Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
There are several package types for Intel® processors. These different package types are illustrated below
along with a brief explanation of how to easily identify them.
Photo examples
Photo examples
FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an
Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during
manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area
for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used
in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).
Pentium 4 processor:
Micro-FCBGA
Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-
down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet.
Instead of using pins, the packages use small balls, which acts as contacts for the processor. The
advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls,
which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top
side.
Photo examples
Micro-BGA2 Package
The BGA2 package consists of a die placed face-down on an organic substrate. An epoxy material
surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small
balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are
no leads that bend. The Pentium® III processor uses the BGA2 package, which contains 495 balls.
Photo examples
Micro-PGA2 Package
The micro-PGA2 consists of a BGA package mounted to an interposer with small pins. The pins are 1.25
mm long and 0.30 mm in diameter. While there are several micro-PGA2 socket designs available, all of
them are designed to allow zero-insertion force removal and insertion of the mobile Pentium III processor.
Photo examples
MMC-2 Package
The Mobile Module Cartridge 2 (MMC-2) package has a mobile Pentium® III processor and the host bridge
system controller (consisting of the processor bus controller, memory controller and PCI bus controller) on a
small circuit. It connects to the system via a 400-pin connector. On the MMC-2 package, the thermal transfer
plate (TTP) provides heat dissipation from the processor and host bridge system controller.
Photo examples
The Mobile Intel® 915GM/PM/GMS and 910GML Express chipset family is a graphics memory controller
hub (GMCH) designed for use with 90nm process technology based Intel® Pentium® M Processors
(containing 2 MB L2 Cache) and Intel® Celeron® M processors.