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Features Description
ESD Protect for 4 high-speed I/O lines and one AZC199-04S is a design which includes ESD
VDD line rated diode arrays to protect high speed data
Provide ESD protection for each line to interfaces. The AZC199-04S has been specifically
IEC 61000-4-2,(ESD) ±27kV (air), ±16kV (contact) designed to protect sensitive components which
IEC 61000-4-4 (EFT) Level-3, 55A (5/50ns) are connected to data and transmission lines from
IEC 61000-4-5 (Lightning) 6A (8/20µs) over-voltage caused by Electrostatic Discharging
For low operating voltage applications: 5V, 4.2V, (ESD).
3.3V, 2.5V etc. AZC199-04S is a unique design which includes
Low capacitance : 1.0pF typical ESD rated, low capacitance steering diodes and a
Fast turn-on and Low clamping voltage unique design of clamping cell which is an
Array of ESD rated diodes with internal equivalent TVS diode in a single package. During
equivalent TVS diode transient conditions, the steering diodes direct the
Solid-state silicon-avalanche and active circuit transient to either the power supply line or to
triggering technology ground line. The internal unique design of
Back-drive protection for power-down mode clamping cell prevents over-voltage on the power
Lead-free version available line, protecting any downstream components.
Green part Besides, there is a back-drive protection design in
AZC199-04S for power-down mode operation.
Applications AZC199-04S may be used to meet the ESD
Video Graphics Cards immunity requirements of IEC 61000-4-2, Level 4
Digital Visual Interface (DVI) (±15kV air, ±8kV contact discharge).
USB2.0 Power and Data lines protection
One AZC199-04S can be used to replace 4
Notebook and PC Computers BAV99 devices in a 5V application or a lower
Monitors and Flat Panel Displays than 5V application.
6 5 4
5
1 3 4 6
1 2 3
I/O 1 GND I/O 2
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATING UNITS
Peak Pulse Current (tp =8/20µs) (I/O pins) IPP 6 A
Operating Supply Voltage (VDD-GND) VDC 6 V
ESD per IEC 61000-4-2 (Air) (I/O pins) 27
VESD_IO kV
ESD per IEC 61000-4-2 (Contact) (I/O pins) 16
ESD per IEC 61000-4-2 (Air) (VDD, GND pins) 30
VESD_PW kV
ESD per IEC 61000-4-2 (Contact) (VDD, GND pins) 22
o
Lead Soldering Temperature TSOL 260 (10 sec.) C
o
Operating Temperature TOP -55 to +85 C
o
Storage Temperature TSTO -55 to +150 C
(GND – 0.5) to
DC Voltage at any I/O pin VIO V
(VDD + 0.5)
ELECTRICAL CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Reverse Stand-Off o
VRWM Pin 5 to pin 2, T=25 C 5 V
Voltage
Reverse Leakage
ILeak VRWM = 5V, T=25 oC, Pin 5 to pin 2 5 µA
Current
Channel Leakage
ICH-Leak VPin5 = 5V, VPin2 = 0V, T=25 oC 1 µA
Current
Reverse Breakdown
VBV IBV = 1mA, T=25 oC, Pin 5 to Pin 2 6 9 V
Voltage
Forward Voltage VF IF = 15mA, T=25 oC, Pin 2 to Pin 5 0.8 1 V
ESD Clamping IEC 61000-4-2 +6kV, T=25 oC, Contact
Vclamp_io 11 V
Voltage –I/O mode, Any Channel pin to Ground
ESD Clamping IEC 61000-4-2 +6kV, T=25 oC, Contact
Vclamp_VDD 9 V
Voltage –VDD mode, VDD pin to Ground
ESD Dynamic Turn on IEC 61000-4-2 0~+6kV,T=25 oC, Contact
Rdynamic_io 0.3 Ω
Resistance –I/O mode, any Channel pin to Ground
ESD Dynamic Turn on IEC 61000-4-2 0~+6kV, T=25 oC, Contact
Rdynamic_VDD 0.15 Ω
Resistance –VDD mode, VDD pin to Ground
Lightning Clamping Vlightning_io IPP=5A, tp=8/20µs, T=25 oC 8.5 V
Voltage Any Channel pin to Ground
Lightning Clamping Vlightning_VDD IPP=5A, tp=8/20µs, T=25 oC 7.7 V
Voltage VDD pin to Ground
Channel Input Vpin5 =5V, Vpin2 =0V, VIN =2.5V, f =1MHz,
CIN-1 1.0 1.2 pF
Capacitance -1 T=25 oC, Any Channel pin to Ground
Channel Input Vpin5=floated,Vpin2=0V,VIN=2.5V,f=1MHz,
CIN-2 1.5 1.7 pF
Capacitance - 2 T=25oC,Any Channel pin to Ground
Channel to Channel Vpin5 =5V, Vpin2 =0V, VIN =2.5V, f =1MHz,
CCROSS-1 0.15 0.2 pF
Input Capacitance -1 T=25 oC , Between Channel pins
Channel to Channel Vpin5 =floated,Vpin2 =0V,VIN =2.5V,f
CCROSS-2 0.18 0.23 pF
Input Capacitance -2 =1MHz,T=25 oC,Between Channel pins
Vpin5 =5V, Vpin2 =0V, VIN =2.5V, f =1MHz,
Variation of Channel
△CIN-1 T=25 oC , Channel_x pin to Ground - 0.08 0.1 pF
Input Capacitance -1
Channel_y pin to Ground
Vpin5 =floated, Vpin2 =0V, VIN =2.5V, f
Variation of Channel
△CIN-2 =1MHz, T=25 oC , Channel_x pin to 0.06 0.08 pF
Input Capacitance -2
Ground - Channel_y pin to Ground
Typical Characteristics
Typical Variation of CIN vs. VIN
2.6
2.4
2.2
Clamping Voltage vs. Peak Pulse Current Forward Clamping Voltage vs. Peak Pulse Current
12 5
11
Forward Clamping Voltage (V)
10
I/O pin to GND pin 4
Clamping Voltage (V)
9
8 I/O pin to GND pin
VDD pin to GND pin
7 3
6
5 2
4 VDD pin to GND pin
Waveform Waveform
3 Parameters: Parameters:
µs
1 µs
2 tr=8µ tr=8µ
td=20µµs td=20µµs
1
0 0
4.5 5.0 5.5 6.0 6.5 7.0 7.5 5 6 7 8 9 10 11
Peak pulse Current (A) Peak pulse Current (A)
Transmission Line Pulsing (TLP) Measurement Transmission Line Pulsing (TLP) Measurement
Transmission Line Pulsing (TLP) Current (A)
18 18
16 16
14 14
V_pulse V_pulse
12 Pulse from a
transmission line
12 Pulse from a
transmission line
TLP_I TLP_I
10 100ns + 10 100ns +
8 -
8 -
6 6
4 4
I/O to GND VDDto GND
2 2
0 0
0 2 4 6 8 10 12 0 2 4 6 8 10
Transmission Line Pulsing (TLP) Voltage (V) Transmission Line Pulsing (TLP) Voltage (V)
I ESD2 I ESD1
D1
data line
+ L1 Protected
Vp
_ IC
VESD
+
D2 V CL
_
GND rail
Fig. 1 Application of positive ESD pulse between data line and GND rail.
1 6
AZC199-04S
VDD rail
GND rail
2 5
*Optional
µF
0.1µ
3 4 Chip Cap.
I/O 3 I/O 3
To To
I/O-port data line Protected
Conne ctor IC
I/O 4 data line I/O 4
1 6
AZC199-04S
3 4
I/O 3 I/O 3
To To
I/O-port data line Protected
Conne ctor IC
I/O 4 data line I/O 4
Fig. 3 Data lines and power rails connection of AZC199-04S. VDD pin is left as floating when no
power rail presented on the PCB.
75 Ω
Green
6 5 4
Green Blue
AZC199-04S
Vide o
Filter
75 Ω
Detect
Signals From Scaler
Blue
DDCA_SCL
Vide o
Filter
1 2 3 DDCA_SDA
75 Ω
Green Red VSYNC
Detect HSYNC
FB HSYNC VGA5V VSYNC
FB
VSYNC 6 5 4 DIG_GND
AZC199-04S
HSYNC Red_GND
FB
DDC_Data Green_GND
FB
DDC_CLK Blue_GND
FB
1 2 3
GND
DDCA_SCL DDCA_SDA
15-pin
VGA connector
Fig. 4 The ESD design for a VGA OUTPUT port which two AZC199-04S are used.
Source Site
(e.g. MB) Monitor Site
VGA5V
6 5 4
System
5V VGA5V
BAV70
VDD
0.1uF
VDD
1 2 3 Ω
100Ω
Ω
10KΩ
DDCA_SDA to scaler
DDC_Data
DDCA_SDA
DDCA_SDA
FB
Fig. 5 The occurred back drive current when the source is at OFF state and the display device is
at ON state.
ESD Protection Design
Detect DSUB-5V Blue
Ω 0.047uF
100Ω
Red
6 5 4 Ω
FB 0Ω to scaler Red
Ω 5.6pF
AZC199-04S
DSUB-5V 75Ω
Blue 1 2 3 Ω 0.047uF
100Ω
Blue
Ω
FB 0Ω to scaler Blue
Detect Green Red Ω
75Ω 5.6pF
Ω
2.2KΩ 220pF
VSYNC
HSYNC Ω
1KΩ
HSYNC FB
Ω
120Ω to scaler HSYNC
DIG_GND
Ω
2.2KΩ 33pF
1 2 3
Red_GND
DDCA_SCL DDCA_SDA System 5V
Green_GND
Ω
10KΩ
Blue_GND Ω
100Ω
System DDCA_SDA to scaler
5V DSUB_5V DDC_Data
GND
BAV70 System 5V
or
BAT54 Ω
10KΩ
15-pin Ω
100Ω
VGA connector DDCA_SCL to scaler
DDC_CLK
EEPROM
Fig. 6 The ESD design for a VGA INPUT port which two AZC199-04S are used.
Pin-1
Pin-1
Fig. 7 The PCB layout example for a VGA port with two AZC199-04S being used.
Mechanical Details
SOT23-6L
PACKAGE DIAGRAMS PACKAGE DIMENSIONS
TOP VIEW Millimeters Inches
Symbol
MIN. MAX. MIN. MAX.
A 1.45 0.057
A1 0 0.15 0.000 0.006
A2 0.9 1.3 0.035 0.051
b 0.3 0.5 0.012 0.020
c 0.08 0.21 0.003 0.008
D 2.72 3.12 0.107 0.123
E 1.4 1.8 0.055 0.071
E1 2.6 3 0.102 0.118
e 0.95BSC 0.037BSC
e1 1.9BSC 0.075BSC
L1 0.3 0.6 0.012 0.024
L 0.7REF 0.028REF
L2 0.25BSC 0.010BSC
SIDE VIEW Ɵ 0 8 0 8
Notes:
This dimension complies with JEDEC
Y14.5M-1994.
All dimensions are in millimeters, and the
LAND LAYOUT
Dimensions
Index Millimeter Inches
A 0.60 0.024
B 1.10 0.043
C 0.95 0.037
D 2.50 0.098
E 1.40 0.055
F 3.60 0.141
Notes:
This LAND LAYOUT is for reference
purposes only. Please consult your
manufacturing partners to ensure your
company’s PCB design guidelines are met.
MARKING CODE
S15X
C16XY
103X AZC199-04S
(Green part)
C16XY
Ordering Information
PN# Material Type Reel size MOQ/internal box MOQ/carton
AZC199-04S.R7G Green T/R 7 inch 4 reel= 12,000/box 6 box =72,000/carton
Revision History