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Compact thermally actuated latching MEMS beam should be compliant as these usually have to displace over the

switch with large contact force largest distance.


In this Letter, a novel latching switch is presented which is more
D. Dellaert and J. Doutreloigne compact than the classical latching switch and in which larger contact
forces appear. In the proposed latching mechanism (Fig. 1b), the first
A novel latching microelectromechanical system (MEMS) switch is actuator (F1) moves the lower contact over a small displacement Δ
reported, which uses a compact configuration of thermal actuators. In using a short lever. This small displacement allows the second contact
the proposed latching mechanism, the necessary displacement of one to move down till it aligns with the first one. After the release of the
of the contacts can be reduced, allowing the use of a linear thermal first and the second actuator, the contacts are pressed against each
actuator. This linear actuator together with a V-shaped actuator can other with a large force, keeping the switch in its latched state. The
be aligned next to each other, requiring less area than the classical contact force in this novel design is much larger compared to the clas-
latching switch design. Another advantage of the proposed design is sical design because little displacement amplification is needed to
the high contact force of 1.33 mN, ensuring a stable contact resistance. move the first contact over a distance Δ. Therefore, the lever at the
The latching switch was fabricated in the Metal multi-user MEMS pro-
right side can be relatively short and large forces are available at the
cesses (MUMPs) technology and its functionality was successfully
tested. In the latched state, a switch resistance of 0.6 Ω was measured. contact. As the first actuator needs to generate only small displacements
but at a large force, a linear thermal actuator type was chosen (see
Fig. 2). In this actuator, a U-shaped structure expands due to the electri-
Introduction: Microelectromechanical system (MEMS) switches provide cal current flowing through the structure. The proposed configuration
very low on-resistance and very high off-resistance, which make them trades two moderate displacements, for a larger and a smaller displace-
almost ideal switches. To obtain a reliable low-ohmic contact, enough ment, resulting in increased contact force and reduced chip area.
contact force must be applied, which puts a restriction on the type and
size of the actuator being used. Even if the contact force is determined
anchor A’ linear actuator nitride B’ C’
by the stiffness of a member in the device, high actuation forces are
needed to displace this stiff member. V2
Vact1
Most MEMS actuators operate by electrostatic [1], electrothermal gnd
[2–4], electromagnetic [5] or piezoelectric actuation. Electrostatic actu- Vact2

ators generally require large compliant structures and can only deliver a V1

limited amount of force. Electromagnetic actuators usually need a per-


manent magnet to operate or require non-standard materials. A V-shaped actuator trench B C contacts

Moreover, piezoelectric actuators need materials which are not always


available. Electrothermal actuators, on the other hand, are easy to fabri-
A A’ B B’ C C’
cate and provide large displacements and forces. A disadvantage is the
relatively high power usage to drive these actuators.
To reduce the power usage of thermally actuated switches, bistable Fig. 2 Schematic top view and cross-sections of proposed latching switch
[6, 7] or latching [2–4, 8, 9] mechanisms have been designed. In a
bistable mechanism, high forces are needed to snap to the second stable In the following sections, the design and fabrication in the Metal
state, and once in that state little force is available for pressing the contacts multi-user MEMS processes (MUMPs) technology [12] will be
against each other. Therefore, it is easier to obtain large contact forces described and experimental results showing the latching behaviour
with thermally actuated latching mechanisms. will be presented.
In a latching mechanism, two independent perpendicular displace-
ments are needed for latching or unlatching. In most cases, these dis- Design and fabrication of latching switch: In the proposed latching
placements are generated by two relatively long perpendicular switch, two perpendicular motions are generated while the two actuators
actuators. As the thermal expansion of the active member in a thermal are oriented in the same direction. This is possible as the first contact
actuator is very small, a displacement amplification mechanism is only needs a small displacement (∼10 μm). The linear thermal actuator
usually needed. This amplification can be obtained using a V-shaped used for this displacement consists out of two 1500 μm-long beams with
(chevron) actuator [4, 10] or a heatuator-like actuator [2, 3, 11], for a width of 15 μm, and is driven by applying current at pads Vact1 and
example. Both types of actuators are relatively long and using them in gnd. Using the lever at the right side, the displacement of this actuator
a latching switch generally results in a large L-shaped switch taking is amplified by a factor of 3.3 to obtain enough displacement for the
up a lot of chip area (Fig. 1a). lower contact.
As the second contact has to move over 57 μm, a lever was also used
here to amplify the displacement of the V-shaped actuator. This
V-shaped actuator has a length of 1380 μm, a width of 10 μm, an
apex of 20 μm and is driven by applying current at pads Vact2 and gnd.
F1
In the latched state, the simulated contact force amounts to 1.33 mN,
which is high compared to the size of the device. This large contact
force is the result of the small amplification of the bare thermal expansion.
F1
The horizontal signal beam connected to the V-shaped actuator is compli-
F2 F2 ant in the y-direction to obtain large displacements, but is relatively stiff in
the x-direction, which is ideal to obtain high contact forces. This is in con-
a b trast to the classical latching switch, in which the second actuator and the
corresponding beam should be compliant to obtain the large displacement,
Fig. 1 Principle of classical latching switch and proposed compact latching but should also be relatively stiff to obtain a high contact force.
switch The device was fabricated in the Metal MUMPs technology, in which
a Classical latching switch the structural layer consists of 20 μm-thick electroplated nickel. In this
b Proposed compact latching switch technology, it is possible to pattern the silicon nitride layer and to etch
a trench into the substrate (see Fig. 2). This results in released parts of
In the classical latching switch (Fig. 1a), the first actuator (indicated silicon nitride, anchored to the nickel structural layer. Using this tech-
by F1) needs to generate a displacement such that the corresponding nique, mechanical connections with electrical isolation can be designed,
contact tip moves over at least the contact overlap. Next, the second which can be used to isolate the signal path from the drive currents for the
actuator (F2) must move the second contact tip over at least the actuators. Additionally, the etched trench underneath the structure
contact spacing and twice the contact width. After the release of the improves the actuator performance by reducing the heat loss to the sub-
first and the second actuators, the contacts are pressed against each strate. The technology also allows plating the sidewalls of the structural
other with a force given by the stiffness of the second actuator and layer with gold, in order to lower the contact resistance of the switch.
the corresponding signal beam. In most cases, this contact force The complete switch measures 2020 × 330 μm, but multiple devices
cannot be made very large as the second actuator and the corresponding can be stacked next to each other with a pitch of 300 μm.

ELECTRONICS LETTERS 8th January 2015 Vol. 51 No. 1 pp. 80–81


In the design, care has been taken regarding the location of the contact Conclusion: A novel thermally actuated latching switch has been pro-
pads. The pad for the linear actuator (Vact1), the pad for the V-shaped posed and its functionality has been demonstrated. By adopting a differ-
actuator (Vact2) and the shared ground pad (gnd) are all located on the ent latching mechanism, the necessary displacement of one of the
left side and could be wire bonded if this was the edge of the die. actuators could be decreased, allowing the use of a linear thermal actu-
When placing different latching switches next to each other on both ator. The proposed latching mechanism combined with the linear actua-
sides of a common output rail, multiple input pads (V1) can be connected tor and the V-shaped actuator results in a compact switch, which takes
to that shared output rail (V2) running along all the switches. This facili- up less area than the classical latching switch, which has an L-shaped
tates the design of a latching switch matrix, needing only connections at configuration. The use of the linear actuator also results in a very high
the edge of the die. contact force of 1.33 mN. The switch was successfully fabricated in
the Metal MUMPs technology and was able to latch into the closed
Experimental results: The fabricated device (Fig. 3a) was connected state. Owing to the nickel structural layer and the sidewall gold
using a probe station and the actuators were driven by two Keithley plating of the contacts, the switch exhibited an on-resistance of 0.6 Ω.
2401 source measure units. Driving the linear actuator with a current
of 225 mA generates a displacement of 3.4 μm, which results in a Acknowledgment: D. Dellaert is supported by the Special Research
contact displacement of 11.2 μm. The V-shaped actuator was driven Fund (BOF) of Ghent University.
with a current of 215 mA, generating 19.6 μm of motion and a contact
displacement of 56.5 μm. By sequentially driving the first actuator, © The Institution of Engineering and Technology 2015
then the second, followed by the release of the first and then the 9 September 2014
second, the switch was able to latch into a stable closed state (Fig. 3b). doi: 10.1049/el.2014.3234
Fig. 4 shows the contacts in more detail during the latching sequence. One or more of the Figures in this Letter are available in colour online.
D. Dellaert and J. Doutreloigne (Centre for Microsystems Technology,
Ghent University/IMEC, Technologiepark 914a, 9052 Ghent, Belgium)
E-mail: dries.dellaert@elis.ugent.be
200 mm
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contact resistance is due to the high contact force. metalmumps, August 2014

ELECTRONICS LETTERS 8th January 2015 Vol. 51 No. 1 pp. 80–81

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