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3, MARCH 2006
Abstract—The common approach to attaching a large number usually used. This includes rapid through-cure, low energy
of fibers to a guided-wave device is to fabricate a linear array requirements, room temperature treatment, nonpolluting, and
using V-grooves. UV-curable adhesives are used to attach the solvent-free formulations.
fiber in V-groove for the fabrication of fiber array. Interfacial
delaminations at the adhesive fiber interfaces are common after The adhesive is supplied in the form of reactive cross-
the reliability test due to uneven curing of the UV adhesive. This linkable monomer blends, which polymerize on exposure to
paper investigated the causes of uneven curing that gave rise to light radiation at an appropriate wavelength and power. Uni-
delamination. An analytical ray tracing technique was used to form adhesive curing and bondline depend on the effective UV
estimate the variation in light intensity or shadowing during the ray penetration during adhesive curing. If there is uniform UV
UV curing of adhesive. These effects were found to be very severe
when the refractive index difference between the adhesive and the exposure, the interfaces will be drawn closer together creating
cladding materials is very large. Based on this study, it can be very little stress. The uneven curing of adhesive in the package
concluded that the delamination problem can be minimized by can generate high interfacial stresses upon heating or cooling of
selecting a UV-curable adhesive having the same refractive index the structure during fabrication, assembly, or in field use. The
of the cladding material. It is also recommended to light illuminate propagation of the resulting delamination along an interface
from the topside for fiber packaging.
can degrade or destroy the functionality of the system [4].
Index Terms—Bonding, delamination, fiber array, optical Therefore, interfacial delamination, due to the uneven curing
propagation, packaging, reliability, shadowing, V-groove.
of adhesive, is one of the primary concerns in photonic package
designs. Alignment and shrinkage of the fiber array also depend
I. I NTRODUCTION on the effective UV ray penetration during the adhesive curing
process [5].
P ACKAGING, and in particular pigtailing, is becoming
an increasingly important issue as optical networks move
from the wide area network (WAN) domain to the local area
Due to the complexity of interconnects, it is also interesting
to consider and study how UV light propagates through uneven
network (LAN) domain with a resultant pressure to increase interfaces. High light reflectance from any interface of the
production and reduce cost [1]. Fiber-to-waveguide connection assembly reduces the light intensity for the next layers and
is one of the key technologies in the realization of guided-wave induces uneven curing of adhesive. Shadowing due to light
optical devices [2]. A modified passive technique for higher bending or optical element shape can also cause incomplete
port number devices is fiber arrays in V-groove blocks. It has or uneven curing [6]. Very few studies have been directed
been used in the precise alignment between fiber and opto- to curing shrinkage and alignment of the fiber in V-groove;
electronic devices [1]. The selection of appropriate bonding no attempt has been paid to the uneven curing induced by
materials and method of attachment will determine the stability incompetent UV ray penetration. The previous study was per-
and reliability of the packaged device. Currently, UV-curable formed to understand the origin of interfacial delamination in
adhesives offer advantages in terms of mass productivity and the adhesive fiber joint of a single V-groove by analyzing light
low cost [3]. This type of adhesive not only performs the reflection, transmission, and its intensity at different portions
function of bonding but also has the high degree of light of the assembly [7]. However, the present studies elaborately
transmittance and other properties required to form a bond most described the details of the uneven curing-induced delamina-
suitable from the optics point of view. They can also be cured tion of UV adhesive-bonded eight-channel fiber array. Only a
rapidly without affecting fiber alignment. Light curing also clearer fundamental understanding of uniform light curing can
provides a number of economic advantages over the operations allow manufacturers to develop highly reliable, low cost, and
better performance optoelectronics products using UV-curable
adhesive-bonded fiber array.
Manuscript received October 26, 2004; revised November 2, 2005. This work
was supported by grants from the Innovation and Technology Fund (Project
UIT-22) and a donation Grant (Project 9220024) from Photonic Manufacturing
Services Ltd., Hong Kong. II. E XPERIMENTS
M. A. Uddin, H. P. Chan, and Y. C. Chan are with the Optoelectronics
Research Center and Department of Electronic Engineering, City University A. Materials
of Hong Kong, Kowloon, Hong Kong (e-mail: eehpchan@cityu.edu.hk).
T. O. Tsun is with the Photonics Manufacturing Services Ltd., Hong Kong. Fig. 1 shows the schematic of a typical cross-section of a fiber
Digital Object Identifier 10.1109/JLT.2005.863329 in V-groove. The fiber packages are made up of four different
C. Reliability Study
B. Fiber Assembly
The test was performed according to the test procedure
Fig. 2 shows the schematic of the bonding process of an that satisfies the Bellcore requirements (GR 326-CORE). The
eight-channel fiber array. To prepare the fiber for placement samples were placed in an environmental chamber at 75 ◦ C
into the V-grooves, it is stripped of its acrylic coating. The temperature and 95% relative humidity for 168 h. They
eight stripped fibers were inserted into the V-groove, and the lid were then removed from the test chamber and the end faces
glass is placed on them, seating them firmly into the V- of the fiber were prepared by materiallographic technique
grooves. After the fibers are seated, low-viscosity UV-curable [8]. A scanning electron microscope (SEM) was used to
adhesive is applied to the leading edge notch of the substrate. investigate any delamination induced at the adhesive fiber
The adhesive wicks down the length of the V-grooves and interfaces.
1344 JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 24, NO. 3, MARCH 2006
III. R ESULTS
At the initial material characterization step, the adhesive-
bonded glass slide showed excellent result in shear strength and
environmental test (no delamination), but after the reliability
test of the adhesive-bonded fiber array, the SEM micrographs
showed many delaminations at various locations with different
extents. The delaminations are classified and summarized be-
low according to location and extent.
Fig. 5. End face images that clearly depict the extent of delamination. (a) At Fig. 6. Comparison of delamination observed at the same magnification of
middle fiber. (b) At the outermost fiber when light exposed from the topside. outermost fiber when light illuminated from the bottom side.
TABLE I
ABSORPTION COEFFICIENT FOR THE CLADDING
MATERIAL (FUSED SILICA)
incident angle of 70◦ . The result also shows that the reflectance
is higher for a large value of ∆n, which is the refractive index
difference between adhesive and cladding materials. There-
fore, reflectance is much higher for Adhesive-1 than that of
Adhesive-2. For Adhesive-3, reflectance increases significantly
above an incident angle of 60◦ and becomes 100% at or above
the incident angle of 78.5◦ due to total internal reflection.
Fig. 8 clearly shows the large incident angles (more than
70◦ ) close to points B and C, near the fiber V-groove contact
point. Light reflectance is very high for this large incident angle.
By conservation of energy R + T = 1, what is not reflected is
transmitted (no absorption is assumed). In tracking the flow
of energy through reflection and transmission, it is realized
that light striking a surface at an angle has less intensity—
Fig. 8. Variation of incident angle at different points of the adhesive fiber
interface during the parallel light illuminating from the topside of the V-groove. less joules landing per unit area—than light striking normally
(head-on). Therefore, transmittance decreases with the increase
radius of the circle acts as a normal axis. Therefore, parallel of incident angle. Initially, it also decreases very slowly for a
lights have different incident angles at different points of that lower incident angle and then dropping more rapidly as the
surface. Fig. 8 schematically shows the variation of incident incident angle approaches 90◦ . Low intensity lands up in this
angle at different points of adhesive fiber interface during region and the adhesive remains partially uncured. Differences
the parallel light illuminating from the topside. Due to fiber in intensity at different portions of the adhesive cause uneven
geometry, it varies from 0◦ to 90◦ . It is zero at point A, then curing. When light illuminated from the bottom side of the
increases gradually, and reaches at its maximum value (90◦ ) at V-groove, it resulted in the same condition as light illuminated
points B and C. Light reflectance also varies with that variation from the topside.
of incident angle. The ratio of reflected to incident power can
be obtained from [10]
B. Uneven Curing Due to Shadowing
2 When light was incident on a curved surface from light me-
n1 cos θi − n22 − n21 sin2 θi dium (adhesive) to dense medium (fiber) with a large incident
R= 2 (2) angle, shadowing resulted in the denser medium due to light
n1 cos θi + n22 − n21 sin θi
2 bending toward the normal axis. The following is a mechanism
of the shadowing at the curved optical fiber surface. Fig. 10(a)
and (b) schematically shows the shadowing mechanism for fiber
where n1 and n2 are the refractive index of the first and second in a V-groove when the light is illuminated from the top and
medium, respectively, and θi is the incident angle of light. bottom sides, respectively.
Based on the above equation, Fig. 9 shows the variation of When the light ray is incident at a location slightly away
light reflectance with the incident angle for three adhesives. from either point B or C of the fiber, it would pass through di-
Initially, light reflectance increases very slowly with the in- rectly without any refraction, as it does not experience any
crease of incident angle and then rises more rapidly above the medium change along its propagation. Moreover, when a light
UDDIN et al.: UNEVEN CURING INDUCED INTERFACIAL DELAMINATION OF UV ADHESIVE-BONDED FIBER ARRAY 1347
Fig. 11. Ray tracing method for the determination of the shaded area when light illuminates from the bottom side.
TABLE II
COMPARISON OF MINIMUM AND MAXIMUM SHADED AREAS AT THE MIDDLE
AND O UTERMOST F IBERS B ETWEEN A DHESIVE -1 AND A DHESIVE -2
detached from the fiber surface during the reliability test. delamination also varies according to different adhesives. Thus,
Fig. 14 shows high-magnification SEM images that depict how the analytical results fully established the reason of uneven
this adhesive segregates from the optical fiber surface. curing for the delamination of reliability studies. When light
For Adhesive-3, the shaded area is also removed, because was exposed from both sides to remove the shaded area, it dis-
light entered from a denser medium and bent away from appeared, but high-intensity variation certainly induced greater
normal, but light intensity greatly differs between the top and internal stress at the interfaces and can also damage (photo
bottom sides due to the total internal reflection from some parts degrade) the cured material [4].
of the optical fiber surfaces. Therefore, the adhesive remains
partially uncured and induced internal stress and delamination
V. C ONCLUSION
during the reliability test. However, the delamination is at a
place (Fig. 7) other than described before for Adhesive-1 and Due to the circular shape of the optical fiber, parallel lights
Adhesive-2. make different incident angles on different points of the fiber
Comparison of Figs. 4 and 10 shows that the positions surface. At some points on the adhesive fiber interface, light
of the shaded area obtained from analytical results are ex- reflectance is very high as a result of a large incident angle.
actly the same as the delamination found from the reliability Therefore, light intensity differs between the top and bottom
test. The larger shaded area obtained from analytical results sides of the fiber. This difference in intensity introduces uneven
also confirmed the greater extent of delamination when light curing of the fiber array. Moreover, light bending toward nor-
was illuminated from the bottom side. Comparison between mal retains some shaded region in the adhesive layer. In this
Figs. 5 and 13 shows that the extent of delamination at different region, the adhesive remains uncured and causes delamination
fibers also varies according to the shaded area. Again, the or distortion of the fiber array in the V-groove. The shaded
comparison between Figs. 6 and 13 shows that the extent of area was calculated separately for light illuminating both from
UDDIN et al.: UNEVEN CURING INDUCED INTERFACIAL DELAMINATION OF UV ADHESIVE-BONDED FIBER ARRAY 1349
the top and bottom sides. The minimum shaded area and the
delamination was found at the middle fiber when light illumi-
nated from topside. These were larger when light exposed from
bottom side and maximum at the outermost fiber. This is due to
the geometrical shape of the bonding element. These effects are
very severe for a large value of ∆n, which is the refractive index
difference between adhesive and cladding materials. Based on
this study, the delamination problem can be minimized by using
the UV-curable adhesive having the same or slightly higher
reflective index than that of the cladding material. From this
study, it is recommended to expose light from the topside for
fiber packaging. This type of fiber array will result in more
reliable assembly and also increase the productivity of the fiber-
optic industry.
Fig. 12. How light inclination varies with vertical axis from fiber to fiber, R EFERENCES
which affects the incident angle on fiber surfaces. [1] S. H. Law, T. N. Phan, and L. Poladian, “Fibre geometry and pigtailing,”
in Proc. 51st Electronic Components and Technology Conf., Orlando,
FL, 2001, pp. 1447–1450.
[2] Y. Yamada, F. Hanawa, T. Kitoh, and T. Maruno, “Low-loss and sta-
ble fiber-to-waveguide connection utilizing UV curable adhesive,” IEEE
Photon. Technol. Lett., vol. 4, no. 8, pp. 906–908, Aug. 1992.
[3] H. Haferkamp, A. Busse von, M. Goede, O. Thurk, and J. Stein, “Efficient
curing of adhesives using laser light,” in Proc. Conf. Lasers and Electro-
Optics, Nice, France, 2000, p. 1.
[4] S. P. Pappas, Radiation Curing Science and Technology. New York:
Plenum, 1992, ch. 9.
[5] T. Kokubun and Y. Katsuyama, “Curing shrinkage effects of UV-curable
materials on fiber loss characteristics,” J. Lightw. Technol., vol. 8, no. 11,
pp. 1654–1658, Nov. 1990.
[6] H. F. Woods, “Causes for separation in UV adhesive bonded optical
assemblies,” in Proc. SPIE, San Diego, CA, 1993, vol. 1999, pp. 59–62.
[7] M. A. Uddin, H. P. Chan, K. W. Lam, Y. C. Chan, P. L. Chu, K. C. Hung,
and T. O. Tsun, “Delamination problems of UV adhesive bonded optical
fiber in V-groove for photonic packaging,” IEEE Photon. Technol. Lett.,
vol. 16, no. 4, pp. 1113–1115, Apr. 2004.
[8] S. A. Hall, R. Lane, H.-C. Wang, and A. Gareri, “Assembly of laser-fiber
arrays,” J. Lightw. Technol., vol. 12, no. 10, pp. 1820–1826, Oct. 1994.
[9] P. Klocek, Handbook of Infrared Optical Materials. New York: Marcel
Dekker, 1991, pp. 141–143.
[10] D. N. Nikogosyan, Properties of Optical and Laser-Related Materials:
A Handbook. New York: Wiley, 1997, pp. 169–184.
[11] T. Izawa and S. Sudo, Optical Fibers: Materials and Fabrication. Tokyo,
Japan: KTK Scientific, 1987, pp. 21–30.
[12] F. W. Sears, Optics, 3rd ed. Reading, MA: Addison-Wesley, 1949,
Fig. 13. Variation of total shaded area within the single V-groove for different pp. 16–25.
fibers of the eight-channel fiber array. [13] D. Weiskopf, T. Schafhitzel, and T. Ertl, “GPU-based nonlinear ray trac-
ing,” Eurographics, vol. 23, no. 3, pp. 625–634, 2004.
[14] L. Johan and P. Lundstrom, Conductive Adhesive for Electronics
Packaging. Isle of Man, U.K.: Electrochemical Publications, 1999,
pp. 212–253.
Hau Ping Chan (M’95), photograph and biography not available at the time of
publication.
Fig. 14. High-magnification SEM images that depict how this adhesive seg- Y. C. Chan (M’85–SM’95–F’04), photograph and biography not available at
regates from the optical fiber surface. the time of publication.