7th Gen Core Family Datasheet Addendum

7th Generation Intel® Core™ Processor,
Intel® Celeron® Processor, and Intel®

Xeon® Processor E3 v6 Family Desktop,
Workstation, and Mobile Platforms
Datasheet Addendum
April 2017
Document Number: 335437-002

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delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost.
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Copyright © 2017, Intel Corporation. All rights reserved.
7th Generation Intel® Core™ Processor, Intel® Celeron® Processor, and Intel® Xeon® Processor E3 v6 Family
Desktop, Workstation, and Mobile Platforms
Datasheet Addendum April 2017
2 Document Number: 335437-002
Contents
1.0 Introduction ............................................................................................................................................ 6
1.1 Terminology ...................................................................................................................................................... 7
1.2 Reference Documents ................................................................................................................................ 8
1.3 Supported Package and Die Plan........................................................................................................ 8
2.0 Interface ................................................................................................................................................ 10
2.1 System Memory Interface and Supported Technology .................................................... 10
3.0 Thermal Management .................................................................................................................... 11
3.1 Processor Thermal Management...................................................................................................... 11
3.2 S/H-Processor Line TDP Specifications........................................................................................ 11
3.3 H-Processor Line TDP Specifications ............................................................................................. 12
4.0 Electrical Specifications ................................................................................................................ 13
4.1 Processor Intel® Architecture Core (VCC) and VCCGT/VCCGTX Current
Specifications ................................................................................................................................................ 13
4.2 H-Processor Power Rails ........................................................................................................................ 13
4.3 Thermal Design Current (TDC) Specification .......................................................................... 14
4.4 H-Line Platform Power Map and Rail Requirements ........................................................... 16
4.4.1 IMVP8 Voltage and Current Requirements - H-Line ........................................ 16
4.4.2 GT2/3/4 Graphics Frequency .......................................................................................... 17
4.4.3 H-Processor Line Thermal and Power Specifications ...................................... 17
4.4.4 Processor Power Rails DC Specifications ................................................................. 18
4.4.5 VccSA DC Specifications........................................................................................................ 19
4.4.6 VccPLL DC Specifications ....................................................................................................... 19
4.4.7 Package Mechanical Specifications .............................................................................. 19
4.5 USB On-The-Go Specification ............................................................................................................ 20
5.0 Processor Listings ............................................................................................................................ 21
April 2017 Datasheet Addendum
Document Number: 335437-002 3
Figures
Figure 1. H-Processor and S-Processor Line Platform ............................................................................... 6
Figure 2. Processor Platform Power Map - H–Line .................................................................................... 16
Tables
Table 1. Terminology ...................................................................................................................................................... 7
Table 2. Reference Documents ................................................................................................................................ 8
Table 3. Processor Lines Package and Die Plan ............................................................................................ 8
Table 4. TDP Specifications...................................................................................................................................... 11
Table 5. Package Intel® Turbo Boost Technology Specifications ................................................. 12
Table 6. Processor Graphics (VccGT and VccGT-X) Supply Current Specifications .......... 13
Table 7. Thermal Design Current (TDC) Specification (Page 1 of 2).......................................... 14
Table 8. General Processor VR Parameters for the H-line ................................................................. 16
Table 9. GT2/3/4 Graphics Frequency (H -Processor Line) ............................................................... 17
Table 10. TDP Specifications (H-Processor Line)......................................................................................... 17
Table 11. Package Intel® Turbo Boost Technology Specifications (H-Processor Line) .... 17
Table 12. Processor Intel® Architecture Core (Vcc) Active and Idle Mode DC Voltage
and Current Specifications ................................................................................................................... 18
Table 13. Processor Graphics (VccGT and VccGT-X) Supply DC Voltage and Current
Specifications ................................................................................................................................................ 18
Table 14. System Agent (VccSA) Supply DC Voltage and Current Specifications................ 19
Table 15. Processor PLL_OC (VccPLL_OC) Supply DC Voltage and Current
Specifications ................................................................................................................................................ 19
Table 16. Package Mechanical Attributes.......................................................................................................... 19
Table 17. U-Processor Family Listing/Package BGA1356 ...................................................................... 21
Table 18. S-Processor Family Listing/Package LGA1151 ....................................................................... 22
Table 19. H-Processor Family Listing/Package BGA1440 ...................................................................... 23
Revision History
Date Revision Description
April 2017 002 • Updated Table 18 and Table 19.

- Added new SKUs
• Updated Chapter 2.0
January 2017 001 Initial release.
Introduction
1.0 Introduction
This datasheet is a supplement to the 7th Generation Intel® Processor Families for H
Platforms – Datasheet and 7th Generation Intel® Processor Families for S Platforms –
Datasheet. It contains more electrical specifications, signal information, interface
functional descriptions, more feature information, and configuration registers pertinent
to the implementation and operation of the H-processor line and S-processor line.
The H-processor line and S-processor line are offered in a 2-Chip Platform and
connected to a discrete Platform Controller Hub (PCH) chip on the motherboard.
Figure 1. H-Processor and S-Processor Line Platform
DDR4 System SATA* Gen 3 /

Memory SATA Gen 2
®
Intel Processor
DDR3L System
Memory PCIe*
Direct Media Interface

BIOS/FW Flash
(DMI) 3.0
SPI
TPM
PCIe
® ®
Intel 100 Series and Intel
C230 Series Chipset Family USB 2.0 Port
SATA Gen 3 / Platform Controller Hub (PCH)
SATA Gen 2
USB 3.0 Port

SMBus
eSPI
LPC
SATA
The processors are manufactured based on Intel's 14 nm process technology that

increases CPU performance and improves graphics microarchitecture.
Two DIMMs per DDR4 and DDR3L channel with ECC/ Non-ECC are supported on this
platform.
Introduction
1.1 Terminology
Table 1. Terminology
Term Description
DIMM Dual In-line Memory Module
DMI Direct Media Interface
DDR3L DDR3 Low Voltage
DDR4 Fourth-Generation Double Data Rate SDRAM Memory Technology
ECC Error Correction Code - used to fix DDR transaction errors
IBP Intel Business Portal
OPC On Package Cache
PCH Platform Controller Hub. The chipset with centralized platform

capabilities including the main I/O interfaces along with display
connectivity, audio features, power management, manageability,
security, and storage features. The PCH may also be referred to as
“chipset”.
Processor Core The term “processor core” refers to the Si die itself, which can contain
multiple execution cores. Each execution core has an instruction
cache, data cache, and 256-KB L2 cache. All execution cores share the
LLC.
Psys Processing Sub-system
RVP Reference Validation Platform provided to customers as the Customer

Reference Board. RVP7/8/11 is for U/S/H-line platforms, respectively.
SDP Scenario Design Power
TBD To Be Determined
TDP Thermal Design Power
Tjmax Maximum Junction Temperature Rating (°C)
TDC Thermal Design Current
TDP Thermal Design Power
TPM Trusted Platform Module
VCC Common Collector Voltage (V+)
Introduction
1.2 Reference Documents

Table 2. Reference Documents
Document Document
No./Location
Kaby Lake Platforms Design-In Presentation Contact your Intel representative

for additional information.
7th Generation Intel® Processor Families for H Platforms – Datasheet -

335190
Volume 1 of 2
7th Generation Intel® Processor Families for H Platforms – Datasheet -

335191
Volume 1 of 2
7th Generation Intel® Processor Families for S Platforms – Datasheet -

335195
Volume 1 of 2
7th Generation Intel® Processor Families for S Platforms – Datasheet -

335196
Volume 2 of 2
Intel® 100 Series Chipset Family Platform Controller Hub (PCH)

332690
Datasheet - Vol 1 of 2
Intel® 100 Series Chipset Family Platform Controller Hub (PCH)

332691
Datasheet - Vol 2 of 2
Skylake / Kabylake Platform H- and S-Processor Lines Power Contact your Intel representative
Architecture Guide for additional information.
Kaby Lake H Platform Design Guide Contact your Intel representative

Kaby Lake S Platform Design Guide Contact your Intel representative

Kaby Lake Platform PCH I/O Buffer Information Specification IBIS Contact your Intel representative
Models for additional information.
Skylake and Kaby Lake Processor BSDL Contact your Intel representative
1.3 Supported Package and Die Plan

Table 3. Processor Lines Package and Die Plan
Processor Line Die Type Package Type (mm) TDP (W) PCH
BGA1440 2016
H 4+2 25 W, 35 W, 45 W
(42x28x1.46) Skylake PCH
BGA1440 2016
H 2+2 25 W, 35 W
(42x28x1.46) Skylake PCH
LGA 1151 2015
S 4+2 80 W, 65 W, 35 W
(37.5x37.5x4.4) Skylake PCH
Introduction
Processor Line Die Type Package Type (mm) TDP (W) PCH
LGA 1151 2015

S 2+2 35 W, 65 W
(37.5x37.5x4.4) Skylake PCH
Interface
2.0 Interface
2.1 System Memory Interface and Supported Technology

Refer to Section 2 in 7th Generation Intel® Processor Families for H Platforms –
Datasheet Volume 1 of 2 (Doc No. 335190) and 7th Generation Intel® Processor Families
for S Platforms – Datasheet Volume 1 of 2 (Doc No. 335195) for further information.
Thermal Management
3.0 Thermal Management
3.1 Processor Thermal Management

The thermal solution provides component-level and system-level thermal
management. To allow optimal operation and long-term reliability of Intel® processor-
based systems, the system/processor thermal solution should be designed so that the
processor:
• Remains below the maximum junction temperature (Tjmax) specification at the
maximum Thermal Design Power (TDP).
• Conforms to system constraints, such as system acoustics, system skin temperatures,
and exhaust-temperature requirements.
Caution: Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
Note: This section supplements the information in 7th Generation Intel® Processor Families
for H Platforms – Datasheet Volume 1 of 2 (Doc No. 335190) and 7th Generation Intel®
Processor Families for S Platforms – Datasheet Volume 1 of 2 (Doc No. 335195). For
further details, refer to the previously mentioned document.
3.2 S/H-Processor Line TDP Specifications

Table 4. TDP Specifications
Processor
Intel®
Segment and Architecture Processor Intel® Graphics Core
Package Cores, Configuration Architecture Core Frequency TDP SDP
Graphics Frequency (W) (W)
Configuration,
and TDP
H-Processor Quad Core

Base 1.9 GHz to 2.0 GHz 350 MHz to 1 GHz 25 NA
Line BGA GT2 25W
H-Processor Dual Core
Base 1.6 GHz to 1.9 GHz 350 MHz to 0.95 GHz 25 NA
Line BGA GT2 25W
Base 2.4 GHz to 2.7 GHz 350 MHz to 0.95 GHz 35 NA
Line BGA GT2 35W
Thermal Management
3.3 H-Processor Line TDP Specifications

Table 5. Package Intel® Turbo Boost Technology Specifications
Processor
Intel®
Segment and Architecture Hardware
Package Cores, Parameter Minimum Default Maximum Units
Graphics
Configuration,
and TDP
Power Limit 1 Time

0.01 1 448 s
(PL1 Tau)
Quad Core GT2
25 W Power Limit 1 (PL1) N/A 25 N/A W
Power Limit 2 (PL2) N/A 1.25 x 25 N/A W
Power Limit 1 Time
0.01 1 448 s
(PL1 Tau)
Line BGA GT2 35W Power Limit 1 (PL1) N/A 35 N/A W
Power Limit 1 Time
0.01 1 448 s
(PL1 Tau)
Dual Core
GT2 25W Power Limit 1 (PL1) N/A 25 N/A W
Electrical Specifications
4.0 Electrical Specifications
4.1 Processor Intel® Architecture Core (VCC) and

VCCGT/VCCGTX Current Specifications
Note: This section supplements the information in 7th Generation Intel® Processor Families
for H Platforms – Datasheet Volume 1 of 2 (Doc No. 335190) and 7th Generation Intel®
Processor Families for S Platforms – Datasheet Volume 1 of 2 (Doc No. 335195). For
further details on other Intel® architecture core (VCC) and VCCGT/VCCGTX parameters
not listed in Table 6, refer to the previously mentioned document.
Table 6. Processor Graphics (VccGT and VccGT-X) Supply Current Specifications

Symbol Parameter Segment Maximum Unit
H-Quad Core GT2 45W 68 A

Maximum
IA Processor Intel® H-Quad Core GT2 25W 50 A
IccMAX Architecture Core H-Dual Core GT2 35W 60 A
ICC
H-Dual Core GT2 25W 30 A
H-Quad Core GT2 45W 55 A
Maximum Current
GT H-Quad Core GT2 25W 38 A
for Processor
IccMAX H-Dual Core GT2 35W 55 A
Graphic Rail
H-Dual Core GT2 25W 38 A
4.2 H-Processor Power Rails

The VDDQC/VCCVDDQ_CLK is connected to VDDQ/+VCCDU through an LP filter.
The +VCCVDDQ_CLK and the +VCCDU are connected directly with the copper trace on
RVP11.
4.3 Thermal Design Current (TDC) Specification

Table 7. Thermal Design Current (TDC) Specification (Page 1 of 2)
Parameter Vcc VccGT VccSA
H-Line 4+2 45W

TDC [A] 50 25 10
Refer to Datasheet Vol 1 (Doc No. 335190) for the VccSA IccMAX numbers.
IccMAX current 10 ms max.
Refer to Datasheet Addendum (Doc No. 335437) for Vcc/VccGT IccMAX numbers.
IccMAX _App current 85% of IccMAX N/A
di (IccMAX Transient) [A]
58 39 3
(Note 6)
IccMAX _App di =
di (IccMAX _App Transient) N/A
IccMAX _App - (IccMAX - IccMAX di)
dt (ns)
(Slew time for the di step) 65 65 200
(Note 3)
H-Line 4+2 25W
TDC [A] 30 25 10
Refer to Datasheet Vol 1 (Doc No. 335190) for the VccSA IccMAX numbers.
IccMAX current 10 ms max.
43 27 3
(Note 6)
IccMAX _App di =
di (IccMAX _App Transient) N/A
dt (ns)
(Note 3)
H-Line 2+2 35W
TDC [A] 44 25 10
IccMAX current 10 ms max. Refer to Datasheet Vol 1 (Doc No. 335190) for the VccSA IccMAX numbers.
51 39 3
(Note 6)
di (IccMAX _App Transient) IccMAX _App di =
N/A
dt (ns)
(Note 3)
Thermal Design Current (TDC) Specification (Page 2 of 2)
Parameter Vcc VccGT VccSA
H-Line 2+2 25W

TDC [A] 22 25 10
IccMAX current 10 ms Refer to Datasheet Vol 1 (Doc No. 335190) for the VccSA IccMAX numbers.
max. Refer to Datasheet Addendum (Doc No. 335437) for Vcc/VccGT IccMAX numbers.
26 27 3
(Note 6)
di (IccMAX _App IccMAX _App di =
N/A
Transient) IccMAX _App -( IccMAX - IccMAX di)
dt (ns)
(Slew time for the di 65 65 200
step) (Note 3)
Notes:
1. IccMAX _App is not a spec, but a characterization of limited samples using a limited set of
benchmarks under default PL1 and PL2 conditions. It aims to show a more realistic current
envelope that can be exceeded.
2. Simulated at processor motherboard pads. This parameter is not tested.
3. The time durations given here are for VR design only.
4. If using the Psys, Intel recommends sizing the VR’s thermal solution to support the domains
equivalent PL2_max TDC currents by continually monitoring the platform’s total power
dissipation. The Psys optimizes the AC adapter’s PsysPL2 power capability, maximizing PL2
power delivered to the CPU (for example, PL2_maxoperation) when rest-of-platform power
headroom exists. Note: PsysPL2 is the sum of PL2 and ROP as measured at the power input.
As ROP is reduced, PL2 may increase but PsysPL2 remains constant.
5. The SET_VR_TDC_CONFIG mailbox register in the BIOS assumes a default tau of 1ms.
6. Subject to change. Vcc can be estimated at 85% of IccMAX. VccGT can be estimated at 70% of
IccMAX.
4.4 H-Line Platform Power Map and Rail Requirements

Figure 2. Processor Platform Power Map - H–Line
Note: For the complete figure, refer to the Kaby Lake Platform Power Architecture Guide.
Contact your Intel representative for additional information..
4.4.1 IMVP8 Voltage and Current Requirements - H-Line

Table 8. General Processor VR Parameters for the H-line
Parameter Description Power H-Line CPU Notes
Rail SKU 42/22
Vcc 1.8
Load line slope within VccGT 2.65 More information about
R_DC_LL
(mV/A) MAX the VR regulation loop decoupling recommendations
capability 0–1 kHz VccGTX and associated VR bandwidth
VccSA 10 requirements are shown in the
Kaby Lake H Platform Design
Vcc 1.8 Guide. Contact your Intel
Load line slope in representative for additional
R_AC_LL response to dynamic VccGT 2.65 information.
(mV/A) MAX load increase events VccGTX
1 kHz-1 MHz
VccSA 10
Note: For the complete table, refer to the Kaby Lake Platform Power Architecture Guide.
Contact your Intel representative for additional information.
4.4.2 GT2/3/4 Graphics Frequency

Table 9. GT2/3/4 Graphics Frequency (H -Processor Line)
Segment GT Unslice GT Unslice + GT Unslice + GT Unslice +
1 GT Slice 2 GT Slice 3 GT Slice
H – Quad Core GT Max. Dynamic [GT Unslice only] - [GT Unslice + 1 Slice] [GT Unslice + 2 Slice]
GT4/GT3+OPC Frequency (1 or 2)BIN - (1or2)BIN - (1or2)BIN
Note: For more information, refer to Table 2-15 in 7th Generation Intel® Processor Families
for H Platforms – Datasheet Volume 1 of 2 (Doc No. 335190).
4.4.3 H-Processor Line Thermal and Power Specifications

Table 10. TDP Specifications (H-Processor Line)
Processor Intel®
Segment and Architecture Processor Intel® Graphics Core TDP SDP
Package Cores, Graphics Configuration Architecture Core Frequency (W) (W)
Configuration, Frequency
and TDP
Quad Core 350 MHz

Base 2.5 GHz to TBD GHz 35
GT4/GT3 to 1.05 GHz N/A
35W with OPC LPM 800 MHz 350 MHz 34.5
Base 2.3 GHz to 3 GHz 45
Quad Core 350 MHz
H-Processor Configurable to 1.05 GHz
Line BGA GT4/GT3 1.9 MHz to 2.5 MHz 35 N/A
TDP Down / LFM
45W with OPC
LPM 800 MHz 350 MHz 34.5
Quad Core 350 GHz

Base 2.7 GHz 35
GT4/GT3 to 0.9 GHz N/A
35W with OPC LPM 800 MHz 350 MHz 34.5
Note: For more information, refer to Table 5-2 in 7th Generation Intel® Processor Families for
H Platforms – Datasheet Volume 1 of 2 (Doc No. 335190).
Table 11. Package Intel® Turbo Boost Technology Specifications (H-Processor Line)
Processor Intel®
Segment and Architecture Hardware
Package Cores, Graphics Parameter Minimum Default Maximum Units
Configuration,
and TDP
Quad Core Power Limit 1 Time (PL1 Tau) 0.01 1 448 s

H-Processor
Line BGA GT4/GT3 45W Power Limit 1 (PL1) N/A 45 N/A W
with OPC Power Limit 2 (PL2) N/A 1.25*45 N/A W
4.4.4 Processor Power Rails DC Specifications

Table 12. Processor Intel® Architecture Core (Vcc) Active and Idle Mode DC Voltage and
Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1
Maximum H (35W) – Quad Core

— — 5715
ICCMAX Processor Intel® GT4/GT3 + OPC 4, 6, 7,
A
(H-Processors) Architecture H (45W) - Quad Core 11
Core ICC — — 74 15
GT4/GT3 + OPC
Y-Processor Line — 4.7 5.9
U-Dual Core GT2 — — 2.4
Load line slope
within the VR U-Dual Core GT3+OPC — — 2.4 10, 13,
DC_LL mΩ
regulation loop H-Dual/Quad Core GT2 — — 1.8 14
capability
H-Quad Core GT4/GT3+OPC — — 1.6
S-Processor Line — — 2.1
Table 13. Processor Graphics (VccGT and VccGT-X) Supply DC Voltage and Current
Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1
H (35W) – Quad Core 94/20

ICCMAX _GT/ Maximum Current — —
GT4/GT3 + OPC (GTx)11
ICCMAX _GTx for Processor A 6
(H-Processors) Graphics Rail H (45W) – Quad Core 94/20
— —
GT4/GT3 + OPC (GTx)11
Y-Processor Line — 4.2 5.7
VccGT Load Line U-Dual Core GT3+OPC — — 2/6.0 (GTx) 7, 9,
DC_LL mΩ
Slope H-Dual/Quad Core GT2 — — 2.65 10
H-Quad Core GT4/GT3+OPC — — 1.4/6.0 (GTx)
4.4.5 VccSA DC Specifications

Table 14. System Agent (VccSA) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
Y-Processor Line — — 4.1

Max. Current for U-Dual Core GT3+OPC — — 5.1
ICCMAX_VCCSA A
VccSA Rail H-Dual/Quad Core GT2 — — 11.1
H-Quad Core GT4/GT3+OPC — — 8
Y-Processor Line — 14 18
DC_LL VccSA Load line U-Dual Core GT3+OPC — — 10.3 mΩ 6,7
H-Dual/Quad Core GT2 — — 10
4.4.6 VccPLL DC Specifications

Table 15. Processor PLL_OC (VccPLL_OC) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
Y-Processor Line — — 100

U-Dual Core GT2 — — 100
U-Dual Core GT3+OPC — — 120
ICCMAX_VCCPL Max. Current for
L_OC H-Dual/Quad Core GT2 — — 130 mA
VCCPLL_OC Rail
S-Dual Core GT2 — — 100
S-Quad Core GT2 — — 130
Note: For more information, refer to Table 7-10 in 7th Generation Intel® Processor Families
4.4.7 Package Mechanical Specifications

Table 16. Package Mechanical Attributes
Y-Processor U-Processor Line H-Processor Line S-Processor Line
Line
Package Parameter
Dual Core Dual Core Quad Core Quad Core Quad Core/
Dual Core GT2
GT3+OPC GT2 GT4/GT3+OPC GT2 Dual Core GT2
Note: The details for this table, refer to Table 8-1 in 7th Generation Intel® Processor Families
4.5 USB On-The-Go Specification

The embedded 7th generation Intel® Processor for S-Platform SKU does not support USB
On-The-Go specification mentioned in the following:
• Intel® 100 Series Chipset Family Platform Controller Hub (PCH) Datasheet – Volume 1
of 2 (Doc No. 332690).
• Kaby Lake S Platform Design Guide. Contact your Intel representative for additional
information.
Processor Listings
5.0 Processor Listings

Table 17. U-Processor Family Listing/Package BGA1356
In Table 17, Turbo refers to Intel® Turbo Boost Technology.
Frequency (GHz)
Frequency (GHz)
Maximum Turbo
Freq. Rate (GHz)
Cache Size (MB)
Functional Core
Graphics Turbo
DDR3L (MHz)
Speed (GHz)
DDR4 (MHz)
Integrated
Integrated
Integrated
Processor
Core SKU
Stepping
Graphics
Graphics
Package
Memory
Memory
Number
SSPEC
MM#
TDP
1 Core: 3.9
SR33Z 953350 i7-7600U H-0 4 2 2 1600 2133 2.8 0.30 1.15 15W BGA1356
2 Core: 3.9
1 Core: 3.5
SR340 953351 i5-7300U H-0 3 2 2 1600 2133 2.6 0.30 1.10 15W BGA1356
2 Core: 3.5
1 Core: 2.4
SR343 953354 i3-7100U H-0 3 2 2 1600 2133 2.4 0.30 1.00 15W BGA1356
2 Core: 2.4
1 Core: 2.2
SR34A 953361 3965U H-0 2 2 1 1600 2133 2.2 0.30 0.90 15W BGA1356
2 Core: 2.2
Processor Listings
Table 18. S-Processor Family Listing/Package LGA1151
Integrated Graphics
Integrated Graphics
Integrated Graphics
External Stepping
Turbo Frequency
Frequency (GHz)
Maximum Turbo
Freq. Rate (GHz)
Cache Size (MB)
Functional Core
DDR3L (MHz)
Speed (GHz)
DDR4 (MHz)
Processor
Core SKU
Package
Memory
Memory
Number
SSPEC
(GHz)
MM#
TDP
1 Core: 4.2
2 Core: 4.1
SR32A 952791 E3-1275v6 B-0 8 4 2 1866 2400 3.8 0.35 1.15 73W LGA1151
3 Core: 4.1
4 Core: 4.0
1 Core: 4.2
2 Core: 4.1
SR338 953004 i7-7700 B-0 8 4 2 1866 2400 3.6 0.35 1.15 65W LGA1151
3 Core: 4.1
4 Core: 4.0
1 Core: 3.8
2 Core: 3.7
SR339 953005 i7-7700T B-0 8 4 2 1866 2400 2.9 0.35 1.15 35W LGA1151
3 Core: 3.7
4 Core: 3.6
1 Core: 3.8
2 Core: 3.7
SR335 953001 i5-7500 B-0 6 4 2 1866 2400 3.4 0.35 1.10 65W LGA1151
3 Core: 3.7
4 Core: 3.6
1 Core: 3.3
2 Core: 3.2
SR337 953003 i5-7500T B-0 6 4 2 1866 2400 2.7 0.35 1.10 35W LGA1151
3 Core: 3.2
4 Core: 3.1
SR32Z 952995 i3-7101E B-0 3 2 2 1 Core: 3.9 1866 2400 3.9 0.35 1.10 54W LGA1151
SR374 955013 i3-7101TE B-0 3 2 2 1 Core: 3.4 1866 2400 3.4 0.35 1.10 35W LGA1151
SR38G 955177 G3930E B-0 2 2 1 1 Core: 2.9 1600 2133 2.9 0.35 1.05 54W LGA1151
SR38H 955178 G3930TE B-0 2 2 1 1 Core: 2.7 1600 2133 2.7 0.35 1.00 35W LGA1151
Processor Listings
Table 19. H-Processor Family Listing/Package BGA1440
Integrated Graphics
Integrated Graphics
Integrated Graphics
External Stepping
Turbo Frequency
Frequency (GHz)
Maximum Turbo
Freq. Rate (GHz)
Functional Core
Cache Size (MB)
Speed (GHz)
DDR4 (MHz)
Processor
Core SKU
Package
Memory
Number
SSPEC
(GHz)
MM#
TDP
1 Core: 4.0
2 Core: 3.8
SR32K 952951 E3-1505Mv6 B-0 8 4 2 2400 3.0 0.35 1.10 45W BGA1440
3 Core: 3.7
4 Core: 3.6
1 Core: 3.0
2 Core: 2.9
SR34X 953947 E3-1505Lv6 B-0 8 4 2 2400 2.2 0.35 1.00 25W BGA1440
3 Core: 2.8
4 Core: 2.7
1 Core: 3.6
2 Core: 3.5
SR3FO 956301 E3-1501Mv6 B-0 6 4 2 2400 2.9 0.35 1.00 45W BGA1440
3 Core: 3.4
4 Core: 3.3
1 Core: 2.9
2 Core: 2.8
SR3EZ 956300 E3-1501Lv6 B-0 6 4 2 2400 2.1 0.35 1.00 25W BGA1440
3 Core: 2.7
4 Core: 2.6
1 Core: 3.7
2 Core: 3.6
SR34S 953940 i7-7820EQ B-0 8 4 2 2400 3.0 0.35 1.00 45W BGA1440
3 Core: 3.5
4 Core: 3.4
1 Core: 3.6
2 Core: 3.5
SR34T 953941 i5-7440EQ B-0 6 4 2 2400 2.9 0.35 1.00 45W BGA1440
3 Core: 3.4
4 Core: 3.3
1 Core: 2.9
2 Core: 2.8
SR34U 953942 i5-7442EQ B-0 6 4 2 2400 2.1 0.35 1.00 25W BGA1440
3 Core: 2.7
4 Core: 2.6
1 Core: 2.9
SR34V 953943 i3-7100E B-0 3 2 2 2400 2.9 0.35 0.95 35W BGA1440
2 Core: 2.9
1 Core: 2.1
SR34W 953944 i3-7102E B-0 3 2 2 2400 2.1 0.35 0.95 25W BGA1440
2 Core: 2.1

7th Gen Core Family Datasheet Addendum

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7th Generation Intel® Core™ Processor,

Intel® Celeron® Processor, and Intel®

Document Number: 335437-002

No computer system can be absolutely secure.

*Other names and brands may be claimed as the property of others.

Copyright © 2017, Intel Corporation. All rights reserved.

Date Revision Description

April 2017 002 • Updated Table 18 and Table 19.

Figure 1. H-Processor and S-Processor Line Platform

DDR4 System SATA* Gen 3 /

Direct Media Interface

USB 3.0 Port

The processors are manufactured based on Intel's 14 nm process technology that

DIMM Dual In-line Memory Module

DMI Direct Media Interface

DDR3L DDR3 Low Voltage

DDR4 Fourth-Generation Double Data Rate SDRAM Memory Technology

ECC Error Correction Code - used to fix DDR transaction errors

IBP Intel Business Portal

OPC On Package Cache

PCH Platform Controller Hub. The chipset with centralized platform

Psys Processing Sub-system

RVP Reference Validation Platform provided to customers as the Customer

SDP Scenario Design Power

TDP Thermal Design Power

Tjmax Maximum Junction Temperature Rating (°C)

TDC Thermal Design Current

TDP Thermal Design Power

TPM Trusted Platform Module

VCC Common Collector Voltage (V+)

1.2 Reference Documents

Kaby Lake Platforms Design-In Presentation Contact your Intel representative

7th Generation Intel® Processor Families for H Platforms – Datasheet -

7th Generation Intel® Processor Families for H Platforms – Datasheet -

7th Generation Intel® Processor Families for S Platforms – Datasheet -

7th Generation Intel® Processor Families for S Platforms – Datasheet -

Intel® 100 Series Chipset Family Platform Controller Hub (PCH)

Intel® 100 Series Chipset Family Platform Controller Hub (PCH)

Kaby Lake H Platform Design Guide Contact your Intel representative

Kaby Lake S Platform Design Guide Contact your Intel representative

1.3 Supported Package and Die Plan

LGA 1151 2015

2.1 System Memory Interface and Supported Technology

3.0 Thermal Management

3.1 Processor Thermal Management

3.2 S/H-Processor Line TDP Specifications

H-Processor Quad Core

3.3 H-Processor Line TDP Specifications

Power Limit 1 Time

4.0 Electrical Specifications

4.1 Processor Intel® Architecture Core (VCC) and

Table 6. Processor Graphics (VccGT and VccGT-X) Supply Current Specifications

H-Quad Core GT2 45W 68 A

4.2 H-Processor Power Rails

4.3 Thermal Design Current (TDC) Specification

H-Line 4+2 45W

Thermal Design Current (TDC) Specification (Page 2 of 2)

Parameter Vcc VccGT VccSA

H-Line 2+2 25W

4.4 H-Line Platform Power Map and Rail Requirements

4.4.1 IMVP8 Voltage and Current Requirements - H-Line

4.4.2 GT2/3/4 Graphics Frequency

4.4.3 H-Processor Line Thermal and Power Specifications