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Application Note
Abstract
In addition to a brief fundamental considera-
tion of the manual lead-free and lead-
containing soldering process, this application
note describes the essential influencing
factors and their effect on the lead-free
soldering process.
Furthermore, the basic rules and specific
guidelines associated with the new manual
lead-free soldering process are illustrated.
Also, possible risks are discussed and the
general procedure of the lead-free soldering
process is described.
In conclusion an overview of the solderability
of the various LED types from OSRAM OS
are presented, along with their ability to be The quality, reproducibility and process
reworked and repaired. stability have achieved an equally high level,
although the solder heat resistance of
individual SMD components such as LEDs
Introduction makes it difficult to conform to the lead-free
soldering process.
With the introduction and ratification of
Directive 2002/95 (RoHS directive "on the In contrast, the introduction of a manual
restriction of the use of certain hazardous lead-free soldering process is still awkward,
substances in electrical and electronic since it is more difficult to control.
devices") as of June 2006, many production Although today, manual soldering is almost
lines have already switched to lead-free, exclusively used for the manufacture of
RoHS-conformant technology or are cur- prototypes and for repair or rework of
rently still in a transition phase, in which both production components, quality assurance
lead-free and lead-containing processes are represents the greatest challenge, here.
executed in parallel.
With manual lead-free soldering, the quality
In automated production sequences, the is therefore essentially influenced and
implementation of lead-free soldering determined by the solder materials and
processes has been carried out without equipment, the experience and ability of the
great difficulties, in spite of the smaller operator and a continuous process control.
processing window due to the higher melting It is therefore recommended to only carry
temperature of the new solder. out manual lead-free soldering with appro-
priate equipment and trained personnel.
In general, the soldering iron should be held The solder joint should be uniform
at the connection location with the largest and smooth in appearance (shiny is
amount of solder. In order to achieve a good not required)
heat transfer, the tip should be
simultaneously held against the solder pad The solder should taper off from the
and the connection contact of the inserted parts (small contact angle)
component.
The surface of the solder joint should
2a. Remove the liquid solder by means be unbroken.
of a desoldering braid or a pump (repair)
Cleaning
Important LED-specific points
In most cases, final cleaning is only
Since LED housings predominantly consist
necessary to remove any flux residue which
of plastic (and ceramic for a few of the new
may be present.
LEDs), the direct contact with a hot soldering
Essentially, other residue or contamination
tip can often lead to damage of the device.
should not be present.
This applies exceptionally to the plastic
optics of the LEDs.
Often, various cleansing solutions or
cleaning by means of an ultrasonic bath is
In addition, it should be noted that with
recommended by solder manufacturers.
higher soldering tip temperatures, heat is
transferred more quickly to the housing via
With the presence of LEDs, however, this is
the connection contacts.
only conditionally or not at all possible.
The prescribed solder times should therefore
not be exceeded, since this can otherwise
In principle, isopropyl alcohol (IPA) can be
damage the component.
used, since this is also suitable and
approved for cleaning LEDs from OSRAM
It should also be noted that with the various
OS.
packaging types, the size and form of the
connection contacts vary as well.
If other cleansing solutions are applied, their
For optimal soldering results, it is
suitability should be tested beforehand,
recommended to use individually adapted
particularly if there is associated damage to
soldering tips.
the LED.
If a soldering tip is too large or wide for
Because of worldwide regulations, cleansers
miniature components, for example, this can
with compounds containing chloroflurocar-
lead to overheating and thus damages to the
bons (CFCs) should not be used.
component housing. If a small, narrow tip is
used for larger contacts, however,
Cleaning by means of an ultrasonic bath is
insufficient heat is available for a good
not recommended for LEDs.
solder connection.
The reason for this is that the influence on
the LEDs is dependent on the ultrasonic
Particular experience combined with special
power, the duration of treatment and the
care and higher demands are required for
cleansing solution used.
the processing of LED with high power
If ultrasonic cleaning cannot be avoided, it
housings. The reason for this is the heat
must first be determined whether the LEDs
slug integrated in the package base. For
will be damaged in the process.
optimal heat transfer, this must be affixed or
soldered to the circuit board.
In the best and ideal case, cleaning is not
Soldering of the heat slug itself can only
required if solder with so-called NO-CLEAN
occur with the help of solder paste and an
flux is used.
additional heating plate.
Generally it is advisable to use an additional The prerequisite for this, however, is that
heating plate for lead-free soldering of LEDs, one thoroughly understands the properties
especially if an insulated metal substrate is and differences of the new solder and also
utilized. considers the corresponding process from a
technical standpoint.
In the following, Table 1 provides an In addition, with manual soldering, it is
overview of the manual solderability of generally recommended to take into account
various LED types from OSRAM OS as well the specific features of the component or
as their repair and rework capability. LED such as the package form, lead size,
etc. when defining the process window.
Miniature
Components
SmartLED
ChipLED 3 3 3
Mini Top
Looker
MiniTOPLED
PointLED 3 3 3
FIREFLY
FIREFLY RGB
Micro SIDELED
Side Looker SIDELED
Multi Color Micro
3 3 3
SIDELED
Multi SIDELED
TOPLED
TOPLED with lens
Top Looker
Multi TOPLED
RG-TOPLED 3 3 3
RG-Multi TOPLED
6-lead MultiLED
Power TOPLED
Power LED Power TOPLED with
lens 3 3 3
Adv. Pow. TOPLED
Ceramos MultiLED
Ceramos Ceramos Multi
SIDELED
2 2 2
Ceramos CERAMOS: only with special CERAMOS: only with CERAMOS: only with
equipment special equipment special equipment
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All information contained in this document has been checked with the greatest care. OSRAM Opto
Semiconductors GmbH can however, not be made liable for any damage that occurs in connection
with the use of these contents.