PCB Design for High Performance

DesignCon 2002
TecForum HP-TF4

DesignCon 2002 TecForum

 Contents

§ Materials and their impact on signal integrity

§ Cost-effective PCB design
§ Capabilities

DesignCon 2002 TecForum

 PCB Materials
5
D k = Dielectric Constant @ 1GHz

4,5

4 GETEK

Rogers Polyimide Polyimide FR-

4000 4
3,5 BT/Epoxy Thermount
Nelco-13
APPE Cyanate
3 Ester
PTFE/Ceramic

2,5 Speedboard
C
PTFE/Glas
2 s
0 0.005 0.01 0.015 0.020 0.025

D f = Dissipation Factor @ 1GHz

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 Dk vs. Resin Content

Glass Resin
Type: Content:

1080 61 %

2116 46 %

2165 48 %
Dk
7628 43 %

Resin Content
of Laminate
(Weight %)

Typical values for FR4.

Filler Content in Resin
(Weight %)

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 Resin Loss Due to Filling
Dielectric Resin Loss due to
= No. Prepregs
Separation Filling. (Thickness in
–
(after pressing) Table)

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 How to Measure Properties

Measurement of Permittivity (Dielectric Constant) and Loss

Tangent (Dissipation Factor) of Insulating Material.

Contacting Electrode Systems (2” Disk) Method

@ 1 MHz è (IPC-TM-650 2.5.5)

Resonator Method
8 to 12.4 GHz è (IPC-TM-650 2.5.5.5)
1 to 14 GHz è (IPC-TM-650 2.5.5.5.1)

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 Frequency Dependency
<= Dk =>

Frequency (MHz)=>

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 Relative Material Prices
<= Materials =>

Times FR4 =>

Note: Shown Prices are for Indication Only!
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Cost-effective Buildups

Limit the use of advanced

(expensive) Materials to those
areas where you absolutely
can’t do without them.
}

} Here the most

sensitive/demanding tracks are
routed on layers 7 & 11 within
High Frequency Chambers.
Only on these places the Rogers
RO-4000 is been used.

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 Tolerances Impact on Impedance

Process:
• Track/Gap
Tolerance = ± 10
mm.
Material:
• Core Thickness
Tolerance = ± 25 mm.
• Prepreg Thickness
Tolerance = ± 13 mm.

Gap è
Trackwidth è
Prepreg è
Core è

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 Aspect Ratio Circuit Packs

A.R. Focus area for Circuitpacks

Area for hole size under development
ASPECT RATIO TABLE (drilled hole size)
Actual Approx 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.60 0.70 0.80 0.90 1.00 1.15
mm mils 4 6 8 10 12 14 16 18 20 24 28 31 35 39 45
0.10 4 1.0 0.7 0.5 0.4 0.3 0.3 0.3 0.2 0.2 0.2 0.1 0.1 0.1 0.1 0.1
0.15 6 1.5 1.0 0.8 0.6 0.5 0.4 0.4 0.3 0.3 0.3 0.2 0.2 0.2 0.2 0.1
0.20 8 2.0 1.3 1.0 0.8 0.7 0.6 0.5 0.4 0.4 0.3 0.3 0.3 0.2 0.2 0.2
0.30 12 3.0 2.0 1.5 1.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.4 0.3 0.3 0.3
0.50 20 5.0 3.3 2.5 2.0 1.7 1.4 1.3 1.1 1.0 0.8 0.7 0.6 0.6 0.5 0.4
0.75 30 7.5 5.0 3.8 3.0 2.5 2.1 1.9 1.7 1.5 1.3 1.1 0.9 0.8 0.8 0.7
P 1.00 39 6.7 5.0 4.0 3.3 2.9 2.5 2.2 2.0 1.7 1.4 1.3 1.1 1.0 0.9
W 1.20 47 8.0 6.0 4.8 4.0 3.4 3.0 2.7 2.4 2.0 1.7 1.5 1.3 1.2 1.0
B 1.60 63 10.7 8.0 6.4 5.3 4.6 4.0 3.6 3.2 2.7 2.3 2.0 1.8 1.6 1.4
2.00 79 10.0 8.0 6.7 5.7 5.0 4.4 4.0 3.3 2.9 2.5 2.2 2.0 1.7
T 2.40 94 12.0 9.6 8.0 6.9 6.0 5.3 4.8 4.0 3.4 3.0 2.7 2.4 2.1
H 3.00 118 15.0 12.0 10.0 8.6 7.5 6.7 6.0 5.0 4.3 3.8 3.3 3.0 2.6
I 3.50 138 14.0 11.7 10.0 8.8 7.8 7.0 5.8 5.0 4.4 3.9 3.5 3.0
C 4.00 157 16.0 13.3 11.4 10.0 8.9 8.0 6.7 5.7 5.0 4.4 4.0 3.5
K 4.50 177 18.0 15.0 12.9 11.3 10.0 9.0 7.5 6.4 5.6 5.0 4.5 3.9
N 5.00 197 16.7 14.3 12.5 11.1 10.0 8.3 7.1 6.3 5.6 5.0 4.3
E 5.50 217 15.7 13.8 12.2 11.0 9.2 7.9 6.9 6.1 5.5 4.8
S 6.00 236 15.0 13.3 12.0 10.0 8.6 7.5 6.7 6.0 5.2
S 6.50 256 14.4 13.0 10.8 9.3 8.1 7.2 6.5 5.7
7.00 276 14.0 11.7 10.0 8.8 7.8 7.0 6.1
7.50 295 15.0 12.5 10.7 9.4 8.3 7.5 6.5
8.00 315 13.3 11.4 10.0 8.9 8.0 7.0
8.50 335 14.2 12.1 10.6 9.4 8.5 7.4
9.00 354 15.0 12.9 11.3 10.0 9.0 7.8
9.50 374 13.6 11.9 10.6 9.5 8.3
10.00 394 14.3 12.5 11.1 10.0 8.7

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 Aspect Ratio Backplanes
Viasystems Mommers holes and plating capabilities are driven by connector
(pin) technology.
Actual Approx 0.10 0.15 0.20
ASPECT RATIO TABLE (drilled hole size)
0.25 0.30 0.35 0.40 0.45 0.50
A.R. Driven by new
0.60 0.70 0.80 0.90 1.00 1.15
mm
0.10
mils
4
4
1.0
6
0.7
8
0.5
10
0.4
12
0.3
14
0.3
16
0.3
18
0.2
20
0.2
connector types GBX,
24
0.2
28
0.1
31
0.1
35
0.1
39
0.1
45
0.1
0.15
0.20
6
8
1.5
2.0
1.0
1.3
0.8
1.0
0.6
0.8
0.5
0.7
0.4
0.6
0.4
0.5
0.3
0.4
0.3
0.4
Metral 4000, mini
0.3
0.3
0.2
0.3
0.2
0.3
0.2
0.2
0.2
0.2
0.1
0.2
0.30
0.50
12
20
3.0
5.0
2.0
3.3
1.5
2.5
1.2
2.0
1.0
1.7
0.9
1.4
0.8
1.3
0.7
1.1
0.6
1.0
pressfit.
0.5
0.8
0.4
0.7
0.4
0.6
0.3
0.6
0.3
0.5
0.3
0.4
0.75 30 7.5 5.0 3.8 3.0 2.5 2.1 1.9 1.7 1.5 1.3 1.1 0.9 0.8 0.8 0.7
P
W
1.00
1.20
39
47
6.7
8.0
5.0
6.0
4.0
4.8
3.3
4.0
2.9
3.4
2.5
3.0
2.2
2.7
2.0
2.4 Develop 18:1 for
1.7
2.0
1.4
1.7
1.3
1.5
1.1
1.3
1.0
1.2
0.9
1.0
B 1.60
2.00
63
79
10.7 8.0
10.0
6.4
8.0
5.3
6.7
4.6
5.7
4.0
5.0
3.6
4.4
3.2
4.0 0.45mm FHS in 2002
2.7
3.3
2.3
2.9
2.0
2.5
1.8
2.2
1.6
2.0
1.4
1.7
T 2.40 94 12.0 9.6 8.0 6.9 6.0 5.3 4.8 4.0 3.4 3.0 2.7 2.4 2.1

Develop 20:1 for

H 3.00 118 15.0 12.0 10.0 8.6 7.5 6.7 6.0 5.0 4.3 3.8 3.3 3.0 2.6
I 3.50 138 14.0 11.7 10.0 8.8 7.8 7.0 5.8 5.0 4.4 3.9 3.5 3.0

0.45mm FHS in 2003

C 4.00 157 16.0 13.3 11.4 10.0 8.9 8.0 6.7 5.7 5.0 4.4 4.0 3.5
K 4.50 177 18.0 15.0 12.9 11.3 10.0 9.0 7.5 6.4 5.6 5.0 4.5 3.9
N 5.00 197 16.7 14.3 12.5 11.1 10.0 8.3 7.1 6.3 5.6 5.0 4.3
E 5.50 217 15.7 13.8 12.2 11.0 9.2 7.9 6.9 6.1 5.5 4.8
S 6.00 236 15.0 13.3 12.0 10.0 8.6 7.5 6.7 6.0 5.2
S 6.50 256 14.4 13.0 10.8 9.3 8.1 7.2 6.5 5.7
7.00 276 14.0 11.7 10.0 8.8 7.8 7.0 6.1
7.50 295 15.0 12.5 10.7 9.4 8.3 7.5 6.5
8.00 315 13.3 11.4 10.0 8.9 8.0 7.0
8.50 335 14.2 12.1 10.6 9.4 8.5 7.4
9.00 354 15.0 12.9 11.3 10.0 9.0 7.8
9.50 374 13.6 11.9 10.6 9.5 8.3
10.00 394 14.3 12.5 11.1 10.0 8.7

DesignCon 2002 TecForum

 Aspect Ratio - Drilling

PCB thickness limitations for one side drilling.

Drill diam. (mm): 0.1 => 0.2 => 0.25 => 0.3 => 0.6 => 0.7 => 0.8 =>
Max. PCB thickness (mm): 0.75 1.23 2.35 3.95 5.15 6.75 7.55

When the pin insertion depth allowes it, we could drilling fom both
sides.

PCB thickness limitations for both side drilling.

Drill diam. (mm): 0.1 => 0.2 => 0.25 => 0.3 => 0.6 => 0.7 => 0.8 =>
Max. PCB thickness (mm): 1.5 2.46 4.7 7.9 10.30 13.50 15.1
Max. based on plating: 0.75 3.0 4.5 5.0 9.00 10 >10

To do this, we need to known of every press fit component:

1. The pin insertion side;
2. The pin insertion depth.

DesignCon 2002 TecForum

 Reducing Hole Capacitance

• “Back-drilling” reduces hole capacitance for

Backplanes and circuit-packs.
• Depth tolerance required +/- 100mm
measured from drill side. (Tolerance
depending on dielectric tolerances.)

DesignCon 2002 TecForum

 Finishes
Drivers
• Environmental concerns
• Cost
• Assembly characteristics
• Fine pitch components
• Reliability

SEM of PCB surface. SEM of soldered joint.

Repeated Process Thermal Avail. at

Features: Cost Bondable Soldering Press-fit Flatness Waste Stress VSM
HASL
Reflow PbSn
Non-Reflow PbSn N.A.
Imm. NiAu (ENIG)
Electrolytic NiAu N.A.
OSP
Imm. Ag
Imm. Pd
Imm. Sn

DesignCon 2002 TecForum

 Questions?

For more information visit our website at:

http://www.viasystems.nl

DesignCon 2002 TecForum