Sei sulla pagina 1di 14

AN1177

Op Amp Precision Design: DC Errors

Author: Kumen Blake DC SPECIFICATIONS


Microchip Technology Inc. There are a small number of DC specifications that
describe errors at the input of an op amp. This section
INTRODUCTION organizes these specifications into those related to the
input offset and the others related to input bias
Engineers that use op amps in their circuits; especially currents.
those new to analog or op amp circuit design. Also
intended for engineers that want to understand op amp Ideal Op Amp
DC specifications.
Figure 1 shows the ideal, DC model for op amps (the
Description external circuitry is not shown). All error sources are
ignored and the open-loop gain (AOL) is infinite. The
This application note covers the essential background output voltage is related to the input voltages as shown
information and design theory needed to design a in Equation 1.
precision DC circuit using op amps. Topics include:
• Op Amp DC Specifications VN
• Circuit Analysis
VOUT
• Circuit Optimization AOL
VI
• Advanced Topics
• References FIGURE 1: Ideal, DC Op Amp Model.
This application note is limited to voltage feedback
(traditional) op amps. Those interested in current feed- EQUATION 1:
back op amps will benefit from the information here; the
DC specifications and op amp DC model have many V OUT = A OL ( V N – V I )
similarities.
For those that are interested, a simple circuit for When negative feedback is applied, the ideal op amp’s
measuring input offset voltage has been included in infinite gain forces VN and VI to be exactly equal; this is
Appendix A: “Input Offset Measurement Circuit”. the virtual short that some authors talk about. [ 1, 2]
When positive feedback is applied (e.g., when used as
a comparator), VOUT swings as far negative or positive
as it can (to the rails), depending on the sign of the dif-
ference (VN – VI).

Op Amp Model with DC Errors


Figure 2 shows a physically based, DC model for op
amps. VPLUS and VMINUS are the external input volt-
ages, while VN and VI are the internal input voltages.
VOST represents the total input offset voltage error. The
non-inverting bias current (IBN) and inverting bias cur-
rent (IBI) represent the physical currents seen at each
of the two input pins. AOL is the finite DC open-loop
gain.

© 2008 Microchip Technology Inc. DS01177A-page 1


AN1177
It is important to understand the units for these
VDD specifications. An engineer not used to op amp data
sheets may be confused by the units shown. The
following list should clear up the confusion.
VOST
VN • VOS units are: mV or µV
VPLUS • AOL units do not usually report the relationship
VOUT
VMINUS AOL shown above:
VI
- µV/V for 1/AOL = ΔVOST/ΔVOUT
- dB for 20log(AOL)
IBN IBI • CMRR units are similar to the AOL units:
- µV/V for 1/CMRR = ΔVOST/ΔVCM
- dB for 20log(CMRR)
VSS
• PSRR units are similar to the AOL units:
FIGURE 2: Physically Biased, DC Op - µV/V for 1/PSRR = ΔVOST/Δ(VDD – VSS)
Amp Model. - dB for 20log(PSRR)
Input Offset Related Specifications ΔVOS/ΔTA units are: µV/°C or nV/°C
A positive VOST creates a positive shift in the output Note: Notice that the gains AOL, CMRR and
voltage (VOUT). The DC voltages are: PSRR, when reported in µV/V, are actually
their reciprocals. This form of the gains is
EQUATION 2: best for statistical analyses; the values
tend to have a Gaussian distribution.
V N = V PLUS + V OST
V I = V MINUS Sometimes PSRR is split in two pieces: PSRR+ that is
related to changes in VDD (ΔVDD) and PSRR– that is
V OUT = A OL ( V N – V I )
related to changes in VSS (ΔVSS).
= A OL ( ( V PLUS – V MINUS ) + V OST )
These quantities are lumped together in the following
equation, where the changes in bias voltages are from
The total input offset voltage (VOST) collects the those specified for VOS (all units are converted to either
following specifications into one, easy to use V or V/V):
parameter:
• Input Offset Voltage (VOS): EQUATION 3:
- Specified offset ΔV OUT ΔV CM ΔV
DD ΔV SS Δ V OS
- Describes VOST at a specific bias point V OST = V OS + -------------------- + ----------------- + ----------------- + --------------- + Δ T A ⋅ ----------------
A
OL
CMRR PSRR PSRR Δ TA
• DC Open-Loop Gain (AOL):
- AOL = ΔVOUT/ΔVOST Notice that all of the specifications will give a positive
• Common Mode Rejection Ratio (CMRR): change in VOST when the corresponding changes are
positive.
- CMRR = ΔVCM/ΔVOST
- VCM is the common mode input voltage
(average of VPLUS and VMINUS)
Input Current Related Specifications
• Power Supply Rejection Ratio (PSRR): The input bias currents (IBN and IBI) create voltage
- PSRR = Δ(VDD – VSS)/ΔVOST drops across external resistances, which cause VOUT
• Input Offset Drift with Temperature (ΔVOS/ΔTA): to shift. By convention, the currents going into the pins
VPLUS and VMINUS are positive.
- Describes how VOST changes with TA;
actually ΔVOST/ΔTA Traditionally, these physically based currents have
- TA is the ambient temperature been mathematically transformed into the equivalent
pair of currents IB (input bias current) and IOS (input off-
set current). These are the average of IBN and IBI, and
their difference, respectively:

EQUATION 4:
( I BN + I BI )
I B = --------------------------
2
I OS = I BN – I BI

DS01177A-page 2 © 2008 Microchip Technology Inc.


AN1177
This model makes sense for traditional op amps that CIRCUIT ANALYSIS
have IBN and IBI nearly equal. This means that, in this
case, IB is much larger than IOS. This happens because Using a few simple techniques, it is easy to analyze the
these currents are caused by similar physically DC error performance of op amp circuits. Several
phenomena (e.g., matched transistor pair with similar common circuits illustrate these techniques.
input bias currents). Figure 2 shows how these
specified currents are modeled in a circuit. Resistance Seen by the Non-inverting
Input
VDD
Figure 4 is a simple circuit with a source and several
impedances attached to the non-inverting input. The
VOST process of calculating the equivalent resistance seen
VN
VPLUS by the non-inverting input will be described using this
VOUT circuit as the starting point.
VMINUS AOL
VI
R1 L1
U1
IB + IOS/2 IB – IOS/2 VOUT
V1 C1 R2

VSS
FIGURE 3: Equivalent DC Model for FIGURE 4: Simple Circuit.
Traditional Op Amps. The first step is to replace all external components with
Some newer op amp architectures have IOS near to the their DC equivalent for a Thevenin analysis:
same magnitude as IB. This happens because the • Voltage sources become 0V (short circuit)
physical causes of IBN and IBI are not physically related • Current sources become 0A (open circuit)
(they are independent or uncorrelated). Most data
• Resistors are left as is
sheets still use IB and IOS as the specifications.
• Capacitors become ∞Ω (open circuit)
The input currents depend strongly on architecture,
• Inductors become 0Ω (short circuit)
type of input transistors, and temperature. As
discussed before, traditional parts have IB >> IOS. Figure 5 shows the resulting circuit when this is done to
Some of the newer architectures have IOS and IB of those components attached to the non-inverting input
about the same size. of the op amp in Figure 4. A test source (VX) has been
added to help in the Thevenin analysis.
Most op amps have ESD diodes at the inputs. PN
junction ESD diodes tend to have small reverse
leakage at room temperature. These leakage currents IX
R1
increase by a factor of 2 for each 10°C increase in
VX
temperature. Since the ESD diodes tend to match well,
the differences between leakage currents tend to be R2
small. These leakage currents are a part of the input
bias currents. When an input goes outside the supply
voltage(s) the ESD diodes are tied to, the forward FIGURE 5: Equivalent DC Circuit for
current can grow to be very large. Non-inverting Input.
CMOS inputs transistors have very small input bias The equivalent resistance seen by the non-inverting
currents. Most of these op amps use ESD diodes at the input, for this example, is:
input for protection; the reverse leakage currents of
these ESD diodes are the dominant input bias currents.
EQUATION 5:
Electrometer grade op amps minimize input currents.
They typically use FET transistors at the input that give V
R NEQ = -----X-
currents in the femto-ampere (1015A) range. IX
Bipolar inputs have larger input bias currents. They are = R 1 || R 2
the input differential pair’s base currents, which do not
change much with supply voltage. They will change
This resistance is used in the error calculations for the
significantly with temperature (e.g., a 4 × range
non-inverting bias current (IBN) source. Figure 6 shows
between -40°C and +125°C). These op amps usually
how this is accomplished; the error at the op amp input
use ESD diodes, which increase the bias currents;
is calculated at this point of the process.
especially at high temperatures.

© 2008 Microchip Technology Inc. DS01177A-page 3


AN1177

IBN U1 IX
VX
VIBN VOUT
RNEQ R3
R2
VIBN = -IBN RNEQ

FIGURE 6: Application to Non-inverting FIGURE 9: Equivalent DC Circuit for the


Bias Current Error Calculations. Inverting Input.
The error voltage (VIBN) shown in Figure 6 can be The equivalent resistance seen by the inverting input,
placed in an equivalent circuit diagram that does not for this example, is:
explicitly show the current IBN. This will make the
analysis easier, and more consistent, in later steps.
EQUATION 6:
This new equivalent circuit is shown in Figure 7 (IBN is
already included in VIBN). The VIBN source, when it is V
R IEQ = -----X-
positive, will produce a positive change in VOUT. IX
= R 2 || R 3
0 U1
This resistance is used in the error calculations for the
VOUT inverting bias current (IBI) source. Figure 10 shows
R1 L1 VIBN
how this is done for the error at the op amp output,
referred to the input.
V1 C1 R2
U1
VIBN = -IBN RNEQ
VOUT
FIGURE 7: Application to Non-inverting
Bias Current Error Calculations.
IBI
This equivalent circuit has the same connections as the
original one (Figure 4) to simplify the analysis; this will RIEQ
be useful later on as we combine all of the error terms.

VIBI VIBI = IBI RIEQ


Resistance Seen by the Inverting Input
Figure 8 is a non-inverting gain amplifier. The process FIGURE 10: Application to Inverting Bias
discussed in the last section will be used here to Current Error Calculations.
calculate the resistance seen by the inverting input.
Note: Since the op amp’s inverting input voltage
U1 must equal its non-inverting input voltage,
VOUT VIBI is shown as a change in VOUT referred
V1 to the input.
The error voltage (VIB) shown in Figure 10 is placed in
R3 an equivalent circuit diagram that does not explicitly
R2
show the current IBI; see Figure 11 (IBI is already
included in VIBI). The VIBI source, when it is positive,
will produce a positive change in VOUT.
FIGURE 8: Non-inverting Gain Circuit.
The same process of generating a Thevenin equivalent
applies here, with one short cut:
• The op amp’s output (VOUT) is treated as a
voltage source
- It becomes a short to ground
Figure 9 shows the resulting circuit at the inverting
input, with the test source (VX).

DS01177A-page 4 © 2008 Microchip Technology Inc.


AN1177
The following examples will show how this concept is
U1 applied in common op amp circuits.
VOUT
Note: The concept of noise gain is central to
understanding op amp behavior. For
0
instance, it simplifies op amp bandwidth,
VIBI noise and stability analyses.

R3 Output DC Error
R2
VIBI = IBI RIEQ Now we can quickly calculate the output error of the op
amp (VOE) using the information we have developed.
FIGURE 11: Application to Inverting Bias The principle of superposition gives:
Current Error Calculations.
EQUATION 9:
The resistors R2 and R3 are shown with the same
connections as the original circuit (Figure 8) to simplify V OE = G N V IE
the analysis; this will be explained in the next section. = G N ( V OST + V IBN + V IBI )

Combined Input Voltage Errors and Noise


Gain Examples
All of the DC errors at an op amp’s input (VOST, VIBN UNITY GAIN BUFFER
and VIBI) can be combined into one equivalent voltage
Figure 13 shows a unity gain buffer using an op amp.
source (VIE) at the non-inverting input pin (see
The op amp’s DC model is shown inside the dashed
Figure 12):
box.

EQUATION 7:
IBN VOST
V IE = V OST + V IBN + V IBI
U1
VIN
VOUT

VIE IBI
Feedback U1
and VOUT
VINk
n Signal Path
FIGURE 13: Unity Gain Buffer.
Circuitry
Because the resistances seen by the op amp inputs are
zero and GN = 1 V/V, the output voltage is simply:
FIGURE 12: Circuit Diagram Illustrating
the Concept of Noise Gain. EQUATION 10:
Noise gain (GN) is the DC gain from VIE (at the non- V OUT = V IN + V OST
inverting input pin) to VOUT when the op amp operates
in a closed-loop condition, when all other (external) Let’s use Microchip’s MCP601 op amp to illustrate this
energy sources are zero. GN is positive for stable feed- design. We’ll assume that VCM, VDD and VOUT vary
back loops. This gain can be obtained with any reason- across their complete ranges. We’ll use an arbitrary
able circuit analysis method. In equation form, we estimate of the worst-case value for ΔVOS/ΔTA (see the
have: data sheet for the official specifications). R1 and R3 will
be 0.1% resistors.
EQUATION 8:
Note: Since the MCP601’s common mode input
V OUT
G N = ------------- voltage range (VCMR), at +25°C, is limited
V IE to the range -0.3V and VDD – 1.2V, there
Where: will be large output errors when VCM
VINk = 0V approaches VDD.
k = 1 to n

© 2008 Microchip Technology Inc. DS01177A-page 5


AN1177
EXAMPLE 1: EXAMPLE 2:
Maximum VOE = VOST: Maximum VOST = ±3.8 mV
VOS < ±2.00 mV Selected Resistors (see Figure 14):
ΔVOUT/AOL ≤ (2.65V)/(100 kV/V) R3 = 20.0 kΩ
≤ 0.03 mV R2 = 2.21 kΩ
ΔVDD/PSRR ≤ (1.40V)/(10.0 kV/V) R1 = 2.00 kΩ
≤ 0.14 mV
GN = 10.05 V/V
ΔVCM/CMRR ≤ (4.3V – (-0.3V))/(5.62 kV/V)
≤ 0.82 mV = ±0.41 mV Maximum VIBN:
ΔTA(ΔVOS/ΔTA) ≤ (100°C) (±12 µV/°C) RNEQ = 2.00 kΩ
≤ ±1.20 mV VIBN ≥ -(5 nA + 0.5 nA)(2.00 kΩ) = -11 µV
VOST ≤ ±3.8 mV
Maximum VIBN:
RIEQ = 1.99 kΩ
NON-INVERTING AMPLIFIER
VIBN ≤ (5 nA – 0.5 nA)(1.99 kΩ) = 9 µV
Figure 14 shows a non-inverting gain amplifier with an
LC low-pass filter at the input. The op amp’s DC model Maximum VOE:
is shown inside the dashed box. VOE ≤ ±38 mV

R1 L1 C1 INVERTING AMPLIFIER
VIN
Figure 15 shows an inverting gain amplifier. The op
amp’s DC model is shown inside the dashed box.
IBN VOST
U1 IBN VOST
R1 VOUT U1
VOUT
IBI R1
IBI

R2 R3 VIN
R2 R3
FIGURE 14: Non-inverting Gain Amplifier.
The output voltage with error is: FIGURE 15: Inverting Gain Amplifier.
The output voltage with error is:
EQUATION 11:
EQUATION 12:
V OE = G N ( V OST + V IBN + V IBI )
V OE = G N ( V OST + V IBN + V IBI )
V OUT = G N V IN + V OE
V OUT = – ( G N – 1 ) V IN + V OE
Where:
Where:
GN = 1 + R3/R2
GN = 1 + R3/R2
RNEQ = R1
RNEQ = R1
RIEQ = R2||R3
RIEQ = R2||R3
VIBN = –IBNRNEQ
VIBN = –IBNRNEQ
VIBI = IBIRIEQ
VIBI = IBIRIEQ
The MCP601 VOST calculations in Example 1 can be
used for a gain of +10 V/V example: Notice that Example 2 is easily modified for an inverting
gain of -9 V/V; the resistors and VOE are the same (only
the signal gain is changed).

DS01177A-page 6 © 2008 Microchip Technology Inc.


AN1177
DIFFERENCE AMPLIFIER CIRCUIT OPTIMIZATION
Figure 16 shows a difference amplifier. The op amp’s There are a few, simple design techniques that can
DC model is shown inside the dashed box. Notice that quickly help a designer reach an acceptable accuracy.
this circuit can be analyzed quickly using superposition.
Gain Selection
R1 R2
Set any amplifier next to a signal source (e.g., temper-
VP VREF
ature sensor) to the highest reasonable gain. This will
cause any later gains to be small; typically they will be
IBN VOST
at a gain of 1 V/V.
U1
This design technique minimizes the impact most of the
VOUT
analog signal processing components have on the
overall error. It also allows the designer to reduce cost
IBI
by specifying more precise components only where
VM they are needed.
R3 R4
Minimizing Bias Current Errors
FIGURE 16: Difference Amplifier. For the examples shown in Figure 13 through
The output voltage with error is: Figure 16, it is instructive to convert the bias current
error voltages to the equivalent form using the specified
EQUATION 13: currents:
V OE = G N ( V IE + V IBN + V IBI )
EQUATION 14:
V OUT = ( G N – 1 ) ( V P – V M ) + V REF + V OE V IBN + V IBI = – I BN R NEQ + I BI R IEQ
Where: R IEQ + R NEQ
= I B ( R IEQ – R NEQ ) – I OS ⎛ ---------------------------------⎞
⎝ 2 ⎠
R2 = R1
R4 = R3 Minimizing the resistances helps minimize these errors
GN = 1 + R2/R1 = 1+R4/R3 for all op amps.
RNEQ = R1||R2 Many op amps’ bias current (IB) have a much larger
RIEQ = R3||R4 maximum specification than their offset current (IOS). In
VIBN = –IBNRNEQ that case, set RN_EQ = RI_EQ for the best performance.
When IOS is much smaller than IB, the resistor toler-
VIBI = IBIRIEQ ance (RTOL) needs to be good enough to prevent IB
from becoming a significant contributor to the error:
Using the MCP601 in a differential amplifier with gain
10 V/V gives (similar to Example 2): EQUATION 15:
I OS
EXAMPLE 3: RTOL << 4 --------
IB
Maximum VOST = ±3.8 mV
Selected Resistors (see Figure 16): Large input resistances can also cause a significant
shift in the input common mode voltage (VCM). In some
R1 = R3 = 2.00 kΩ
cases, this can significantly reduce the input common
R2 = R4 = 20.0 kΩ mode voltage range (VCMR):
GN = 11.00 V/V
(GN–1) = 10.00 V/V, the differential gain EQUATION 16:
R +R
Maximum Error Voltages: Δ V CM = – I B ⎛⎝ --------------------------------
IEQ NEQ⎞
-

2
VIBN ≥ -(5 nA + 0.5 nA)(1.82 kΩ) = -10 µV
VIBN ≤ (5 nA – 0.5 nA)(1.82 kΩ) = 8 µV V CMR_EQ = V CMR + Δ V CM
VOE ≤ ±42 mV

© 2008 Microchip Technology Inc. DS01177A-page 7


AN1177
Op Amp Selection ADVANCED TOPICS
The op amp needs to support the level of DC precision
required by the design. Table 1 shows four general op PCB Layout
amp architectures that give trade-offs between Printed Circuit Board (PCB) layout can have a signifi-
performance, cost and design complexity. cant effect on DC precision. Effects that need to be
considered include:
TABLE 1: OP AMP CAPABILITIES(1)
• Ground Loops – Poor grounding techniques and
Performance for Each Architecture inattention to current return paths can cause
Parameter General Auto- Auto-
significant shifts in DC voltages
Trimmed • Crosstalk – Other signals on a PCB can find
Purpose calibrated zeroed
sneak paths through the ground, power supplies
VOS 1 2 3 4
and traces
ΔVOS/ΔTA 1 1 3 4
VOS Aging 1 1 3 4
Input Common Mode Voltage Range
AOL 2 2 3 4
CMRR 1 1 1 4
A commonly overlooked error source is allowing the
signal to go outside the input voltage range. This most
PSRR 1 1 1 4
commonly occurs when using a non-rail-to-rail input op
IB 2 2 1 3 amp in unity gain; the input will cause an output error
IOS 2 2 2 2 when the VCMR is exceeded; this error grows quickly.
Note 1: The performance numbers signify: 1 = okay,
2 = good, 3 = better and 4 = best. Output Voltage Range
There will be a significant error, that grows very quick,
Process and Environmental Variations
when the output voltage range is exceeded. The VOL
Methods to evaluate a design’s variation in and VOH specifications usually shown in op amp data
performance are commonly understood in the industry. sheets describe non-linear behavior (i.e., when used as
Examples include worst case analysis (all tolerances at a comparator). When the output approaches either
minimum or maximum) and RSS (Root Sum of limit, VOST can increase significantly before reaching
Squares – a statistical approach). the hard limits. For the most stringent designs, keep
VOUT within the range that the data sheet shows for the
The following list gives important op amp behaviors to
AOL specification.
include when evaluating process and environmental
changes (almost all have a Gaussian distribution):
Noise
• VOS
- All VOS values for duals and quads are The data sheet’s input noise density specifications can
statistically independent (zero correlation) be used to calculate an op amp’s integrated output
• 1/AOL, 1/CMRR and 1/PSRR (in units of µV/V) noise (random variation in output voltage). This helps
determine the range of expected errors at any point in
• ΔVOS/ΔTA
time; it also can significantly reduce the output range
• Offset Aging when there is a very high gain.
- Increases with time
- Only specified on auto-zeroed op amp data Non-linear Distortion
sheets
Non-linear distortion converts a sinewave at one
• IB and IOS
frequency into a Fourier series of tones; the undesired
- CMOS inputs (with ESD diodes) have an tone frequencies are the harmonic distortion products.
exponential relationship with temperature One of these undesired tones is at zero frequency
(double every 10°C increase) (DC); non-linear distortion can produce DC shifts.
- Bipolar inputs typically double at -40°C and
For example, a simple sinewave that is processed by
are halved at +125°C
an amplifier with a quadratic (polynomial) response will
- Are typically uncorrelated produce:

DS01177A-page 8 © 2008 Microchip Technology Inc.


AN1177
EQUATION 17: Oscillations
V IN = V M sin ( 2πft ) We sometimes see an op amp circuit that is unstable
2
V OUT = A 0 + A 1 V IN + A 2 V IN enough to oscillate. When this does happen, many
2 puzzling symptoms appear. The supply current
= A 0 + A 1 V M sin ( 2 π ft ) + A 2 ( V M sin ( 2 π ft ) ) increases, the DC voltages in a circuit can shift,
= B 0 + B 1 sin ( 2 π ft ) + B 2 cos ( 4 π ft ) voltages can wander and intermittent glitches can be
Where: seen.
2 To find this problem, use a fast oscilloscope and
A2 VM
B 0 = A 0 + -------------
- change the time scale; it may be necessary to gain up
2 a signal to see oscillations much smaller than 0.1V.
B1 = A1 VM To verify the source of oscillation (unstable behavior),
2 modify component values (e.g., place a capacitor in
–A2 VM parallel) in different feedback loops. A change in
B 2 = -----------------
2 oscillation frequency usually indicates that the unstable
loop has been affected.
All other even order harmonic distortion terms cause a Note: Op amps, by themselves, cannot be either
shift in DC bias too. The quadratic term, however, stable or unstable. The feedback loop
usually dominates. design (interaction of op amp and passive
Using mildly non-linear components in the signal path components) sets the stability.
can cause this effect. The cure is to select higher
quality components.
SUMMARY
More commonly, higher frequency signals will be re-
routed through a non-linear element. A common This application note has covered the topic of precision
example is discussed in detail in the next section. design using (voltage feedback) op amps in some
detail. It shows how all of the DC errors can be referred
to the input; they appear as an additional change in
EMI
input offset voltage. It gives results for the most
Electro-magnetic Interference (EMI) at high frequen- common op amp circuits: unity gain buffer, non-invert-
cies (i.e., near and above the op amp’s Gain Bandwidth ing gain amplifier, inverting gain amplifier and
Product) easily couples to the inputs of any component difference amplifier. Tips on optimizing performance
on a PCB; op amps are no exception to this rule. and coverage of advanced topics help the designer
Because the op amp has little control over this energy, with more difficult designs. The references give
and the ESD diodes are very fast, the latter will rectify additional information on related topics.
high frequency EMI.
The rectification of the EMI energy produces both high REFERENCES
frequency energy and a significant DC shift at the op
amp inputs. This appears as an unexpectedly large Textbook on Circuit Level Design
VOST on many measurement boxes; they average out
the high frequency component. To see if this is an issue [1] Paul R. Gray and Robert G. Meyer, “Analysis
with your design, use a fast oscilloscope at short time and Design of Analog Integrated Circuits,” 2nd
scales. Ed., John Wiley & Sons, 1984.
The most effective cures for EMI problems are handled
at the PCB design level. The coupling paths include Textbook on Transistor Level Design
power supply lines, magnetic loops and capacitive [2] Paul R. Gray and Robert G. Meyer, “Analysis
metal areas. and Design of Analog Integrated Circuits, 2nd
It is possible to improve performance with high Ed., John Wiley & Sons, 1984.
frequency filters at the op amp inputs. Usually, how-
ever, the improvements are small. Also, the filters may
affect the feedback network’s stability, causing
unexpected behaviors.

© 2008 Microchip Technology Inc. DS01177A-page 9


AN1177
APPENDIX A: INPUT OFFSET A.1.1 CIRCUIT DESIGN
MEASUREMENT The goal is to make GN reasonably large and the error
CIRCUIT terms (with VOST, IBN and IBI) as small as possible. The
following design choices will give good results (since
This appendix shows a simple test circuit that can be GNVOST is chosen to be so large):
used on the bench to evaluate most op amps’ input
offset voltage and bias current performance. A simpler EQUATION A-2:
circuit is discussed first, which only measures VOST. It
( 25mV )
is then expanded to include IBN and IBI measurements. G N ≈ -------------------------------
The limitations of these circuit are also discussed. ( max V OST )
R 3 ≈ typical load resistance
A.1 Basic Input Offset Test Circuit R3
R 2 = --------------- -
GN – 2
The circuit shown in Figure A-1 supports quick op amp R
VOST measurements (VOS, AOL, CMRR, PSRR and R 1 = ------3-
ΔVOS/ΔTA). VP sets the op amp’s VCM. VM sets the GN
nominal VOUT value. R1 isolates U1’s input from VP and
is used to cancel IB induced errors. The two resistors The 25 mV used to estimate GN gives VOUT a reason-
R3 set an inverting gain of -1 V/V for VM. R2 increases able output range. For instance, the MCP601’s AOL
the noise gain, but does not affect the gains seen by VP specification requires VOUT to be 0.1V from the rails;
and VM. VDD and VSS are the supply voltages, which the GNVOST term will make this 0.05V to 0.15V from the
can be varied for PSRR measurements. rails.
Solving for VOST, and assuming that the bias current
VDD errors are negligible, gives:
R1
VP U1
VOUT EQUATION A-3:
R2 V OUT#1 – ( 2V P – V M )
VSS V OST ≈ ----------------------------------------------------
GN
VM
R3 R3 Let’s use Microchip’s MCP601 op amp to illustrate this
design (similar to Example 2 on page 6). R3 is reduced
FIGURE A-1: Offset Test Circuit.
to minimize the impact of IBN and IBI.
The common mode input voltage and output voltage
are: EXAMPLE A-1:
VOST ≤ ±3.8 mV
EQUATION A-1:
Design Selections:
V OST
V CM = V P + ⎛ ---------------⎞ – I BN R 1 ≈
⎝ 2 ⎠ GN (25 mV)/(3.8 mV)
V OST = 6.6 V/V → 5 V/V
= V P + ⎛ ---------------⎞ – ( I B + I OS )R 1
⎝ 2 ⎠ R3 = 100 kΩ → 20.0 kΩ
V OUT = 2V P – V M + V OST G N – I BN G N R 1 + I BI R 3
R2 = 6.65 kΩ
= 2V P – V M + V OST G N + I B ( R 3 – G N R 1 )
R1 = 4.02 kΩ
R3 + GN R1
– I OS ⎛⎝ ---------------------------⎞⎠ Impact on VCM and VOUT accuracy:
2
Where: VCM = VP ± 1.9 mV
GN = 2 + R3/R2 VOUT = 2VP – VM + VOSTGN ± 0.01 mV

The error in VCM, divided by CMRR (5.62 kV/V),


Note: VCM contains a VOST/2 term because it is produces a ±0.3 µV error in VOUT. It also reduces the
the average of the two input voltages (one input common mode voltage range by 2.0 mV, which is
with VOST and the other without). Usually, negligible for most purposes. Thus, the estimated VOUT
this makes only a small difference. has errors, dominated by the bias currents, of about
±0.04%.

DS01177A-page 10 © 2008 Microchip Technology Inc.


AN1177
A.1.2 MEASUREMENT STRATEGY The common mode input voltage and output voltage
are:
Now that we have a circuit, it pays to have a strategy to
measure those points needed. Let’s assume the goal is
to double check the MCP601’s data sheet specifica- EQUATION A-4:
tions at +25°C. V OST
V CM = V P + ⎛ ------------⎞ – I BN R NEQ
⎝ 2 ⎠
TABLE A-1: MEASUREMENT POINTS V OST
= V P + ⎛⎝ ------------⎞⎠ – ( I B + I OS )R NEQ
Nominal Bias 2
Target Parameters V OUT = 2V P – V M + G N ( V OST – I BN R NEQ + I BI R IEQ )
Meas. Point
No. V = 2V P – V M + G N V OST + I B G N ( R IEQ – R NEQ )
DD VCM VOUT V R IEQ + R NEQ
OS AOL CMRR PSRR
(V) (V) (V) + I OS G N ⎛ --------------------------------⎞
⎝ 2 ⎠
1 2.7 1.35 1.35 X — — X Where:
2 1.35 0.1 — X — — GN = 2 + R3/R2
3 1.35 2.6 — X — — RNEQ = R1, SW4 = short
4 5.0 -0.3 2.5 — — X — = R1+R4, SW4 = open
5 3.8 2.5 — — X — RIEQ = R3/GN, SW5 = short
6 5.5 2.75 2.75 X — — X = (R3/GN)+R5, SW5 = open

7 2.75 0.1 — X — —
A.2.1 CIRCUIT DESIGN
8 2.75 5.4 — X — —
We now add to the design equations estimates of R4,
See Section “Input Offset Related Specifications” R5, C4 and C5. The capacitors are much larger than
on page 2 for the equations relating these measure- most op amps’ common mode input capacitance (for
ments and the specifications. stability, noise and speed).

A.2 Complete Input Offset Test Circuit EQUATION A-5:


The circuit in Figure A-2 functions like Figure A-1, plus Select GN, R3, R2 and R1 as before
it has R4 and R5 to measure IBN and IBI. SW4 and SW5
R4 = (25 mV) / (GN max |IBN|)
short R4 and R5 for all VOST related measurements. C4
and C5 help maintain stability and reduce noise. R5 = (25 mV) / (GN max |IBI|)
C4 = C5 = 100 pF
SW4
The practical way to use this circuit is as follows.
Measure all of the VOST related parameters with SW4
C4
R1 and SW5 shorted; the circuit behaves exactly as
VP VDD described in A.1 “Basic Input Offset Test Circuit”.
R4
U1 To measure IBN and IBI, take three measurements at a
R2 VOUT single bias point with different switch selections:
R5
VSS TABLE A-2: SWITCH SELECTIONS
C5 Switches
Meas.
Emphasize
R3 R3 No. SW1 SW2
SW5
VM 1 short short VOST
FIGURE A-2: Offset Test Circuit with Bias 2 open short VOST and IBNR4
Current Capabilities. 3 short open VOST and IBIR5
Note 1: The change in VCM caused by R4, in Meas. No.
2, can be substantial.

© 2008 Microchip Technology Inc. DS01177A-page 11


AN1177
Subtracting these measurements gives the following A.2.2 MEASUREMENT STRATEGY
simple results:
Let’s double check the MCP601’s data sheet bias
current specifications, for one temperature, at
EQUATION A-6: VDD = 2.7V and 5.5V.
– ( V OUT#2 – V OUT#1 )
I BN = ------------------------------------------------- -
R4 TABLE A-3: BIAS CURRENT
V OUT#3 – V OUT#1 MEASUREMENT POINTS
I BI = ------------------------------------------ -
R5 Nominal Bias Switch
V OUT#1 – ( 2V P – V M ) R3 Meas. Point Settings Target
V OST = --------------------------------------------------- - + I BN R 1 – I BI ⋅ ------
GN G No. V Parameter
DD VCM VOUT SW
V OUT#1 – ( 2V P – V M ) (V) (V) (V) 4 SW5
≈ ---------------------------------------------------
-
GN
1 2.7 1.35 1.35 short short VOST
( I BN + I BI )
I B = -------------------------- - 2 open short IBN
2
I OS = I BN – I BI 3 short open IBI
4 5.5 2.75 2.75 short short VOST
Let’s continue Example A-1, which uses the MCP601, 5 open short IBN
for measurements up to +85°C: 6 short open IBI
EXAMPLE A-2: See Equation A-6 for the parameter extraction
VOST ≤ ±3.8 mV equations.
TA ≤ +85°C
A.3 Limitations of These Test Circuits
Additional Design Selections:
Some of the more important limitations are:
R4 = R5 = (25 mV) / ((5 V/V) (60 pA))
• VCM is not accurately controlled (especially for
= 83.3 MΩ → 20.0 MΩ CMRR)
GNR4 = GNR5 = 100 MΩ • The common mode input range may be exceeded
C4 = C5 = 100 pF when IBNR4 is very large
Example Output Values: • The VOST resolution is not better than10 µV to
20 µV
IBNGNR4 = 0.10 mV, IBN = 1 pA • Temperature gradients on the PCB cause thermo-
= 6.0 mV, IBN = 60 pA junction voltages
• VOUT needs to be measured accurately in order to
The 20 MΩ is comprised of two, easy to obtain, 10 MΩ maintain reasonable accuracy on the extracted
resistors in series. Using a 18-bit ADC to measure parameters. For instance, with VDD = 5.5V and a
VOUT should be adequate. Let’s continue Example A-2 maximum VOSTGN of 0.1V, an ADC at VOUT
at +125°C by using a different value for R4 and R5: would need at least 16 bits in order to resolve
VOST to 0.1%
EXAMPLE A-3: • Measurements can be slower than with other
VOST < ±3.8 mV solutions
TA = +125°C
Additional Design Selections:
R4 = R5 = (25 mV) / ((5 V/V) (5 nA))
= 1 MΩ
GNR4 = GNR5 = 5 MΩ
C4 = C5 = 100 pF
Example Output Values:
IBNGNR4 = 0.25 mV, IBN = 50 pA
= 25 mV, IBN = 5 nA

This means that a 16-bit ADC is sufficient for this


temperature.

DS01177A-page 12 © 2008 Microchip Technology Inc.


Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks


applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Accuron,
and may be superseded by updates. It is your responsibility to
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
ensure that your application meets with your specifications.
PICSTART, PRO MATE, rfPIC and SmartShunt are registered
MICROCHIP MAKES NO REPRESENTATIONS OR trademarks of Microchip Technology Incorporated in the
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
U.S.A. and other countries.
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
INCLUDING BUT NOT LIMITED TO ITS CONDITION, SEEVAL, SmartSensor and The Embedded Control Solutions
QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology
FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A.
arising from this information and its use. Use of Microchip Analog-for-the-Digital Age, Application Maestro, CodeGuard,
devices in life support and/or safety applications is entirely at dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
the buyer’s risk, and the buyer agrees to defend, indemnify and ECONOMONITOR, FanSense, In-Circuit Serial
hold harmless Microchip from any and all damages, claims, Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
suits, or expenses resulting from such use. No licenses are Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
conveyed, implicitly or otherwise, under any Microchip PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
intellectual property rights. PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide


headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

© 2008 Microchip Technology Inc. DS01177A-page 13


WORLDWIDE SALES AND SERVICE
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office India - Bangalore Austria - Wels
2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 91-80-4182-8400 Tel: 43-7242-2244-39
Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 91-80-4182-8422 Fax: 43-7242-2244-393
Tel: 480-792-7200 Harbour City, Kowloon India - New Delhi Denmark - Copenhagen
Fax: 480-792-7277 Hong Kong Tel: 45-4450-2828
Tel: 91-11-4160-8631
Technical Support: Tel: 852-2401-1200 Fax: 45-4485-2829
Fax: 91-11-4160-8632
http://support.microchip.com
Fax: 852-2401-3431 France - Paris
Web Address: India - Pune
Australia - Sydney Tel: 91-20-2566-1512 Tel: 33-1-69-53-63-20
www.microchip.com
Tel: 61-2-9868-6733 Fax: 91-20-2566-1513 Fax: 33-1-69-30-90-79
Atlanta Fax: 61-2-9868-6755
Duluth, GA Japan - Yokohama Germany - Munich
China - Beijing Tel: 81-45-471- 6166 Tel: 49-89-627-144-0
Tel: 678-957-9614
Tel: 86-10-8528-2100 Fax: 49-89-627-144-44
Fax: 678-957-1455 Fax: 81-45-471-6122
Fax: 86-10-8528-2104 Italy - Milan
Boston Korea - Daegu
China - Chengdu Tel: 39-0331-742611
Westborough, MA Tel: 82-53-744-4301
Tel: 86-28-8665-5511 Fax: 82-53-744-4302 Fax: 39-0331-466781
Tel: 774-760-0087
Fax: 86-28-8665-7889 Netherlands - Drunen
Fax: 774-760-0088 Korea - Seoul
China - Hong Kong SAR Tel: 82-2-554-7200 Tel: 31-416-690399
Chicago
Itasca, IL Tel: 852-2401-1200 Fax: 82-2-558-5932 or Fax: 31-416-690340
Tel: 630-285-0071 Fax: 852-2401-3431 82-2-558-5934 Spain - Madrid
Fax: 630-285-0075 China - Nanjing Tel: 34-91-708-08-90
Malaysia - Kuala Lumpur
Tel: 86-25-8473-2460 Fax: 34-91-708-08-91
Dallas Tel: 60-3-6201-9857
Addison, TX Fax: 86-25-8473-2470 Fax: 60-3-6201-9859 UK - Wokingham
Tel: 972-818-7423 China - Qingdao Tel: 44-118-921-5869
Malaysia - Penang
Fax: 972-818-2924 Tel: 86-532-8502-7355 Fax: 44-118-921-5820
Tel: 60-4-227-8870
Detroit Fax: 86-532-8502-7205 Fax: 60-4-227-4068
Farmington Hills, MI China - Shanghai Philippines - Manila
Tel: 248-538-2250 Tel: 86-21-5407-5533 Tel: 63-2-634-9065
Fax: 248-538-2260 Fax: 86-21-5407-5066 Fax: 63-2-634-9069
Kokomo China - Shenyang Singapore
Kokomo, IN Tel: 86-24-2334-2829 Tel: 65-6334-8870
Tel: 765-864-8360 Fax: 86-24-2334-2393 Fax: 65-6334-8850
Fax: 765-864-8387
China - Shenzhen Taiwan - Hsin Chu
Los Angeles Tel: 86-755-8203-2660 Tel: 886-3-572-9526
Mission Viejo, CA Fax: 86-755-8203-1760 Fax: 886-3-572-6459
Tel: 949-462-9523
China - Wuhan Taiwan - Kaohsiung
Fax: 949-462-9608
Tel: 86-27-5980-5300 Tel: 886-7-536-4818
Santa Clara Fax: 86-27-5980-5118 Fax: 886-7-536-4803
Santa Clara, CA
China - Xiamen Taiwan - Taipei
Tel: 408-961-6444
Tel: 86-592-2388138 Tel: 886-2-2500-6610
Fax: 408-961-6445
Fax: 86-592-2388130 Fax: 886-2-2508-0102
Toronto
China - Xian Thailand - Bangkok
Mississauga, Ontario,
Tel: 86-29-8833-7252 Tel: 66-2-694-1351
Canada
Tel: 905-673-0699 Fax: 86-29-8833-7256 Fax: 66-2-694-1350
Fax: 905-673-6509 China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049

01/02/08

DS01177A-page 14 © 2008 Microchip Technology Inc.

Potrebbero piacerti anche