15/11/2011

1
Thesis 1
RESISTIVE SUPERCONDUCTING
FAULT CURRENT LIMITER
15/11/2011
2
Contribution of this Thesis
Simulations
Simulations were carried out on the resistive
SCFCL in order better to understand its
behaviour under fault conditions and to behaviour under fault conditions and to
minimise the problems facing it. Simulations
of the shielded-inductive SCFCL were also
carried out in order to aid comparisons
between it and the resistive SCFCL.
The simulations:
15/11/2011
3
Contribution of this Thesis
1. Enabled design trade-offs for the resistive SCFCL
to be established on a quantitative basis
between the length and the critical current
density of the superconducting film, the type of
substrate material, the value of the applied substrate material, the value of the applied
voltage per unit length across the film, and the
performance of the resistive SCFCL.
2. Enabled the impact of a shunt resistor on the
reduction of transient overvoltages in the
resistive SCFCL to be evaluated.
15/11/2011
4
Contribution of this Thesis
3. Showed how the weak parts problem in the
resistive SCFCL could be reduced or eliminated by
increasing the applied voltage per unit length across
the superconducting film, by the application of an
externally magnetic field on the film from a shunt or externally magnetic field on the film from a shunt or
series connected boost coil, and by using a high
thermal conductivity substrate such as sapphire.
4. Enabled design trade-offs for the shielded-inductive
SCFCL to be formulated and comparisons to be
made between it and the resistive SCFCL.
15/11/2011
5
Contribution of this Thesis
Measurements
Measurements were carried out on a series of
superconducting samples under various voltages
and angles of fault occurrence. Measurements
with three different circuit configurations were with three different circuit configurations were
achieved:
Superconductor sample with no externally
applied magnetic field.
Superconductor sample with shunt boost coil.
Superconductor sample with series boost coil.
15/11/2011
6
Contribution of this Thesis
Measurements showed that:
1. The rise in temperature of the superconductor
sample during the fault period can be decreased by
connecting a shunt coil across the sample. connecting a shunt coil across the sample.
2. Superconductor samples can deal with a higher
number of successive faults when using a shunt
boost coil compared with a series boost coil or no
such a coil.
15/11/2011
7
Contribution of this Thesis
3. Transient overvoltages across the
superconductor sample are higher when a
series boost coil is used.
4. The degradation in the properties of the 4. The degradation in the properties of the
superconducting samples is more likely when
the temperature of the sample is higher than
the critical temperature.
15/11/2011
8
Sources of Losses in the Resistive
SCFCL: A Critical Review
1. Current Leads: There are two types of
current leads: conventional and
superconducting current leads. There are two
different cooling systems for current leads different cooling systems for current leads
namely, conduction cooled and vapour
cooled current leads.
2. Electric Contacts: The current leads are
connected to the HTSs through electric
contacts.
15/11/2011
9
Sources of Losses in the Resistive
SCFCL: A Critical Review
3. AC Losses
4. Radiation Losses.
Total Losses: minimum value of the total loss
in watts is hence given by in watts is hence given by
1.372A I 10 8.5 I 0.5R 0.03787I q
2
c sc
-6 2
c c c t
+ + + = l
Costs per year are: 13.63 when using super
insulation material with the bucket, 110.14
when using an aluminium bucket and 192.27
when using a brass bucket.
15/11/2011
10
There is an optimum value of (I L/A) which gives the
minimum value of (Q
C
/I) for each lead system.
Temperature
distribution
along the
current lead in
conduction
cooled leads cooled leads
Temperature
distribution
along the
current lead in
vapour cooled
leads
15/11/2011
11
(Q
C
/I) versus (I L/A) for both conduction cooled
and vapour cooled leads
15/11/2011
12
Simulation of Resistive SCFCL
Without Shunt Resistor or Boost
Coil Coil
15/11/2011
13
Introduction
Behaviour of the resistive SCFCL is determined by
the parameters of the superconducting film such
as length, critical current density, and type of
superconducting material.
It is also affected by an externally applied It is also affected by an externally applied
magnetic field generated for instance by a series
or shunt coil, by the type of substrate material on
which the superconducting film is deposited, and
by the thermal characteristics of the cooling
liquid in which the film is immersed.
15/11/2011
14
Design Parameters of the
Superconducting Film
T < T
c
and J > J
c
( )
( )
( )

J
J
77 T
T T
1 T J,
c77
c
c
k sc
|
|

\
|
|
|

\
|

=
T > T
c
( ) ( ) 90 - T 10 10
-8 -6
+ =
sc

t
A C
i R
T
sc
2
lim sc
=
sc
l
15/11/2011
15
Simulation of the Resistive SCFCL
SC film
Line impedance
Input voltage
S2
S1
Load
i
lim
v
sc
v
sc
0
1
2
3
0 100 200 300
H
e
a
t

C
a
p
a
c
i
t
y

(
J
/
c
m
^
3
.
K
)
Temperature (K)
15/11/2011
16
T
sc
, i
lim
, R
sc
, and v
sc
for a short superconducting
film (10cm) when J
c
= 10A/mm
2
15/11/2011
17
T
sc
, i
lim
, R
sc
, and v
sc
for a medium superconducting
film (50cm) when J
c
= 10A/mm
2
15/11/2011
18
T
sc
, i
lim
, R
sc
, and v
sc
for a long superconducting
film (10m) when J
c
= 10A/mm
2
15/11/2011
19
Effect of lsc and J
c
0
0,2
0,4
0,6
0,8
1
10 20 30 40 50
F
i
r
s
t

p
e
a
k

l
i
m
i
t
e
d

c
u
r
r
e
n
t
/
p
e
a
k

p
r
o
s
p
e
c
t
i
v
e

c
u
r
r
e
n
t

(
-
)
Jc=10A/mm^2 Jc=100A/mm^2
0
2
4
6
8
10
12
10 20 30 40 50
F
i
f
t
h

p
e
a
k

l
i
m
i
t
e
d

c
u
r
r
e
n
t
/
p
e
a
k

n
o
m
i
n
a
l

c
u
r
r
e
n
t

(
-
)
Length (cm)
Jc=10A/mm^2 Jc=100A/mm^2
10 20 30 40 50
Length (cm)
77
127
177
227
277
327
10 20 30 40 50
T
e
m
p
e
r
a
t
u
r
e

(
K
)
Length (cm)
Jc=10A/mm^2 Jc=100A/mm^2
0
2
4
6
8
10
10 20 30 40 50
T
r
a
n
s
i
e
n
t

o
v
e
r
v
o
l
t
a
g
e
/
p
e
a
k

i
n
p
u
t

v
o
l
t
a
g
e

(
-
)
Length (cm)
Jc=10A/mm^2 Jc=100A/mm^2
15/11/2011
20
Effect of the input voltage and J
c
0
0,2
0,4
0,6
0,8
1
40 80 120 160 200
F
i
r
s
t

p
e
a
k

l
i
m
i
t
e
d

c
u
r
r
e
n
t
/
p
e
a
k

p
r
o
s
p
e
c
t
i
v
e

c
u
r
r
e
n
t

(
-
)
Peak input voltage (cm)
Jc=10A/mm^2 Jc=100A/mm^2
0
2
4
6
8
10
12
40 80 120 160 200
F
i
f
t
h

p
e
a
k

l
i
m
i
t
e
d

c
u
r
r
e
n
t
/
p
e
a
k

n
o
m
i
n
a
l

c
u
r
r
e
n
t

(
-
)
Peak input voltage (V)
Jc=10A/mm^2 Jc=100A/mm^2
77
177
277
377
477
40 80 120 160 200
T
e
m
p
e
r
a
t
u
r
e

(
K
)
Peak input voltage (V)
Jc=10A/mm^2 Jc=100A/mm^2
0
200
400
600
800
1000
1200
1400
10 30 50 70 90 110 130 150 170 190
P
e
a
k

i
n
p
u
t

v
o
l
t
a
g
e

(
V
)
Length (cm)
Jc=10A/mm^2 Jc=100A/mm^2
15/11/2011
21
T
sc
of the weak and major parts when J
c
= 10A/mm
2
lsc = 10cm lsc = 60cm
15/11/2011
22
T
sc
of the weak and major parts when J
c
= 100A/mm
2
lsc = 10cm
lsc = 60cm
15/11/2011
23
T
sc
of the weak and major parts when
J
c
= 10A/mm
2
, lsc= 60cm, and V
inp
= 160V
J
c
= 100A/mm
2
, lsc= 60cm, and V
inp
= 380V
15/11/2011
24
T
sc
of the 10 sections when J
c
= 10A/mm
2
lsc= 10cm
lsc= 60cm
15/11/2011
25
T
sc
of the 10 sections when J
c
= 100A/mm
2
lsc= 10cm lsc= 60cm
15/11/2011
26
T
sc
of the 10 sections when
J
c
= 10A/mm
2
, lsc = 60cm, and V
inp
= 160 V
J
c
= 100A/mm
2
, lsc = 60cm, and V
inp
= 380V
15/11/2011
27
Conclusion
1. Increasing lsc is desirable if instantaneous limitation
and recovery with no excessive current dives or
overvoltages are required. However, increasing
increases the volume of the FCL and the losses under
non-fault conditions.
2. Increasing J
c
is desirable as this effectively limits the
fault current. However, for high J , the fault current. However, for high J
c
, the
superconducting film can survive only if it is so
homogeneous that its whole length quenches
simultaneously.
3. In a long limiter length or in a limiter consisting of
many samples connected in series, the fault current
may be limited by only a small fraction of the limiter
while most of its length stays below T
c
.
15/11/2011
28
Conclusion
4. Increasing the voltage per unit length across the
superconducting film could be a reliable way of
solving the weak parts problem in superconducting
samples with low J
c
. However, it is not effective in
samples with high J
c
.
c
5. Increasing T
sc
during the limiting period is not safe
as it is relies on the opening of a circuit breaker to
remove the current. If for any reason the circuit
breaker opening is delayed, the likelihood is that
the superconducting film will be damaged and
there is a consequent risk that the resistive SCFCL
will be totally destroyed.
15/11/2011
29
Simulation of Resistive SCFCL with
Shunt Resistor and Boost Coils Shunt Resistor and Boost Coils
15/11/2011
30
Introduction
Two important problems in the resistive SCFCL
were outlined. The first problem concerned
the transient overvoltages when the
superconducting film changes from the flux- superconducting film changes from the flux-
flow state to the normal state (and vice
versa). The second problem is the formation
of weak parts in the superconducting film
during the fault period.
15/11/2011
31
Introduction
The first problem can be reduced by
connecting a shunt resistor across the
superconducting film. The second problem
can be reduced by designing the resistive
SCFCL so that the critical currents of the weak SCFCL so that the critical currents of the weak
and major parts of the superconducting film
and of the different sections of a multisection
film are below the limited current. This could
be done by applying a magnetic field to the
superconducting film during the fault period.
15/11/2011
32
Maximum T
sc
during the fault period and the
normalised first peak of both i
lim
and i
sc
when J
c
= 10A/mm
2
and lsc = 10cm
0,6
0,8
1
227
277
327
F
i
r
s
t

p
e
a
k

l
i
m
i
t
e
d

c
u
r
r
e
n
t
/
p
e
a
k

p
r
o
s
p
e
c
t
i
v
e

)
T
e
m
p
e
r
a
t
u
r
e

(
K
)
0
0,2
0,4
0,6
77
127
177
227
0,1 1 10
F
i
r
s
t

p
e
a
k

l
i
m
i
t
e
d

c
u
r
r
e
n
t
/
p
e
a
k

p
r
o
s
p
e
c
t
i
v
e

c
u
r
r
e
n
t

(
-
)
T
e
m
p
e
r
a
t
u
r
e

(
K
)
Shunt resistance (ohm)
Tsc
isc
ilim
15/11/2011
33
Waveforms of v
sc
during the fault period for
different R
sh
when J
c
= 10A/mm
2
and lsc =
10cm
15/11/2011
34
Waveforms of weak part and major part temperature
when lsc = 60cm, J
c
= 10A/mm
2
R
sh
= 0.1 R
sh
= 10
The weak parts problem becomes worse when using a shunt resistor
and small values of R
sh
are worse than high values. This is because
the shunt resistor decreases i
sc
, which helps the major part to stay
below the critical temperature, so that the fault is then limited by the
weak part only.
15/11/2011
35
Effect of Connecting a Shunt Boost
Coil across the Resistive SCFCL Coil across the Resistive SCFCL
15/11/2011
36
Superconducting film contains only one small
weak part
J
c
= 100A/mm
2 J
c
= 10A/mm
2
The weak parts problem is diminished when a magnetic
field is applied from a shunt boost coil. However, the
problem still exists, especially with high J
c
.
15/11/2011
37
Multisection superconducting film
J
c
= 10A/mm
2
and lsc = 60 cm
J
c
= 100A/mm
2
and lsc = 10 cm
The problem is nearly solved. However, a higher magnetic
field would be required to quench all 10 sections.
15/11/2011
38
Effect of Connecting a Series Boost
Coil with the Resistive SCFCL Coil with the Resistive SCFCL
15/11/2011
39
Values of Kc, L
series
and R
series
of the
series boost coil
Values of Kc and the corresponding impedances
of the coil estimated for six designs of boost coil
(same core, different number of turns).
Kc (T/A) 0.0125 0.01 0.005 0.0025 0.002 0.001
L (mH) 1.7 1.088 0.272 0.068 0.04352 0.01088
R (m) 34 27.2 13.6 6.8 5.44 2.72
(same core, different number of turns).
15/11/2011
40
Superconducting film contains only one small weak
part for J
c
= 10A/mm
2
, lsc = 60cm, and Kc = 0.002T/A
With this small value of Kc, the two parts quench
simultaneously, however, the above design is accompanied
by high overvoltages of v
sc
15/11/2011
41
Multisection superconducting film
J
c
= 10A/mm
2
, lsc = 60cm, Kc = 0.002T/A J
c
= 100A/mm
2
, lsc = 10cm, Kc = 0.001T/A
This design is acceptable and the weak parts problem is
nearly solved , however, this design is accompanied by
transient overvoltages that decrease its effectiveness.
15/11/2011
42
Multisection superconducting film
J
c
= 10A/mm
2
,
= 60cm
J
c
= 100A/mm
2
,
= 10cm
J
c
= 100A/mm
2
,
= 60cm
Q NQ Q NQ Q NQ
Without boost coil 3 7 7 3 1 9
With shunt boost coil
(perpendicular field)
8 2 9 1 1 9
Kc = 0.0125T/A
With series boost coil
(Parallel field)
9 1 10 0 10 0
Kc = 0.002T/A Kc = 0.001T/A Kc = 0.01T/A
15/11/2011
43
Conclusion
1. Use of a shunt resistor is advantageous with high
J
c
but cannot be used with low J
c
films. Low values
of R
sh
are not preferred. Transient overvoltages
can be reduced by using a shunt resistor.
2. Use of a shunt boost coil is accompanied by
significant transient overvoltages. Perpendicular
magnetic field is preferred when a shunt boost
coil is used. It helps to reduce the weak parts
problems but seems not to solve it completely.
Finally, large coils are required to generate high
magnetic fields.
15/11/2011
44
Simulation of Resistive SCFCL
with Different Substrates with Different Substrates
15/11/2011
45
Introduction
There are several substrates available and several
deposition methods for HTS. LaAlO
3
(Lanthanum
Aluminate), Al
2
O
3
(Sapphire), YSZ (Yttria Stabilised
Zirconia), STO (Strontium Titanate), and MgO
(Magnesium Oxide) substrates are used for YBCO films.
The thermal conductivity of the substrate plays a great The thermal conductivity of the substrate plays a great
role in the removal of heat from the superconducting
film during the fault period.
If the superconducting film is deposited on a low
thermal conductivity substrate then the heat removed
to the substrate will be small. However, if a high
conductivity substrate was used then the heat removed
will be improved.
15/11/2011
46
Heat transfer between the
superconducting film and liquid nitrogen

+ =
< =
< =
< =
T 28.3 T 80 10 4 A q
28.3 T 13 T 10 4 A q
13 T 10 10 14 A q
10 T 0 T 250 A q
3
n
4 - 9
n
4
n
2.75
n
15/11/2011
47
Heat transfer between the
superconducting film and substrate
T
T1
T2
Tm-2
Layer 1
Layer 2
Layer m-1
Superconducting film
Substrate
[ ] [ ]
(
(
(
(
(
(
(

+
(
(
(
(
(
(
(

=
(
(
(
(
(
(
(

2
1
2
1
.
2
1
.
.
U
U
B
.
.
T
T
A
.
.
T
T
Tm = 77 K
Tm-1
Tm-2
Layer m-1
Layer m
Surface in contact with liquid nitrogen
DU CX Y
BU AX X
+ =
+ =

[ ] [ ]
(
(
(
(
(
(

+
(
(
(
(
(
(

=
(
(
(
(
(
(

(
(

(
(

(
(

m
2
1
m
2
1
m
2
1
m m
.
m
U
.
.
U
U
D
T
.
.
T
T
C
T
.
.
T
T
U T
T
15/11/2011
48
Heat transfer between the
superconducting film and substrate
1
2 2 2
2 2
2 2
2 2 2
2 2 2
2 2
0
0
0
0
0
k
B ,
k 2k - k 0 0 0 0
0 k 2k - 0 0 0 0
0 0 0 2k - k 0 0
0 0 0 k 2k - k 0
0 0 0 0 k 2k - k
0 0 0 0 0 k k -
A
(
(
(
(
(
(
(
(
(
(
(

=
(
(
(
(
(
(
(
(
(
(
(

=
M
L
L
M M M O M M M M
L
L
L
L
2
2 2
2
2 2
1
2 2 2
d C
k ,
V C
1
k where
0
0
0
0
0
0
0
D ,
1 0 0 0 0 0 0
0 1 0 0 0 0 0
0 0 1 0 0 0 0
0 0 0 1 0 0 0
0 0 0 0 1 0 0
0 0 0 0 0 1 0
0 0 0 0 0 0 1
C
0
0
0 0 0 0 0 0 0
k 2k - k 0 0 0 0

= =
(
(
(
(
(
(
(
(
(
(
(

=
(
(
(
(
(
(
(
(
(
(
(

=
(
(
(

(
(
(

M
L
L
L
M M M O M M M M
L
L
L
L
L
L
15/11/2011
49
Heat transfer between the
superconducting film and substrate
MgO STO YSZ
Thermal conductivity (W/m.K)
40.6 20 1.4
Specific heat capacity (J/m
3
.K)
3 10
6
1.216 10
6
2.5 10
6
Thermal
conductivity for
single crystal
sapphire
15/11/2011
50
177
227
277
T
e
m
p
e
r
a
t
u
r
e

(
K
)
Sapphire YSZ
77
127
0 0,2 0,4 0,6 0,8 1
T
e
m
p
e
r
a
t
u
r
e

(
K
)
Distance (mm)
Temperature along the axis of
the substrate
T
sc
when using
different substrates
15/11/2011
51
Temperature distribution for
Sapphire substrate layers
Temperature distribution for
YSZ substrate layers
15/11/2011
52
200
250
300
V
o
l
t
a
g
e

(
V
)
10A/mm^2
100A/mm^2
0
50
100
150
YSZ STO MgO Sapphire
V
o
l
t
a
g
e

(
V
)
Substrate material
Maximum allowable input voltage with different substrate materials
15/11/2011
53
Effect of Substrate on the Weak Parts Problem
STO substrate MgO substrate
Neither STO nor MgO substrates are effective in solving
the weak parts problem.
15/11/2011
54
Sapphire, J
c
= 100A/mm
2
, lsc
= 10cm, and peak Vin = 80V
Sapphire, J
c
= 100A/mm
2
, lsc =
60cm, and peak Vin = 400V
Sapphire substrate appears to solve small disturbances in
the temperatures of the different sections.
15/11/2011
55
Sapphire Recovery time for the
superconducting film after the
opening of a circuit breaker
Sapphire substrate is
not effective when
the disturbance
becomes large.
15/11/2011
56
Conclusion
1. Liquid nitrogen has a negligible effect on T
sc
during
the limitation time.
2. The thermal conductivity of the substrate plays a
major role in absorbing heat from the
superconducting film during and after the fault
period, decreases T
sc
and increases the allowable period, decreases T
sc
and increases the allowable
voltage per unit length. This effect increases when
increasing J
c
. Absorption of more heat decreases
the recovery time of the film.
3. YSZ, STO and MgO substrates have no effect on
solving any weak parts problem. However, sapphire
substrates can solve a mild weak parts problem but
fail in solving a severe weak parts problem.
15/11/2011
57
Simulation of the Shielded-
Inductive SCFCL Inductive SCFCL
15/11/2011
58
The hot spots are not a problem in the shielded-
inductive SCFCL
15/11/2011
59
Laboratory Set-up and
Experimental Procedures Experimental Procedures
15/11/2011
60
Introduction
Magnetic fields applied to the superconducting
sample can be generated from a boost coil
connected in series or in parallel with the
superconducting sample. This coil can have either an
air core or an iron core. Factors affecting the design air core or an iron core. Factors affecting the design
of both types of coil are covered.
Irons higher permeability is expected to result in
improved figures of weight, resistance and
inductance. In order to ensure a uniform magnetic
field on the superconducting sample, it is envisaged
that the superconducting sample is located in an air
gap in the iron circuit.
15/11/2011
61
95
5
5
5
5
5
10
55
1
5
3
5
Configuration of the iron
core used for the iron-
cored coil (dimensions in
mm)
2
8
5
5
5
10
5
5
1
0
1
0
5
58
1
0
1
0
1
(a)
(b) (c)
Configuration of the pieces
of material used for
insulating coil from the
iron core and keeping the
veroboard in upright
position (dimensions in
mm)
15/11/2011
62
10
1
0
3
Current probes
Voltage probes
1 2 3 4
51
5
1
3
Superconductor sample
Schematic diagram of the DC 4-
terminal method
Superconducting sample (dimensions in mm)
15/11/2011
63
Circuits used for measuring I-V characteristics of the
superconducting sample
Diode
DC input
voltage
Pulsed
voltage
t
e
n
t
Current Probe
Amplifier
Line resistance
Gate
Drive
Diode
Instrumentation
Amplifier
Digital
Storage
Oscilloscope
Superconducting
Sample
C
u
r
r
e
n
t

M
e
a
s
u
r
e
m
e
Voltage Measurement
Amplifier
IRF540
MOSFET
15/11/2011
64
Circuit used for current limiting measurement of the
superconducting sample
Line Resistance
Current Probe
Amplifier
n
t
Line Inductance
0
V
,

5
0
H
z
20:1
Step down
transformer
Digital
Storage
Oscilloscope
Superconducting
Sample
C
u
r
r
e
n
t

M
e
a
s
u
r
e
m
e
n
Voltage Measurement
S1
(Semiconductor
switch)
T2
T1
2
4
0
Variac
20:1
Step down
transformer
15/11/2011
65
Measuring the I-V Characteristics of the
Superconducting Sample
8,0E-04
1,0E-03
1,2E-03
E
l
e
c
t
r
i
c

f
i
e
l
d
,

E

(
V
/
c
m
)
0 mT
11 mT
22 mT
34 mT
57.75 mT
0,0E+00
2,0E-04
4,0E-04
6,0E-04
0 4 8 12 16 20
E
l
e
c
t
r
i
c

f
i
e
l
d
,

E

(
V
/
c
m
)
Current density, J (A/mm^2)