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MCR12DCM MCR12DCN
Motorola Preferred Devices
Designed for high volume, low cost, industrial and consumer applications such as motor control; process control; temperature, light and speed control. SCRs 12 AMPERES RMS 600 thru 800 VOLTS
A K K A G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient Thermal Resistance Junction to Ambient (2) Maximum Lead Temperature for Soldering Purposes (3) Symbol RqJC RqJA RqJA Max 2.2 88 80 Unit C/W
TL 260 C (1) VDRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the device are exceeded. (2) Surface mounted on minimum recommended pad size. (3) 1/8 from case for 10 seconds.
Preferred devices are Motorola recommended choices for future use and best overall value.
MCR12DCM MCR12DCN
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Characteristics Peak Forward Blocking Current Peak Reverse Blocking Current (VAK = Rated VDRM or VRRM, Gate Open) Peak OnState Voltage (1) (ITM = 24 A) Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 W, TJ = 25C) (VD = 12 V, RL = 100 W, TJ = 40C) Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 W, TJ = 25C) (VD = 12 V, RL = 100 W, TJ = 40C) (VD = 12 V, RL = 100 W, TJ = 125C) Holding Current (VD = 12 V, IT = 200 mA, TJ = 25C) (VD = 12 V, IT = 200 mA, TJ = 40C) Latching Current (VD = 12 V, IG = 20 mA, TJ = 25C) (VD = 12 V, IG = 40 mA, TJ = 40C) Symbol IDRM IRRM TJ = 25C TJ = 125C VTM IGT 2.0 VGT 0.5 0.2 IH 4.0 IL 4.0 22 40 80 22 40 80 mA 0.65 1.0 2.0 mA 7.0 20 40 Volts 1.4 2.1 mA 0.01 5.0 Volts Min Typ Max Unit mA
DYNAMIC CHARACTERISTICS
Characteristics Critical Rate of Rise of OffState Voltage (VD = Rated VDRM, Exponential Waveform, Gate Open, TJ = 125C) (1) Pulse Test; Pulse Width 2.0 msec, Duty Cycle 2%. Symbol dv/dt 50 200 Min Typ Max Unit V/ms
MCR12DCM MCR12DCN
TC , MAXIMUM ALLOWABLE CASE TEMPERATURE ( C) P(AV) , AVERAGE POWER DISSIPATION (WATTS) 125 120 115 110 105 100 95 90 85 0 1.0 16 14 12 10 8.0 6.0 4.0 2.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 IT(AV), AVERAGE ONSTATE CURRENT (AMPS) 120 180
90 60 dc
a = Conduction
Angle
dc
a = 30
a = Conduction
Angle
a = 30
2.0 3.0
60 4.0
90 5.0
120 6.0
1.0
0.1 0 1.0 2.0 3.0 4.0 5.0 VT, INSTANTANEOUS ONSTATE VOLTAGE (VOLTS)
100 VGT, GATE TRIGGER VOLTAGE (VOLTS) 20 35 50 65 80 95 110 125 I GT, GATE TRIGGER CURRENT (mA)
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 5.0 40 25 10 5.0 20 35 50 65 80 95 110 125 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C)
10
1.0 40 25 10
MCR12DCM MCR12DCN
100 100
10
10
1.0 40 25 10
1.0 40 25 10
5.0
20
35
50
65
80
95
110
125
1000 VD = 800 V TJ = 125C STATIC dv/dt (V/ ms) 100 10 100 1000 10 K RGK, GATECATHODE RESISTANCE (OHMS)
MCR12DCM MCR12DCN
PACKAGE DIMENSIONS
T B V R
4
SEATING PLANE
C E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 0.030 0.050 0.138 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 0.77 1.27 3.51
S
1 2 3
A K F L D G
2 PL
Z U
J H 0.13 (0.005) T
DIM A B C D E F G H J K L R S U V Z
STYLE 4: PIN 1. 2. 3. 4.
MCR12DCM MCR12DCN
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