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I. I NTRODUCTION
-4 -3 -2 -
0 2 3 4
1533
74 PMOS
2.7
2.5
72
2.1
70
1.9
68 1.7
1.5
66 1.3
1.1
64 0.9
0.7
62 0.5
0.3
60
0.1
0 10 20 30 40 50 60 70 80 90 100
1E+03 10E+03 100E+03 1E+06 10E+06
Temperature ( °C ) Frequency ( Hz )
Fig. 7. Plot of the output current from the n-channel and the p-channel
Fig. 8. Simulated output noise current from the CP block.
transistor due to temperature variation.
-70
-75
IV. N OISE C ONTRIBUTION -80
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0 1.5
-10 1.4
-20 1.3
1.5
-30 1.2
Signal Power ( dB )
1.4
1.1 1.3
-40 1.2
1.0
Vctrl ( V )
-50 1.1
Vctrl ( V )
0.9 1.0
-60 0.9
0.8 0.8
-70 0.7
0.7 0.6
-80 0.5
0.6
-90 0.4
0.5 0.3
-100 0.2
0.4
-110 0 1 2 3 4 5 6 7
0.3 Time ( μs )
-120 0.2
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 100 200 300 400 500 600 700 800 900 1000
Frequency ( GHz ) Time ( ms )
Fig. 10. Frequency spectrum of the output signal from frequency synthesizer Fig. 12. Measured acquisition of the voltage controlled signal. The inset is
configured to generate a 2.4GHz signal. a magnified view of the lock-in period.
V. M EASURED R ESULTS The DC power dissipation from a 1V supply of the PFD and
A frequency synthesizer implementing the proposed PFD the CP is a 3.73mW and a 460μW, respectively. The SFDR
and CP was fabricated in CMOS 0.13μm technology. Figure due to the PFD and the CP is 80dBc, while the phase noise
11 shows the photograph of the fabricated chip. In order to at 100kHz offset is -95dBc/Hz. The occupied chip area of the
perform the measurements, the fabricated chip was bonded PFD is 1632μm2 , and of the CP is 1564μm2 .
to a printed circuit board (PCB). The reference signal was
generated from an Agilent 81134A 3.35GHz Pulse/Pattern ACKNOWLEDGMENT
Generator and the acquisition of the loop signal was monitored The authors wish to acknowledge the contributions and
by a Tektronix TDS 3032 300MHz 2.5GS/s. support of NSERC and Agilent Labs toward the realization
of the research reported herein.
R EFERENCES
[1] S. Milicevic, and L. MacEachern, “Frequency Dividers Implementing
Custom Cells with Resistor Tail Bias”, The International Symposium on
Signals, Systems and Electronics 2007, pp. 493 - 496, August 2007.
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Wang, “A Family of Low Power Truly Modular Programmable Dividers
in Standard 0.35μm CMOS Technology,” IEEE Journal of Solid State
Circuits, Vol. 35, No: 7, July 2000.
[3] N. Sheng, R. Pierson, K. Wang, R. Nubling, P. Asbeck, M. Chang, W.
Edwards, and D. Phillips, “A high-speed multimodulus HBT prescaler for
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[4] C. S. Vaucher and Z. Wang, “A low-power truly modular 1.8 GHz
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[5] M. Ali and E. Hegazi, “A Multigigahertz Multimodulus Frequency
Divider in 90-nm CMOS”, IEEE Transactions on Circuits and Systems
II: Express Briefs, Vol. 53, No. 12, pp. 1333 - 1337, December 2006.
Fig. 11. Die photograph of the fabricated chip.
[6] S. Milicevic, and L. MacEachern, “Frequency of Oscillation of a Cross-
Coupled CMOS VCO with Resistor Tail Biasing”, The 50th IEEE
International Midwest Symposium on Circuits and Systems, August 2007.
Figure 12 depicts an example of the measured acquisition of [7] I. Shahriary, G.Des Brisay, S.Avery, and P.Gibson, “GaAs Monolithic
the voltage-control signal. The magnified view of the lock-in Digital Phase/Frequency Discriminator,” GaAs IC Symposium Technical
Digest, pp. 183 - 186, 1985.
period shows the transient waveform of the voltage-controlled [8] J. Rogers, C. Plett, and F. Dai, “Integrated Circuit Design for High-Speed
signal versus a normalized time-scale. Frequency Synthesis,” Artech House, 2006.
[9] J. Rogers, M. Cavin, F. Dai, and D. Rahn, “A ΔΣ Fractional-N Frequency
VI. C ONCLUSION Synthesizer with a Multi-Band PMOS VCOs for 2.4 and 5GHz WLAN
Applications,” Proceedings of the 29th European Solid-State Circuits
The design and performances of the PFD and the CP as Conference, 2003. ESSCIRC ’03., pp. 651 - 654, September 2003.
building blocks of the frequency synthesizer implemented in [10] F. M. Gardner, “Charge-Pump Phase-Lock Loops”, IEEE Transactions
a CMOS 0.13μm technology are discussed. on communications, vol. COM-28, No. 11, pp. 1849 - 1858, November
1980.
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