GENERAL PURPOSE SILICON RECTIFIER

VOLTAGE RANGE 50 to 1000 Volts

6A05 THRU 6A10 CURRENT 6.0 Ampere

FEATURES

Low cost construction.

Low forward voltage drop

Low reverse leakage

High forward surge current capability.

High temperature soldering guaranteed:
260/10 seconds, 0.375" (9.5mm)lead length
at 5 lbs (2.3kg) tension.

MECHANICAL DATA

Case: transfer molded plastic

Epoxy: UL94V - 0 rate flame retardant.

Polarity: Color band denotes cathode end.

Lead: Plated axial lead, solderable per MIL - STD - 202E
method 208C

Mounting position: Any

Weight: 0.07 ounce,2.0grams

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 ambient temperature unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load derate current by 20%

SYMBOLS 6A05 6A1 6A2 6A4 6A6 6A8 6A10 UNIT

Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600   Volts
Maximum RMS Voltage VRMS 35 70 140 280 420   Volts
Maximum DC Blocking Voltage VDC 50 100 200 400 600   Volts
Maximum Average Forward Rectified Current,
I(AV) 
 Amps
0.375" (9.5mm) lead length at TA = 60
Peak Forward Surge Current
8.3ms single half sine - wave superimposed on IFSM  Amps
rated load (JEDEC method )
Maximum Instantaneous Forward Voltage at 6.0A VF 
 Volts
Maximum DC Reverse Current at rated TA = 25  A
IR
DC blocking voltage TA  
 mA
Maximum Full Load Reverse Current, full cycle
IR(AV) 1.0 mA
average 0.375" (9.5mm) lead length at TL = 105
Typical Junction Capacitance (Note 1) CJ 150 pF
Typical Thermal Resistance (Note2) RθJA 10 /W
Operating and Storage Temperature Range TJ (-65 to +175) 
Storage Temperature Range TSTG (-65 to +175) 

NOTES:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts.
2. Thermal Resistance from Junction to Ambient at 0.375" (9.5mm) lead length, P.C. board mounted with 1.1" x 1.1"
(30 X 30mm) copper heatsink.

MIC INVESTMENTS (CHINA) COMPANY LIMITED

 RATINGS AND CHARACTERISTIC CURVES 6A05 THRU 6A10

FIG.1-TYPICAL FORWARD CURRENT FIG.2-MAXIMUM NON-REPETITIVE PEAK

DERATING CURVE FORWARD SURGE CURRENT
6.0 400
AVERAGE FORWARD CURRENT,

60 Hz Resistive or
Inductive Loads
Ground Plane

PEAK FORWARD SURGE

5.0 1" X 1" Copper
Surface Area 8.3ms Single Half Sine-Wave
P.C. Board 300
4.0 (JEDEC Method) Tj
=T j max

CURRENT, (A)
Recommended P.C. Board
Mounting.
(A)

3.0
200
2.0 P.C. Board

Standard P.C. Board

1.0 Mounting.
100

0 1 Cycle
0 25 50 60 75 100 125 150 175
1 2 4 6 8 10 20 40 60 80 100

AMBIENT TEMPERATURE, ( ° C)
NUMBER OF CYCLES AT 60 Hz

FIG.3-TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS FIG.4-TYPICAL REVERSE
1000 CHARACTERISTICS
20
INSTANTANEOUS FORWARD CURRENT,

10
INSTANTANEOUS REVERSE CURRENT,

100

Tj =100 ° C

1.0
(A)

10
(uA)

T =25 ° C
j

Pulse Width=300us
1% Duty Cycle 0.1
1.0

Tj =25 ° C

0.1 0.01
0 20 40 60 80 100 120 140
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

INSTANTANEOUS FORWARD VOLTAGE,(V)

FIG.5-TYPICAL JUNCTION CAPACITANCE FIG.6-TYPICAL THERMAL RESISTANCE

VS LEAD LENGTH
1000
70

60
JUNCTION CAPACITANCE,(pF)

THERMAL RESISTANCE,

50
R JL ( ° C/W)

40
100 Single Lead to heat Sink,
Insignificant Heat Flow
30 Through Other Lead

T =25 ° C
j

f=1MHz
V sig =50mV p-p

10
0.1 1.0 10

REVRESE VOLTAGE,(V) EQUAL LEAD LENGTH TO HEAT SINK (IN.)