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t
(4)
where GBW
amp
is the amplifier gain bandwidth. The noise
performance is typically dominated by the thermal noise of
the feedback resistor as the amplifier noise is minimized.
In this case the minimum detectable capacitance at the
optimal drive frequency is independent of R
f
:
amp
p s B
m
rms
GBW
C C T k
V
BW
C
t
) 2 ( 2
0
min
+
= A
(5)
3. Switched-capacitor circuit:
In a switched capacitor circuit the sense and reference
capacitors are charged with opposite polarity voltages and a
packet of charge proportional to the capacitance difference
is integrated on the input feedback capacitor (C
int
, Fig. 1-c):
int
C
C
V V
p out
A
=
(6)
The amplifier 1/f noise can be cancelled by correlated
double sampling (CDS) [7-10]. The wideband thermal
noise sources of amplifier and the switches are sampled at
the high impedance nodes of the circuit and aliased into the
baseband frequency range. The sampled switch noise (also
referred to as kT/C noise) is dominated by that of feedback
capacitance since this capacitor is typically small to
increase the output voltage. Also by the proper choice of
circuit topology the sampled noise at the sense and
reference capacitor remain the same and cancel each other
(e.g. [7]). The capacitance readout resolution is given by:
( ) ( ) BW TC k
C
C C C T k
f
C
B
out
p s B
s
rms
|
|
.
|
\
|
+
+
= A
int
int 0 2
min
2
) 2 ( 16
1
(7)
where C
out
is the total amplifier output capacitance and f
s
is
the sampling frequency. The first term corresponds to the
sampled amplifier noise power which is doubled due to
CDS for 1/f noise cancellation.
The kT/C
int
noise can be cancelled by sampling and
deducting it from the output as shown in [8-9]. The
sampled noise of the reset switch at the end of o
reset
is
stored on the output capacitor C
o
since o
1
goes low after a
delay with respect to o
reset
. In o
2
the sampled voltage across
C
o
is in series and deducted from the amplifier output
resulting in cancellation of kT/C
int
noise (Fig. 1-d). Note
that the amplifier offset and 1/f noise can be similarly
cancelled using double-sampling at C
o
[9]. In this case the
minimum detectable capacitance is calculated by Eq. (8):
Figure 1: Simplified block diagram of various capacitive readout circuits: (a) ac-bridge with voltage amplifier;
(b) Transimpedance amplifier; (c) Switch-capacitor circuit; (d) Switched-capacitor circuit with kT/C noise reduction.
Cp
Amp
Sync.
Demod.
LPF
Vout
Cs
Cr
Vp+
Vp-
Cp
Amp
Sync.
Demod.
LPF
Vout
Cs
Cr
Vp+
Vp-
Vp+
Vp-
-
+
Cp
Cint
Vout
LPF
o
reset
Cs
Cr
Vp+
Vp-
o
1
o
2
-
+
Cp
Cint
Vout
LPF
o
reset
Cs
Cr
Vp+
Vp-
o
1
o
2
(a)
(c)
-
+
Cp
Cint
Vout
LPF
o
reset
Cs
Cr
Vp+
Vp-
o
1
o
2
Co
o
1
-
+
Cp
Cint
Vout
LPF
Vout
LPF
o
reset
Cs
Cr
Vp+
Vp-
o
1
o
2
Co
o
1
Sync.
Demod.
LPF
Vout
-
+
Rf
Cs
Vm+
Cr
Vm-
Cp
Sync.
Demod.
LPF
Vout
-
+
Rf
Cs
Vm+
Cr
Vm-
Cp
(b)
(d)
29
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( ) BW
C
C C C T k
f
C
out
p s B
s
rms
|
|
.
|
\
|
+
= A
int 0
min
) 2 ( 16
1 (8)
4. Comparison of capacitive readout schemes:
The capacitance readout schemes are compared based on
their readout resolution using equations (2), (5), (7), and
(8). These equations provide the minimum achievable
capacitance based on thermal noise limit. However, as
mentioned in the previous section other noise sources
including substrate-noise coupling, EMI, and series
interconnect resistance noise can result in an overall worse
capacitance readout resolution in practice.
Figure 2 presents the capacitance resolution for various
readout schemes with V
p
=3V and V
m
=1V as the input
parasitics and some of the circuit parameters change. As
expected the resolution for ac-bridge with voltage amplifier
increases linearly with parasitics and input referred
amplifier noise. For a transimpedance amplifier the
minimum detectable capacitance improves as the amplifier
gain bandwidth increases (10MHz & 50MHz plotted). The
SC circuit readout resolution is plotted when C
out
=15pF,
C
int
=0.5pF, and for two sampling frequencies of 500kHz
and 2MHz. The resolution improves as the sampling
frequency increases, and significant improvement is
obtained when kT/C noise is cancelled. The virtual ground
at the input of transimpedance amplifier and SC readout
circuits reduce the input parasitic capacitance effect. The
AC-bridge provides the best performance when parasitics
are small. The SC scheme is suitable for the cases when
input parasitics are large due to non-monolithic integration.
Figure 3 shows the capacitance resolution vs. C
p
for two
cases of C
s0
=100fF and C
s0
=1pF as input parasitics change.
The minimum detectable capacitance increases as the sense
capacitance becomes larger. Also the input parasitics
threshold above which the SC circuits perform better than
the ac-bridge with voltage amplifier is reduced in this case.
MICRO-G ACCELEROMETER READOUT CIRCUIT
Meeting the overall sensor module performance target
requires proper choice and optimization of the sensor and
its fabrication technology, readout circuit, and package. A
Figure 4: Switched-capacitor readout circuit for micro-g accelerometer. The main clock phases are o
p
: precharge; o
1
:
readout phase; o
2
: Offset sampling for CDS; o
f
: Feedback phase for closed-loop operation mode; o
sw
: Sense electrode
in readout & feedback phases. Reset phase (reset) and o
2
are the same.
Figure 2: Capacitance readout resolution versus input
capacitance parasitics (C
s0
=250fF) for various readout schemes.
Figure 3: Minimum detectable capacitance as the
parasitics and sense rest capacitance change.
30
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micro-g accelerometer requires both high capacitance
sensitivity and low-mechanical noise that can be achieved
by surface-bulk micromachined accelerometer [11].
However, unlike surface-micromachined accelerometers
monolithic circuit integration is not available and therefore
SC readout circuit is more suitable.
As evident from equations (6)-(8), the signal-to-noise ratio
of the SC front-end can be improved by reducing C
int
.
However, in practice C
int
cannot be reduced arbitrarily due
to switching noise and dynamic range considerations. Even
in a fully-differential SC topology the matching
requirements limit the performance with small C
int
. Figure
4 shows the schematic diagram of a switched capacitor
readout front-end which uses CDS for amplifier finite gain,
1/f noise and offset cancellation, and chopper-stabilization
of the switches to improve the matching, and to further
reduce the offset [7,10]. The CDS is implemented by
sampling the input amplifier offset on C
o
in o
2
. Chopper-
stabilization is implemented by alternating the switches at
the high impedance nodes between the two differential
signal paths. The first generation of this circuit
implemented in 1.2um 5V CMOS process resolves 75aF of
capacitance on ~120pF total sense and parasitic capacitance
with a 200kHz sampling rate. The combined micro-g
accelerometer and interface chip module (Fig. 5) achieves
Table 1: Summary of the sensor module performance.
Surface-Bulk Micromachined Accelerometer
Sensitivity
1.3pF/g (2x1mm
2
bridge)
6pF/g (4x1mm
2
bridge)
20pF/g (2x1mm
2
cantilever)
Sense + parasitic capacitance > 80pF
Mechanical Noise 0.39ug/\Hz @ 1 atmosphere
2
nd
Generation Readout Circuit
Sampling clock 1MHz
Power dissipation <12mW @ 5V
Capacitance sensitivity 0.2-1.2V/pF (adjustable)
Resolution <20aF
Sensor and Readout Circuit Module
Sensitivity 0.26-1.6V/g (2x1mm
2
bridge)
Open-loop resolution <1.6g/Hz (2x1mm
2
bridge)
Full scale range 1.35g with 5V supply
a sensitivity of 430 mV/g and a resolution of 3.5ug/\Hz
[10]. The offset is reduced by >7x to ~82ppm of the full-
scale output range when chopper stabilization is employed.
The second generation of this circuit implemented in 0.5um
CMOS resolves 20aF with 1MHz sampling rate, and has a
resolution of 1.6ug/\Hz at ambient pressure [10].
SUMMARY
This paper presents a review of capacitive readout circuits
and the trade-offs involved in their performance. Also a
high-performance switched-capacitor readout front-end for
micro-g accelerometers with high dc stability is described.
The hybrid-packaged interface circuit with an all-silicon
microaccelerometer fabricated in a combined surface and
bulk process has a resolution of 1.6ug/\Hz at ambient
pressure.
REFERENCES
[1] S.J. Sherman, et.al., Low cost monolithic accelerometer,
Dig. VLSI Circuits Symp., June 1992, pp. 34-35.
[2] K. Chau, S.R. Lewis, Y, Zhao, R. T. Howe, S.F. Bart, and
R.G. Marcheselli, An integrated force-balanced capacitive
accelerometer for low-g applications, 1995 IEEE Conf. on
Solid-State Sensors & Actuators, June 1995, pp. 593-596.
[3] J. Wu, G.K. Fedder, L.R. Carley, A low-noise low-offset
capacitive sensing amplifier for a 50-ug/\Hz monolithic
CMOS MEMS accelerometer, IEEE J. of Solid-State
Circuits, vol. 39, May 2004, pp. 722-730.
[4] W. Yun, R.T. Howe, and P.R. Gray, Surface
micromachined digitally force-balanced accelerometer with
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and Actuator Workshop, Hilton-Head Island, SC, USA, June
1992, pp. 126-131.
[5] J. A. Geen, S. J. Sherman, J. F. Chang, S. R. Lewis, Single-
chip surface micromachined integrated gyroscope with 50/h
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Dec. 2002, pp.1860-1866.
[6] N. Yazdi, A. Mason, K. Najafi, K.D. Wise, A generic
interface chip for capacitive sensors in low-power multi-
parameter microsystems, Sensors & Actuators Part A, vol.
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[7] N. Yazdi, K. Najafi, An interface IC for a capacitive silicon
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Conf., Feb. 1999, pp. 132-133.
[8] N. Wongkomet, B. E. Boser, Correlated double sampling in
capacitive position sensing circuits for micromachined
applications, 1998 IEEE Asia-Pacific Conf. on Circuits and
Systems, Nov. 1998, pp.723-726.
[9] M. Lemkin, B. Boser, A three-axis micromachined
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[10] H. Kulah, J. Chae, N. Yazdi, K. Najafi, A multi-step
electromechanical sigma-delta converter for micro-g
capacitive accelerometers, 2003 IEEE Int. Solid-State
Circuits Conference, Feb. 2003, pp. 202-203.
[11] N. Yazdi, K. Najafi, An all-silicon single-wafer micro-g
accelerometer with combined surface & bulk micromachining
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vol. 9, Dec. 2000, pp. 544-550.
Figure 5: Hybrid-packaged micro-g accelerometer
and the capacitive interface chip.
31
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