support is now
available for all Freescale i.MX51 applications processors,
providing at-speed testing of embedded processor-based
electronic PCBs and systems to detect, isolate, and diag-
nose structural and functional defects.
ScanExpress JET controls the i.MX51s ARM Cortex-A8
core through the JTAG debug port enabling binary and
script test step execution using a GUI on the host PC.
ScanExpress JET provides standardized interface tests for
SDRAM memory, I
2
C, Ethernet, PMIC, and UART; fast in-
system programming and testing of parallel and serial
NOR and NAND Flash, and fully automatic test develop-
ment for all supported peripherals. (Contact company for
price and availability.)
Corelis, Cerritos, CA
Sales 888-808-2380 sales@corelis.com
www.corelis.com
Temperature monitor is web based
The iSD-TC series temperature monitor delivers web-
based temperature monitoring in critical equipment and
locations such as clean rooms, computer rooms, HVAC
systems, pharmaceutical and food processing and stor-
age, laboratories, semiconductor fabs, electronic assem-
bly, and greenhouses.
The device accepts two thermocouple inputs types J,
K, T, E, R, S, B, C, N, and L, triggering an alarm if tem-
perature veers from the set point, which can be estab-
lished remotely by e-mail. (From $495 available now.)
Omega Engineering, Stamford, CT
Information 203-359-1660 info@omega.com
www.omega.com
16-bit, 800-MHz DACs create real or in-phase (I) and
quadrature (Q) analog outputs. PCIe, cPCI, VPX, and rug-
gedized, extended-temperature versions are also avail-
able. (From $13,745 available 10-14 weeks ARO.)
Pentek, Upper Saddle River, NJ
Sales 201-818-5900 sales@pentek.com
www.pentek.com
15 Jonathan Drive, Unit 4
Brockton, MA 02301-5566
Tel: (508) 580-1660
Fax: (508) 583-8989
www.krohn-hite.com
Quality in
Test and Measurement
Since 1949
o
y
6
Call T
da
(508) 580-1
60
Made in U.S.A.
General Purpose
Tunable Active Filter
Features Front Panel Channel Control
Two Low-Pass, High-Pass
Cutoff Frequency: 0.1Hz to 200kHz
Attenuation Slope: 48dB/Octave Response: Butterworth and Bessel
Wideband Noise: <25V at Max. Gain Input: Differential and Single-Ended
Max Input/Output: 10V Peak Pre-Filter Gain: 0dB to 50dB
Crosstalk Between Channels: -80dB Post-Filter Gain: 0dB to 20dB
BNC Input and Output Connectors AC/DC Coupling

Independent Filter Channels
One Band-Pass/Band-Reject Channel
The Model 3382 Filter provides the performance and flexibility
needed for todays production and laboratory. Tunable from
0.1Hz to 200kHz, each channel provides independent
control of cutoff frequency, filter response, low-pass and
high-pass functions, differential and single-ended input config-
uration, pre and post filter gain, and ac/dc coupling. One
(3381) and four (3384) channel models are also available.
One that can be configured your way.
Test & Measurement
NEW
PRODUCTS
Cable system eliminates
junction boxes, splices
The ESG Flexible Power and Data Bus
System is a family of multiconductor
flat cables. It eliminates the need for
junction boxes,
splices, and
home run wir-
ing when run-
ning power and
data to industri-
al and commercial equipment.
The family is available with five
to seven conductors. The cables are
PVC, polyethylene, or halogen-free
sheaths. Power connection boxes are
rated from 1 to 76 A and are based on
IDC technology. (Contact company
for price available now.)
Electrotech Direct, Colmar, PA
Info 215-997-8855
sales@esgllc-usa.com
www.esgllc-usa.com
RJ45/Enet connector
suits harsh environs
The IP 67 Bayonet RJ45/Ethernet
field-wireable connector offers ro-
bust housing for use in such harsh
environments as washdown, toxic
chemical, or high-impact applica-
tions. Bayonet-style mating prevents
damage causing over tightening and
under tightening, requiring only a
quarter turn to attach and lock.
The connector is water resistant
in depths of 1 m for up to 30 min,
and features CAT 5 performance for
data transmission speeds of up to
1,000 Mbits/s. Available in plastic
and metal, the connector works in
all Ethernet applications. (Contact
company for price and availability.)
Turck, Minneapolis, MN
Technical Information 800-544-7769
usa@turck.com
www.turck-usa.com
www.advanced.com
4D"-BE3-bEDD
$RAW&ROM/UR4OOL"OX
/F#USTOMIZED3OLUTIONS
(IGHRELIABILITYINTERCONNECTDESIGNSBUILT
FORYOURAPPLICATIONFROMPROTOTYPETO
PRODUCTION,ETUSCUSTOMIZE
YOURSOLUTIONTODAY
Packaging &
Interconnections
edited by richardcomerford and carolynmathas
See more online at electronicproducts.com/in
Die-cast enclosures
have uncommon shapes
Providing a robust, environmentally
sealed enclosures with good EMC
screening, 1590 series TRP and STP
models respectively provide octagonal
and trapezoidal housings made of die-
cast aluminum alloy. The 1.54 x 5.23
in. octagonal unit can house a 5.0 in.-
dia. circular PCB. Both trapezoidal
units are 1.54 in. high;
the portrait-format unit
is 4.41 in. long, narrow-
ing from 3.11 to 2.42 in.;
the landscape-format
ones dimensions are
3.74 in., 5.95 to 4.79 in.
All three types are available in nat-
ural finish or in black, cobalt-blue,
green, light-gray, orange, or red gloss
polyester powder paint. A lap joint
seals the units to IP54. (Contact Ray
Shatzel for pricing and availability.)
Hammond Manufacturing
Cheektowaga, NY
Ray Shatzel 716-630-7030
rshatzel@hammfg.com
www.hammondmfg.com
USB 2.0 connectors
are latched, sealed
The addition of latching and circular
sealing to industrial USB 2.0 connec-
tors provides 40 N of locking strength
and 1,500 mating and unmating cy-
Paper Tube Company
1033 S. Noel Ave., Wheeling, IL 60090
More Than 75 Years- The Original
To receive literature & details fast - www.pptube.com
Phone: 847-537-4250 Fax: 847-537-5777 E-Mail: sales@pptube.com
DuPont Co.
420F, 720 VPM!
High Temperature - High Dielectric
NOMEX
for Electrical/Electronic
Tubing, Bobbins, Fabricated Parts
Widely specified for its excellent electrical,
thermal and mechanical properties
Nomex tubing is produced by Precision
with an exclusive, special binder to
provide a thermally
stable class H
insulating tubing.
U/L Recognized.
NEW
PRODUCTS
Single-chip CMOS 100G
optical interconnect debuts
Said to be the industrys first such de-
vice, a single-chip CMOS photonics-
based 100G optical interconnect targets
next-generation cloud computing, data
centers, and high-performance comput-
ing connectivity. The device comprises
four 28-Gbit/s transmit and receive
channels powered by a single laser.
Targeted applications include 100-
Gbit/s Ethernet, OTN, InfiniBand,
OIF Short Reach and Very Short
Reach. (Sampling evaluation plat-
forms to strategic partners and lead
customers; contact company for pric-
ing and availability.)
Molex, Lisle, IL
Sales 800-786-6539
amerinfo@molex.com
www.molex.com
the
support
theyve
given us
has been
exceptional.
Director of Engineering,
Medical Interconnect Manufacturer
To view our Design Guide, new product offerings
and request a datasheet with free samples,
visit www.mill-max.com/EP608
Our connectors speak for
themselvesso do our customers.
MAXIMUM
Service
Client: Mill-Max Job No.: MMAX-112 Subject: Support
Size: 3.25 x 9.5 Color: 4C Publication: Electronic Products ssue Date: Feb 2011
This Ad Prepared by Sanna Mattson MacLeod
they make things simple. Where others

find ways to complicate the process, Mill-Max
consistently delivers whats needed, when
its needed, with little or no fuss.
At Mill-Max we do everything we can to make your

job easier from our easy-to-use website to quick-
turnaround quotesresponsive customer service and
technical supporton-time deliveryfree samples
and so much more.
Quality is not open to compromise,

and Mill-Max components meet our
very stringent standards.
cles. Latching eliminates accidental unplugging for such mo-

bile applications as handheld devices with controller-to-pe-
ripheral interconnection.
The circular sealed version of USB 2.0 plugs and receptacles
provide an environmentally protected USB for field data col-
lection systems, keyboard, video mouse extensions, human-
machine interfaces, and industrial control panels, protecting
against water and dust ingress to IP67 level. Connector halves
are durably interlocked and have a quarter-turn bayonet latch.
(Contact company for price available now.)
TE Connectivity, Harrisburg, PA
Product Information Center 800-522-6752
www.te.com/products/Industrial-USB-connectors
Cable wrap prevents binding, crushing
Strap-It Cable Wrap is a hook and loop cable organizer
that can be cut to length and reused for bundling fiber
optic cables damaged from rigidity and overtightening of
plastic ties.
Easily adjustable, the organizer comes in -, 3/5-, and
1-in.-wide sizes on 25-yard rolls. The nylon wrap features
a micro hook on one side and low-profile loop on the
other. Applications include audio-visual equipment, fiber
optics, home stereo, medical instrumentation, telecom-
munications cabling, and other cable systems. (Contact
company for pricing available now.)
Eastex Products, Holbrook, MA
John Kimball 781-767-4511 jkimball@eastexproducts.com
www.eastexproducts.com
www.masterbond.com
154 Hobart Street, Hackensack, NJ 07601 USA
+1.201.33.883 - mainmasterbond.com
right off the bat
High shear and peel strength
Resists vibration and impact
Non-drip
Superior electrical insulator
One Part Epoxy Adhesive Has Exceptional
Thermal Conductivity
Supreme 3ANHT
Packaging &
Interconnections
Abracon Corporation 24
Absopulse Electronics Ltd. 71
Advanced Interconnections Corp. 77
Advanced Power Solutions 73
Agilent Technologies, Inc. Cover 2, 2, 3, 21, 51
AKM Semiconductor, Inc. 63
Allied Electronics, Inc. Cover 3
Ametek Programmable Power 72
APM Hexseal 66
Aries Electronics, Inc. 57
Avnet Electronic Marketing 29, 37
Bel Fuse Inc. 56
Cirrus Logic, Inc. 7
CIT Relay & Switch 68
Clare, Inc. 69
Coilcraft CPS 53
Coilcraft, Inc. 10
Cornell Dubilier Electronics 25
Digi-Key Corporation 1
Epcos AG 41
FCI Electronics 60, 61
Floyd Bell Inc. 80
Garrett Electronics Corporation 20
GlobTek, Inc. Cover 1, 71
Hammond Manufacturing Company Inc. 78
Harting, Inc. 59
Harwin 58
Hittite Microwave Corporation 43
Integrated Power Designs, Inc. 19
International Rectifer Insert, 65
Ironwood Electronics 80
IXYS Corporation 34
KOA Speer Electronics, Inc. 55
Krohn-Hite Corporation 76, 80
Linear Technology Corporation 13
Master Bond Inc. 79
Maxim Integrated Products, Inc. Cover 4
Mean Well USA, Inc. 4
Measurement Computing Corporation 74
Memory Protection Devices 39
MicroMo Electronics, Inc. 35
MicroPower Direct, LLC 38
Microtips Technology, Inc. 20
Mill-Max Manufacturing Corp. 79
Mouser Electronics 16, 17, 27, 32
MuRata Power Solutions, Inc. 40
National Instruments 15
Newark/element14 9
OKW Enclosures, Inc. 77
Panasonic Industrial Company 80
PDuke Technology 73
Pico Electronics, Inc. 54, 64
Positronic Industries 23
Precision Paper Tube Company 78
Rigol Technologies 75
Statek Corporation 67
TDK-Lambda Americas, Inc. 30
Total Power International, Inc. 72
Traco Power 70
Voltage Multipliers Inc. 42
Zilog Inc. 26
BGA & QFN Sockets
Quick-Turn Custom Designs
BandwidIhs Io 40 GHz SockeIs or ALL Xilinx
IndusIrys SmallesI FooIprinI and AlIera Chips
Five dierenI conIacIor opIions FiIch 0.4mm Io 1.27mm
MulIi Level SIacked sockeIs SMT OpIions
Ideal or FroIoIype and TesI
BGA and QFN
SimulaIion Models Available
Ironwood Electronics
Tel: (800) 404-0204
Fax: (952) 229-8201
www.ironwoodelectronics.com
Voice-Capable Alarms Replace Ambiguous Beep
Sometimes a beep or whoop doesnt convey enough
information.
Announcer Series alarms rom Floyd Bell play a pre-recorded
audio message or voice instructions up to ten seconds
(up Io 0dB).
Choose rom sIandard messages ("Warning!"), or cusIom
message producIion. Announcer Series alarms come sIandard
wiIh quick connecI Ierminals
and volIage range Io LI your
applicaIion.
Floyd Bell Inc.
888-FLOYD-BELL
sales@foydbell.com
www.foydbell.com
Panasonics ECW-F(A) Series 250/450V
Metallized Polypropylene Capacitors
The ECW-F(A) Series features Panasonics new safety construction
for increased capacitor safety. This patterned metallization
technology allows current to fow past a failed point bypassing
failed cells and therefore increasing capacitor safety.
The ECW-F(A) Series miniaturized footprint is the choice for
application downsizing where
smaller case sizes are required.
Panasonic Electronic
Components
1-800-344-2112
piccomponentsmarketing@
us.panasonic.com
www.panasonic.com/industrial/
electronic-components/
For Reprints contact Wrights Media 877-652-5295
Fixed Frequency Active Filter Modules
Krohn-Hites Fixed Frequency Filter Modules and Module Boxes
are a low cost customer defned solution for anti-aliasing and
noise reduction applications.
Analog, ConIinuous Time, Low Noise
Frequency SelecIion: 1Hz Io 2MHz
HF, LF, BF and CusIom
1 Io 8 and 1o-Foles Available
BuIIerworIh or Bessel Responses
InpuI Gains rom 1 Io 100
OuIpuI Gains rom 1 Io 100
For more inormaIion call:
Krohn-Hite
(508) 580-1660
www.krohn-hite.com
advertiser index
This index is provided as an additional service.
The publisher does not assume any liability for errors or omissions.
Product mart
Electronic Products Presented by the Manufacturer
Buy it your way from
Allied Electronics.
1.800.433.5700
Allied Electronics, Inc 2012. Allied Electronics and the Allied Electronics logo are trademarks of Allied Electronics, Inc. An Electrocomponents Company.
THINK ALLIED
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NOV11-MultiChannel Ad (EP).qxd:Ad Layout 12/7/11 11:08 AM Page 1
Imagine what you could do if you didnt have to sacrifce size for efciency. You could drive power densities to new levels in
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2012 Maxim Integrated Products, Inc. All rights reserved. Innovation Delivered, Maxim, and the Maxim logo are trademarks or registered trademarks of Maxim Integrated Products, Inc., in the United States and other jurisdictions throughout the world.
All other company names may be trade names or trademarks of their respective owners.
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Imagination. Its in everything we do.

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