Notes of hand soldering for MLCC

Murata will explain what kind of problem will be caused in MLCC when it is soldered and solder correction by soldering iron. Also Murata will explain how to solve it.

Agenda

1. What kind of problem will be caused when MLCC is soldered by soldering iron? 2. Relationship between preheating temperature of PCB bending strength 3. Mechanism of bending strength deterioration 4. Method of hand soldering. 4.1 Using soldering iron 4.2 Using hot air gun 4.3 Hot air gun operating procedure

1. What kind of problem will be caused when MLCC is soldered by soldering iron? Cracking might be occurred into MLCC due to thermal shock by rapid and local heating from soldering iron. The bending strength might decrease due to low temperature preheating condition of PCB. (because of increasing remained tensile stress) Then, What shall we do?

Optimized preheating condition of PCB and MLCC is necessary.

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2. The Relationship between preheating temperature of PCB and bending strength

: Bending strength test Test board:100mmx40mm thicknes:1.6mm FR4 solder:Sn-3Ag-0.5Cu Products shall be judged to be defective if the change in capacitance has exceeded12.5% Test sample : MLCC 0805 X7R 0.1uF 50V Sample condition : MLCC sample is soldered on the test board by reflow soldering, Then, one side of solder fillet is melted again by soldering iron At this time, test board is preheated to 4 conditions of temperature. Preheating condition : room temp.(25deg C), 75deg C, 125deg C, 175deg C, and only reflow (not hand soldering) Test method

Not preheating

Survival rate (%)

Hand work by soldering iron after reflow will decrease bending strength.

Only reflow

Optimized preheating temperature condition of PCB is effective to improve decreasing bending strength.
Bend length (mm) 4

3. Mechanism of bending strength destroy

The stress under cooling after reflow MLCC is strong with compressive stress, but is weak with tensile stress.
concentrated point of stress

(2)MLCC (3)solder

(1) : compressive stress by shrinking PCB (2) : tensile stress by shrinking MLCC (3) : tensile stress by shrinking solder
(ref) Line expansion coefficient (ppm/deg C) FR4 board20, MLCC11, solder22

(1)PCB reflow soldering Compressive stress (+) Tensile stress (-)

Hand soldering without preheating of PCB Compressive stress (+) Tensile stress (-)

Remained stress of concentrated point

Remained stress of Concentrated point

Remained tensile stress of hand soldering without preheating of the PCB is bigger than reflow soldering.
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4. Hand soldering method

4.1 using soldering iron
1 temperature condition about the temperature of the soldering iron head BC type/3mm iron head is recommended because of large thermal capacity about preheating of the PCB At a high temperature , considering heatproof of parts as much as possible As the PCB, it is necessary to check the time of heating 2) Example of preheating PCB One-side mounted substrates hot plate hot air gun
Preheating of MLCC 90120 90120 90-120sec. Preheating of MLCC & 90 90 PCB 90sec min. B Type/R0.5

BC Type/3mm

Both-side mounted substrates (as below)

Size 1206 max 1210 min

Temp. of Iron head

Preheating of the PCB,MLCC

T 150 deg. C max 130 deg. C max

350 deg. C max 150 deg. C min 280 deg. C max 150 deg. C min

Quotation from JEITA safety application guide RCR-2335B

4. Hand soldering method.

4.2 using hot air gun
Nozzle setting each side 5sec soldering
angle 40degree

350 Temperature (deg. C) 300 250 200 150 100 50 0 0 10 20 30 Time (sec) 40

Nozzle 1hole

The back Surface

distance5mm

Photo image

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0603 X7R 1000pF

100 Survival rate (%) Survival rate (%) 80 60 40 20 0 0 1 2 3 4 Bend length (mm) 5 6 7 Soldering iron w/o preheating Only reflow Hot air gun
100 80 60 40 20 0 0

1206 X7R 1uF

Soldering iron w/o preheating Only reflow Hot air gun

Only using hot air gun is better than using soldering iron without preheating substrate.

Bend length (mm)

4. Hand soldering method.

4.3 hot air gun operating procedure 1. Pre-soldering on the pads by soldering iron 2. Coating flux on outer electrodes of MLCC 3. Melting again the pre-solder by hot air gun 4. Setting MLCC on pads and soldering one side electrode by hot air 5. Soldering another side electrode using solder wire on the pad , melting solder by hot air gun 6. Cooling
distance between MLCC and Nozzle : more than 5mm Angle : 45deg. Temperature of hot air : less than 400deg.C Flux of air : min. level Inside diameter : 2mm Time 1206 max : 10sec. max 1210 min : 30sec. max

1 hole nozzle 2mm

0603Size

JEITA safety application guide RCR-2335B-1 amendment1 (2009/8 revised) 8