HUAWEI Ascend P2-6070 Maintenance Manual

P2-6070 Maintenance Manual
Issue 1.0
Date 2013-05-05
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: support@huawei.com
Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential i

Copyright © Huawei Technologies Co., Ltd.
P2-6011 Maintenance Manual About This Document
About This Document
Author
Prepared by Go Shang (ID: 194140) Date 2013-05-06
Reviewed by Li Yong (ID: 64410) Date 2013-05-06
Approved by Date
Change History
Date Version Revision Changed Description Author
Reason Chapter
2013-05-06 V1.0
Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential ii

P2-6011 Maintenance Manual 1 Product Overview
Contents
About This Document .................................................................................................................... ii

1 Product Overview ......................................................................................................................... 1
1.1 Appearance ....................................................................................................................................................... 1
1.2 Specifications ................................................................................................................................................... 2
2 Applicable Scope and Precautions ............................................................................................ 4

2.1 Applicable Scope .............................................................................................................................................. 4
2.2 How to Obtain Product and Repair Information .............................................................................................. 4
3 Exploded View............................................................................................................................... 5
4 Components on the PCBA ........................................................................................................... 7
5 Software Upgrade ....................................................................................................................... 15
5.1 Upgrade Preparation....................................................................................................................................... 15
5.2 Upgrade Using the USB Port ......................................................................................................................... 15
5.3 Troubleshooting Upgrade Failures ................................................................................................................. 19
6 Repair Tools ................................................................................................................................. 20

7 Disassembly Procedure .............................................................................................................. 22
8 Assembly Procedure ................................................................................................................... 26
9 Troubleshooting Common Faults ............................................................................................ 33
9.1 Working Principle of the P2-6011 .................................................................................................................. 33
9.2 Power-on Failure ............................................................................................................................................ 39
9.2.2 Excessive Current (DC Power Supply) ................................................................................................. 40
9.2.3 Weak Current (DC Power Supply) ........................................................................................................ 41
9.2.4 No Current (DC Power Supply) ............................................................................................................ 43
9.3 Charging Failure ............................................................................................................................................. 44
9.4 Display Failure ............................................................................................................................................... 45
9.5 Vibration Failure ............................................................................................................................................ 47
9.6 Failure to Identify the USIM Card ................................................................................................................. 48
9.7 Touch Panel Failure ........................................................................................................................................ 50
9.8 Proximity Sensor and Automatic Light Sensing Failures ............................................................................... 52
9.9 Accelerometer Sensor Failure ........................................................................................................................ 53
Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential iii

9.10 Compass Sensor Failure ............................................................................................................................... 55

9.11 Gyroscope Failure ........................................................................................................................................ 56
9.12 Camera Failure ............................................................................................................................................. 58
9.13 Audio Failure ................................................................................................................................................ 60
9.13.1 Ringtone Failure .................................................................................................................................. 60
9.13.2 Voice Transmission Failure ................................................................................................................. 61
9.13.3 Voice Receiving Failure ...................................................................................................................... 62
9.14 Headset Audio Failure .................................................................................................................................. 63
9.14.1 Failure in Hearing Sound from the Headset ........................................................................................ 63
9.14.2 Failure in Transmitting Sound from the Headset ................................................................................ 65
9.15 Speaker Noise Faults .................................................................................................................................... 67
9.16 WiFi and Bluetooth Failure .......................................................................................................................... 69
9.17 GPS Failure .................................................................................................................................................. 71
9.18 RF Transmission Failure — WCDMA/LTE ................................................................................................. 73
9.19 RF Reception Failure — WCDMA/LTE ...................................................................................................... 76
9.20 RF Transmission Failure — GSM ................................................................................................................ 78
9.21 RF Reception Failure — GSM ..................................................................................................................... 80
10 Functional Tests......................................................................................................................... 82
10.1 Keypad Introduction ..................................................................................................................................... 82
10.2 MMI Test ...................................................................................................................................................... 83
10.3 Wi-Fi Test ..................................................................................................................................................... 95
10.4 Audio Test .................................................................................................................................................... 96
Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential iv

1 Product Overview
1.1 Appearance
Figure 1-1 shows the appearance of the HUAWEI Ascend P2-6070 mobile phone (P2-6070
for short).
Figure 1-1 P2-6070
Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 1

1.2 Specifications
Table 1-1 lists the P2-6070 specifications.
Table 1-1 P2-6011 specifications
Item Description
Type Touchscreen smartphone

Dimensions (H x W 136.2 mm x 67 mm x 8.6 mm
x D)
Frequency bands GSM 850/900/1800/2100
HSDPA Band1/5/8
LTE Band3/7
Weight About 118 g (with battery)
Network mode LTE 4G mobile phone
System platform AP: K3V2
MODEM: Balong
Operating system: Android 4.1+Emotion UI
Memory 16 GB ROM + 1 GB RAM
Interfaces Micro USB ports for charge, data connection and MHL; 3.5 mm
headset jack
Battery 2350 mAh Lithium-ion battery
Display Liquid crystal display (LCD) size: 4.7 inches
LCD type: Thin film transistor (TFT)
Resolution: HD 1280 x 720 pixels
microSD card slot Not supported
Antenna Built-in
Camera Rear camera: 13.0 megapixels (MP) with LED flash and
supporting autofocus
Front camera: 1.3 MP
Bluetooth Supports Bluetooth v3.0
WIFI 802.11b/g/n
GPS GPS and AGPS
FM Supported
Outstanding features Hisilicon K3V2 1.5G quad-core processor
Android 4.1 + Emotion UI
Mobile High-Definition Link (MHL)
4.7-inch IPS HD Incell capacitive touchscreen

Item Description
2350 mAh large capacity battery
13 MP BSI camera with LED flash and supporting autofocus.
1.3 MP HD front camera
1080p HD video recording and playback
Two-stage physical camera button
Dual-microphone noise reduction
Gravity sensing, proximity sensing, ambient light sensing,
compass, and gyroscope
DLNA

P2-6011 Maintenance Manual 2 Applicable Scope and Precautions
2 Applicable Scope and Precautions
2.1 Applicable Scope

This document provides maintenance instructions for technical support at the authorized
service centers. Being Huawei proprietary, this document is accessible only for authorized
service centers. Although every effort was made to ensure the accuracy of this document,
errors may still exist. If you find any errors or have any suggestions, contact Huawei's
customer service using the Compartner service platform.
2.2 How to Obtain Product and Repair Information

To obtain product and maintenance information, visit Huawei website at
http://support.huaweidevice.com/service/. You are advised to install Huawei service
platform software Compartner to obtain the maintenance tool and software.
To obtain the ComPartner installation package, visit Huawei website at
http://support.huaweidevice.com/service/ and search for ComPartner to obtain the
installation package.

P2-6011 Maintenance Manual 3 Exploded View
3 Exploded View
Figure 3-1 shows the exploded view of the P2-6011.
Figure 3-1 Exploded view
NOTE
The components in Figure 3-1 are structural parts of the P2-6070, and cannot be used as reference when
requesting spare parts..
Figure 3-1 describes the product BOM in the black phone.

P2-6011 Maintenance Manual 3 Exploded View
Figure 3-1Product BOM of the black phone
No. BOM Description Quantity

1 23040268 LCD Indication Module,single 1.0 PCS
display,TFT,4.7,1280*RGB*720,24bit,16:9,1.5mm(
MAX),with in-cell touch panel,HUAWEI Logo,BTB
2 51611496 U9700L Side Key, Black, PVD 1.0 PCS
3 51611495 U9700L Power Key, Black, PVD 1.0 PCS
4 03021WMQ LTE P2-6013-HL1U9700LR-RCV Board FPC-1*1 1.0 PCS

22030055 1.0 PCS
Receiver,32ohm,6*15*2.0,terminal
5 03022BUM P2-6070-HL2U9700LME-Main Board-Australia-2*2 1.0 PCS
6 51634425 DKBA80936240,U9700L_SUB_ANT_HOLDER,U9 1.0 PCS

700L
7 51660EAT U9700 Battery Cover Assy, Black, Painting, Australia 1.0 PCS
Version
8 51634178 U9700 Battery Housing Assy,Black,Painting, General 1.0 PCS
Version
9 51660BEQ U9700L_Lens_Film 1.0 PCS
10 51611518 U9700L Front Cover Assy, Black, PVD 1.0 PCS
11 51611513 U9700 SIM Door, Black,PVD, General Version 1.0 PCS
12 03022BUN P2-62070,HL1U9700LAE,Australia Antenna Boar 1.0 PCS

d,4*4
13 24021209 Rechargeable Battery,Li-polymer 1.0 PCS
Battery,HB5Y1V,3.8V,2.35Ah,Single
Cell,Max5.1*58.5*60.5mm,Embedded,4.35V High
Voltage,Terminal Dedicated
14 03022CMG LTE P2-6011,HL1U9700LWB,Main FPC Board,1*1 1.0 PCS
15 22020079 Speaker,8ohm,0.5w,11*15*3.5(Improved),Terminal 1.0 PCS

Dedicated
16 27161305 Terminal 1.0 PCS
Antenna,791-960MHz,1710MHz-2170MHz,2500-27
00MHz,larger than -2dBi,Isotropic,not greater
than3,0.004W,P2-6011(U9700L EU)main
antenna,skycross,LDS
17 51655394 U9700L_IMEI_LABEL02 1.0 PCS
NOTE
The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.

P2-6011 Maintenance Manual 4 Components on the PCBA
4 Components on the PCBA
Figure 4-1 show the components on the PCBA.
Figure 4-1 Components on the top side of the PCBA

Secondary microphone J2202 R board FPC BTB J1601 TP/LCD BTB J1801 front camera BTB
Failure symptom Failure symptom Failure symptom Failure symptom
Failure of dual silicon Phone power-on failure by pressing the LCD display Failure to open the front
microphone noise reduction power key, no voice heard from the exception, black camera and black screen
receiver, and invalidity of the Proximity screen, and TP display for preview or photo
U1501 headset PA sensor, ambient light sensing, and invalidity taking by the front camera
Failure symptom tricolor indicator
No or abnormal sound
heard from the headset
U2004 accelerometer
sensor
J1802 rear camera Failure symptom
BTB Accelerometer invalidity
Failure symptom
Failure to open the rear U2003 gyroscope
camera and black Failure symptom
screen display for Gyroscope invalidity
preview or photo taking
by the rear camera
J5503 J5504 J5506 J4301 J4302 J4306
J5507 antenna spring J4307 antenna spring
Failure symptom Failure symptom
Diversity antenna fault Diversity antenna fault
Z5502 U5503 IC U4006 U4204 Z4005

Failure symptom U4007 U4205 U4101
GPS invalidity and weak U4302 RF IC
signal Failure symptom
Communication fault
U5603 integrated chip
Failure symptom
WIFI, BT, and GPS
faults U1301 battery gauge
Failure symptom
Recharging and battery
faults
J2201 main FPC BTB U2501 Hi6920 U1102 32+1 EMMC U3901 Hi6360 RF J1301 battery
Failure symptom MODEM (MCP) Transceiver connector
Invalidity of functional Failure symptom Failure symptom Failure symptom Failure symptom
keys, motor, SPK, and Communication fault Power-on failure Communication Recharging and battery
camera key fault faults

Figure 4-2 Components on the bottom side of the PCBA
J1500 headset jack

Failure symptom
Abnormal sound J1900 USB socket U3000 AUDIENCE IC
heard from the Failure symptom Failure symptom
headset or headset Data transmission failure, Failure of dual silicon
invalidity recharge failure, and current microphone noise
exception reduction
U3101 MHL IC
Failure symptom U2005 compass
Failure to export Failure symptom
HDMI signal Compass invalidity
U300 U300_POP
AP+LPDDR
Failure symptom
Power-on failure
U900 Hi6421
Failure symptom
J2203 J2204 J2205 Power-on failure,
spring audio fault, and
Failure symptom module invalidity
Volume key invalidity
U2106 U2107 IC
U1601 IC Failure symptom
Failure symptom Card detection
LCD black screen failure
U4102 U4001 U4003

RF PA chip
Failure symptom
Communication fault
J2102 SIM card

holder
U2900 Hi6951 MDM PMU Failure symptom
Failure symptom Card detection
Communication fault failure
Table 4-1 Components on the PCBA
BOM Description Quantity Location
19040169 Protection Tube,Fast Blowout 1.0 PCS F1900

Fuse,32V,3A,IEC Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal Dedicated
14240576 Card Block Connector,BTF 1.0 PCS J1301
Connector,3*2,Female,1.3mm,Terminal
Dedicated
14240381 Headphone Connector,3.5mm,6pin,Side 1.0 PCS J1500
plugging,SMT,Mid Mount
14240375 BTB 1.0 PCS J1601
Connector,female,40Pin,0.4mm,0.8mm,SMT,T
erminal Dedicated


14240496 BTB 3.0 PCS J1801,
Connector,Female,24Pin,0.4mm,SMT,Mating J2201,
Height 0.8mm,Terminal Dedicated J2202
14240579 BTB 1.0 PCS J1802
Connector,BTBconnector,34PIN,0.4mm,0.8m
m,SMT,female,Terminal Dedicated
14240639 IO Connector,Female,Micro_B,5pin,Side 1.0 PCS J1900
Plugging Type,SMT,4 Dip,Mid Mount,1.1mm
Height from PCB Top Side,remove turnover
border,Terminal Dedicated
14240640 Card Socket,Micro SIM 1.0 PCS J2102
Socket,8Pin,Horizontal,2.54mm,Without Hold
Peg,PUSH-PUSH,Pin Tail Length
0.8mm,Pop-up trip 2.9mm.Double dip
pins,Terminal Dedicated
51621023 108-5785,Ground Spring,U1250 5.0 PCS J2203,
J2204,
J2205,
J5700,
J5701
51624071 U9700L_PA_Shield_Frame 1.0 PCS J2403
51624069 U9700L_AP_Shield_Frame_Assy 1.0 PCS J2404
51624076 DKBA80359903,U9700L_EMMC_Shield_Fra 1.0 PCS J2405
me,U9700L
51624094 U9700L_Wifi_Shield_Frame 1.0 PCS J2406
51624097 U9700L_GPS_Shield_Casing 1.0 PCS J2407
14240432 RF Connector,RF 4.0 PCS J4101,
Switch,Straight,female,SMT,Terminal J4303,
Dedicated J4305,
J5509
14240433 RF Connector,Coaxial 1.0 PCS J4102
Connector,50ohm,Straight,male,SMT,W.FL2,P
CN Control,Terminal Dedicated
51621274 DKBA8.382.0615,Main Antenna SMT 12.0 PCS J4306,
Spring,C5600 J4307,
J4308,
J4309,
J4310,
J4311,
J5503,
J5504,
J5505,
J5506,
J5507,


J5508
7050063 Thermistor,150kohm+/-5%,SMT,0402,Termina 2.0 PCS RT2501,
l Dedicated RT4101
7040075 Varistor,18V,14V,10A,40V,SMT,0402,Termin 1.0 PCS RV1900
al Dedicated
10100527 Terminal Common Mode 8.0 PCS T1801,
Inductor,28ohm,+/-20%,5V,0.1A, T1802,
2.5ohm,03025,0.85*0.65*0.45(mm),TAIYO T1803,
YUDEN 12ohm@100M;TDK T1804,
35ohm@100M,Terminal Dedicated T1805,
T1806,
T1807,
T1808
10100331 Terminal Common Mode 1.0 PCS T1901
Inductor,40ohm,+/-25%,5V,0.1A,1.625ohm,1.2
5*1.0*0.5(mm),Terminal Dedicated
12070055 Temperature Compensated 1.0 PCS TCXO100
Oscillator,19.2MHz,+/-2.5ppm,2.8V,+/-2.0ppm
,-30degC,85degC,Terminal Dedicated
12070038 Temperature Compensated 2.0 PCS TCXO1001,
Oscillator,26MHz,+/-1.5ppm(max),+1.8V,+/-0. TCXO5601
5ppm(max),-40degC,85degC,Terminal
Dedicated
35020185 Consumption 1.0 PCS U300
Chip,Hi3620GFCV121G15,FCCSP576,1.1/1.2/
1.8/2.5/3.3V,Application processor
40020172 DDR2 DRAM,8Gb 1.0 PCS U300_POP
LPDDR2,533MHz,32bit,1.8V/1.2V,216BALL
FBGA(POP),Terminal Dedicated
Chip,Hi6421GFCV232,FCCSP189,1.8/3.3/4.2
V,K3 PMU and Codec Chip
40060418 MCP,32GB(32Gbx8) EMMC,52MHz,3.3/1.8 1.0 PCS U1102
V,FBGA169,1Gb(32Mbx32) LPDDR,Termina
l Dedicated
38020077 Analog Switch,one input one output Load 2.0 PCS U1103,
switch,1.1V~3.6V-1.8Vinput,<55mohm;1.2Vin U3203
put,<90mohm,WLCSP4,Terminal Dedicated
39080180 Operation Amplifier,Audio Power 1.0 PCS U1201
Amplifier,2.5V~5.5V,Differencial,Micro SMD
16pin(WLCSP),Terminal Dedicated
39070073 -0.3~2.75V,Battery Gauge,SON,Terminal 1.0 PCS U1301
Dedicated


39080124 Operation Amplifier,Headphone Audio Power 1.0 PCS U1501
Amplifier,2.3 V to 5.5 V,differential AB
Amplifier,QFN,Terminal Dedicated
39110626 Switching 1.0 PCS U1600
Regulators,Vin~38V,0.02A,QFN-2*2,SMT,2*2
,10 LED Driver,Terminal Dedicated
39110636 Switching Regulators,0~5.5V 1.0 PCS U1601
0~-7V,1%,0.08A,ThinQFN,SMT,3mm*3mm,L
CD Driver,Terminal Dedicated
39110792 LDO,fixed,2V-5V,3.1V,2%,0.3A,DFN-4,Termi 3.0 PCS U1602,
nal Dedicated U3104,
U3301
39110620 Power Driver,1.5A LED flash driver 1.0 PCS U1800
IC,CSP,Terminal Dedicated
39070149 Battery Management IC,charger IC,buck,3A 1.0 PCS U1901
input ability,3.9V~6.5V,QFN24,OTG
38020071 Analog Switch,double-pole, triple throw 1.0 PCS U1905
(DP3T)
multiplexer,2.5V-4.5V,<6.6ohm,1470MHz,QF
N12,Terminal Dedicated
33030026 Temperature 1.0 PCS U2001
Sensor,-40~+125degC,1.4V~2.75V,Digital
Output,+/-1degC,DFN,60000us,NA,12bit,IIC,T
erminal Dedicated
38140103 Semiconductor Sensor,three axis 1.0 PCS U2003
gyroscope,LGA-16,Terminal Dedicated
38140098 Semiconductor 1.0 PCS U2004
Sensor,Accelerometer,LGA,3axis,Terminal
Dedicated
38140112 Semiconductor 1.0 PCS U2005
Sensor,E-Compass,WLCSP(Pb-free),3axis,Ter
minal Dedicated
36020419 CMOS,Dual 1.0 PCS U2103
Reverse,QFN,33.6ns,20mA,CMOS,CMOS,
Terminal Dedicated
38020072 Bi-directional,4PDT, 1.65-4.3V, 1.0 PCS U2106
Rond(max)<12ohm;
Ronv<0.7ohm-160MHz-UMLP, Terminal
Dedicated.
36020341 CMOS,8-D Triggering 1.0 PCS U2107
Device,SC_70,20,24,CMOS,CMOS
38020074 Analog Switch,one input one output load 1.0 PCS U2200
switch,1.4V~5.5V,60mohm,WLCSP, Terminal


Dedicated
Chip,Hi6920GFCV100,FBGA520,1.1/1.8/2.5,L
TE,WCDMA/GSM
35020150 Chip,Hi6451GBCV110,BGA104,5V,Power 1.0 PCS U2900
management unit
39110756 Switching Regulators,DC/DC 3.0 PCS U2901,
buck,2.5V~5.5V,Voadj,1.2A,DFN/QFN U3105,
U3200
43110067 AUDIO Chip,2 digital microphones/4 Digital 1.0 PCS U3000
Audio Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal Dedicated
43090148 VIDEO Chip,49 1.0 PCS U3101
VFBGA,1.2V/1.8V/3.3V,HDMI&USB
2in1,1080p/60Hz, Terminal Dedicated
35020159 Consumer chip,Hi6360RBCV210, 1.0 PCS U3901
VFBGA,2.2V/1.8V/1.2V,2G/3G/4G multi
mode multi band RF Transceiver,special for
low power voice application
47140042 0.5~3GHz,SPDT,0.46,22,TSSON,Terminal 3.0 PCS U3903,
Dedicated U4301,
U4302
47100500 RF Power Amplifying 1.0 PCS U4001
Module,1920MHz~1980MHz,29.5dB
max.,28.25dBm,QFN,Terminal Dedicated
Module,1710-1785MHz,26.5dB/18dB/12dB,28
.6dBm,QFN,CLASS1
13080198 Duplexer,1920~1980,2110~2170,2dB.,2.5dB.,5 1.0 PCS U4006
5dB.,2016,Terminal Dedicated
13080175 Duplexer,1850~1910MHz;1930~1990MHz;,3d 1.0 PCS U4007
B.,3.7dB.,45dB.,2016,Terminal Dedicated
47140081 RF Switch,746~2690MHz,SP10T ASM-1.5dB 1.0 PCS U4101
max.,1.7 max,21dB.3.2*3.2*1.0mm,Terminal
Dedicated
Module,824MHz~849MHz/880MHz~915MHz/
1710MHz~1785MHz/1850MHz~1910MHz,33.
5,35dBm,LGA
Module,880MHz~915MHz,28/18/11,QFN,100
0V


Module,832~862MHZ,28,31.5dBm,QFN,1000
Module,2500-2570MHz,28,31dBm,QFN,1000
V
13080162 Duplexer,TX:2500-2570MHz/RX:2620-2690M 1.0 PCS U4204
Hz,2.5dB.,2.5dB.,-50dB.,-2016.,Terminal
Dedicated-Unbalance-FBAR
13080176 Duplexer,880~915MHz;925~960MHz,3.9dB.,4 1.0 PCS U4205
.7dB.,38dB.,2016,Terminal Dedicated
13080081 Duplexer,RX:791~821MHz/TX:832~862MHz, 1.0 PCS U4206
3dB,4dB,45dB/47dB,2520,Terminal Dedicated
47090053 RF LNA,1575MHz,14dB min.,1.6dB 1.0 PCS U5503
max.,SOT886,Terminal Dedicated
47140113 RF Switch,100~3500MHz,SP3T,0.65dB max. 1.0 PCS U5504
at 2400~2500MHz,1.29 at
2450MHz,32dB.,QFN,Terminal Dedicated
39210059 Terminal Baseband process IC,Dual Band 1.0 PCS U5603
2.4GHz WLAN/Bluetooth 4.0/FM/GPS Single
chip,2.3~5.5V,WLBGA133(Pb-free)
12020125 Crystal,0.032768MHz,12.5pF+/-30ppm,60/80k 1.0 PCS X1000
ohm,3.2*1.5 SMD,Terminal
Dedicate,ELOM,TS16949
12020206 Crystal,27.12MHz,10pF,+/-50ppm,100ohm,32 1.0 PCS X5701
25,special for terminal company
15040385 Transient Suppression 1.0 PCS Z1601
Diode,5.6V,12V,50W,5A, WDFN16,Three
pairs,Terminal Dedicated
15040384 Transient Suppression 1.0 PCS Z1602
Diode,5.6V,12V,50W,5A,WDFN10,Double
PairS,Terminal Dedicated
13080086 Duplexer,TX:1710~1785MHz/RX:1805~1880 1.0 PCS Z4005
MHz,3.5dB,4dB,44dB/45dB,2520
13010212 SAW 1.0 PCS Z4101
Filter,1842.5MHz,1.6dB(typ),50V,SFLT5-0101
,Terminal Dedicated
13010147 SAW Filter,881.5,2.2dB,50V,00241564, 1.0 PCS Z4102
Wireless Terminal Special Product
13010306 SAW 1.0 PCS Z4301
Filter,1842.5MHz,4dB,50V,1411,Terminal
Dedicated


13010270 SAW 1.0 PCS Z4302
Filter,806MHz,4.0dB,50V,1411,Terminal
Dedicated
13010271 SAW 1.0 PCS Z4303
Filter,2655MHz,3.8dB,50V,1411,Terminal
Dedicated
13010262 2140MHz,3.0dB,50V,1411,Terminal Dedicated 1.0 PCS Z4304
13010264 SAW 2.0 PCS Z5502,
Filter,1590.16MHz,1.8dB,50V,1411,Terminal Z5503
Dedicated
13010274 SAW Filter,2437MHz,3.5,500V,2016,Terminal 1.0 PCS Z5505
Dedicated
22050076 Microphone,-38dB.,3.76*2.95*1.1mm,silicon,b 1.0 PCS MIC1400
ottom
NOTE
The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.

P2-6011 Maintenance Manual 5 Software Upgrade
5 Software Upgrade
5.1 Upgrade Preparation

Table 5-1 lists the items to be prepared for a software upgrade.
Table 5-1 Items to be prepared
Item Description Remarks

Upgrade Computer Operating system (OS): Windows 2000,
environment Windows XP, or Windows 7
USB cable USB cable with the standard configuration
Battery With at least 20% power remaining
Upgrade software UPDATE.APP This version is provided for reference only.
Use the latest released version.
Driver Handset WinDriver
SwitchToDiag
Upgrade tool WH62406270ML01
5.2 Upgrade Using the USB Port

Performing a Normal Upgrade
Step 1 Install the driver software Handset WinDriver. Click Next in the installation wizard.
Step 2 Install the driver software SwitchToDiag.
Double-click the SwitchToDiag.exe file in the package and click Install Driver in the dialog
box that is displayed, as shown in Figure 5-1.

Figure 5-1 Port Switch Tool dialog box
After the installation is successful, a message "Install the driver success" is displayed.
Figure 5-2 Installation success message
Step 3 Connect the mobile phone to the computer.

Step 4 Log in to the SwitchToDiag tool.

Figure 5-3 Logging in to the SwitchToDiag tool
The password is Huawei.

Step 5 Configure the tool.
Select Allow upgrade for the second time.
Select Firmware and select the upgrade package UPDATE.APP, as shown in Figure 5-4.
Figure 5-4 Selecting the upgrade package
Step 6 Select Please Choose The Configuration File.

Select the configuration file (provided by the equipment department) shown in Figure 5-5 for
the K3 platform.

Figure 5-5 Selecting the configuration file for the K3 platform
Figure 5-6 shows the configuration page.
Figure 5-6 Configuration page
Step 7 Click Next.

The upgrade page is displayed.

Step 8 Click Scan && Download to perform the upgrade.

----End
Performing a Forcible Upgrade

Press and hold the power key to power off the phone. Press and hold the volume up and down
buttons, insert the USB disk to the host. The phone enters forcible upgrade mode. Then use
the upgrade tool to perform the upgrade.
5.3 Troubleshooting Upgrade Failures

Failure Solution
Failed to upgrade the 1. Check that the upgrade file is correct.
P2-6011 using the USB 2. Check that the computer driver has been properly
cable. installed.
3. Check that the upgrade method is correct.
4. Perform the upgrade again.

P2-6011 Maintenance Manual 6 Repair Tools
6 Repair Tools
Name: hot air gun

Usage: heats components
Name: soldering iron

Usage: solders components
Name: DC power supply

Usage: supplies power
Name: soldering fixture

Usage: secures the PCBA
Name: lead-free tin solder wire

Usage: solders components

P2-6011 Maintenance Manual 6 Repair Tools
Name: digital multimeter

Usage: measures parameters during maintenance
Name: toolkit
Usage: assembles and disassembles the P2-6011
Name: electric screwdriver

Usage: fastens and removes screws

P2-6011 Maintenance Manual 7 Disassembly Procedure
7 Disassembly Procedure
NOTE
The P2-6011configuration varies with the version in different markets. The following disassembly
procedure only for your reference, in which the Information such as the appearance and steps may vary
with the mobile phone version.
1. Remove the battery cover.
NOTE
Check the waterproof label in the SIM card slot on the front cover to determine whether the battery is
water penetrated.
1. Pull out the SIM card slot to verify that the

waterproof label is valid. Then use the
disassembly tab to remove the buttery cover. 2. P2-6011 after the battery cover is
removed.

2. Disassemble the front cover.

NOTE
Check the tamper-resistant label on a screw of the rear cover to determine whether the rear cover was
removed.
2. Remove the power

key, volume keys,
1. Verify that the tamper-resistant and camera key.
label is not damaged. Use the
electric screwdriver with a 3. Use the tweezers to tilt
torque of 1.0 kgf.cm to remove the antenna rack and
the eight screws. remove it.
4. Remove the steel SIM card rack. 5. Use the tweezers to tilt the speaker rack in the
connection position between the bottom of the
cover and the buckle of the speaker rack, and
remove the speaker rack. Keep the tweezers
away from the LDS antenna routing to avoid
damaging the antenna.

3. Remove the PCBA.
2. Pull the BTBs of the LCD, battery, main

1. Use the tweezers to disassemble the RF FPC, receiver (RCV) FPC, and light
cable. guide plate FPC, and remove the power
key FPC. When removing the power key
FPC, do not tear it. Pull the camera BTB
and remove the primary camera.
4. Use the tweezers to remove the

3. Use the tweezers to tilt the bottom of the REC.FPC without tearing it. Keep the
PCBA and then remove the PCBA. proximity sensor sheath.
Remove the front camera (this operation
will damage the foam under the front
camera). When disassembling the
PCBA, prevent the LCD FPC from
being caught by the PCBA and torn.
6. Use the screwdriver to remove the

5. Use the electric screwdriver to remove camera key and electrical component
the eight screws and remove the small FPCs such as the vibrator. When
board. removing the power key FPC, do not tear
it. When removing an electrical
component FPC, do not distort it. If the
FPC is distorted, the component will be
invalid. The double-sided adhesive on
the removal position is invalid.

4. Disassemble the front cover components.
1. Use the tweezers to remove the side key 2. Use a fixture to fix the front cover, use
FPCs, and use the disassembly tab and the hot air gun to blow the front cover to
hot air gun to remove the battery. decrease the stickiness of the
double-sided adhesive. Use the sucker to
remove the TP slowly from the corner at
the bottom. During the removal, prevent
the LCD FPC from being caught by the
PCBA and torn.

P2-6011 Maintenance Manual 8 Assembly Procedure
8 Assembly Procedure
1. Remove the protective film from the TP, and install the RCV cosmetic part with the
broader slice upward.
2. Remove the release paper from the front cover, install the touch key light guide blade.
Ensure that the two holes of the blade align with the corresponding positioning rods on
the cover.
3. Remove the release paper from the front cover, pass the TP BTB FPC through the front
cover, and ensure that the TP grounding PAD FPC is between the TP and the front
cover. Then press-fit the TP to the front cover.

4. Remove the release paper, and install the RCV with the elastic contact facing upward.
5. Obtain the RCV FPC component and the proximity sensor sheath. Verify that there is
no fault such as burrs on the incoming material of the proximity sensor sheath. Install
the proximity sensor sheath on the proximity sensor of the RCV FPC component, as
shown in Figure 1. There is the adhesive on the edge of the proximity sensor sheath.
When obtaining the proximity sensor sheath, check whether the adhesive is damaged. If
the incoming material of the proximity sensor sheath is independent, you must remove
the release paper of the adhesive. The installation standard is that the proximity sensor
sheath is not dog-eared or translocated and is pasted firmly.
2. Pre-fold the RCV FPC component, as shown in Figure 2. Pre-fold the part adjacent to
the proximity sensor first and then pre-fold the edge connectors at positions 1 and 2.
3. Remove the release paper on the right of the RCV on the front cover, as shown in
Figure 3. The release paper must be totally removed, and the adhesive cannot be
removed.
4. Install the pre-folded RCV FPC to the proximity sensor (position L in Figure 4).
Insert the two reinforcers (positions 1 and 2 in Figure 4) on the upper part at position M
on the FPC to the installation slots on the top of the front cover. Then connect the lower
reinforcer (position 3 in Figure 4) on position M to the front cover. Finally, install the
LED part (position R in Figure 4) of the FPC to the front cover. During the installation
of the position M of the FPC, position L may be dog-eared. In this case, press position
L. The installation standard is that the RCV FPC is not dog-eared or translocated.

6. Assemble the side key FPC.
7. Assemble the four shielding covers and attach the insulation film and REC rack.

8. Remove the release paper and assemble the front camera vertically to avoid foam
disclosure.
9. Install the PCBA. Insert the USB port to the front cover, adjust the position based on the
positioning rods and buckle, assemble the primary camera, and fix the flash rack. Fasten
the BTB connectors on the PCBA.
10. Assemble the power key FPC, adjust the position based on the positioning rods, and
attach the FPC to the grounding point well.

11. Fix the antenna board and install the coaxial cable.
12. Paste the antenna based on the positioning holes and press-fit the antenna. (This step
may not be required for the product in some markets.)
13. Install the battery to the A cover housing. Fasten the BTB, push the battery to the top,
and press-fit the battery.
14. Assemble the main FPC component based on the positioning rods, fasten the light guide
FPC BTB and main FPC BTB, and attach the camera key FPC.

15. Install three keys, install the SIM card rack, and assemble the antenna rack component.
16. Install the speaker rack, fasten the eight screws, and paste the tamper-resistant label.

17. Paste the IMEI label.
18. Assemble the SIM card slot and install the battery cover.
19. Paste the machine IMEI label. The assembly is complete.

P2-6011 Maintenance Manual 9 Troubleshooting Common Faults
9 Troubleshooting Common Faults
Before repairing a phone, ensure that the failure of the phone is not caused by environmental
factors or incorrect functional settings.
9.1 Working Principle of the P2-6070

Figure 9-1 shows the working principle of P2-6070.
Figure 9-1 Working principle of the P2-6070
The P2-6070 mobile phone is a flagship product of Huawei in 2013. As a bar-type smartphone
integrating AP and MODEM structures, the P2-6070 uses the K3V2 (1.5 GHz quad core
ARM Cortex-A9) processor launched by Hisilicon. The P2-6070 is equipped with two

LPDDR2 ports, which implements dual channel and improves the system performance. Figure
9-2 shows the internal structure of the chip.
Figure 9-2 Internal structure of the K3V2
Hi3620
LPDDR2/DDR3
HSIC DDRC
3G/4G HSI
ARM Cotex A9 *4 LPDDR2/DDR3
Modem UART1
Baseband I/F
GPIO
ICache DCache NANDC NAND FLASH

PCM
1MB L2 Cache
eMMC 4.41 eMMC
Hi6421
I2S
Audio Signal Processor
Power
MMC/SD3.0 Memory Card
Audio G2D/G3D GPU
Headset MMU
Receiver PMU_SPI
CSI/I2C
PMSPI Camera1
Speaker MIPI CSI*2
MIC Video Encoder ISP Camera2
DVP/I2C
Headset DVP Camera3
Video Decoder
Vibrator PCM
BT Baseband LCD Panel 1

MIPI DSI*2
EDC LCD Panel 2
DMA Controller
GPS/BT RF HDMI TMDS/DDC/CEC
HD TV
Hi6350 System Controller
8*8
GPS Baseband KeyPad Controller KEYPAD
BT/WiFi Switch CRG Periph Ctrl
SYS
RF TX RF RX IO CONF USB 2.0 Device PC
Ctrl
WiFi SDIO1 USB 2.0 Host USB Disk
PCI-E 1X South Bridge

UART4 UART3 I2C0 I2C1 SIM SPI0 UART0 JTAG
X- Capacitive Charger
BT GPS FM Sensor TP IC Mobile TV Trace Debug
The P2-6070's hardware structure can be divided into three parts: the AP subsystem, Modem
subsystem, and RF module. The whole system is composed of the PCBA, internal battery, and
mechanical parts. The PCBA incorporates the main board (HL2U9700LM), main FPC
(HL1U9700LWB), capacitive keys mini-board (HL1U9700LKB), volume board
(HL1U9700LV), RCV FPC (HL1U9700LR), and antenna board (HL1U9700LAD).
Mechanical parts include the LCD module, 1.3 megapixel FHD camera module,
speaker/recorder modules, touch lens, B shell, C shell, main antenna, GPS/Wi-Fi/Bluetooth
antenna and diversity antenna.
Table 9-1 Structure of P2-6011's main PCBA
Subsyste Module Unit Function

m
Baseband HI3620 Application subsystem 40 nm fabrication, quad ARM9
subsystem processors, supports the SD card
and incorporates functional
modules, such as the UART, SPI,
SDIO, I2C, I2S, PCM, HSI,
HSIC, MIPI, DVP, GPIO, HDMI,
USB, Keypad, LPDDR2 (POP),
EMMC, and PWM.


m
User interface processing Provides camera, PCM, I2S, RF,
unit LCD, USB, UART, HIS/HSIC,
MIPI, GPIO, JTAG, and keypad
interfaces.
Multimedia and game Runs MPEG and JPEG hardware
engine engines and game engines, JAVA
accelerator, and provides
MP3/MMS/MIDI functions.
HI6421 PMU subsystem 180nm fabrication, supplies
power to external subsystems
such as the Hi3620, provides five
BUCK circuits, 20 LDO
regulators, HKADC, Reset, motor
driver, and LED driver.
CODEC subsystem Provides two PCM interfaces, one
I2S interface, two analog MIC
interfaces, two digital MIC
interfaces, Receiver interface,
headset jack, built-in
single-ClassD audio amplifier,
stereo Lineout, and stereo Linein,
and supports headset insertion and
removal test and headset key
detection.
Hi6920 Hi6920 40nm Low Power fabrication,
programmable I/O, supports LTE,
WCDMA/HSDPA/HSPA+,
GSM/GPRS/EDGE, and
2G/3G/LTE multimode operation,
and integrates two Cortex-A9
processors, one functioning as the
communication processor and the
other functioning as the
application processor. The
application layer uses the
Tensilica Xtensa processor and
ZSP500 processor that is based on
the ZSP G2 architecture and
integrates an independent audio
processor.
Hi6451 Supplies power to modem and
BB, provides the reset function,
six BUCK circuits and 17 LDO
regulators, and uses the BGA104
packaging.
Modem memory MDDR (1 GB)
EMMC EMMC feature, power Stores programs and NV items,


m
consumption, and file 32 GB.
system support
LPDDR2 POP encapsulation RAM for program running, 1 GB.
RAM
RF W-CDM Balong Performs the RF function of
subsystem A WCDMA, GSM, and LTE signal
GSM/LT reception and transmission. It
E mainly includes the RFMD RF
transmiss chip, PMU, and its peripheral
ion and circuits.
reception
GPS GPS reception Receives and processes GPS
signals and mainly includes the
WL1873 chip and the peripheral
circuit.
Bluetooth Bluetooth module Implements the Bluetooth
interface baseband function and transmits
and receives RF signals. It mainly
includes the WL1873 and its
peripheral circuits.
Wi-Fi Wi-Fi module Implements the Wi-Fi baseband
interface function and transmits and
receives RF signals. It mainly
includes the Wi-Fi module of the
WL1873 chip and its peripheral
circuits.
Crystal 19.2 MHz TCXO and Generates the highly accurate
oscillator control circuit 19.2 MHz local reference clock
and TCXO.
frequenc
y
synthesiz
er
Antenna External antenna, internal Provides built-in antennas for
interface component, and communication, including the
antenna protection main antenna, GPS antenna,
Wi-Fi/Bluetooth antenna,
diversity antenna
User UART In the AP subsystem, the UART1
interface Interface interface is used in the MODEM,
subsystem the UART2 interface is used in
the ES305 chip, the UART3
interface is reserved, and the
UART4 interface is used in the
WL1873 chip that incorporates
the GPS, Bluetooth, Wi-Fi, FM,


m
and NFC functions.
USB Driver, protection circuit Refers to the peripheral circuit of
Interface and output interface the USB interface in the AP,
component modem, and MHL subsystems,
and unit circuits such as
protection circuit and interface
connectors. It is the major data
service channel for the
engineering sample, and can be
used to debug and test devices
during product development.
SIM card Power supply, protection Mainly includes the SIM card
interface circuit and SIM card holder holder and related connection
circuits.
Keypad, Keypad driver circuit and Performs interruption monitoring
physical backlight LED control on physical keys using GPIO. The
keys, and circuit driver IC is used for capacitive
backlight keys and two side backlight LEDs
LED are provided.
Color LCD driver, interface The main LCD is of 1600 M color
LCD and mode, and backlight and 720 x 1280 pixels. The LDC
backlight control backlight brightness is controlled
by the CABC function.
Speaker Driver mode, connection Supports a maximum of 500mW
mode, and speaker power. The frequency response is
component good enough to playback 20 Hz to
20 kHz ringtones smoothly. It can
also play mono-audio MP3 files.
Receiver Driver mode, connection The power of the receiver for
mode, and receiver calls must be less than 30 mW
component
MIC Interface circuit, Built-in dual silicon MIC, which
connection mode, and can reduce noises.
microphone component
Earphone Earphone, headset interface Provides a 3.5 mm headset jack to
circuit, and microphone support incoming calls, MP3 file
interface circuit playback, and outgoing
microphone calls.
Vibration Driver mode, connection Vibrates to notify the user of
motor mode, and motor incoming calls.
interface
Accelero I2C interface control Senses acceleration to help realize
meter game functions.
Gyroscop I2C interface control Functions as the three-axial rate


m
e sensor.
Compass I2C interface control Functions as the geomagnetic
sensor.
Proximit I2C interface control Senses the ambient light and
y sensor proximity light.
Power Internal Li-ion battery and interface Li-ion battery with the standard
subsystem backup component output 3.8 V/2350 mAh. The
battery charge/discharge lifecycle is
required to be over 500 times. The
battery must be certified and
comply with relevant safety
regulations.
Power Power distribution network Includes filtering networks and
distributi cabling for the power supply.
on
network Backup battery Manages battery charging and
and management, charge discharging and provides
power circuit, charge mode, and overcharging and
managem charge protection over-discharging protection for
ent the battery.
Board circuit power Mainly refers to the LDO
management (power-on/off regulators, which manages power
analysis) supply flexibly. Based on the
service status, protocol
requirements, and power-saving
analysis, the board software
manages power supply to unit
circuits on the board to reduce
power consumption. A 32 kHz
sleep clock is provided.
HI6421 RTC Built-in RTC circuit, which uses a
enhanced sleep clock of 32.768 kHz to
function provide precise time.
HKADC Provides 4 external analog signal
inputs.
UVLO Provides the low-voltage
power-off function. When the
input voltage is lower than the
threshold for a specific period, the
phone powers off.
WDT reset Supports the WDT counter
overflow reset function.
Overheat protection Powers off the phone when the
on-chip junction temperature
exceeds 150°C.


m
Internal driver circuit Provides four LED drivers, one

vibrator driver, one speaker
driver, one receiver driver, and
one headset driver.
Interrupt management Handles interrupted signals.
USB driver Contains a built-in OTG USB
driver that supports the USB 2.0
HS and /B interface. The software
supports the OTG function.
9.2 Power-on Failure

When a power-on failure occurs, locate the cause. The possible causes are as follows:
1. No voltage output caused by battery damage, protection upon startup caused by low
voltage, or installation defects of battery connection components
2. Startup failure caused by PCBA faults
3. Seeming power-on failure caused by LCD damage, LCD backlight failure, or black
screen
4. Seeming power-on failure caused by power key FPC failure (The power key is disabled.)
Identification methods:
1. During normal power-on of the phone, the motor vibrates for a short while and the
power-on ringtone is played with the LCD light up. Therefore, when a power-on failure
occurs, press the power key again for a second. If the motor vibrates or the power-on
ringtone is played, or both occur, the LCD is damaged or an LCD backlight failure or
black screen occurs, causing the determination of power-on failure by mistake. When
this occurs, replace the LCD of the phone with a normal one and attempt to power on the
phone again.
2. If the motor does not vibrate and the power-on ringtone is not played after you press the
power key, use a USB charger to charge the phone. If the phone can be powered on after
being charged for a while and display the charging status, the power-on failure is caused
by battery over-discharging. If the phone can be powered on immediately after being
recharged and display the charging status, the power-on failure may be caused by the
power key FPC failure. If the phone keeps restarting after being recharged, the possible
cause of the power-on failure is battery damage or main PCBA damage.
3. If the phone still cannot be powered on after being charged for a quite while, disassemble
the phone to locate the cause. After you verify that the battery is normal, you can
determine that the failure is caused by PCBA damage.
If the failure is caused by PCBA damage, you can charge the phone with external
programmable power supply, and then power on the phone to detect current to identify the
possible cause, which can be any of the following:
 Excessive current

 Weak current
 No current
For details, see the following sections.
9.2.2 Excessive Current (DC Power Supply)

Excessive current is mainly caused by short circuits. When the phone is charged by DC power
supply, the current is equal to or greater than 500 mA. (Generally, it can achieve the output
protection value of the external power supply.) The main reason is ground short circuits of
VBAT and VPH_PWR. The normal voltage of VBAT and VPH_PWR is between 3.3 V and
4.25 V.
Figure 9-3 shows the excessive current handling process.
Figure 9-3 Excessive current handling process
When you charge the phone by

external power supply or dummy
battery, excessive current is detected
after the power key is pressed.
N Check whether relevant

Check whether the VBAT circuits of the VPH_PWR
is short-circuited. are short-circuited.
Check whether the circuits Check whether Y

Y Re-solder or
of the battery connection they are normal End
replace the
components are after soldering
components.
short-circuited. the U900.
Check whether main IC Y N

components, such as the Re-solder or
U1301, U1901, and U5603, replace the
of the PCBA are short components.
circuited.
Check whether other circuits

are short-circuited (especially
the circuits near the connection
components).

VPH_PWR
VBATT
Battery connector
9.2.3 Weak Current (DC Power Supply)

After the phone is powered on, if weak current is generated, partial short circuits may exist on
the PMU IC. If the system does not start normally and reserve certain current, it may be
caused by the main chip or MEMORY fault that results in the system startup failure. The
current is between 20 mA and several hundreds mA.
Figure 9-4 shows the weak current handling process.

Figure 9-4 Weak current handling process
When you charge the phone by external power

supply or dummy battery, weak current is
detected after the power key is pressed, but the
phone cannot be powered on.
Check whether the N

Re-solder or replace
U900 power output is
the U900.
normal.
Check whether the 19.2 MHz N

XO is normal (whether there is Re-solder or replace
output voltage). the XO.
Check whether the U300 and N Re-solder or

U1102 are normal. replace the U300
or U1102.
U900 power output

U1102
U300
19.2 MHz XO power
output

9.2.4 No Current (DC Power Supply)

This failure occurs when the power supply channel is not established or poorly soldered, or
circuits related to the power key are faulty.
Figure 9-5 No current handling process
When you charge the phone by

external power supply or dummy
battery, no current is detected after
the power key is pressed.
Check whether the N Press to fasten the power

power key FPC is key or replace the power
normal. key FPC.
Check whether the

N Re-solder or replace the
battery connection
battery connection
components are
components.
normal.
Re-solder or replace the

U900.
Power key FPC connector
Battery connector

9.3 Charging Failure

The P2-6070 charging management is conducted by the U1901 charging IC module. If the
system is operating normally but fails to be charged, check circuits in the charging
management module, or replace U1901 to check whether this failure is rectified. If failure
persists, replace the U1301 and check again.
Figure 9-6 Charging circuit principle of the P2-6070
Figure 9-7 Battery gauge circuit principle of the P2-6070

U1901 charging IC
module
U1301 battery
gauge module
9.4 Display Failure

Figure 9-8 shows the handling process for the display failure.

Figure 9-8 Handling process for the display failure
Display failure
Check whether the connection

N
between the LCD and the Fasten the connector between
the LCD and the PCBA.
PCBA is normal.
N
Check whether nothing is
Replace the LCD to
displayed on the LCD. identify that it is LCD
failure or PCBA
failure.
N
Check whether it is caused by Replace the J1601
LCD components defects. or peripheral
components.
Replace the LCD

components.
Connector J1601 between

the LCD and the PCBA

9.5 Vibration Failure

Figure 9-9 shows the handling process for the vibration failure.
Figure 9-9 Handling process for the vibration failure
Vibration failure
Check whether the

Check whether the N connection between
phone never vibrates. the FPC and the PCBA
is normal.
Supply the motor

with external power N Replace the
and check whether it motor.
vibrates.
Check whether the motor N Re-solder or replace

channel and PCB cabling are relevant
normal. components.

U1201.

Connector Supply 3.0 V

between the external power
main FPC and to the motor
the PCBA and check
whether it
vibrates.
9.6 Failure to Identify the USIM Card

For a USIM card identification failure, check whether the phone is set to the airplane mode. If
not, troubleshoot the fault as shown in Figure 9-10.

Figure 9-10 Handling process for the USIM card detection failure
Failure to identify the USIM card
Check whether the N Re-solder or replace

USIM card socket is the USIM card socket
normal. J2102.
Check whether the USIM N Re-solder or replace

card power supply the U2106.
VREG_L15_UIM is normal.
Check whether the USIM1_RST N Re-solder or replace

channel and other signal cables relevant
are normal. components.

U2501.

U2106
USIM card socket J2102
USIM card power supply

VREG_L15_UIM (3 V or 1.8 V)
USIM1_RST (3 V or
1.8 V)
9.7 Touch Panel Failure

The touch panel failure is mainly reflected as touch panel unlocking failure while the LCD
display is normal.
The TP components have great independence and multiplex power supply and communication
interfaces with other circuits; therefore, you can replace the front shell to identify whether it is
a touch panel failure or PCBA-related circuit failure.

Figure 9-11 Handling process for the touch panel failure
Touch panel failure
Check whether the Y Replace the

problem is solved after touch panel.
the touch panel
connector is replaced.
Check whether the N Re-solder or replace

touch panel is properly the U900.
supplied with power.
Check whether the RS, INT, N the touch panel
and I2C signal channels of signal channel
the touch panel are normal. components.

J1601.
Connector J1601 between

the LCD and the PCBA
RS, INT, and I2C (1.8 V) signal

channels of the touch panel

9.8 Proximity Sensor and Automatic Light Sensing

Failures
Figure 9-12 Handing process for the proximity sensor and automatic light sensor failures
Proximity sensor or automatic light

sensing failure
Check whether there is any Remove the shielding

shielding object on the panel Y object and ensure that
and whether the silicon case the silicon case is
is properly assembled. properly assembled.
Check whether the J2202 N Ensure that the J2202

connection is firm. connection is firm.
Replace the sensor FPC.

Connector J2202
between the sensor
FPC and the PCBA
Check whether there is any

shielding object on the panel
and whether the silicon case
is properly assembled.
9.9 Accelerometer Sensor Failure

If the accelerometer sensor is faulty, the compass sensor does not work either, because the
compass sensor software operates depending on the accelerometer. This can be treated as an
identification basis.

Figure 9-13 Handling process for the accelerometer sensor failure
Accelerometer sensor failure
Check whether the N

accelerometer sensor is Inspect the power
properly supplied with supply circuit.
power.
After replacing the U2004 of

the accelerometer sensor, N Re-solder or replace
check whether the the U1101.
accelerometer sensor is
normal.
End
Accelerometer sensor
chip U2204
power supply
Sensor_2V6 (2.6 V)
power supply Vout_1V8
(1.8 V)

9.10 Compass Sensor Failure

Figure 9-14 Handling process for the compass sensor failure
Compass sensor failure
Check whether the compass N Inspect the power

sensor is properly supplied with supply circuit.
power.
After replacing the U2005 of the N Re-solder or

compass sensor, check whether replace the U1101.
the compass sensor is normal.
End
Compass
sensor chip
U2005

Compass sensor power

supply Sensor_2V6 (2.6
V)

supply Vout_1V8 (1.8
V)
9.11 Gyroscope Failure

The gyroscope is also called the angular rate sensor and mainly used to test the angular
variation. If the gyroscope is faulty, users fail to take turns effectively when they are playing
racing games. Therefore, you can determine whether the gyroscope is faulty by playing racing
games.

Figure 9-15 Handling process for the gyroscope failure
Gyroscope failure
Check whether the gyroscope is N Inspect the power

properly supplied with power. supply circuit.
After replacing the U2003 of N Re-solder or

the gyroscope, check whether replace the U1101.
the gyroscope is normal.
End
Gyroscope chip U2003


supply Sensor_2V6 (2.6
V)

supply Vout_1V8 (1.8
V)
9.12 Camera Failure

Common camera failures can be any of the following:
1. The cameras fail to be started.
2. The primary camera fails to be focused.
3. The capture screen has garbled images or stray lights, or the capture screen is black.
For the first two types of failures, check whether they are fixed after you restart the phone or
restore the phone to its default settings. If the problem persists, replace the front and rear
cameras to check whether the fault is caused by the PCBA or camera module side. If the
failure is caused by the camera module, replace the module; if the failure is caused by the
PCBA, verify that the camera's power supply channel and flash driving chip are normal.
For the third type of failure, replace the camera module.

Primary camera power supply Primary camera power supply Secondary camera power supply
MCAM_DVDD_1V05L (1.05 V) MCAM_IOVDD_1V8L (1.8 V) SCAM_DVDD_1V2 (1.2 V)
Secondary
Primary camera camera power
power supply supply
MCAM_AFVDD_ CAM_IOVDD_1V
2V85 (2.85V) 8 (1.8V)
Secondary
camera power
Primary camera supply
power supply SCAM_AVDD_2
MCAM_AVDD_2V8 V85 (2.85V)
5L (2.85V)

9.13 Audio Failure

9.13.1 Ringtone Failure
Figure 9-16 Handling process for the ringtone failure
Ringtone failure
Check whether the N

Replace the
speaker functions
speaker.
properly?
Check whether the

speaker circuit
functions properly?

U1201.
U1201
Speaker

9.13.2 Voice Transmission Failure

Figure 9-17 Handling process for the voice transmission failure
Voice transmission failure
Check whether the N

MIC on the small Replace the MIC
board functions or small board.
properly?
Y
N Troubleshoot
relevant circuit
Check whether the
faults of the MIC
circuit functions
small board, FPC
properly?
flat cable, and
main board.
Y
Replace the U900.
U900
MIC

9.13.3 Voice Receiving Failure

Figure 9-18 Handling process for the voice receiving failure
Voice Receiving Failure
Check whether the Replace the

N
receiver functions receiver.
properly?
Check whether the N Replace

receiver FPC functions the FPC.
properly?
Troubleshoot
Check whether relevant N relevant signal
signal circuits function circuit faults of the
properly? main board.
Y
U1201.
Receiver
U1201

9.14 Headset Audio Failure

9.14.1 Failure in Hearing Sound from the Headset
Figure 9-19 Handling process for the failure in hearing sound from the headset
Failure in hearing sound

from the headset.
Check whether the J1500 N Replace the

functions properly? J1500.
Check whether left and

N Replace relevant
right channel elements
of the headset function elements.
properly?
Check whether the short Troubleshoot

N
circuit occurs between signal circuit
the headset channels and faults.
the earth?
Y
Replace the U1201.

Inductance on the left

and right headset
channels (check
whether the channels
function properly)
Headset jack
J1500

9.14.2 Failure in Transmitting Sound from the Headset

Figure 9-20 Handling process for the failure in transmitting sound from the headset
Failure in transmitting
sound from the headset.
N
Check whether the Replace the
J1500 functions J1500.
properly?
Y
N
Check whether the Diagnose and

microphone bias rectify the fault.
voltage is normal?
Check whether the N

Troubleshoot
short circuit occurs signal circuit
between the MIC faults.
channel and the earth?
Replace the U1501.

MIC_BIAS
Headset jack
J1500
U1501

9.15 Speaker Noise Faults

If the speaker is water penetrated or contains impurities, such as iron scraps, noise may occur
on the speaker.
Figure 9-21 Handling process for speaker noise faults
Speaker noise faults
Y Troubleshoot the fault

Check whether the speaker
according to relevant
is water penetrated?
Huawei regulations.
Troubleshoot the fault

Check whether the speaker Y according to relevant
contains iron scraps? Huawei regulations.
Check whether the fault is Y End

rectified after the speaker
is replaced?
Check whether the fault is

rectified after the front Y
End
cover components are
replaced?
Replace spare components.

Speaker

9.16 WiFi and Bluetooth Failure

Figure 9-22 Handling process for the WiFi and Bluetooth failure
WiFi and Bluetooth failure
Check whether the

software functions N Replace the software.
properly?
Check whether springs

J5506 to J5508 are in good N Ensure that they are
contact with the antenna? in good contact.
Check whether the Z5505 Troubleshoot signal

N
functions properly? circuit faults.
Check whether the fault is Troubleshoot signal

rectified after the U5504 is N
circuit faults.
replaced?
End

Figure 9-23 WiFi/Bluetooth signal input circuit
J5506-J5508
springs
Z5505
U5504

9.17 GPS Failure

Figure 9-24 Handling process for the GPS failure
GPS failure
Check whether springs N Ensure that they

J5503 to J5505 are in good are in good
contact with the antenna? contact.
Check whether the fault is Y

rectified after the Z5502 is End
replaced?
Check whether the fault is Y

rectified after the U5503 is End
replaced?
N
Y
Check whether the fault is
rectified after the Z5503 is End
replaced?
N
Replace the U5603.
Figure 9-25 GPS circuit

J5503-J5505
springs
Z5502
U5503
Z5503
U5603

9.18 RF Transmission Failure — WCDMA/LTE

Figure 9-26 Handling process for the WCDMA/LTE transmission failure
WCDMA/LTE transmission
failure
Check whether RF
connectors function
Check whether Y
properly and whether
wired indicators the antenna spring is in
function properly? good contact.
Y
Check whether the problem
End
is solved after the software is
updated to the latest version?
N If the problem is
solved after the U4001
(B1), U4003 (B3),
Check whether the power Y U4203 (B7), U4201
supply of the RF PA is (B8), and U4202 (B20)
normal? are replaced, the
process ends. If the
problem persists,
N replace the U2900.
Check whether PA U4001 (B1), N

U4003 (B3), U4203 (B7), U4201 the components.
(B8), and U4202 (B20) are
normal by frequency band?

Y
is solved after relevant End
circuits are replaced for
abnormal frequency bands?
N
N the U4006 (B1) and
Check whether the filter is Z4005 (B3 and B9).
normal?
Y
Replace the U4101 switch.

If the problem persists, replace the Balong RFIC U3901.
U2900
U4001 (B1)
U4003 (B3)
U4203 (B7)
U4201 (B8)
U4202
(B20)

U4006
Z4005
U4101
U3901

9.19 RF Reception Failure — WCDMA/LTE

Figure 9-27 Handling process for the WCDMA/LTE reception failure
WCDMA/LTE reception failure
Check whether
Y RF connectors
Check whether wired function properly
indicators are normal? and whether the
antenna spring is
in good contact.
N
Y
is solved after the software is End
Re-solder the
N circuits. If the
Check whether relevant circuits
are properly soldered for the problem is
abnormal frequency bands? solved, the
process ends.
Y
Replace the U4101
(main), U4301
Check whether the RF circuit N (B3B20 diversity),
switches function properly? and U4302 (B1B7
diversity). If the
problem is solved,
the process ends.
Y
Check whether the U4006 (B1), Re-solder the

Z4005 (B3), U4204 (B7), U4205 components or
(B8), or U4206 (B20) is in poor Y replace the
soldering or damaged based on the duplexer.
abnormal frequency bands and check
whether the Z4304 (B1), Z4301
(B3), Z4302 (B20), or Z4304 (B7) is
abnormal for diversity reception?
Replace the RFIC

U3901.

U4006
Z4005
U4204
U4206
U4205
U3901

9.20 RF Transmission Failure — GSM

Figure 9-28 Handling process for the GSM transmission failure
GSM transmission failure
Y Check whether RF
Check whether wired connectors function
indicators are normal? properly and whether
the antenna spring is
in good contact.
N
Check whether the problem is Y

solved after the software is End
Replace the U4101.

Check whether the RF N If the problem is
circuit switches function solved, the process
properly? ends.
Check whether the problem is Y

solved after the GSM, PA, and End
U4102 are replaced in order?
Check whether the problem Y

is solved after relevant End
circuits are replaced for
abnormal frequency bands?
Replace the RFIC U3901.

U4102
U4101
U3901

9.21 RF Reception Failure — GSM

Figure 9-29 Handling process for the GSM reception failure
GSM reception failure
Check whether
RF connectors
Check whether wired Y function properly
indicators are normal? and whether the
antenna spring is
in good contact.
N

is solved after the software Y End
is updated to the latest
version?
Check whether
Check whether the RF N the RF circuit
circuit switches function switches function
properly? properly.
Check whether the problem is

Y
solved after the 4007 (PCS),
Z4101 (DCS), U4205
(GSM900), and Z4102 End
(GSM850) are re-heated or
replaced based on the abnormal
frequency bands?
N
Replace the RFIC U3901.

U3901
U4007
Z4101
U4205
Z4102
If all RF signals are abnormal, pay special attention to inspect the circuits for the power supply, antenna
feed point, antenna switch chip, antenna connector, and RF test base.

P2-6011 Maintenance Manual 10 Functional Tests
10 Functional Tests
10.1 Keypad Introduction

Smartphone has few keys. The P2-6070 has seven keys. The three keys on the panel are
common keys for phones running an Android operating system; the other three are
respectively the power key, volume up key, volume down key, and camera key.
The P2-6070's battery is unremoveable. The phone will be forcibly restarted after you press
and hold the power button for 10 seconds.

Figure 10-1 P2-6070 keys
10.2 MMI Test

Enter *#*#2846579#*#* on the touch panel to switch to the test mode. Select MMI Test_II
and Start MMI test is displayed on the LCD. Press the volume down key to start the test.
During the test, you can touch the menu key to make the test fail, press the volume down key
to enter the next test, touch the back key to return to the previous test. 错误！未指定书签。
The following is the test procedure.
1. Enter MMI test mode

2. Board information test
3. Battery information test

4. Key test
5. LCD test

6. LCD backlight and tricolor indicator test
7. Keypad LED test

8. External and Internal camera test
9. Flash test

10. Touch panel test
11. Proximate light sensing test

12. Ambient light sensing test
13. Motor test
14. Speaker test

15. Receiver test
16. Audio loopback test

17. FM test
18. Headset wire control test

19. HDMI test
20. Bluetooth test

21. G-sensor test
22. Gyroscope and compass test

23. Wi-Fi test
24. SIM card test

25. Test result display
10.3 Wi-Fi Test

To ensure a normal network, place the mobile phone within 15 meters away from the AP, and
there must be no obstacle between the mobile phone and AP.
1. Configure the AP properly. Power on the phone and place it within the AP's transmission
range.
2. Tap Settings > WIRELESS&SETTINGS > WLAN > turn WLAN on, and enable
network notifications.
3. After the phone automatically finds the AP's SSID, touch the SSID and enter the
password to establish a connection.
4. Change the distance between the phone and AP and check the change of the Wi-Fi signal
strength.
5. In the normal network, launch a browser and access a website to test the network quality.

If no problems are found, finish the Wi-Fi test. If any problems are found, troubleshoot the
phone or send it to an advanced service site for repair.
10.4 Audio Test

1. Install a UIM card on the phone.
2. Press and hold the power key to power on the phone.
3. Check whether the signal strength displayed on the LCD is normal (given that the
network is normal).
4. Make a call to a fixed-line phone, and check the voice quality during the call.
5. If no problems are found, exit the voice call test. If any problem is found, troubleshoot
the problem or send the Y300 to an advanced service center for repair.


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Huawei Technologies Co., Ltd.

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential i

About This Document

Reviewed by Li Yong (ID: 64410) Date 2013-05-06

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential ii

About This Document .................................................................................................................... ii

2 Applicable Scope and Precautions ............................................................................................ 4

6 Repair Tools ................................................................................................................................. 20

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential iii

9.10 Compass Sensor Failure ............................................................................................................................... 55

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential iv

Figure 1-1 P2-6070

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 1

Table 1-1 P2-6011 specifications

Type Touchscreen smartphone

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 2

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 3

2 Applicable Scope and Precautions

2.1 Applicable Scope

2.2 How to Obtain Product and Repair Information

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 4

Figure 3-1 shows the exploded view of the P2-6011.

Figure 3-1 Exploded view

Figure 3-1 describes the product BOM in the black phone.

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 5

Figure 3-1Product BOM of the black phone

No. BOM Description Quantity

3 51611495 U9700L Power Key, Black, PVD 1.0 PCS

4 03021WMQ LTE P2-6013-HL1U9700LR-RCV Board FPC-1*1 1.0 PCS

6 51634425 DKBA80936240,U9700L_SUB_ANT_HOLDER,U9 1.0 PCS

10 51611518 U9700L Front Cover Assy, Black, PVD 1.0 PCS

11 51611513 U9700 SIM Door, Black,PVD, General Version 1.0 PCS

12 03022BUN P2-62070,HL1U9700LAE,Australia Antenna Boar 1.0 PCS

15 22020079 Speaker,8ohm,0.5w,11*15*3.5(Improved),Terminal 1.0 PCS

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 6

4 Components on the PCBA

Figure 4-1 show the components on the PCBA.

Figure 4-1 Components on the top side of the PCBA

Z5502 U5503 IC U4006 U4204 Z4005

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 7

Figure 4-2 Components on the bottom side of the PCBA

J1500 headset jack

U4102 U4001 U4003

J2102 SIM card

Table 4-1 Components on the PCBA

BOM Description Quantity Location

19040169 Protection Tube,Fast Blowout 1.0 PCS F1900

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 8

BOM Description Quantity Location

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 9

BOM Description Quantity Location

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 10

BOM Description Quantity Location

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 11

BOM Description Quantity Location

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 12

BOM Description Quantity Location

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 13

BOM Description Quantity Location

Issue 1.0 (2013-03-25) Huawei Proprietary and Confidential 14

5.1 Upgrade Preparation

15 22020079 Speaker,8ohm,0.5w,11153.5(Improved),Terminal 1.0 PCS