.

2: DOUBLE LAYER PCB PROCESS

1. Check designed circuit for errors.

2. Press “VIEW ELECTRICAL REPORT”.

Figure 3.4: Location of “VIEW ELECTRICAL REPORT”

3. The net list should be generated. ERC errors are ignored.

4. Go to TOOLS NETLIST COMPILER  MODEL COMPILER.
5. Save the file and open ARES.
6. In ARES, route the circuit accordingly.
7. In auto router, press EDIT STRATEGIES.
8. Select the layers, and set trace style and via style to T40.

Figure 3.5: Trace style and via style setting

 Set pad- trace clearance and trace – trace clearance to 30th.
9. The steps were repeated for the bottom layer.

3.3: PREPARATION FOR LAMINATING PROCESS

1. Go to TOOLSPOWER PLANE GENERATOR.

2. Set the clearance for both layers to 30th.
3. The layer will be shown. Adjust the top layer to move a little bit lower for the
names.

Figure 3.6: The layout

4. All the holes should be well defined.

5. In laminating process, double click the icon and the drill hole should be set and
marked to 0th.
 Figure 3.7: Setting for the holes to drill

6. Go to OUTPUTCADCAM OUTPUT (tick top copper, bottom copper, drill

and edge only)
7. There will be 4 files generated.
8. The drill file for CNC machine drilling was taken.
9. ROUTEPRO was used to view the holes
10. VIEWVIEW TABLESET OFFSETUPDATE DATA
11. The driller was changed to different sizes which were defined earlier.
12. After the drilling process, the PCB was cleaned by using the brush machine.
13. The PCB was cut according to the layout. Then copper plating process will take
place.
14. All five processes in Figure 3.8 were needed to go through. Though, the 2nd
process (Predip), water would not be advised for the medium of cleaning as
copper would be able to be planted. At the 5 th process (copper plating) the current
count as area*6 and moves 2 decimal place in front.
15. The whole process would consume almost an hour of time.
16. The layout would be printed in ARES by using document writer along with the
INVERT command in Adobe Photoshop program.
17. Go to TOOLADJUSTMENTINVERT.
 18. Laminate film was put in and printed out.
19. Select BEST PHOTOADVENCEUNCHECK FAST PRINT AND
SELECT OTHERS for the printing commands.
20. The film was dried on the PCB in the UV room.
21. Precautions were taken to prevent the dry film’s plastic from entering the
laminating machine during the lamination process.
22. UV light was exposed.
23. Go through Developing machine, Etching machine and Stripping machine to end
the process.

Figure 3.8: Through hole planting machine Figure 3.9: Through hole planting instructions
Figure 3.10: Developing machine Figure 3.11: Etching machine

Figure 3.12: Stripping machine