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• This course is intended to expand on the thermal analysis capabilities outlined in the
introduction to Mechanical training course material.
• Although the underlying thermal analysis capabilities of the solver is related to MAPDL, this
course is distinct from the Heat Transfer Analysis with MAPDL training course.
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4 © 2016 ANSYS, Inc. July 14, 2016
01.01 About ANSYS, Inc.
Breadth of Technologies
Fluid Mechanics: To Multiphase
From Single-Phase Flows Combustion
Systems: To Multi-Domain
From Data Sharing System Analysis
t time
T temperature
density
c specific heat
h film coefficient
emissivity
Stefan - Boltzmann constant
K thermal conductivity
Q heat flow (rate)
q heat flux
q , v internal heat generation/volume
E energy
T
q K nn heat flow rate per unit area in direction n
n
Where,
K nn thermal conductivity in direction n
T temperature q
T T
thermal gradient in direction n dT
n
dn
T the temperature difference between the ends of the the cube through the Length
L
Rthcond the thermal conductive resistance, in this case Rthcond ,
KL A
where: L is the length, A is the area, and the K L is the thermal conductivity in the length direction
q h (TS TF ) heat flow rate per unit area between surface and fluid
Where,
h convective film coefficient
TS surface temperature
TF bulk fluid temperature
TF
Convection is typically applied as a surface boundary condition.
The simplest form of convection condition requires the user to
prescribe a film coefficient and fluid temperature as user inputs.
Ts
T TS TF
1
Rthconv the thermal convective resistance, in this case Rthconv ,
h A
where: h is the convective film coefficient, and A is the area
Where,
"Stefan - Boltzmann constant"
emissivity i
Ai area of surface i
Fij form factor from surface i to surface j
Ti absolute temperature of surface i
T j absolute temperature of surface j
j
Radiation in ANSYS Mechanical is treated as a surface
phenomenon where bodies are assumed to be opaque.
• When one applies this to a differential volume, the strong form of governing differential equation
for heat conduction (in the absence of applied heat loads and advection is obtained)
𝜕𝑇
𝜌𝑐 + 𝑄 − 𝐾𝛻 2 𝑇= 0
𝜕𝑡
where Q is the rate of internal heat generation per unit volume and the Laplacian is defined as:
𝜕 2𝑓 𝜕 2𝑓 𝜕 2𝑓
𝛻2𝑓 ≡ 2 + 2 + 2
𝜕𝑥 𝜕𝑦 𝜕𝑧
Potential Problems:
• Poorly posed / Under constrained :
– In a Steady-State analysis when heat is supplied with no heat outlet the temperature is undefined
(energy balance not satisfied). This is the thermal equivalent to rigid body motion in structures.
– In practice, this issue shows up frequently among technical support service requests.
– Well-posed problems typically have at least one boundary with prescribed temperature or non-
adiabatic heat flux boundary condition.
Specified Temperature:
• Temperature is the degree of freedom (DOF) ANSYS solves for thus constraining it makes the
problem easier to solve.
• Users must verify that a fixed temperature is a reasonable assumption.
• At a fixed temperature there will be a heat flux calculated which maintains this temperature.
• A simulation that contains only fixed temperature boundary conditions will always be bounded.
• A temperature applied as a step change during a transient analysis is generally more difficult to
solve than one that is ramped.
Heat Flux
• Heat added per unit area per unit time.
• Applied to a face.
• If the geometry (area) changes, the amount of heat added will change.
Heat Flow
• Heat added per unit time.
• Applied to a face, edge, or vertex.
• If the geometry changes, the amount of heat added does not.
Radiation
• The radiation boundary condition employed in Mechanical is a surface condition.
That is, the surface in question radiates to ambient and/or to other surfaces.
Emitted
Reflected
Incident
For more information about the Engineering Data, please consult the course Introduction to ANSYS Mechanical
25 © 2016 ANSYS, Inc. July 14, 2016
01.10 Geometry Types
All geometry types (solid, surface and line bodies), can be used for thermal analyses
in Mechanical. The elements contain temperature degrees of freedom (DOF).
Solid Geometry (2D and 3D):
• Models may be full 3D or symmetry sections 3D
including 2D sections.
All temperature
variation is along
membrane
directions
Exterior Surface
Interior Surface
27 © 2016 ANSYS, Inc. July 14, 2016
01.10 Geometry Types
Thermal Shells – SHELL131 Elements
• Only membrane behavior in ANSYS/Mechanical is directly exposed.
• Through thickness is possible with ANSYS/MAPDL or with command objects.
• Layered sections can be defined via command objects.
Layered Solids Support - SOLID278
• Composite thermal solids supported starting with Revision 15.
• Advanced Composites Prep/Post is required for defining imported sections.
Line Bodies
Thermal
Point Mass
3D Shells (SHELL131)
• For Bonded and No Separation contact the pinball region determines when contact occurs and is
automatically defined and set to a relatively small value to accommodate small gaps in the model.
• Remember, thermal contact in Mechanical involves no status changes. The initial status of the contact
controls heat transfer throughout the solution.
Pinball Radius
• The amount of heat flow across a contact interface is defined by the contact heat flux q:
q TCC Ttarget Tcontact
– where Tcontact is the temperature of the contact surface and Ttarget is the temperature of the
corresponding target surface.
• By default, TCC is set to a relatively ‘high’ value based on the largest material
conductivity defined in the model KXX and the diagonal of the overall geometry
bounding box ASMDIAG:
TCC KXX 10,000 / ASMDIAG
• This essentially provides ‘perfect’ conductance between parts.
T2
T1
Note: An extensive discussion of mesh controls in Mechanical is in the Introductory course. Thermal
applications requiring specific meshing considerations will be addressed later as needed.
41 © 2016 ANSYS, Inc. July 14, 2016
01.13 Meshing
As with other analyses, poor quality meshes
can adversely effect thermal results. One
common problem seen with coarse meshing is
thermal over/under shoot.
T is below
minimum T
prescribed
when the
coarse mesh
is solved