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DATA SHEET
Philips Semiconductors
Product specication
PCA82C250
The PCA82C250 is the interface between the CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.
UNIT A Mbaud V V ns C
ORDERING INFORMATION TYPE NUMBER PCA82C250 PCA82C250T PCA82C250U PACKAGE NAME DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm bare die; 2790 1780 380 m CODE SOT97-1 SOT96-1
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
VCC 3
TXD
PROTECTION
Rs
SLOPE/ STANDBY
DRIVER HS 7 CANH
RXD
RECEIVER 6 CANL
Vref
REFERENCE VOLTAGE
PCA82C250
2 GND
MKA669
PINNING SYMBOL TXD GND VCC RXD Vref CANL CANH Rs PIN 1 2 3 4 5 6 7 8 ground supply voltage receive data output reference voltage output LOW-level CAN voltage input/output HIGH-level CAN voltage input/output slope resistor input DESCRIPTION transmit data input
handbook, halfpage
TXD 1 GND 2
PCA82C250
VCC RXD 3 4
MKA670
6 5
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
Pin 8 (Rs) allows three different modes of operation to be selected: high-speed, slope control or standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slope. Use of a shielded cable is recommended to avoid RFI problems. The high-speed mode is selected by connecting pin 8 to ground. For lower speeds or shorter bus length, an unshielded twisted pair or a parallel pair of wires can be used for the bus. To reduce RFI, the rise and fall slope should be limited. The rise and fall slope can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If a HIGH level is applied to pin 8, the circuit enters a low current standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slow in standby mode, the first message will be lost.
RESULTING VOLTAGE OR CURRENT AT PIN Rs IRs < 10 A 0.4VCC < VRs < 0.6VCC IRs < 500 A
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2; positive input current. SYMBOL VCC Vn V6, 7 Vtrt Tstg Tamb Tvj Vesd PARAMETER supply voltage DC voltage at pins 1, 4, 5 and 8 DC voltage at pins 6 and 7 transient voltage at pins 6 and 7 storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage note 1 note 2 note 3 Notes 1. In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). 2. Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V. 3. Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PCA82C250 PCA82C250T QUALITY SPECIFICATION According to SNW-FQ-611 part E. PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 100 160 K/W K/W VALUE UNIT 0 V < VCC < 5.5 V; no time limit see Fig.8 CONDITIONS MIN. 0.3 0.3 8.0 150 55 40 40 2000 200 MAX. +9.0 +18.0 +100 +150 +125 +150 +2000 +200 V V V C C C V V VCC + 0.3 V UNIT
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
CHARACTERISTICS VCC = 4.5 to 5.5 V; Tamb = 40 to +125 C; RL = 60 ; I8 > 10 A; unless otherwise specied; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at +25 C. SYMBOL Supply I3 supply current dominant; V1 = 1 V recessive; V1 = 4 V; R8 = 47 k recessive; V1 = 4 V; V8 = 1 V standby; Tamb < 90 C; note 1 DC bus transmitter VIH VIL IIH IIL V6,7 ILO V7 V6 V6, 7 HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current recessive bus voltage off-state output leakage current CANH output voltage CANL output voltage difference between output voltage at pins 6 and 7 output recessive output dominant V1 = 4 V V1 = 1 V V1 = 4 V; no load 2 V < (V6,V7) < 7 V 5 V < (V6,V7) < 18 V V1 = 1 V V1 = 1 V V1 = 1 V V1 = 1 V; RL = 45 ; VCC 4.9 V V1 = 4 V; no load Isc7 Isc6 short-circuit CANH current short-circuit CANL current V7 = 5 V; VCC 5 V V7 = 5 V; VCC = 5.5 V V6 = 18 V 0.7VCC 0.3 200 100 2.0 2 5 2.75 0.5 1.5 1.5 500 1.0 7 V < (V6, V7) < 12 V; not standby mode 7 V < (V6, V7) < 12 V; not standby mode see Fig.5 I4 = 100 A 1.0 0.9 1.0 0.8VCC 0 0 5 6 150 VCC + 0.3 V 0.3VCC +30 600 3.0 +1 +12 4.5 2.25 3.0 +50 105 120 160 V A A V mA mA V V V V mV mA mA mA 100 70 14 18 170 mA mA mA A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; 2 V < (V6, V7) < 7 V; unless otherwise specied Vdiff(r) differential input voltage (recessive) differential input voltage (dominant) differential input hysteresis HIGH-level output voltage (pin 4) +0.5 +0.4 5.0 5.0 VCC 0.2VCC 1.5 25 V V V V mV V V V k
Vdiff(d)
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
PARAMETER differential input resistance CANH, CANL input capacitance differential input capacitance
MIN.
TYP.
MAX. 100 20 10
UNIT k pF pF
Timing (see Figs 4, 6 and 7) tbit tonTXD toffTXD tonRXD toffRXD minimum bit time delay TXD to bus active delay TXD to bus inactive delay TXD to receiver active delay TXD to receiver inactive V8 = 1 V V8 = 1 V V8 = 1 V V8 = 1 V V8 = 1 V; VCC < 5.1 V; Tamb < +85 C V8 = 1 V; VCC < 5.1 V; Tamb < +125 C V8 = 1 V; VCC < 5.5 V; Tamb < +85 C V8 = 1 V; VCC < 5.5 V; Tamb < +125 C tonRXD toffRXD SR tWAKE tdRXDL V8 I8 Vstb Islope Vslope Note 1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC. delay TXD to receiver active delay TXD to receiver inactive differential output voltage slew rate wake-up time from standby (via pin 8) bus dominant to RXD LOW V8 = 4 V; standby mode R8 = 47 k R8 = 24 k R8 = 47 k R8 = 24 k R8 = 47 k V8 = 0 V 0.75VCC 10 0.4VCC 40 55 82 82 90 90 390 260 260 210 14 1 50 80 120 150 170 170 190 520 320 450 320 20 3 s ns ns ns ns ns ns ns ns ns ns ns V/s s s V A V A V
Standby/slope control (pin 8) input voltage for high-speed input current for high-speed input voltage for standby mode slope control mode current slope control mode voltage 0.3VCC 500 200 0.6VCC
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
handbook, halfpage
+5 V 100 pF
PCA82C250
Vref CANL GND 30 pF Rs Rext
MKA671
62
100 pF
RXD
VCC VTXD 0V
0.7VCC
MKA672
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
VRXD HIGH
LOW hysteresis
0.5 V
0.9 V
Vdiff
MKA673
Fig.5 Hysteresis.
VRs
VCC
0V
VRXD
tWAKE
MKA674
V1 = 1 V.
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
1.5 V Vdiff 0V
VRXD
tdRXDL
MKA675
V1 = 4 V; V8 = 4 V.
1 nF
PCA82C250
RXD 62 1 nF Vref GND Rs Rext CANL
SCHAFFNER GENERATOR
MKA676
The waveforms of the applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a and 3b.
2000 Jan 13
10
Philips Semiconductors
Product specication
PCA82C250
handbook, halfpage
P8xC592/P8xCE598 CAN-CONTROLLER
CTX0 CRX0 CRX1 PX,Y
PCA82C250T CAN-TRANSCEIVER
GND CANH CANL
100 nF
124
124
MKA677
2000 Jan 13
11
Philips Semiconductors
Product specication
PCA82C250
SJA1000 CAN-CONTROLLER
TX0 TX1 +5 V VDD 390 RX0 6.8 k 390 RX1 3.6 k 100 nF
6N137 0V 6N137
VSS
390 +5 V TXD
100 nF
+5 V
390
RXD
Vref
Rs VCC
+5 V
PCA82C250 CAN-TRANSCEIVER
GND CANH CANL
100 nF
Rext
124
124
MKA678
2000 Jan 13
12
Philips Semiconductors
Product specication
PCA82C250
VCC 3
TXD
Rs
RXD
CANH CANL
PCA82C250
Vref 5 6
2 GND
MKA679
2000 Jan 13
13
Philips Semiconductors
Product specication
PCA82C250
COORDINATES(1) SYMBOL TXD GND VCC RXD Vref CANL CANH Rs Note 1. All coordinates (m) represent the position of the centre of each pad with respect to the bottom left-hand corner of the die (x/y = 0). PAD x 1 2 3 4 5 6 7 8 196 1280 1767 2588 2594 1689 948 196 y 135 135 135 135 1640 1640 1640 1640
CANH
1.78 mm
PCA82C250U
1 TXD x 0
2 GND
3 VCC
0 y
RXD
Vref 5 4
CANL
Rs
2.79 mm
MGL945
2000 Jan 13
14
Philips Semiconductors
Product specication
PCA82C250
SOT97-1
D seating plane
ME
A2
A1
c Z e b1 w M (e 1) b2 5 MH
b 8
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 EIAJ SC-504-8 EUROPEAN PROJECTION
2000 Jan 13
15
Philips Semiconductors
Product specication
PCA82C250
SOT96-1
A X
c y HE v M A
Z 8 5
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
8 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
2000 Jan 13
16
Philips Semiconductors
Product specication
PCA82C250
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 17
2000 Jan 13
Philips Semiconductors
Product specication
PCA82C250
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING suitable suitable suitable suitable suitable suitable
2000 Jan 13
18
Philips Semiconductors
Product specication
PCA82C250
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
2000 Jan 13
19
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
285002/05/pp20
Jan 13