Pressure

Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features 2.5% Maximum Error over 0 to 85C Ideally Suited for Microprocessor or Microcontroller-Based Systems Available in Absolute, Differential and Gauge Configurations Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element ORDERING INFORMATION
Case Device Name No. Unibody Package (MPX5700 Series) MPX5700A MPX5700AP MPX5700AS MPX5700ASX MPX5700D MPX5700DP MPX5700GP MPX5700GP1 MPX5700GS 867 867B 867E 867F 867 867C 867B 867B 867E None # of Ports Single Dual Gauge Pressure Type Differential Absolute

MPX5700 Rev 9, 09/2009

MPX5700 Series
0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.7 V Output

Device Name MPX5700A MPX5700AP MPX5700A MPX5700A MPX5700D MPX5700DP MPX5700GP MPX5700GP MPX5700D

UNIBODY PACKAGES

MPX5700A/D CASE 867-08

MPX5700AP/GP/GP1 CASE 867B-04

MPX5700DP CASE 867C-05

MPX5700AS/GS CASE 867E-03

MPX5700ASX CASE 867F-03

Freescale Semiconductor, Inc., 2007-2009. All rights reserved.

Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in required to meet electrical specifications.)
Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Zero Pressure Offset(3) Full Scale Output(4) Full Scale Span Accuracy
(6) (5)

Symbol Gauge, Differential: MPX5700D Absolute: MPX5700A POP VS IO Gauge, Differential (0 to 85C) Absolute (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS V/P tR IO+

Min 0 15 4.75 0.088 0.184 4.587

Typ 5.0 7.0 0.2 4.7 4.5 6.4 1.0 0.1 20

Max 700 700 5.25 10 0.313 0.409 4.813 2.5

Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms

Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time 1. 2. 3. 4. 5.
(8)

1.0 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.

MPX5700 2 Sensors Freescale Semiconductor

Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Parametrics Maximum Pressure(2) (P2 1 Atmosphere) Symbol P1max Tstg TA Value 2800 -40 to +125 -40 to +125 Unit kPa C C

Storage Temperature Operating Temperature

1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 3

Sensing Element

Thin Film Temperature Compensation and Gain Stage #1

Gain Stage #2 and Ground Reference Shift Circuitry

Vout

2 GND

Pins 4, 5, and 6 are no connects

Figure 1. Fully Integrated Pressure Sensor Schematic

MPX5700 Sensors Freescale Semiconductor 3

Pressure
On-chip Temperature Compensation and Calibration
Figure 3. illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5700D in a high-pressure cyclic application, consult the factory.) The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor
. 5.0 4.5 4.0 3.5 Output (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 100 200 500 400 300 Differential Pressure (kPa) 600 700 800 Maximum Minimum Transfer Function: Vout = VS*(0.0012858*P+0.04) Error VS = 5.0 Vdc Temperature = 0 to 85C Typical

performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2. shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in . The output will saturate outside of the specified pressure range. shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.

Figure 2. Output vs. Pressure Differential

Fluoro Silicone Die Coat Wire Bond Stainless Steel Metal Cover P1 Fluoro Silicone Die Coat Wire Bond Stainless Steel Metal Cover P1

Die

Die

Lead Frame Epoxy Case

P2

RTV Die Bond

Lead Frame Epoxy Case

P2 ABSOLUTE ELEMENT

RTV Die Bond

DIFFERENTIAL/GAUGE ELEMENT

Figure 3. Cross-Sectional Diagrams (not to scale)

+5 V

Vout Vs IPS 1.0 F 0.01 F GND

Output

470 pF

Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5700 4 Sensors Freescale Semiconductor

Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX
Part Number MPX5700A/D MPX5700DP MPX5700GP/AP MPX5700GS/AS MPX5700ASX

pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
Case Type 867 867C 867B 867E 867F Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached

MPX5700 Sensors Freescale Semiconductor 5

Pressure
PACKAGE DIMENSIONS

C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6

POSITIVE PRESSURE (P1)

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66

-TG F D 6 PL 0.136 (0.005)

M

J S

T A

DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN

STYLE 1: PIN 1. 2. 3. 4. 5. 6.

VOUT GROUND VCC V1 V2 VEX

STYLE 2: PIN 1. 2. 3. 4. 5. 6.

OPEN GROUND -VOUT VSUPPLY +VOUT OPEN

STYLE 3: PIN 1. 2. 3. 4. 5. 6.

CASE 867-08 ISSUE N BASIC ELEMENT

P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2)

T Q

-AU W L V

NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH.
INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06

PORT #2 VACUUM (P2)

PORT #1 POSITIVE PRESSURE (P1)

-QB
PIN 1

K S

C
SEATING PLANE

DIM A B C D F G J K L N P Q R S U V W X

-T-

-TJ

SEATING PLANE

G F

D 6 PL 0.13 (0.005)

STYLE 1: PIN 1. 2. 3. 4. 5. 6.

VOUT GROUND VCC V1 V2 VEX

CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP)

MPX5700 6 Sensors Freescale Semiconductor

Pressure
PACKAGE DIMENSIONS

PAGE 1 OF 2

CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP)

MPX5700 Sensors Freescale Semiconductor 7

Pressure
PACKAGE DIMENSIONS

PAGE 2 OF 2

CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP)

MPX5700 8 Sensors Freescale Semiconductor

Pressure
PACKAGE DIMENSIONS
C A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
INCHES MILLIMETERS MAX MIN MAX MIN 18.28 0.720 17.53 0.690 6.48 6.22 0.245 0.255 20.82 0.780 0.820 19.81 0.84 0.69 0.027 0.033 4.72 4.52 0.178 0.186 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 9.53 8.76 0.375 0.345 7.87 7.62 0.300 0.310 6.10 5.59 0.220 0.240 4.93 4.62 0.194 0.182 STYLE 1: PIN 1. 2. 3. 4. 5. 6.

-B-

V
PIN 1

PORT #1 POSITIVE PRESSURE (P1)

S G F D 6 PL 0.13 (0.005)
M

J N E -T-

DIM A B C D E F G J K N S V

T B

VOUT GROUND VCC V1 V2 VEX

CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS)

-TC E A U -Q-

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6.

N B R

PORT #1 POSITIVE PRESSURE (P1)

PIN 1

-P0.25 (0.010)
M

T Q

S K J 0.13 (0.005)
M

T P

D 6 PL Q S F

VOUT GROUND VCC V1 V2 VEX

CASE 867F-03 ISSUE D PRESSURE SIDE AXIAL PORT (ASX)

MPX5700 Sensors Freescale Semiconductor 9

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MPX5700 Rev. 9 09/2009