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4, DECEMBER 1997
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GUZEK et al.: FATIGUE CRACK PROPAGATION ALONG POLYMER-METAL INTERFACES 497
This expression is identical to the solution for in a ho- Note that and are all constants that depend upon
mogeneous material, since it does not consider the presence specimen geometry and material properties only. Equation (4)
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498 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY—PART A, VOL. 20, NO. 4, DECEMBER 1997
TABLE I
ENCAPSULANT CHEMISTRY, FILLER LOADING, ELASTIC
MODULUS, AND RECOMMENDED CURE SCHEDULES
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GUZEK et al.: FATIGUE CRACK PROPAGATION ALONG POLYMER-METAL INTERFACES 499
Fig. 4. Graph of crack length versus time showing that no crack growth
occurred during a 30 min hold at maximum load.
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500 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY—PART A, VOL. 20, NO. 4, DECEMBER 1997
Fig. 6. Interfacial FCP data for three candidate encapsulants bonded to the Fig. 7. Interfacial FCP data for material B encapsulant bonded to as-plated
as-plated nickel. and blast-treated nickel.
TABLE II
SUMMARY OF KEY INTERFACIAL FCP PARAMETERS FOR
CANDIDATE ENCAPSULANTS ON AS-PLATED NICKEL
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GUZEK et al.: FATIGUE CRACK PROPAGATION ALONG POLYMER-METAL INTERFACES 501
V. DISCUSSION
where is the initial crack length and is the critical crack B. Shielding Mechanisms
length. , therefore, is highly dependent on , the slope of On the basis of the results obtained from FCP experi-
the FCP curve in the Paris regime. ments and subsequent fractography, one may postulate some
The low threshold of the material C system indicates that mechanisms associated with crack growth at an interface. The
a crack will begin to propagate under loading conditions that mechanisms postulated here include bridging by metal asper-
would not cause crack propagation in either the material B or ities and interfacial crack deflection and premature closure.
A systems. Furthermore, the steep slope in the Paris regime Microscopic analysis of the encapsulant fatigue-fracture
implies that the crack, once propagating, will grow to a critical surfaces was difficult for two reasons. First, the presence
length very rapidly. It was interesting to note that the strain of such a large volume fraction of filler particles on the
energy release rate range necessary to cause unstable crack fractured encapsulant surface tended to obscure any detail. No
growth along the interface between material C and nickel fatigue striations were observed on any of the fatigue-fracture
was on the order of the threshold in both materials A and surfaces. Second, due to the intimate contact of the encapsulant
B. Since the A and B systems had similar thresholds, crack with the metal, the encapsulant fracture surfaces were basically
growth is expected to occur under similar conditions for the “mirror images” of the metal substrate surfaces. Therefore,
two materials. However, since material A exhibits a smaller any detail on the encapsulant fatigue-fracture surface was also
, it should have a longer fatigue life. As seen in Fig. 6, at obscured by the topography of the metal plating.
the necessary for the onset of unstable crack growth in The only interesting feature observed was on the fatigue-
material B, the crack growth rate in material A was still stable fracture encapsulant surface from material A bonded to as-
and on the order of 10 mm/cycle. plated nickel substrate. Metal particles were found embedded
The interfacial FCP results were in very good agreement in the encapsulant surface (see Fig. 9). These embedded par-
with the package-level temperature cycling tests. After 1000 ticles were only observed in the material A specimen. This
cycles, material C was observed to completely delaminate suggested that unlike all the other specimens, where crack
from the nickel heat slug surface, material B exhibited slight propagation involved only debonding at the interface, crack
delamination, and material A showed no delamination. This propagation in this specimen involved some fracturing of
suggested that the loading conditions were severe enough metal asperities embedded in the polymer material. Thus, it is
to induce noticeable crack growth in material B, but not in possible that as the crack front approached and advanced past
material A. Since the FCP results predicted that cracks would these embedded asperities, the asperities could have bridged
grow more slowly at the material A interface, this was a the crack tip, much like fiber-bridging in fiber-reinforced
reasonable result. Furthermore, if the package experienced composites. This would improve the adhesion of this system,
conditions severe enough to cause crack growth at the material which is consistent with the FCP data shown in Fig. 6.
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502 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY—PART A, VOL. 20, NO. 4, DECEMBER 1997
(a)
(9)
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GUZEK et al.: FATIGUE CRACK PROPAGATION ALONG POLYMER-METAL INTERFACES 503
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504 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY—PART A, VOL. 20, NO. 4, DECEMBER 1997
[19] H. Azimi, “Toughened epoxy polymers: Fatigue crack propagation Subra Suresh received the B.Tech. degree from the Indian Institute of
mechanisms,” Ph.D. dissertation, Lehigh Univ., Bethlehem, PA. Technology, Madras, India in 1977, the M.S. degree from Iowa State Uni-
[20] S. Suresh, Metall. Trans. A, vol. 16A, pp. 249–260, 1985. versity, Ames, IA, in 1979, and the Sc.D. from the Massachusetts Institute of
[21] , Fatigue of Materials. Cambridge, U.K.: Cambridge Univ. Technology (MIT), Cambridge, in 1981.
Press, 1991. He is the R. P. Simmons Professor in the Department of Materials Science
and Engineering and Professor of Mechanical Engineering, MIT. Between
1981 and 1983, he was a Lecturer and Assistant Research Engineer in the
Department of Materials Science and Mineral Engineering at the University
John Guzek received the B.S. and M.S. degrees in of California, Berkeley, and the Lawrence Berkeley Laboratory. He joined the
materials science and engineering from the Mass- faculty at Brown University, Providence, RI, in December 1983, as Assistant
achusetts Institute of Technology, Cambridge, in Professor of Engineering and was promoted to the rank of Associate Professor
1995 and 1996, respectively. of Engineering in 1986, and to Professor of Engineering in 1989. He joined
After graduation, he joined Intel Corporation as MIT in 1993. He is currently a Principal Editor of the international journals
a Package Integration Engineer in the Chandler Acta Metallurgica et Materialia and Scripta Metallurgica et Materialia, an
Assembly/Test facility, Chandler, AZ. He is cur- Associate Editor of Materials Science and Engineering, and a Series Editor
rently working on the integration of next-generation for the Cambridge University Press Solid State Science Series. His current
assembly technologies into a high-volume manufac- research interests focus on quantitative investigations of the microscopic and
turing environment. macroscopic aspects of mechanical behavior of metals, ceramics, thin films,
and composites.
Dr. Suresh is a member of the Executive Committee, Materials Division,
ASME.
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