MSPP Page 1

Wireless Broadband
Trends and Challenges

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Technology Trends

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Wireless Applications Roadmap

UWB
Wi-MAX

Source: Philips
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Communications and
Computing Convergence

Source: Intel
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Quad-Band Mobile Phones

Handspring Treo 600 Motorola V525

• Multi-Band : GSM 850/900/1800/1900 MHz • Multi-Band : GSM 850/900/1800/1900 MHz
• Baseband: 144 MHz ARM Processor • Bluetooth

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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SMART Phones

O2 Xphone
• Multi-Band : GSM 900/1800/1900 MHz
• Baseband: 144 MHz ARM Processor
• Bluetooth
• Wireless Modem

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Emerging Applications

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Wireless Standards

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Wireless Standards

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Wireless Broadband

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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WLAN & UMTS / 3G Interoperability

Strong need for interoperability between LAN and Cellular standards

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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WLAN Trends

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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WLAN and Bluetooth Coexistence

Strong need for co-existence between LAN and PAN standards

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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UWB (Ultrawideband)

Home Mesh Networking Performance Requirements

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
MSPP
UWB (Ultrawideband)
Impulse radio
implementation
Traditional design approach for UWB communication
system using narrow time-domain pulses that occupy
a very wide spectrum
• encodes information using impulses
• impulses can be modulated either with
position, or with amplitude or with phase
• especially effective for radars systems
• difficult to be realized in CMOS
• application into niche markets such as
radars, imaging, military communications
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Pulsed multi-band
implementation
In the Multi-band approach the information is encoded
in multiple RF sub-bands at staggered time, each band
occupying 500MHZ.
• use multiple frequency band to efficiently use
the UWB spectrum
• transmits multiple UWB signal at different
frequencies
• signals don’t interfere with each other
because they operate at different frequencies
• available spectrum is broken down in bands
each of them occupying 500MHz bandwidth.
• can be realized in CMOS
• application in personal network area which
requires speeds of 110,220 and 480Mbps at
10m with low power consumption
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LMDS (Local Multipoint Distribution System)

• Point to Multipoint Communication (Video, Digital, Internet)

• Interoperable with Ethernet and Optical Standards
• Lower Entry and Deployment Costs
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Wi-MAX

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Wi-MAX

• Very High Data Rate

• Interoperable with WLAN
• Lower Entry and Deployment Costs
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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SiP Integration:
Technologies and Challenges

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Key Integration Challenges

Higher Operating Frequency

• Signal Integrity Design and Modelling
• Low-loss substrate, materials, etc.
• Low-loss interconnection

Miniaturization
• High Density Interconnection
• Compact Passives and Antenna Integration
• Noise Coupling Reduction Design Methodologies
• Thermal Management

Interoperability
• Multi-Band (3G, WLAN, Bluetooth)
• Mixed-Mode, Mixed-Signal Design and Modelling

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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RF Module Integration Trends

Separate RF Modules SiP RF Module

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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802.11 a/b/g RF Module Integration

Source: EPCOS
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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WLAN PA Module

Source: Infineon
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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RF SiP

Source: Philips
Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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SiP with Antenna Integration

802.11 a/b/g Bluetooth

Source: IMEC Source: Amkor

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004
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Summary

Strong drive for integration of RF, Digital, Passives

• Mixed-signal (Baseband and RF) integration
• Multi-band and multi-mode functionality
• Higher frequency: Wi-MAX (up to 11 GHz), UWB (up to 11 GHz), LMDS (28 GHz)

System in Package (SiP) will provide

• Flexible and cost-effective integration of High-Q passives and antenna
• Faster time-to-market
• Enhanced interoperability between multiple wireless broadband standards

Forum on SiP Integration for Wireless Applications, SIMTech Auditorium, 3 May 2004